M40 & M46. M40 & M46 SP series that enables maximum cost reduction

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1 M40 & M46 M40 & M46 SP series that enables maximum cost reduction Achieves high quality with low silver content Achieves quality characteristics equivalent to those of the M705 series by using lower amounts of precious metals, which are rising in price Does not require profile changes Realizes packaging under the same conditions as those of the M705 series by lowering the melting point, significantly reducing production costs Enables high-speed printing Realizes solder paste that withstands high-speed printing through the application of our expertise in rheology, making a large contribution to the improvement of production efficiency Enables short time reflow soldering Realizes short reflow time through our outstanding organic synthesis technology, contributing to a significant improvement of production efficiency Stable production yield Achieves high quality through our long-accumulated comprehensive technical capabilities, ensuring a constant high production yield The SP series solder paste capable of short-time reflow soldering Approx. 30% reduction in production tact time achieved by the SP series Sh-Semi12-05E

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3 NSV300 Transfer paste for 3D PoP (Package of Package) packaging M705- NSV300 Solves contact non-wet failures in ball-to-ball stacking Possesses excellent transferability and significantly reduces contact non-wet failures in ball-to-ball stacking Accommodates PoP and TMV packaging and realizes excellent solderability Robust against warping, achieves higher performance than that of conventional products while being halogen-free Conventional product Contact non-wet failures are observed Sh-Semi12-06E NSV300 Contact non-wet failures are ignificantly reduced

4 Chip solder "Chip solder" for lands where a lack of solder is anticipated The 0402 size type is available for those devices where minimal solder connection is expected. They come in tape and reel packaging which allows simultaneous automatic placement on surface mount devices. Melts in tandem with solder paste, requiring no additional soldering Provides an appropriate amount of solder to ensure high connection reliability Sh-Semi12-07E

5 M53 M53 series solder paste that is capable of being applied to small-sized and lightweight on-board products Exhibits superior thermal fatigue resistance and maintains high bond strength even under severe environments Prevents crack propagation due to thermal fatigue and maintains electrical conductivity after long term use Ensures high quality even in products with small-sized and lightweight designs having small land areas Sh-Semi12-01E

6 MACROS "MACROS" that prevents migration No cracking of flux residue occurs even under environment with rapid temperature changes, such as in on-board equipment. Flux residue with high adhesiveness and water repellency prevents the occurrence of migration. Excellent for laser soldering, prevents flux spattering peculiar to laser soldering Cracks on flux become the cause of migration SMIC has developed MACROS, which prevents the occurrence of cracks in flux residue during temperature cycle tests. Ion migration did not occur during a water drop test with when using MACROS. Provides good break-off, ensuring good drag soldering Insulation resistance [Ω] Time [h] Comparison of flux scattering in laser soldering Sh-Semi12-04E

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