MCPCB Material (Heat sync)
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1 MCPCB Material (Heat sync) NIPPON RIKA KOGYOSHO CO.,LTD Feb
2 Metal Base CCL (Heat sync) Metal Base CCL (Heat sync) Copper Foil FR-4 High Performance Epoxy Metal Base Glass Cloth + Epoxy Etching Etching Metal Base PCB Lamination Metal base PCB (FR-4) Bonding Sheet Metal Base
3 High Performance Epoxy Resin High Performance Epoxy Epoxy Resin We kept the performance by the original technology. Inorganic Filler Peel strength and the insulating property deteriorate if a lot of inorganic fillers are filled to epoxy resin.
4 Microsection of Metal Base CCL Copper Foil Epoxy Resin + Inorganic Filler Metal Base
5 Thermal Conductivity of Every Materials
6 General Properties Of Filler
7 Thermal Conductivity VS Filler Content
8 Feature of NRK Metal Base CCL (Heat sync) Excellent Radiation Heat is greatly radiated from the mounting parts. Excellent Heat Resistance Superior heat resistance insulating material is adaptable to direct bonding and reflow soldering High Voltage Insulation performance that endures energizing high voltage. Many Line Up The material corresponding to the usage can be selected.
9 Market Trend of Metal Base PCB Metal Base PCB Audio Power Supply Intelligent Power Module Inverter DC/DC Converter Trend Lead Free Approaching New Market New Application Car Electronics (In Engine Room) LED (Lighting) (LCD Back Light) Others More excellent heat radiation Long-term reliability
10 NRK Line Up per Requirement Item Power Module Car Electronics LED Requirements Lead Free High Voltage Radiation High density mounting Noise reduction Lead Free Long-term reliability Radiation High density mounting Heat Resistance Lead Free Excellent Radiation Cost Performance NRK Line Up RCCPrepreg
11 NRK Metal Base CCL Line up
12 General Properties of Metal Base CCL
13 NRK LINE UP & Other Company USINGAlN NRA-X 4.2W/mK,6.5W/mK NRA-E6.5W/mK,12.0W/mK
14 Lead Free Reliability The solder crack is generated in lead free solder in the Thermal shock test Thermal Shock Test Condition (or 125)
15 Solder Resistance
16 Thermal Shock Test Graph
17 Measurement Method of Thermal Resistance
18 Thermal Conductivity & Thermal Resistance
19 Name,Classification,Specifiction
20 Specification when shipping Copper Fiol Insulation Metal Base Musking Film A Musking Film B Musking Film A (Copper Foil Side) Musking Film B (Alminium Side)
21 CCL Side Masking Solder Resist Type Film Tape Type
22 MCPCB Munufucturing Process (1Layer) Copper Fiol Insulation Metal Base Masking Film Metal Base CCL Etching Coating Solder Resist Contour Processing Peeling Protection Film
23 MCPCB Munufucturing Process - 1 (2Layers) Copper Fiol Insulation Metal Base Masking Film Metal Base CCL Etching 1)Black Oxide or CZ Treatment 2)RCC Layup
24 MCPCB Munufucturing Process - 2 (2Layers) Lamination Lazer Drilling Copper Plating
25 MCPCB Munufucturing Process - 3 (2Layers) Etching Coating Solder Resist Contour Processing Peeling Protection Film
26 Press Condition (NRP-8)
27 Press Condition (NRP-E)
28 Contour Processing (1) Clearance of Die Core Plate Fixed Platen Clearance = BaseMetal Thickness 1012%
29 Contour Processing (2) Routers Condition of Reference drill bit /2.0 Revolution / 40,000rpm More Fast feeding / 300mm/min More Slow
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