Platinum Temperature Sensors

Transcription

1 Platinum Temperature Sensors 1/21 General Information In many sectors, temperature measurement is one of the most important physically defined parameter to determine product quality, security and reliability. Temperature sensors are produced with different technologies to fit specific application requirements. To this end, IST has concentrated the development, manufacturing processes and materials to produce high-end thin-film temperature sensors. This know-how, partially derived from the semiconductor industry, allowing IST to manufacture sensors in very small dimensions. Thin-film temperature sensors exhibit a very short response time due to their low thermal mass. The technologies and processes of IST thin-film sensors combines the positive attributes of traditional wirewound platinum sensors - accuracy, long-term stability, repeatability and interchangeability within a wide temperature range. The advantages of thin-film mass-production creates an optimal price/performance ratio. Construction The temperature sensor consists of a high-purity platinum meander, photolithographically structured on a ceramic substrate. The resistivity is laser-trimmed and precisely adjusted to the final value. The resistive structure is covered with a glass passivation layer protecting the sensor against mechanical and chemical damages. The welded leadwires are covered with an additional fixation layer. Special Features Fast response time Small dimensions Excellent long-term stability Vibration and temperature shock resistant Low self-heating Simple interchangeability Optimal price/performance ratio Long-Term Stability For all sensor types up to 7W (750 C), the change in ohmic value after hrs is less than 0.04% at maximum operating temperatures. Nominal Value and Temperature Coefficent The nominal value of the sensor is the defined value of the sensor resistance at 0 C. The temperature coefficient α (TCR) is defined as R - R0 α = [K -1 ] according to the DIN IEC 751 numerical value of K -1. R0 Generally, the value is defined in ppm/k. This example defines 3850ppm/K.

2 Platinum Temperature Sensors 2/21 Temperature Characteristic Curve The curve determines the relationship between the electrical resistance and the temperature. The below temperature curves refers to DIN EN standards to 0 C R(T) = R 0 (1 + A * T + B * T 2 + C * [T-] * T 3 ) 0 to 850 C R(T) = R 0 (1 + A * T + B * T 2 ) Platinum (3850 ppm/k): A = * 10-3 [ C -1 ]; B = * 10-7 [ C -2 ]; C = * [ C -4 ] C Platinum (3911 ppm/k): A = * 10-3 [ C -1 ]; B = * 10-7 [ C -2 ]; C = * [ C -4 ] Other TCR available Platinum (3750 ppm/k): A = * 10-3 [ C -1 ]; B = * 10-7 [ C -2 ]; C = -6 * [ C -4 ] Platinum (3770 ppm/k): A = * 10-3 [ C -1 ]; B = * 10-7 [ C -2 ]; R 0 = Resistance value in ohm at 0 C; T = Temperature in accordance with ITS 90 t [K] B A Y t [ C] General standard deviations Tolerance Classes DIN EN Norm Temperature sensors are classified according to DIN EN 60751, Class +/- deviations IST AG Temperature in C reference range of validity DIN EN 60751, F 0.1 (formerly class 1/3 DIN B) x T Y -50 C to +150 C DIN EN 60751, F 0.15 (formerly class A) x T A -90 C to +300 C DIN EN 60751, F 0.3 (formerly class B) x T B -200 C to +850 C 2 DIN EN 60751, F 0.6 (formerly class C) x T C -200 C to +850 C 1/5 DIN EN F x T K on request 1/10 DIN EN F x T K on request T is the numerical value of the temperature in C without taking leading signs into account. Applied Current The current applied is highly dependent on the application and leads to self-heating effects. Depending on the thermal transfer from the sensor into the application, the current can be increased. There is no bottom current limit for platinum thin-film sensors. The maximum current for sensors between 750 C and C (7W, 8W, 10W) should not exceed 1mA. Recommended current supplies: Ω: 1mA 500 Ω: 0.5mA Ω: 0.3mA 2000 Ω: 0.2mA 0 Ω: 0.1mA The measurement point is 5mm from the wire end. For long wires (>20mm) the resistance is compensated (measured at room temperature) to ensure the correct resistance at the chip edge.

3 Platinum Temperature Sensors 3/21 Self Heating The electric current generates self-heating resulting in errors of measurement. To minimize the error, the testing current should be kept as low as possible. The measurement error caused by self-heating is dependent on temperature error T = RI 2 / E. E = self-heating coefficient in mw/k, R = resistance in kω, I = measuring current in ma Response Time The response time is defined as the time in seconds the sensor needs to detect the change in temperature. T 0.63 describes the time in seconds the sensor needs to measure 63% of the temperature change. The response time is depending on the sensor dimensions, the thermal contact resistance and the surounding medium. Dimensions Number Sensor Size Response Time in Seconds Self-Heating L x W x T / H Water 0.4 m/s Air 1m/s Water Air v = 0 m/s v = 0 m/s t 0.5 t 0.63 t 0.9 t 0.5 t 0.63 t 0.9 mw/k T[mK]* mw/k T[mK ]* x 1.2 x 0.25/ x 0.8 x 0.25/ x 2.0 x 0.25/ x 2.0 x 0.65/ x 1.6 x 0.65/ x 2.0 x 0.65/ x 2.5 x 0.65/ x 1.6 x 0.65/ x 2.0 x 0.65/ x 2.5 x 0.65/ x 3.8 x 0.65/ x 5.0 x 0.65/ x 2.0 x 0.65/ x 13 x Ø x 13 x Ø x 13 x Ø x 13 x Ø SMD x 1.6 x SMD x 1.2 x FC x 0.75 x *self heating T[mK] measured with Pt 8 at 1mA applied current at 0ºC L: Sensor length (without connections) T: Sensor thickness (without connections) W: Sensor width H: Sensor height (incl. connections and strain relief) The values in the table are for informative purposes only. Based on the assembly method and the different measurement conditions, self-heating and response time can variate. Dimensions Tolerances Sensor width (W) ± 0.2 mm Sensor length (L) ± 0.2 mm Sensor height (H) ± 0.3 mm Sensor thickness (T) ± 0.1 mm Wire length ± 1.0 mm (5-30 mm) Wire length >30mm, tolerances on request

4 Platinum Temperature Sensors 4/21 CustomSens Thin-film temperature sensors with universal connection possibilities To best serve our customers needs, IST policy is putting forward as many sensor options as possible. The true to this policy is to create and provide a versatile CustomSens product solution facing all customer specific requirements. The highlight of these thin-film temperature sensor solutions is the flexibility of determining your own packaging which could help to improve your assembly solutions considerably. You can decide how much work we should take off your hands. You can choose between short or long leads, whether they are to be bare or insulated, and whether the sensor is to be completed in 2-, 3- or even 4-wire technology. It is not only the great choice of these variables which offers you many advantages. Through our customized connection structure we can propose you sensors directly soldered on a metallic surface (such as copper, stainless steel, or brass) and which is also characterized by superior product properties, giving you a double benefit. Universal connection solutions Directly welded: Leads up to mm, 2- / 3-/ 4-wire, bare wire, PTFE insulated solutions ( C), single wire or stranded wire (generally AWG30, or AWG28/7), with connectors (e.g. JST PHR-2, JST ZHR-3, Molex 6471). Extended: All lead length available, 2- / 3-/ 4-wire extensions, extended by soldering process, welding or brazing, connection protections using shrinking sleeves, PTFE insulated solutions (-50 C +200 C), or using glas fibre sleeves ( C). Sensors soldered on metallic surface All our sensor solutions with metallised backside can be soldered on a metallic sheet or surface. Enhanced thermal contact to the measured medium improves response time considerably. Based on our experience and outstanding soldering processes we can offer you various solutions with backside solderable sensors (even on stainless steel materials) at favourable prices. Sensors with soft-coating Depending on the assembly method and various materials used for housing and potting, the sensor element could change it s caracteristic curve or basic value. We can offer you sensors with soft-coating creating a deformable zone to avoid any mechanical stress against the sensing element caused by embedding materials. Sensors with custom housing Within our large product range we can offer you custom specific housings. Depending on your requirements with regard to dimensions, electrical specifications, temperature range, tolerances etc., or based on your formal drawing, we can propose you a suitable assembly solution.

5 Platinum Temperature Sensors 5/21 SMD - Product Series Temperature Range: -50 C (250) C RTDs in SMD construction DIN EN class F 0.3 (formerly class B) and class F 0.15 (formerly class A) available Technical Data Temperature range: -50 C to +150 C (2P), -50 C to +250 C (3P, 4P) Accuracy: DIN EN F 0.15 (Class A) DIN EN F 0.3 (Class B) 2x DIN EN F 0.3 (Class B) Contacts: Contacts around the sides: 2P = Contacts tin-coated (96.5Sn/3Ag/0.5Cu), LMP lead-free, reflow soldering 3P = Contacts tin-coated (5Sn/93.5Pb/1.5Ag), HMP, reflow soldering 4P = Contacts gold-coated, solderable coating The soldering process can influence accuracy. Solderability: 235 C 8s (DIN IEC 68 T2-20, Ta Meth. 1) Resistance to soldering heat: 260 C 10s (DIN IEC 68 T2-20, Ta Meth. 1A) Long-term stability: Maximal drift = 0.04% after h at 130 C LxW 2.0 x 1.2 P0K xP.x 500 LxW 2.0 x 1.2 P0K xP.x LxW 2.0 x 1.2 P1K xP.x LxW 3.2 x 1.6 P0K xP.x 500 LxW 3.2 x 1.6 P0K xP.x LxW 3.2 x 1.6 P1K xP.x

6 Platinum Temperature Sensors 6/21 FC - Product Series Temperature Range: -50 C /250/400/600 C RTDs without leadwires as Flip Chip (FC) construction The contacts are solderable (1FC, 2FC, 5FC), bondable (3FC) or weldable (6FC) DIN EN class F 0.3 (formerly class B) available Technical Data Temperature range: -50 C to +150 C (1FC), -50 C to +250 C (2FC, 3FC), -50 C to +400 C (5FC), -50 C to +600 C (6FC) Accuracy: DIN EN F 0.3 (Class B), 2x DIN EN F 0.6 (Class 2B) Contacts: Pads: 1FC = Contacts tin-coated, soldering depot, LMP lead-free, % Sn (reflow soldering) 2FC = Contacts tin-coated, soldering depot, HMP, 5Sn/93.5Pb/1.5Ag (reflow soldering) 3FC = Au-Pads (bonding pads), various types available 5FC = Reinforced thinfilm Pt-pads (solderable pads) 6FC = Thick film Pt-pads (weldable) The soldering process can influence accuracy. Solderability: 235 C 8s (DIN IEC 68 T2-20, Ta Meth. 1) 1FC, 2FC, 5FC Resistance to soldering 260 C 10s (DIN IEC 68 T2-20, Ta Meth. 1A) 1FC, 2FC, 5FC heat: Long-term stability: Maximal drift = 0.04% after h at 130 C Chip- Dimensions in mm P0K1.232.xFC.x 500 P0K5.232.xFC.x P1K0.232.xFC.x LxW 2.0 x 1.2 P0K xFC.x 500 LxW 2.0 x 1.2 P0K xFC.x LxW 2.0 x 1.2 P0K xFC.x other chip sizes available

7 Platinum Temperature Sensors 7/21 2S Product Series Temperature Range: -50 C C RTDs with SIL connections 10mm length Advantages: - Solderable, weldable, crimpable - Very robust connections - Connections remain in shape - Easy handling LxW 3.0 x 2.5 P0K S.010 LxW 3.0 x 2.5 P1K S.010 LxW 5.0 x 2.5 P0K S.010 LxW 5.0 x 2.5 P1K S.010 LxW 5.0 x 3.8 P0K S.010 LxW 5.0 x 3.8 P1K S.010 LxW 5.0 x 5.0 P0K S.010 LxW 5.0 x 5.0 P1K S.010

8 Platinum Temperature Sensors 8/21 2I/2L - Product Series Temperature Range: -50 C C RTDs with long insulated lead wires 2I 2L Cu/Ag-single wire, PTFE insulated, AWG 30, length >20 mm (solderable, weldable crimpable) Cu/Ag-stranded wire, PTFE insulated, AWG 30/7, length >20 mm (solderable, weldable, crimpable) LxW 1.6 x 1.2 P0K I.x.x LxW 1.6 x 1.2 P1K I.x.x (AWG 32) P0K I.x.x 500 P0K I.x.x P1K I.x.x P0K L.x.x P1K L.x.x LxW 5.0 x 1.6 P0K I.x.x 500 LxW 5.0 x 1.6 P0K I.x.x LxW 5.0 x 1.6 P1K I.x.x LxW 5.0 x 2.0 P0K I.x.x LxW 5.0 x 2.0 P1K I.x.x LxW 5.0 x 2.0 LxW 5.0 x 2.0 P0K L.x.x P1K L.x.x see page 4 for other chip versions

9 Platinum Temperature Sensors 9/21 3FW - Product Series Temperature Range: C RTDs with flat wire (FW) connections Ni/Au flat wire 0.2 x 0.4 x 7/10 mm (HxWxL), (solderable, weldable, crimpable) LxW 2.5 x 1.6 P0K FW.x.x LxW 2.5 x 1.6 P1K FW.x.x LxW 2.0 x 2.0 P0K FW.x.x 500 LxW 2.0 x 2.0 P0K FW.x.x LxW 2.0 x 2.0 P1K FW.x.x P0K FW.x.x 500 P0K FW.x.x P1K FW.x.x 500 LxW 5.0 x 2.0 P0K FW LxW 5.0 x 2.0 P10K.520.3FW.010 other chip sizes and connection lengths available

10 Platinum Temperature Sensors 10/21 4W - Product Series Temperature Range: -200 C C RTDs with wire connections Ag-wire 0.25mm x 10mm (Ø x L), (solderable, weldable) i mm LxW 1.6 x 1.2 P0K W.x LxW 1.6 x 1.2 P0K W.x.010 LxW 1.6 x 1.2 P1K W.x.010 LxW 2.0 x 2.0 P0K W.x LxW 2.0 x 2.0 P0K W.x.010 LxW 2.0 x 2.0 P1K W.x LxW 2.0 x 2.0 P2K W.x LxW 2.5 x 1.6 P0K W.x.010 P0K W.x P0K W.x.010 P1K W.x P2K W.x.010 LxW 5.0 x 1.6 P0K W.x LxW 5.0 x 1.6 P0K W.x.010 LxW 5.0 x 1.6 P1K W.x LxW 5.0 x 1.6 P2K W.x.010

11 Platinum Temperature Sensors 11/21 4W - Product Series Temperature Range: -200 C C LxW 5.0 x 2.0 P0K W.x LxW 5.0 x 2.0 P0K W.x.010 LxW 5.0 x 2.0 P1K W.x LxW 5.0 x 2.0 P10K.520.4W.x LxW 5.0 x 3.8 P0K W.x.010 LxW 5.0 x 3.8 P1K W.x LxW 5.0 x 5.0 P0K W.x.010 LxW 5.0 x 5.0 P1K W.x LxW 10.0 x 2.0 P0K W.x LxW 10.0 x 2.0 P0K W.x.010 LxW 10.0 x 2.0 P1K W.x.010 other chip sizes and connection lengths available

12 Platinum Temperature Sensors 12/21 6W - Product Series Temperature Range: -200 C C RTDs with wire connections Pt/Ni clad wire 0.2mm x 10mm (Ø x L), (solderable, weldable, crimpable) LxW 1.6 x 1.2 P0K W.x LxW 1.6 x 1.2 P0K W.x.010 LxW 1.6 x 1.2 P1K W.x.010 LxW 2.0 x 2.0 P0K W.x LxW 2.0 x 2.0 LxW 2.0 x 2.0 LxW 2.0 x 2.0 P0K W.x.010 P1K W.x.010 P2K W.x LxW 2.5 x 1.6 P0K W.x.010 LxW 2.5 x 1.6 P1K W.x.010 P0K W.x P0K W.x.010 P1K W.x P2K W.x.010

13 Platinum Temperature Sensors 13/21 6W - Product Series Temperature Range: -200 C C 500 LxW 5.0 x 1.6 P0K W.x.010 LxW 5.0 x 1.6 P1K W.x LxW 5.0 x 1.6 P2K W.x.010 LxW 5.0 x 2.0 P0K W.x LxW 5.0 x 2.0 P0K W.x.010 LxW 5.0 x 2.0 P1K W.x LxW 5.0 x 2.0 P10K.520.6W.x.010 LxW 5.0 x 3.8 P0K W.x.010 LxW 5.0 x 3.8 P1K W.x.010 LxW 10.0 x 2.0 P0K W.x LxW 10.0 x 2.0 P0K W.x.010 LxW 10.0 x 2.0 P1K W.x.010 other connection lengths available

14 Platinum Temperature Sensors 14/21 7W - Product Series Temperature Range: -200 C C RTDs with wire connections Platinum wire 0.2mm x 7mm (Ø x L), (solderable, weldable, crimpable) P0K W.x.007 P1K W.x.007 LxW 5.0 x 1.6 P0K W.x LxW 5.0 x 1.6 P0K W.x.007 LxW 5.0 x 1.6 P1K W.x.007 LxW 5.0 x 2.0 P0K W.x LxW 5.0 x 2.0 P0K W.x.007 LxW 5.0 x 2.0 P1K W.x.007 LxW 10.0 x 2.0 P0K W.x LxW 10.0 x 2.0 P0K W.x.007 LxW 10.0 x 2.0 P1K W.x.007 other chip sizes and connection lengths available

15 Platinum Temperature Sensors 15/21 8W - Product Series Temperature Range: -200 C C RTDs with wire connections Platinum wire 0.2mm x 7mm (Ø x L), (solderable, weldable, crimpable) LxW 5.0 x 1.6 P0K W.x.007 LxW 5.0 x 1.6 P1K W.x LxW 4.0 x 2.0 P0K W.x W/10K - Product Series Temperature Range: -70 C...+ C RTDs with wire connections Temperature coefficient 3770 ppm/k DPH - platinum wire 0.2mm x 7mm (Ø x L), (solderable, weldable, crimpable) Example of chip size 200 LxW 4.0 x 2.0 P0K K.K.007

16 Platinum Temperature Sensors 16/21 PW - Product Series Temperature Range: -200 C C RTDs in class F 0.15 from -200 C to +600 C Advantages: - Alternative to wire-wound sensors - Reduced hysteresis - Increased long-term stability - Short-term applicable up to +750 C Platinum wire 0.2mm x 7mm (Ø x L), (solderable, weldable, crimpable) Temperature coefficient 3850 ppm/k F 0,1 (class 1/3 DIN B) F 0,15 (formerly class A) F 0,3 (formerly class B) Class 1/5 DIN B Class 1/10 DIN B -200 C to +500 C -200 C to +600 C -200 C to +600 C - C to +300 C -50 C to +125 C Example of chip size 500 LxW 2.5 x 1.6 LxW 2.5 x 1.6 LxW 2.5 x 1.6 PW0K W.x.007 PW0K W.x.007 PW0K W.x.007 Also available in round housing Example of chip size LxØ 13.0 x 2.8 PW0K W.x.R 500 LxØ 13.0 x 2.8 PW0K W.x.R LxØ 13.0 x 2.8 PW1K W.x.R

17 Platinum Temperature Sensors 17/21 PG - Product Series Temperature Range: -200 C C RTDs with temperature coefficient 3911 ppm/k Advantages: - Alternative to wire-wound sensors - Reduced hysteresis - Short-term applicable up to +750 C Temperature range: -200 C +600 C: Platinum wire 0.2mm x 7mm (Ø x L), (solderable, weldable, crimpable) F 0,1 (class 1/3 DIN B) F 0,15 (formerly class A) F 0,3 (formerly class B) -200 C to +500 C -200 C to +600 C -200 C to +600 C Temperature range: -200 C +400 C: Pt/Ni clad wire 0.2mm x 7mm (Ø x L), (solderable, weldable, crimpable) F 0,1 (class 1/3 DIN B) F 0,15 (formerly class A) F 0,3 (formerly class B) -200 C to +400 C -200 C to +400 C -200 C to +400 C Example of chip size LxW 2.5 x 1.6 LxW 2.5 x 1.6 LxW 2.5 x 1.6 LxW 2.5 x 1.6 PG1K W.x.007 PG1K W.x.007 PG1K W.x.007 PG1K W.x LxW 2.5 x 1.6 LxW 2.5 x 1.6 LxW 2.5 x 1.6 PG K.x.007 PG0K K.x.007 PG1K K.x.007 Also available in round housing Example of chip size LxØ 13.0 x 2.8 LxØ 13.0 x 2.8 LxØ 13.0 x 2.8 LxØ 13.0 x 2.8 PG W.x.R PG0K W.x.R PG0K W.x.R PG1K W.x.R 50 LxØ 13.0 x 2.8 LxØ 13.0 x 2.8 LxØ 13.0 x 2.8 PG K.x.R PG0K K.x.R PG1K K.x.R

18 Platinum Temperature Sensors 18/21 4SW - Product Series Temperature Range: -200 C C RTDs with perpendicular wire connections Silver wire 0.25mm x 10mm (Ø x L), (solderable, weldable) Example of chip size 500 P0K SW.x.010 P0K SW.x.010 P1K SW.x.010 available with metallised (solderable) backside other connection lengths and chip sizes available U - Product Series Temperature range: -200 C C RTDs with backwards welded wire connections Advantages: - Improved isolation towards mounting surface - Wires can be bent vertically over the chip area - Ideal for limited space requirements 500 LxW 1.6 x 1.2 LxW 1.6 x 1.2 LxW 1.6 x 1.2 P0K I.x.040.U P0K I.x.040.U P1K I.x.040.U 500 P0K I.x..U P0K I.x..U P1K I.x..U P0K W.x.010.U also available with metallised (solderable) backside

19 Platinum Temperature Sensors 19/21 T/D Product Series Temperature Range: -200 C /600/850 C RTDs with thinner substrate thickness for a fast response time Ag wire 400 C, 0.25mm x 15mm (Ø x L), (solderable, weldable, crimpable) Pt/Ni Clad wire 600 C, 0.2mm x 10mm (Ø x L), (solderable, weldable, crimpable) Substrate thicknesses: T (10 mils) = mm D (15 mils) = 0.38 mm 0.9 P0K W.x.010.T 500 P0K W.x.010.T P1K W.x.010.T 200 P0K W.x.010.D P0K W.x.010.D LxW 5.0 x 2.0 P0K W.x.007.T LxW 5.0 x 2.0 P0K W.x.007.D other chip sizes, nominal values and wire lengths available

20 Platinum Temperature Sensors 20/21 R - Product Series Temperature Range: -50 C C RTDs in round ceramic housing Only applicable in dry environments Pt/Ni clad wire 0.2mm x 7mm (Ø x L), (solderable, weldable, crimpable) LxØ 13.0 x 4.5 P0K W.x.R 500 LxØ 13.0 x 4.5 P0K W.x.R LxØ 13.0 x 4.5 P1K W.x.R 2 x LxØ 13.0 x 4.5 2xP0K W.x.R 2 x 500 LxØ 13.0 x 4.5 2xP0K W.x.R 2 x LxØ 13.0 x 4.5 2xP1K W.x.R LxØ 13.0 x 2.8 P0K W.x.R 500 LxØ 13.0 x 2.8 P0K W.x.R LxØ 13.0 x 2.8 P1K W.x.R 2 x LxØ 13.0 x 2.8 2xP0K W.x.R 2 x 500 LxØ 13.0 x 2.8 2xP0K W.x.R 2 x LxØ 13.0 x 2.8 2xP1K W.x.R other nominal values and wire lengths available

21 Platinum Temperature Sensors 21/21 Order Information P. 1 K W. B M Temperaturerange 1-50 C to 150 C 2-50 C to 200 C C to 300 C C to 400 C C to 600 C C to 750 C C to 850 C C to C Mechanical Dimensions (see various Dimensions) Resistance value in ohm at 0 C Characteristic curve Pt 3850 ppm/k W Pt 3850 ppm/k (extended temperature range) U Pt 3750 ppm/k G Pt 3911 ppm/k Material identification P Platinum *Additional details, specifications required from the customer Specials T Substrate thickness 0.25 mm D Substrate thickness 0.38 mm R Round housing W Sintered powder M Metallised (solderable) backside U Wire connections backward welded S Special* Connection length Tolerance classes A Class F 0.15 (formerly Class A) B Class F 0.3 (formerly Class B) C Class 2 x F 0.3 (formerly 2 x Class B) Y Class F 0.1 (formerly 1/3 Class B) P Pairs* G Groups* K Customer specific* Extension type 2P = Contact tin-coated, S SIL (Single in line) LMP lead free, P SMD contact around the sides RoHS-conform FC Flip Chip 3P = Contact tin-coated, W Wire HMP, RoHS-conform SW Perpendicular leads 4P = Gold coated contacts, FW Flat wire I Insulated contacts solderable layer E Enameled wires L Insulated stranded wires K Customer specific* 1FC = contact tin-coated, LMP lead free 2FC = contact tin-coated, HMP 3FC = Au-Pads (bonding pads) 5FC = increased thin film Pt-Pads (solderable pads) 6FC = Thick film Pt-pads (weldable) Order example: P 1K W. B M 1: Material identification = Platinum Temperature Sensor : Resistance value in ohm = 1'000 Ω / 0 C 3: Chip Dimensions = 5 mm x 2 mm 4: Temperature range/technology = -200 C to +400 C 5: Extension = Wire connections (Ag, Ø 0.25 mm) 6: Tolerance class = DIN EN F 0.3 (formerly class B) 7: Wire length = 10 mm 8: Special = metallised (solderable) backside All mechanical Dimensionss are valid at 25 C ambient temperature, if not differently indicated. All data except the mechanical Dimensionss only have information purposes and are not to be understood as assured characteristics. Technical changes without previous announcement as well as mistakes reserve. The information on this data sheet was examined carefully and will be accepted as correct; No liability in case of mistakes. Load with extreme values during a longer period can affect the reliability. All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. Typing errors and mistakes reserved. Product specifications are subject to change without notice. All rights reserved BTP_E1.0