FYS4260/FYS9260: Microsystems and Electronics Packaging and Interconnect Printed Circuit Boards

Size: px
Start display at page:

Download "FYS4260/FYS9260: Microsystems and Electronics Packaging and Interconnect Printed Circuit Boards"

Transcription

1 FYS4260/FYS9260: Microsystems and Electronics Packaging and Interconnect Printed Circuit Boards Interior detail from an Apple iphone 5 printed circuit board

2 Learning objectives Understand how printed wiring/circuit boards are constructed Types of printed circuit boards High density interconnect technology Background literature: Halbo & Ohlckers Chapter 5 The HDI handbook Malestroem: The printed circuit handbook 6 th ed.

3 The substrate The are several purposes for the substrate for electronic component mounting, including: Mechanical support Electrical interconnection Heat conduction

4 Printed Circuit Board A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate. PCBs can be single sided (one copper layer), double sided (two copper layers) or multi-layer. Conductors on different layers are connected with plated-through holes called vias. Advanced PCBs may contain components - capacitors, resistors or active devices - embedded in the substrate

5 Printed Wiring Board vs. Printed Circuit Board Halbo & Ohlckers book emphasises the difference between printed wiring board and printed circuit board In principle/by definition, an electrical circuit is not a circuit before it is closed, that is, components have been attached. When the board has only copper connections and no embedded components, the term printed wiring board (PWB) has been recommended. Although more accurate, the term printed wiring board has fallen into disuse. The lecturer will therefore often use PCB also when PWB could be more precise.

6 What do you think are important requirements when you must select substrate technology? Discuss with the one next to you!

7 Some requirements on substrate technology Function Requirement Electrical property High conductivity in conductive wires High resistance between wires Mechanical properties Stiff and rigid Low weight Low coefficient of thermal expansion (why?) Chemical resistance Must withstand solder fluxes and other chemicals during manufacturing Must be stable in usage environment Fire resistance An overheated component may not cause the entire circuit board to catch fire. (FR = flame retardant) Processability Compliant with component assembly process Possible to shape to fit the application Adhesion Many components are glue attached to the substrate Metallization must stick on the substrate Moisture absorption Organic polymers tend to absorb water from the environment. Price and availibility Cost and availability of processing equipment/facilities are always concerns

8 Classification of circuit boards 1. Base material 2. How wires are defined 3. Physical nature 4. The way wires are formed 5. Number of layers (single/double/multi layer boards) 6. Plated through holes 7. Production process Malestrom: Printed Circuit Board Handbook, 6 th ed

9 RoHS directive: Impact of lead-free soldering requirement changes FR-4 composition Malestrom: Printed Circuit Board Handbook, 6 th ed

10 Another way of classifying laminates Reinforcement Flame Resin Cotton Woven Mat Glass retardgrade Epoxy Polyester Phenolic paper glass glass veil ant XXXPC FR-2 FR-3 FR-4 FR-5 FR-6 G-10 CEM-1 CEM-2 CEM-3 CEM-4 CEM-5 CEM-6 CEM-7 CEM-8 Table 5.1: Conventional laminates for printed wiring boards. (The designations are according to National Electrical Manufacturers Association, NEMA, USA.)

11 Laminate material classification (alternative to Fig 5.1 in H&O) Malestrom: Printed Circuit Board Handbook, 6 th ed

12 Physical properties of some common base materials Malestrom: Printed Circuit Board Handbook, 6 th ed

13 FR4 laminate structure FR4 is the most widely used starting point for PCBs FR4 consists of a woven glass fibre mesh soaked in organic polymer (epoxy) with copper layers laminated possibly with filler material (similar to steelenforced concrete) FR means Flame Retardant Organic substrates: Substrates where organic polymers are binders Prepreg: The laminate before copper is added and before final curing of laminate Fig. 5.1: Woven glass fibre for printed wiring board reinforcement

14 FR4 build-up (two-layer structure) HDI Handbook p 188

15 Conventional manufacturing process for PCB labminates Printed Circuits Handbook 6 th Edition

16 Printed Wiring Board technology examples Fig. 5.2: Printed wiring board structures with varying complexity: a) Single sided and double sided. b) Double sided through hole plated with bare Cu or Sn/Pb surface. c) Four layer board. d) Six layer board with two Cu/Invar/Cu cores.

17 And multilayer structures become increasingly dense Multilayer boards and high density interconnects are increasingly more common and available Illustration of multilayer Printed Wiring Board FYS4260/FYS9260 Frode Strisland 17

18 Multi-layer PCB Cross section of 14-layer multilayer printed wiring board, showing a typical inner layer and prepreg material relationship. In this case, to reduce z-axis expansion, the innerlayers are polyimide, while the prepreg material is semicured polyimide.typical signal, power, and ground layers are also indicated, as well as the thickness of the copper foil for each layer. Printed Circuits Handbook 6 th Edition FYS4260/FYS9260 Frode Strisland 18

19 Single sided boards processing steps 1. Drilling / punching of registration holes 2. Panel cleaning 3. Printing of etch resist 4. Etching 5. Stripping 6. Printing solder resist 7. Curing of solder resist 8. Cleaning of solder areas 9. Deposition of solder coating 10. Punching of holes and edge contour (or drilling/milling) Illustration of steps 3-5 This is a subtractive process (wires defined by removal of Cu) Alternative: Additive processes (based on plating Cu)

20 Single sided boards processing steps (alternative illustration) Fig. 5.4: Process steps of "print and etch" process for single sided boards

21 Printed Wiring Boards: Manufacturing Process Two main classes of wire definition approaches: Graphical the image of the master circuit pattern is formed photographically on a photosensitive material, such as treated glass plate or plastic film. The image is then transferred to the circuit board by screening or photoprinting the artwork generated from the master. Discrete wire interconnection boards Discrete-wire boards do not involve an imaging process for the formation of signal conductors. Rather, conductors are formed directly onto the wiring board with insulated copper wire. Wire-wrap and Multiwire are the best known discrete-wire interconnection technologies. Because of the allowance of wire crossings, a single layer of wiring can match multiple conductor layers in the graphically produced boards, thus offering very high wiring density. However, the wiring process is sequential in nature and the productivity of discrete-wiring technology is not suitable for mass production.

22 Discrete wire interconnection board (example) Printed Circuits Handbook 6 th Edition

23 Processing of Double Sided Thru-Hole Plated Boards Comment: Process description based on the production of eutectic tin-lead solder. This is not according to industry standard, but illustrates the principles and the way the project prototypes are manufactured FYS4260/FYS9260 Frode Strisland 23

24 Graphical illustration of the thru-hole plated boards process steps Fig. 5.5: Through hole plated PWB, process steps: a) Panel plating. b) Pattern plating. c) Hot air levelling. FYS4260/FYS9260 Frode Strisland 24

25 Processing of Double Sided Thru-Hole Plated Boards (1) 1. Drilling 2. Cleaning of the surfaces and hole ("deburring"), and a mild etch to ensure adhesion in later steps 3. Activation for chemical (electroless) plating. Dipped into a solution containing Sn 2+ ions, to increase the sensitivity of the surface. The activation takes place in an acidic solution of palladium chloride, that is transformed into metallic Pd. Reaction: Sn 2+ + Pd 2+ -> Sn 4+ + Pd (met). In the later plating process, Pd catalyses the deposition of copper.

26 Processing of Double Sided Thru-Hole Plated Boards (2) 4. Chemical (electroless) plating of Cu: Dipped into a reducing bath containing Cu 2+ ions, for example in the form of dissolved CuSO 4. Formaldehyde, HCHO, is the common means of reduction. In this bath, Cu 2+ is reduced to Cu that covers the whole surface, including the holes, also where the surface is electrically insulating. At the same time formaldehyde is oxidised into acetic acid. The plated thickness is approximately 3 µm. The purpose is to create an electrically conducting surface everywhere, for the subsequent step. 5. Electrolytic (electro-) plating of Cu: dipped into an electrolyte that contains Cu2+ ions, such as CuSO 4 dissolved in H 2 SO 4. The panel forms the negative electrode (cathode), and a metallic copper plate forms the positive electrode (anode) of an electrolytic cell. At the anode copper is dissolved: Cu -> Cu e-. The reaction at the cathode is the following: Cu e- -> Cu, thus, metallic copper is deposited on the panel. Approximately µm Cu is normally plated, in order to get good coverage in the via holes.

27 Processing of Double Sided Thru-Hole Plated Boards (3) 6. Pattern definition Dry film photoresist is laminated on to both sides, normally negative resist. The resist is illuminated through a positive photographic mask and is developed. The pattern is therefore black on the photomask, and the photoresist will dissolve where there is a pattern, during the development. 7. Tin/lead plating for etch masking: The panel is connected to the cathode of an electrolytic bath containing Sn 2+ and Pb 2+ ions. The anode is metallic Sn/Pb alloy. The electrolyte is based on fluoroboric acid, HBF 4. The ratio between the concentration of the ions in the bath and on the anode, is such that the deposited layer of metal on the panel will be approximately the eutectic mixture 63Sn/37Pb (percent by weight). The normal thickness is about 7 µm. After this the photoresist is dissolved in a suitable solvent, for instance methylene chloride.

28 Processing of Double Sided Through Hole Plated Boards (4) 8. Etching: The Cu foil is etched simultaneously on both sides, analogous to step 4, Section 5.5, but with an ammonia-based etch bath, which does not attack Sn/Pb. The plated Sn/Pb serves as an etch resist. After the etching, the Cu is covered with Sn/Pb where we want conductor pattern and solder lands, as well as in the holes through the board. 9. Fusing: If it is desired to have Sn/Pb on the completed board, a "fusing" step follows. It consists in heating of the board to a temperature where the alloy melts and changes its crystalline structure. It flows and covers the nearly vertical edges of the etched copper. We get an intermetallic copper/tin interfacing layer. The heating may take place in hot air or oil, by IR radiation heating, etc. 10. Organic solder resist may be added by screen printing

29 Graphical illustration of the thru-hole plated boards process steps Fig. 5.5: Through hole plated PWB, process steps: a) Panel plating. b) Pattern plating. c) Hot air levelling. FYS4260/FYS9260 Frode Strisland 29

30 Double Sided Through Hole Plated Boards: Choice of Surface Metallisation and Solder Resist Fig. 5.6.a: Selective Sn/Pb surface coverage with hot air levelling. The alternatives, bare Cu or Sn/Pb on all Cu surface, are shown in Figure 5.2 b).

31 Definition of patterns 2000 Lasers are used to define pattern on photographic plate or to expose photolitography film Pattern definition anno 1960

32 Choice of Surface Metallisation and Solder Resist, continued Fig. 5.6.b: "Tenting", i.e. covering of the via holes by dry film solder resist. If tenting is only partially succesful, chemical entrapment from surface finish preclean lines is probable

33 Multilayer Printed Wiring Boards 1. Drilling 2. Rinse, Photo process for inner layers 3. Etch inner layers 4. Black oxidation for adhesion promotion 5. Baking 6. Lamination 7. Drilling of through holes Further process as for double layer boards

34 Multilayer Printed Wiring Boards, continued Fig. 5.7: Process steps for multilayer printed wiring boards with holes only through the board.

35 Via Holes in Multilayer Printed Wiring Boards Fig. 5.8: Types of via holes: a) Through hole. b) Buried hole. c) Blind hole. Figure d) shows a microscope section of a drilled blind via. (Contrave s "Denstrate" process).

36 Fine Line Printed Wiring Boards, Additive Process Fig. 5.9 a): The development of minimum line width from 1965 until The figures in the ovals tell how many conductors can be positioned between the leads of DIP-components with a lead pitch of 0.1" (number of "channels").

37 Fine Line Printed Wiring Boards, Additive Process, continued Etch control: Under etch/etch factor Accuracies in subtractive processes limited by underetching. Additive process avoids this problem, but requires cleanroom processing and collimated light Fig. 5.9 b): Underetch and etch factor.

38 Fine Line Printed Wiring Boards: Photolithographic Process Fig a: Machine for double sided illumination with parallel light, for pattern transfer from photographic film for fine line printed wiring boards. Take-home message from this figure from the 90's: Alignment is still important in two-sided photolitographic processes

39 Fine Line Printed Wiring Boards: Photolithographic Process, continued Fig b : Automatic in-line system for lamination of photoresist, illumination and development, in an enclosed clean room atmosphere.

40 Metal Core Printed Wiring Boards Better heat conduction TCE matching with ceramic packages Most common: Cu/Invar/Cu Fig. 5.2.d) Six layer board with two Cu/Invar/Cu cores.

41 Metal Core Boards, continued Fig a): Cross section of metal core board with one Cu/Invar/Cu core (Texas Instruments). Invar Cu Fig b): Thermal coefficient of expansion of Cu/Invar/Cu, as function of the composition (Texas Instruments).

42 New Materials for PWBs Higher Tg Better dimensional stability ε r low, not dependent on T, f, or moisture Low losses Lower TCE Purpose High frequency use Controlled characteristic impedance High reliability Materials Cyanate ester PTFE (Teflon) Polyimide and others

43 New Materials for PWBs, continued Fig. 5.13: TCE for FR-4 below and above T g in a): the x or y direction, b): the z-direction.

44 New Materials for PWBs, continued Table 5.2: Material parameters for polymers for printed wiring boards Tan δ (at 1 MHz) α (T < Tg) Tg [oc] Material εr [ppm/ oc] Paper/phenolic Bisphenol epoxy (FR-4) Multifunctional epoxy Tetrafunctional epoxy > 150 BT/epoxy Cyanate ester Polyimide (Pi) PTFE (Teflon) ) ) Melts, no regular glass-transition

45 New Materials for PWBs, continued ε r tan δ Fig. 5.14: Frequency dependence of ε r and tan δ for FR-4. ε r :Relative dielectric constant. tan δ: Loss tangent.

46 Commercial Products, continued Fig a): Structure of Rogers material RO2800.

47 Commercial Products, continued Fig b): Combination of Gore-Ply and FR-4 gives a simple process, and at the same time low dielectric losses and reduced capacitance to ground.

48 Commercial Products, continued Fig. 5.16: Attenuation in (db) as function of frequency for a one meter long stripline, for the high performance materials Gore, Nelco and polyimide, compared to FR-4.

49 Commercial Products, continued Fig. 5.17: Top: Microwire from PCK, with conductors insulated with organic insulation, and a metal foil as ground plane. Bottom: Next generation technology, where each conductor has its own metal shield.

50 Commercial Products, continued Fig. 5.18: The equipment head that deposits the conductors on the laminate for Microwire.

51 Special Boards Flexible printed wiring boards Dynamic or static bending. Uses: Movable parts and odd shaped, cramped places

52 Flexible Printed Wiring Boards, continued Fig. 5.19: Flexible printed wiring boards: Most of the electronics in Minoltas camera Maxxum 9000 is on two flexible printed circuit boards.

53 Table 5.4: Properties for materials used for flexible printed wiring boards. Flexible Printed Wiring Boards, continued Typical values Unit Glass Epoxy Polyester base laminate Polyimide base laminate Solderability C/s 260/10 230/1 260/10 Max. continuous operating temperature C Tensile strength kp cm Peel strength to copper kp 4,5 1,8 1,3 Moisture absorption % 0,5 0,8 2,5 Coefficient of linear expansion C -1 1, , , Etch shrinkage: Machine direction % 0,2-0,8 1,0-0,55 0,45-0,25 /transverse direction Dielectric constant (60 Hz) 3,4 3,25 3,5 Dissipation factor (1 khz) 0,037 0,006 0,003 Resistivity ohm cm 1, Cost ratio (laminate only) 1,4/2 1 2/3 Comments Not suitable for continuous folding use. Max. peel strength to copper and minimum elongation. Sensitive to solder heat. Lowest cost. Good physical and electrical properties Non-flammable. Outstanding physical and electrical properties.

54 Flexible Printed Wiring Boards, continued Fig. 5.20: Cross section of flexible PWB: Top: Single layer conductor foil. Bottom: Double layer conductors with through hole plating.

55 Membrane Switch Panels Purpose: Switches and informative instrument fronts. Fig a): Membrane switch panel, schematically. Top: Structure Bottom: Cross section of a normal panel and a panel with metal dome.

56 Membrane Switch Panels, continued Fig b): Exploded view of simple switch panel

57 End of Chapter 5: Technologies for Electronics Overview Important issues: Many circuit board technologies are used. You should understand and be able to explain the main processing steps in order to develop a PCB Please comment and discuss!

CHAPTER 5 PRINTED WIRING BOARDS 5.1 INTRODUCTION

CHAPTER 5 PRINTED WIRING BOARDS 5.1 INTRODUCTION CHAPTER 5 PRINTED WIRING BOARDS 5.1 INTRODUCTION The substrate on which the components are mounted has several purposes: - Mechanical support for the components. - Electrical interconnection, "wiring",

More information

GRAPHIC MANUFACTURING CAPABILITY Q217-18

GRAPHIC MANUFACTURING CAPABILITY Q217-18 All features are design dependent and may not be achievable in combination Reduced Yield / Special values up ( or down ) to the standard limit are design and application dependent Standard features only

More information

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards Qualification and Performance Specification for High Frequency (Microwave) Printed Boards Developed by the High Speed/High Frequency Board Performance Subcommittee (D-22) of the High Speed/High Frequency

More information

!"#$#%&#'(() ) **+,-./01)2-,-.3)456,1) /0! **)

!#$#%&#'(() ) **+,-./01)2-,-.3)456,1) /0! **) !"#$#%&#'(() ) **+,-./01)2-,-.3)456,1) /0!7.5853-09**) B 2 IT is a Toshiba Process Technology 1. Conductive Ag bumps are printed on a sheet of Cu foil. 2. Prepreg is pierced through by the bumps 3. Another

More information

Introduction Conductors. Supply Planes. Dielectric. Vias PCB Manufacturing Process Electronic Assembly Manufacturing Process

Introduction Conductors. Supply Planes. Dielectric. Vias PCB Manufacturing Process Electronic Assembly Manufacturing Process PCBs/Overview Printed Circuit Boards (PCB) Introduction Conductors. Supply Planes. Dielectric. Vias PCB Manufacturing Process Electronic Assembly Manufacturing Process 29/09/2005 EE6471 (KR) 263 PCBs/Overview

More information

ALTIUMLIVE 2018: NAVIGATING THE COMPLEXITIES OF PCB MATERIAL SELECTION

ALTIUMLIVE 2018: NAVIGATING THE COMPLEXITIES OF PCB MATERIAL SELECTION ALTIUMLIVE 2018: NAVIGATING THE COMPLEXITIES OF PCB MATERIAL SELECTION Chris Hunrath Insulectro, VP of Technology San Diego October 4 Outline 1 PCB Material Overview 2 What is the Dielectric Constant of

More information

The Anatomy of a PCB SINGLE-SIDED BOARD

The Anatomy of a PCB SINGLE-SIDED BOARD Published on Online Documentation for Altium Products (https://www.altium.com/documentation) 主页 > The Board Using Altium Documentation Modified by Jason Howie on Apr 11, 2017 Open up just about any electronic

More information

CLAD MATERIAL ~ FINE CLAD is a solution for high density, low cost PWB.

CLAD MATERIAL ~ FINE CLAD is a solution for high density, low cost PWB. ~ CLAD MATERIAL ~ FINE CLAD is a solution for high density, low cost PWB. Principle of bonding technique Principle of bonding technique Step 1 Material A, B In vacuum Step 2 Surface activated treatment

More information

Embedded Passives..con0nued

Embedded Passives..con0nued Embedded Passives..con0nued Why Embedded Passives? Improves the packaging efficiency System-on-Package (SOP); SLIM integration Reducing size Eliminating substrate assembly Minimizing solder joint failure

More information

Building HDI Structures using Thin Films and Low Temperature Sintering Paste

Building HDI Structures using Thin Films and Low Temperature Sintering Paste Building HDI Structures using Thin Films and Low Temperature Sintering Paste Catherine Shearer, James Haley and Chris Hunrath Ormet Circuits Inc. - Integral Technology California, USA chunrath@integral-hdi.com

More information

How Printed Circuit Boards are Made. Todd Henninger Field Applications Engineer Midwest Region

How Printed Circuit Boards are Made. Todd Henninger Field Applications Engineer Midwest Region PCB 101: How Printed Circuit Boards are Made Todd Henninger Field Applications Engineer Midwest Region Tooling PRE-PRODUCTION ENGINEERING (Tooling) Design Data Package CAD Data (ODB++ or Gerber 274x format)

More information

Product-Info 3D-MID. 1. Introduction. 2. Material and manufacturing process. 1/5

Product-Info 3D-MID. 1. Introduction. 2. Material and manufacturing process.   1/5 Product-Info 3D-MID 1. Introduction The term 3D-MID (3D moulded interconnect devices) stands for injectionmoulded, three-dimensional circuit carriers that have been in use for many years in various fields

More information

CANDOR Industries Inc. High Quality PCB Manufacturing Solutions

CANDOR Industries Inc. High Quality PCB Manufacturing Solutions CANDOR Industries Inc High Quality PCB Manufacturing Solutions 1 Our Mission Founded in 1999, Candor is an industry leader in High Technology Printed Circuit Board Fabrication Services. Quick turn services

More information

Deepen your knowledge

Deepen your knowledge FLEX & RIGID-FLEX PRINTED CIRCUIT BOARDS Deepen your knowledge What are Flex & Rigid-flex Printed Circuit Boards? What are their similarities and differences? Their capabilities? And the design rules.

More information

Welcome to Streamline Circuits Lunch & Learn. Design for Reliability & Cost Reduction of Advanced Rigid-Flex/Flex PCB Technology

Welcome to Streamline Circuits Lunch & Learn. Design for Reliability & Cost Reduction of Advanced Rigid-Flex/Flex PCB Technology Welcome to Streamline Circuits Lunch & Learn Design for Reliability & Cost Reduction of Advanced Rigid-Flex/Flex PCB Technology Accurate PCB data is critical to the tooling process. Here are some key items

More information

Flexible PCB Plating Through Hole Considerations, Experiences and Solutions

Flexible PCB Plating Through Hole Considerations, Experiences and Solutions Presented in the ECWC 10 Conference at IPC Printed Circuits Expo, SMEMA Council APEX and Designers Summit 05 Flexible PCB Plating Through Hole Considerations, Experiences and Solutions Neil Patton Atotech

More information

Qualification and Performance Specification for Flexible Printed Boards

Qualification and Performance Specification for Flexible Printed Boards Qualification and Performance Specification for Flexible Printed Boards Developed by the Flexible Circuits Performance Specifications Subcommittee (D-12) of the Flexible Circuits Committee (D-10) of IPC

More information

Troubleshooting. for. Printed Board. Manufacture. and Assembly IPC PE-740. Revision A December Developed by THE INSTITUTE FOR INTERCONNECTING

Troubleshooting. for. Printed Board. Manufacture. and Assembly IPC PE-740. Revision A December Developed by THE INSTITUTE FOR INTERCONNECTING IPC PE-740 Revision A December 1997 Troubleshooting for Printed Board Manufacture and Assembly IPC 1997 Developed by THE INSTITUTE FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS December 1997 IPC-PE-740

More information

Manufacturing Capacity

Manufacturing Capacity Capability List Manufacturing Capacity QTA & Prototype Layer : 1L ~32 L Impedance Board Ball Grid Array ( BGA ) Blind/ Buried Via Micro Via ( Laser Drilling) Flex /Rigid Flexible PCB Series Orders Layer

More information

RO4835T Core/RO4450T Bonding Layers Multi-Layer Board Processing Guidelines

RO4835T Core/RO4450T Bonding Layers Multi-Layer Board Processing Guidelines Fabrication Technical Articles Notes RO4835T Core/RO4450T Bonding Layers Multi-Layer Board Processing Guidelines These guidelines were developed to provide fabricators basic information on processing core

More information

Basic 4-layer manufacturing process

Basic 4-layer manufacturing process Basic 4-layer manufacturing process Erwin Lemmens - AQC BV 7-11 D&E BE / Booth 1 8-11 D&E NL / Booth 18 AQC (Advanced Quality Control) BV Supplying pcb s, flex, flex-rigids, aluminium, etc - standard and

More information

IPC-2221B APPENDIX A Version 2.0 June 2018

IPC-2221B APPENDIX A Version 2.0 June 2018 IPC-2221B APPENDIX A Version 2.0 June 2018 A.1 INTRODUCTION This appendix was developed by the IPC 1-10c Test Coupon and Artwork Generation Task Group and is included in this current document revision

More information

IPC Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures IPC-6015

IPC Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures IPC-6015 ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures February 1998 A standard developed

More information

Flex and Rigid-Flex Printed Circuit Design

Flex and Rigid-Flex Printed Circuit Design Flex and Rigid-Flex Printed Circuit Design Old Content - visit altium.com/documentation Modified by on 29-Nov-2016 Related Videos Bending Lines Enhanced Layer Stack Management Layer Stack Regions A rigid-flex

More information

PRINTED CIRCUITS HANDBOOK

PRINTED CIRCUITS HANDBOOK PRINTED CIRCUITS HANDBOOK Clyde F. Coombs, Jr. Sixth Edition Me Graw New York Chicago San Francisco Lisbon London Madrid Mexico City Milan New Delhi San Juan Seoul Singapore Sydney Toronto CONTENTS List

More information

Metallization of MID Dec 2 010

Metallization of MID Dec 2 010 Metallization of MID Dec 2010 Agenda Introduction to Dow Electronic Materials MID Applications & Advantages Dow MID Metallization Processes Plating Equipment Summary Dow Business Structure Where Dow Electronic

More information

High Frequency Circuit Materials Attributes John Coonrod, Rogers Corporation

High Frequency Circuit Materials Attributes John Coonrod, Rogers Corporation High Frequency Circuit Materials Attributes John Coonrod, Rogers Corporation Specialty high frequency circuit materials have been used in the PCB industry for decades and for many different reasons. There

More information

N9000 PTFE Processing Guidelines

N9000 PTFE Processing Guidelines N9000 PTFE Substrates The Park/Nelco (previously known as Metclad) NY, NX, and NH families of RF and Microwave materials are woven fiberglass/ptfe composites for use as printed-circuit substrates. The

More information

PASSIVE COMPONENT MATERIALS HIMEC, UNIMEC, OHMCOAT

PASSIVE COMPONENT MATERIALS HIMEC, UNIMEC, OHMCOAT PASSIVE COMPONENT MATERIALS HIMEC, UNIMEC, OHMCOAT PRODUCT RANGE Sintering Materials =>> HIMEC Used for Electrodes on Passive Components For Photovoltaic Pastes (Front Side & Back Side Silver Paste ) For

More information

NiP Resistor Manufacturing Overview

NiP Resistor Manufacturing Overview 0 NiP Resistor Manufacturing Overview Thin film NiP resistive alloy material is made by electrodepositing of the NiP alloy onto copper foil (RESISTOR-CONDUCTOR MATERIAL) which is then laminated to a dielectric

More information

Sherlock 4.0 and Printed Circuit Boards

Sherlock 4.0 and Printed Circuit Boards Sherlock 4.0 and Printed Circuit Boards DfR Solutions January 22, 2015 Presented by: Dr. Nathan Blattau Senior Vice President 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 301-474-0607 www.dfrsolutions.com

More information

PRODUCTION SERVICE OF PRINTED CIRCUIT BOARDS (PCBS)

PRODUCTION SERVICE OF PRINTED CIRCUIT BOARDS (PCBS) PRODUCTION SERVICE OF PRINTED CIRCUIT BOARDS (PCBS) TESAT PCB - Manufacturing PROPRIETARY INFORMATION Tesat-Spacecom GmbH & Co. KG reserves all rights including industrial property rights, and all rights

More information

Flexible Printed Circuits Design Guide

Flexible Printed Circuits Design Guide www.tech-etch.com/flex Flexible Printed Circuits Design Guide Multilayer SMT Assembly Selective Plating of Gold & Tin-Lead Fine Line Microvias Cantilevered & Windowed Leads 1 MATERIALS CONDUCTOR Copper

More information

Bungard Surfaces Page 1 / 8

Bungard Surfaces Page 1 / 8 Bungard Surfaces Page 1 / 8 This flyer is supposed to inform you about the different kinds of surfaces for your pcb. We hope to provide interesting information. If you encounter any questions or you need

More information

Modeling Printed Circuit Boards with Sherlock 3.2

Modeling Printed Circuit Boards with Sherlock 3.2 Modeling Printed Circuit Boards with Sherlock 3.2 DfR Solutions September 23, 2014 Presented by: Dr. Nathan Blattau Senior Vice President 9000 Virginia Manor Rd Ste 290, Beltsville MD 20705 301-474-0607

More information

FABRICATING HIGH CURRENT, HEAVY COPPER PCBS

FABRICATING HIGH CURRENT, HEAVY COPPER PCBS Royal Circuit Solutions 21 Hamilton Ct, Hollister, CA 95023 (831) 636-7728 www.royalcircuits.com FABRICATING HIGH CURRENT, HEAVY COPPER PCBS INTRODUCTION All printed circuit boards (PCBs) carry current

More information

Interconnection Reliability of HDI Printed Wiring Boards

Interconnection Reliability of HDI Printed Wiring Boards Presented in the ECWC 10 Conference at IPC Printed Circuits Expo, SMEMA Council APEX and Designers Summit 05 Interconnection Reliability of HDI Printed Wiring Boards Tatsuo Suzuki Nec Toppan Circuit Solutions,

More information

ATS Document Cover Page

ATS Document Cover Page 221-008 Item Rev Status: RELEASED printed 9/20/2017 2:27:42 PM by Les Deenin ATS: OPERATIN PROCEDURE ATS Document Cover Page Responsible Department: Supply Chain This copy is uncontrolled unless otherwise

More information

Lead Free, Zero Shrink, Substrate Bonded LTCC System

Lead Free, Zero Shrink, Substrate Bonded LTCC System Lead Free, Zero Shrink, Substrate Bonded LTCC System R.L. Wahlers, A.H. Feingold and M. Heinz Electro-Science Laboratories, 416 E. Church Rd., King of Prussia, PA, 19406 Abstract Previous papers have reported

More information

NEW COPPER ELECTROLYTES FOR BLIND MICROVIA FILLING

NEW COPPER ELECTROLYTES FOR BLIND MICROVIA FILLING NEW COPPER ELECTROLYTES FOR BLIND MICROVIA FILLING Michael Dietterle, Ph.D. Dr.-Ing. Max Schlötter GmbH & Co. KG Geislingen, Germany dietterle@schloetter.de ABSTRACT Due to progressive miniaturisation

More information

Low CTE / High Tg FR-4 with High Heat Resistance

Low CTE / High Tg FR-4 with High Heat Resistance Low CTE / High Tg FR-4 with High Heat Resistance Laminate: EM-827 Prepreg: EM-827B 1 Features Tg(DSC) > 170 Z direction CTE < 3.0% (50~260 ) High thermal degradation temperature: Td > 340 Excellent thermal

More information

Optimizing Immersion Silver Chemistries For Copper

Optimizing Immersion Silver Chemistries For Copper Optimizing Immersion Silver Chemistries For Copper Ms Dagmara Charyk, Mr. Tom Tyson, Mr. Eric Stafstrom, Dr. Ron Morrissey, Technic Inc Cranston RI Abstract: Immersion silver chemistry has been promoted

More information

3M Electromagnetic Compatible Products

3M Electromagnetic Compatible Products 3M Electromagnetic Compatible Products 3Innovation Faster, smaller, lighter, easier the skyrocketing development of today s electronics requires new solutions for significant new problems. These solutions

More information

LTCC SYSTEMS and LTCC DESIGN RULES

LTCC SYSTEMS and LTCC DESIGN RULES LTCC SYSTEMS and LTCC DESIGN RULES Low Temperature Co-fired Ceramic revision status: G page 1 of 19 Table of Contents: 1 General page 3 2 Commercial LTCC tape systems page 4 3 Design possibilities page

More information

TEST REPORT (Self-Tested Data)

TEST REPORT (Self-Tested Data) TEST REPORT (Self-Tested Data) CLIENT: IPC Validation Services 3000 Lakeside Drive Suite 105N Bannockburn, IL 60015 USA Attention: Mr. Randy Cherry +1-847-597-5606 TEST ITEMS: Peel Strength, Volume Resistivity,

More information

Optimizing Immersion Silver Chemistries For Copper

Optimizing Immersion Silver Chemistries For Copper Optimizing Immersion Silver Chemistries For Copper Ms Dagmara Charyk, Mr. Tom Tyson, Mr. Eric Stafstrom, Dr. Ron Morrissey, Technic Inc Cranston RI Abstract: Immersion silver chemistry has been promoted

More information

Question: Are RO4000 materials compatible with lead-free processes? Answer:

Question: Are RO4000 materials compatible with lead-free processes? Answer: Question: Are RO4 materials compatible with lead-free processes? Answer: RO4 cores and prepregs are among the most temperature stable products available. They easily meet or exceed all expectations for

More information

FYS4260/FYS9260: Microsystems and Electronics Packaging and Interconnect Components

FYS4260/FYS9260: Microsystems and Electronics Packaging and Interconnect Components FYS4260/FYS9260: Microsystems and Electronics Packaging and Interconnect Components Presentation based on Per Ohlckers' slides Topics Introduce descriptions of geometrical, thermal and some electrical

More information

Innovative PCB Solutions. Win time and flexibility benefit from Swiss quality. THE PCB CHALLENGE Doing it together

Innovative PCB Solutions. Win time and flexibility benefit from Swiss quality. THE PCB CHALLENGE Doing it together Innovative PCB Solutions Win time and flexibility benefit from Swiss quality THE PCB CHALLENGE Doing it together INDIVIDUAL CUSTOMER SOLUTIONS from a reliable partner 2 Optiprint offers consulting, development

More information

3M Electromagnetic Compatible Products

3M Electromagnetic Compatible Products 3M Electromagnetic Compatible Products Selection Guide Revision E 3 Innovation Faster, smaller, lighter, easier the skyrocketing development of today s electronics requires new solutions for significant

More information

UL PCB Recognition what is it & why do you need to know about it

UL PCB Recognition what is it & why do you need to know about it UL PCB Recognition what is it & why do you need to know about it Presented by Emma Hudson NCAB Customer Event March 2015 UL and the UL logo are trademarks of UL LLC 2015 Agenda What is UL and what are

More information

Introduction to Embedded Passives

Introduction to Embedded Passives Introduction to Embedded Passives Passive components PTH, SMD, and now embedded passives Form factor, weight, size, height and OEM capability Tolerance values, material compatibility with PWB processing

More information

Sn-Pb plating or Tin plating

Sn-Pb plating or Tin plating 2/14 Unit mm L a a Code letter Dimension L 2..2 W 1.25.2 W t a b.4.1.4.2.4.2 t b b Fig.1 Construction and dimensions NOTE : Resistive element Electrode Protective coat Substrate Nichrome alloy thin film

More information

!"#$#%&#'(() ) **+,-./01)2-,-.3)456,1) /0! **)

!#$#%&#'(() ) **+,-./01)2-,-.3)456,1) /0! **) !"#$#%&#'(() ) **+,-./01)2-,-.3)456,1) /0!7.5853-09**) Etching Removal of unwanted or non-circuit copper from board Etch resists organic and metallic resists photoresist tin, gold, nickel, silver and alloys

More information

Flex-Rigid Design Guide

Flex-Rigid Design Guide DESIGN GUIDE Version 1.2 / March 2018 Flex-Rigid Design Guide The trend to miniaturization in electronics continues. Integrated circuit board solutions are becoming more and more popular as a means of

More information

FLEXIBLE & RIGID-FLEX CIRCUITS TECHNICAL ENGINEERING GUIDE. Delivering Quality Since 1952.

FLEXIBLE & RIGID-FLEX CIRCUITS TECHNICAL ENGINEERING GUIDE. Delivering Quality Since 1952. FLEXIBLE & RIGID-FLEX CIRCUITS TECHNICAL ENGINEERING GUIDE Delivering Quality Since 1952. DELIVERING QUALITY SINCE 1952. Epec Engineered Technologies designs and manufactures customized, built-to-print,

More information

Embedding Passive and Active Components: PCB Design and Fabrication Process Variations

Embedding Passive and Active Components: PCB Design and Fabrication Process Variations Embedding Passive and Active Components: PCB Design and Fabrication Process Variations Vern Solberg Solberg Technical Consulting Saratoga, California USA Abstract Embedding components within the PC board

More information

Offshore Wind Turbines Power Electronics Design and Reliability Research

Offshore Wind Turbines Power Electronics Design and Reliability Research Offshore Wind Turbines Power Electronics Design and Reliability Research F. P. McCluskey CALCE/Dept. Of Mechanical Engineering University of Maryland, College Park, MD (301) 405-0279 mcclupa@umd.edu 1

More information

Chapter 11: Passives: Discrete, Integrated, and Embedded. Johan Liu

Chapter 11: Passives: Discrete, Integrated, and Embedded. Johan Liu Chapter 11: Passives: Discrete, Integrated, and Embedded Johan Liu jliu@chalmers.se 1 Types of Passive Components 2 Embedded passive devices: advantages Reduced system mass, volume and footprint. Individual

More information

Axiom Electronics LLC

Axiom Electronics LLC 1 of 8 1.0 PURPOSE and SCOPE This document defines Axiom s requirements for printed circuit board (PCB) fabrication, handling, and storage. Industry standards are referenced where appropriate. This document

More information

INTERFLUX ELECTRONICS NV

INTERFLUX ELECTRONICS NV Reflow soldering temperature profiling Min : 30sec Max : 120sec Max : +4 C/sec Max : 250 C Min : 230 C Min: +0,5 C/sec Min : +1 C/sec Max : +3 C/sec Max : +1 C/sec Max : -6 C/sec Min : -2 C/sec Min : +1

More information

PEC (Printed Electronic Circuit) process for LED interconnection

PEC (Printed Electronic Circuit) process for LED interconnection PEC (Printed Electronic Circuit) process for LED interconnection Higher wattage LED s/ power components or their placement in higher densities, requires a larger dissipation of heat in a more effective

More information

Environment-friendly Halogen-free Materials for PWBs

Environment-friendly Halogen-free Materials for PWBs Environment-friendly Halogen-free Materials for PWBs Yoshiyuki Takeda*/Kenichi Ikeda*/Nozomu Takano** *R & D Group, Electronic Laminates Div., Hitachi Chemical Co., Ltd. **Research & Development Center,

More information

Component Palladium Lead Finish - Specification Approved by Executive Board 1997-xx-xx August 22 Version

Component Palladium Lead Finish - Specification Approved by Executive Board 1997-xx-xx August 22 Version Component Palladium Lead Finish - Specification Approved by Executive Board 1997-xx-xx August 22 Version Appendices 1. User Commitment Form 2. Supplier Compliance Form Table of contents 1. Background 2.

More information

Taconic Advanced Dielectric Division. Thomas McCarthy. Sean Reynolds. Jon Skelly

Taconic Advanced Dielectric Division. Thomas McCarthy. Sean Reynolds. Jon Skelly Strategies for Designing Microwave Multilayer Printed Circuit Boards Using Stripline Structures Taconic Advanced Dielectric Division Thomas McCarthy Sean Reynolds Jon Skelly Multilayer/Stripline Design

More information

ESPANEX L Series. Technical data sheet Nishigotanda Shinagawa Tokyo, , Japan TEL FAX

ESPANEX L Series. Technical data sheet Nishigotanda Shinagawa Tokyo, , Japan TEL FAX ESPANEX L Series Technical data sheet This sheet will be changed without any information in advance. The data on this sheet are solely for your reference and are not to be constructed as constituting a

More information

English version. Precision in detail

English version. Precision in detail English version Precision in detail PCB TECHNOLOGY SURFACE TECHNOLOGY SMALL EQUIPMENT FOR SURFACE TREATMENT 2 3 PRECISION Over 40 years of experience and passion For over 40 years the Walter Lemmen Ltd.

More information

B-IS400 IS420/3 IS400 IS420 PCL370HR. Temperature resistant mid and high T g - base materials with low z-axis expansion CAF ENHANCED

B-IS400 IS420/3 IS400 IS420 PCL370HR. Temperature resistant mid and high T g - base materials with low z-axis expansion CAF ENHANCED J B-IS4 IS42/3 IS4 IS42 PCL37HR Temperature resistant mid and high T g - base materials with low z-axis expansion CAF ENHANCED Temperature-resistant base materials with low z-axis expansion IS4, IS42 and

More information

ESA s approach to quality control of the supply chain for PCBs. Stan Heltzel European Space Agency

ESA s approach to quality control of the supply chain for PCBs. Stan Heltzel European Space Agency ESA s approach to quality control of the supply chain for PCBs Stan Heltzel European Space Agency Outline A. ESA s approach to supply chain control for PCBs B. Case study: contamination in PCBs 1. Problem

More information

1.3.2 Nanotechnology Nanoporosity Deposition Methods Dissolution Methods

1.3.2 Nanotechnology Nanoporosity Deposition Methods Dissolution Methods Table of Contents 1. Metal Finishing 1 1.1 Introduction 1 1.1.1 Description of Industrial Activity Covered 1 1.1.2 Environmental and Legislative Background 3 1.1.3 Emerging Technology or Research? 4 1.2

More information

IPC-AJ-820A Assembly and Joining Handbook. The How and Why of All Things PCB & PCA

IPC-AJ-820A Assembly and Joining Handbook. The How and Why of All Things PCB & PCA IPC-AJ-820A Assembly and Joining Handbook The How and Why of All Things PCB & PCA 1 Scope To provide guidelines and supporting info for the mfg of electronic equipment To explain the HOW TO and WHY Discussions

More information

Verifying The Reliability Of Connections In HDI PWBs

Verifying The Reliability Of Connections In HDI PWBs Verifying The Reliability Of Connections In HDI PWBs The stacking of via holes is used effectively in the development of high density circuits on build-up printed wiring boards (PWBs). However, when micro

More information

UBE Polyimide Film Exhibits Industry Leading Heat Resistance

UBE Polyimide Film Exhibits Industry Leading Heat Resistance UBE Polyimide Film Exhibits Industry Leading Heat Resistance Super-heat resistant polyimide film produced from UBE s exclusive BPDA (Biphenyl tetracarboxylic dianhydride) monomers. This formulation is

More information

All-Polyimide Thermal Interface Products

All-Polyimide Thermal Interface Products All-Polyimide Thermal Interface Products SMTA Harsh Environment Electronics Workshop Dearborn, MI 6/24/03 Jim Fraivillig Fraivillig Technologies Boston, MA Why polyimide? HARSH ENVIRONMENT ELECTRONICS.

More information

Process & Capability Manual (Vol )

Process & Capability Manual (Vol ) Process & Capability Manual (Vol. 12-2015) Seite 1 von 13 1 CHAPTER OVERVIEW 1 CHAPTER OVERVIEW... 2 2 MICROCIRTEC A SHORT PROFILE... 3 2.1 WHO WE ARE... 3 2.2 OBJECTIVES & MARKETS... 3 2.3 DECLARATION

More information

2W, 2512, 4-Terminal, Low Resistance Chip Resistor (Lead / Halogen Free)

2W, 2512, 4-Terminal, Low Resistance Chip Resistor (Lead / Halogen Free) 2W, 2512, 4-Terminal, Low Resistance Chip Resistor (Lead / Halogen Free) 1. Scope This specification applies to 3.2mm x 6.4mm size 2W, fixed metal foil with ceramic carrier current sensing resistors used

More information

Features Conductive Room Temperature Cure. Product Ref IP 4525IP Low viscosity adhesive & coating. High thermal conductivity

Features Conductive Room Temperature Cure. Product Ref IP 4525IP Low viscosity adhesive & coating. High thermal conductivity Properties and Part Selection Overview Selection Table - Epoxy-Based Adhesive Properties Features Conductive Room Temperature Cure Product Ref 120 132 4461IP 42IP 438 700 Properties High electrical conductivity

More information

Precision Engineered Parts

Precision Engineered Parts Precision Engineered Parts Photoetching Laser Cutting Forming Finishing Thin Metal Parts Flexible Circuits EMI Shielding Gaskets www.tech-etch.com PHOTOETCHING Tech-Etch specializes in the manufacture

More information

Thermal Reliability of Laser Ablated Microvias and Standard Through-Hole Technologies as a Function of Materials and Processing

Thermal Reliability of Laser Ablated Microvias and Standard Through-Hole Technologies as a Function of Materials and Processing Thermal Reliability of Laser Ablated Microvias and Standard Through-Hole Technologies as a Function of Materials and Processing Todd Young Isola Frank Polakovic and Michael Carano Electrochemicals Inc.

More information

Materials and basic processes in microelectronics

Materials and basic processes in microelectronics Materials and basic processes in microelectronics Frøydis Oldervoll SINTEF ICT Instrumentation department Oldervoll Mars 2009 IKT 1 Introduction Materials and basic processes Die attach Interconnect Encapsulation

More information

c/bach, 2-B Pol. Ind Foinvasa Montcada i Reixac (Barcelona) SPAIN Tel FAX

c/bach, 2-B Pol. Ind Foinvasa Montcada i Reixac (Barcelona) SPAIN Tel FAX 1- What is 2- How does it work? 3- How do we make it? 4- Applications 5- Processing? WHAT IS? Thick aluminium based substrate, cladded in ED copper foil. Designed for an effective thermal dissipation and

More information

Flexible Substrates for Smart Sensor Applications

Flexible Substrates for Smart Sensor Applications Flexible Substrates for Smart Sensor Applications A novel approach that delivers miniaturized, hermetic, biostable and highly reliable smart sensor modules. AUTHORS Dr. Eckardt Bihler, Dr. Marc Hauer,

More information

Company Overview Markets Products- Capabilities

Company Overview Markets Products- Capabilities Company Overview Markets Products- Capabilities A Simpler way for PCB production. www.purepcb.co.uk What can Pure do for you? From 1 off Circuit upward, No MOQ/MOV High Mix Production Focus. Fast Turn

More information

ROLINX Laminated Busbar. Design Rules Version 01 (12/2015)

ROLINX Laminated Busbar. Design Rules Version 01 (12/2015) ROLINX Laminated Busbar Design Rules Version 01 (12/2015) Content 1. Introduction... 03 7. Features... 13 2. Configuration...03 8. Thermal parameters... 14 3. Products... 04 9. General parameters... 14

More information

A Novel Material for High Layer Count and High Reliability Printed Circuit Boards

A Novel Material for High Layer Count and High Reliability Printed Circuit Boards A Novel Material for High Layer Count and High Reliability Printed Circuit Boards Jie Wan, Junqi Tang, Xianping Zeng Shengyi Technology Co., Ltd. No.5 Western Industry Road, North Industry District SSL

More information

Integrated Metallization System for High Density Interconnects and Modified Semi Additive processing

Integrated Metallization System for High Density Interconnects and Modified Semi Additive processing Integrated Metallization System for High Density Interconnects and Modified Semi Additive processing Kesheng Feng, Tim Spencer, Jim Watkowski Electronics Solutions, MacDermid, Inc. 227 Freight Street,

More information

Design and Construction Affects on PWB Reliability Paul Reid PWB Interconnect Solutions

Design and Construction Affects on PWB Reliability Paul Reid PWB Interconnect Solutions Design and Construction Affects on PWB Reliability Paul Reid PWB Interconnect Solutions The reliability, as tested by thermal cycling, of printed wire boards (PWB) are established by three variables; copper

More information

3M Electrically Conductive Adhesive Transfer Tape 9707

3M Electrically Conductive Adhesive Transfer Tape 9707 Technical Data May 2014 3M Electrically Conductive Adhesive Transfer Tape 9707 Product Description 3M Electrically Conductive Adhesive Transfer Tape (ECATT) 9707 is a pressure sensitive adhesive (PSA)

More information

PRINTED WIRING BOARDS, HIGH RELIABILITY, SPACE USE, GENERAL SPECIFICATION FOR

PRINTED WIRING BOARDS, HIGH RELIABILITY, SPACE USE, GENERAL SPECIFICATION FOR Registration No.1099 JAXA-QTS-2140D Superseding JAXA-QTS-2140C Cancelled PRINTED WIRING BOARDS, HIGH RELIABILITY, SPACE USE, GENERAL SPECIFICATION FOR JAXA JAPAN AEROSPACE EXPLORATION AGENCY This document

More information

PRINTED WIRING BOARDS, HIGH RELIABILITY, SPACE USE, GENERAL SPECIFICATION FOR

PRINTED WIRING BOARDS, HIGH RELIABILITY, SPACE USE, GENERAL SPECIFICATION FOR Registration No.1126 JAXA-QTS-2140E Superseding JAXA-QTS-2140D Cancelled PRINTED WIRING BOARDS, HIGH RELIABILITY, SPACE USE, GENERAL SPECIFICATION FOR JAXA JAPAN AEROSPACE EXPLORATION AGENCY This document

More information

Bar Code Labels for Circuit Boards

Bar Code Labels for Circuit Boards Bar Code Labels for Circuit Boards OVERVIEW Electronics manufacturers face incessant pressures to increase the reliability and functionality of their products, while reducing costs. Bar code technology

More information

TECHNICAL DATA SHEET 1 P a g e Revised January 9, 2014

TECHNICAL DATA SHEET 1 P a g e Revised January 9, 2014 1 P age Revised January 9, 2014 TAIYO PSR-4000 CC01SE (UL Name: PSR-4000JV / CA-40JV) LIQUID PHOTOIMAGEABLE CURTAIN COAT SOLDER MASK Curtain Coat Application Aqueous Developing Solder Mask RoHS Compliant

More information

Via Filling: Challenges for the Chemistry in the Plating Process

Via Filling: Challenges for the Chemistry in the Plating Process Via Filling: Challenges for the Chemistry in the Plating Process Mike Palazzola Nina Dambrowsky and Stephen Kenny Atotech Deutschland GmbH, Germany Abstract Copper filling of laser drilled blind micro

More information

High Tg Bromine-free Laminates for PWB Applications

High Tg Bromine-free Laminates for PWB Applications Presented at IPC Printed Circuits EXPO www.ipcprintedcircuitexpo.org High Tg Bromine-free Laminates for PWB Applications Marty Choate Isola Abstract The development of halogen free materials has been a

More information

ICDs (InterConnect Defects) What are they? Where do they come from? How can we make them go away? Doug Trobough Suixin Zhang

ICDs (InterConnect Defects) What are they? Where do they come from? How can we make them go away? Doug Trobough Suixin Zhang ICDs (InterConnect Defects) What are they? Where do they come from? How can we make them go away? Doug Trobough Suixin Zhang Definition of ICD ICDs are any defect that occurs adjacent to the innerlayer

More information

CHAPTER 3 ELECTROPLATING OF FDM-ABS

CHAPTER 3 ELECTROPLATING OF FDM-ABS 31 CHAPTER 3 ELECTROPLATING OF FDM-ABS 3.1 INTRODUCTION Electroplating can be referred to as, an electrodeposition process for producing a thick and consistent coating, using of metal or alloys, upon a

More information

NP-180R NAN YA PLASTICS CORPORATION ELECTRONIC MATERIALS DIVISION. COPPER CLAD LAMINATE DEPARTMENT NO TUNG HWA N. ROAD, TAIPEI, TAIWAN.

NP-180R NAN YA PLASTICS CORPORATION ELECTRONIC MATERIALS DIVISION. COPPER CLAD LAMINATE DEPARTMENT NO TUNG HWA N. ROAD, TAIPEI, TAIWAN. New: 2014/04/30 flame retardant copper clad laminate NP-180R High Tg 175 (DSC) Excellent dimensional stability through-hole reliability Excellent electrical, chemical and heat resistance properties IPC-4101C

More information