Qualification Report CASCADEABLE FIFOS. November 1995, QTP# Version 1.2 DEVICE DESCRIPTION MARKETING PART NUMBER. 1K x 9 Cascadeable FIFO
|
|
- Branden Walsh
- 6 years ago
- Views:
Transcription
1 Qualification Report November 1995, QTP# Version 1.2 CASCADEABLE FIFOS MARKETING PART NUMBER CY7C419 CY7C420/CY7C421 CY7C424/CY7C425 DEVICE DESCRIPTION 256 x 9 Cascadeable FIFO 512 x 9 Cascadeable FIFO 1K x 9 Cascadeable FIFO
2 PRODUCT DESCRIPTION (for qualification) Information provided in this document is intended for generic qualification and technically describes the Cypress part supplied: Cascadeable FIFO Marketing Part #: CY7C425 Device Description: Cypress Division: 1024 x 9 Cascadeable FIFO Cypress Semiconductor Corporation Overall Die (or Mask) REV Level (pre-requisite for qualification): Rev. D (7C425) Die Size (stepping): 80 mils x 90 mils (7C425) What ID markings on Die: 7C425D TECHNOLOGY/FAB PROCESS DESCRIPTION Number of Metal Layers: 2 Metal Composition: Metal1: 6000A Al with 1500A TiW cap Barrier Metal: Ti/TiW 500A/1200A Metal2: TiW/Al/Ti 1500A/10000A/150A Passivation Type and Materials: 7,000A TEOS 6,000 A Oxynitride Free Phosphorus contents in top glass layer(%): Die Coating(s), if used: Generic Process Technology/Design Rule (µ-drawn): CMOS, Double Poly, Double Metal /0.65 µm Gate Oxide Material/Thickness (MOS): Name/Location of Die Fab (prime) Facility: Die Fab Line ID/Wafer Process ID: None SiO2 / 165 A Cypress Semiconductor - Bloomington, Minnesota Fab3 / R25
3 PAGE 3 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION (7C425) Package Outline, Type, or Name: 28-pin,300-mil PDIP Mold Compound Name/Manufacturer: Sumitomo EME-6300H(R) Lead Frame material: Copper Lead Finish, composition: Solder Plate, 85%Sn, 15%Pb Die Attach Area Plating: Silver Spot Die Attach Pad Dim: 120 mils x 170 mils Die Attach Method: Paste Die Attach Material: Silver Epoxy Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.3 mil Name/Location of Assembly (prime) facility: Cypress Bangkok, Thailand Assembly Line ID and Process ID: Alpha-X / P283 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION (7C425) Package Outline, Type, or Name: 32-pin PLCC Mold Compound Name/Manufacturer: Sumitomo EME-6300H(R) Lead Frame material: Copper Lead Finish, composition: Solder Plate, 85%Sn, 15%Pb Die Attach Area Plating: Silver Spot Die Attach Pad Dim: 200 mils x 200 mils Die Attach Method: Paste Die Attach Material: Silver Epoxy Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.3 mil Name/Location of Assembly (prime) facility: Anam, Korea Assembly Line ID and Process ID: Korea-A/ J32R HERMETIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, or Name: 28-pin, 300-mil CerDIP (7C425) Mold Compound Name/Manufacturer: N/A Lead Frame material: Alloy 42 Lead Finish, composition: Solder Dipped, 63%Sn, 37%Pb Die Attach Area Plating: None Die Attach Pad Dim: 150 mils x 250 mils Die Attach Method: Silver Glass Die Attach Material: Silver Glass Wire Bond Method: Ultrasonic Wire Material/Size: Aluminum / 1.25 mil Name/Location of Assembly (prime) facility: Cypress Bangkok, Thailand Assembly Line ID and Process ID: Alpha-X /D283
4 PAGE 4 OTHER INFORMATION For approval by similarity, identify other devices using the same basic die with bonding or metal mask options or test selections and explain: CY7C419/CY7C420/CY7C421/CY7C424/CY7C425 If Cypress is planning any changes in the near future, identify change (Qtr/Yr) in: Die Design Rev./Shrink: Fab/Assembly site change: Other Devices to be qualified in this technology: Other Packages to be qualified for this device: ESD Voltage Rating (per MIL STD-008, Method 3018): Flammability Classification (UL-94V): Die Process Change: Cross Licensee/Licensor: 1/8 or None Alternate Fab/Assembly Locations: Assembly : >2,200V Please attach the following Qualification / Reliability data for the die revision and Package type, for the fab and assembly sites identified above (mark [X] if included): 1 X HAST (5.5V, 140 C, 85%RH, 15psig) 7 X Operating Life at (temp): 150 C 2 X Temperature Cycles (-65 C to 150 C) 8 X Steady State Life (HTSSL, 5.5V, 150 C) 3 Temperature Cycles (-40 C to 165 C) 9 Temperature Humidity Bias (5.5V, 85 C, 85%RH) 4 Data Retention Bake, Plastic (165 C) 10 X Latchup Testing 5 Data Retention Bake, Hermetic (250 C) 11 X ESD Tests (MIL-STD 883, method 3015) 6 X Autoclave (PCT, 121 C, 100%RH) 12 X Other: Current Density
5 PAGE 5 Product Family: Mfg Division: PRODUCT INFORMATION FOR QUALIFICATION BY SIMILARITY Cascadeable FIFO Cypress Semiconductor Supplier's Part Number Rated Speed (ns) CY7C419 CY7C420 CY7C421 CY7C424 CY7C425 -**AC -**JC -**PC -**VC -**DMB -**LMB -**PC -**DMB -**AC -**JC -**PC -**VC -**DMB -**LMB -**PC/PI -**DC/DMB -**AC -**JC -**PC -**VC -**DMB -**LMB 10 ns to 65 ns 10 ns to 65 ns 10 ns to 65 ns 65 ns to 20 ns 65 ns to 20 ns Pkg Size/ Type 32 TPQF 28.3 PDIP 28.3 SOJ 28.3 CDIP 32R LCC 28.6 PDIP 28.6 CDIP 32 TPQF 28.3 PDIP 28.3 SOJ 28.3 CDIP 32R LCC 28.6 PDIP 28.6 CDIP 32 TPQF 28.3 PDIP 28.3 SOJ 28.3 CDIP 32R LCC Die Rev. Die Size mil x mil (stepping) Design Rule (µ) Fabrication Process ID D 80 x R25 CMOS D 80 x µ R25 CMOS D 80 x µ R25 CMOS D 80 x µ R25 CMOS D 80 x µ R25 CMOS Line ID Passivation Type 3 TEOS + Oxynitride 3 TEOS + Oxynitride 3 TEOS + Oxynitride 3 TEOS + Oxynitride 3 TEOS + Oxynitride Mold Compound Assembly Line Location Sumitomo Anam-Bupyong, Korea Anam, Korea Sumitomo Omedata, Indonesia Sumitomo Anam-Bupyong, Korea Anam, Korea Sumitomo Omedata, Indonesia Sumitomo Anam-Bupyong, Korea Anam, Korea ESD Volt Rating >2,200V HBM >2,000V CDM >2,200V HBM >2,000V CDM >2,200V HBM >2,000V CDM >2,200V HBM >2,000V CDM >2,200V HBM >2,000V CDM
6 PAGE 6 DEVICE RELIABILITY SUMMARY Marketing Part: CY7C425 Wafer Fab: Fab3 - Bloomington, MN Pkg Description: 28-pin, 300-mil PDIP 28-pin, 300-mil CDIP High Temperature Dynamic Operating Life (HTOL, 5.5V, 150 C) - Early Failure Rate Device Assy Lot# Fab Lot # 48 Hours Cumulative CY7C425-JC /504 0/1008 CY7C425-DM /504 High Temperature Dynamic Operating Life (HTOL, 5.5V, 150 C) - Latent Failure Rate Device Assy Lot# Fab Lot# 80 Hours 500 Hours Cumulative CY7C425-JC /127 0/127 0/243 CY7C425-DM /116 0/116 Long Life Verification (LLVA, 5.5V, 150 C) Device Assy Lot# Fab Lot# 1000 Hours Cumulative CY7C425-PC /120 0/120 High Temperature Steady State Life (HTSSL, 5.5V, 150 C) Device Assy Lot# Fab Lot# 80 Hours 168 Hours Cumulative CY7C425-JC /78 0/78 0/176 CY7C425-DM /98 0/98 Temperature Cycle (Condition C, -65 C to 150 C) Device Assy Lot# Fab Lot# 100 Cycles 1000 Cycles 1000 Cycles Cumulative CY7C425-DM /45 0/45 0/45
7 PAGE 7 DEVICE RELIABILITY SUMMARY Marketing Part: CY7C425 Wafer Fab: Fab3 - Bloomington, MN Pkg Description: 28-pin, 300-mil PDIP 28-pin, 300-mil CDIP Temperature Cycle (Condition C, -65 C to 150 C), precondition 48 hours PCT (121 C, 100%RH) Device Assy Lot# Fab Lot# 300 Cycles 1000 Cycles 1000 Cycles Cumulative CY7C425-JC /46 0/46 0/46 Group C, Subgroup 1 Life test (150 C, 5.75V) Device Assy Lot# Fab Lot# 184 Hours Cumulative CY7C425-DMB /45 0/45 Autoclave (PCT, No bias, 121 C, 100%RH, 15psig), precondition 40 Temperature Cycles Device Assy Lot# Fab Lot# 168 Hours Cumulative CY7C425-JI /46 0/46 High Accelerated Saturation Test (HAST, 140 C, 5.5V, 85%RH), precondition 40 Temperature Cycles Device Assy Lot# Fab Lot# 128 Hours Cumulative CY7C425-PC /47 0/47
8 PAGE 8 DEVICE RELIABILITY SUMMARY Marketing Part: CY7C425 Wafer Fab: Fab3 - Bloomington, MN Pkg Description: 28-pin, 300-mil PDIP 28-pin, 300-mil CDIP Electrostatic Discharge Human Body Model Circuit per Mil Std 883, Method 3015 >+2,000V Unit 1 >-2,000V >+2,000V Unit 2 >-2,000V >+2,000V Unit 3 >-2,000V Charge Device Model >+2,000V Unit 1 >-2,000V >+2,000V Unit 2 >-2,000V >+2,000V Unit 3 >-2,000V Latchup Testing to Cypress Internal Latch-up Procedure 3 Tests: Current Injection = 200mA Trigger Hot Socket = VCC 0-8V Temp = 125 C Current Density Other miscellaneous tests Pass
9 PAGE 9 PREVIOUS QUALIFICATION DATA Device: 7C42X Cascadeable FIFOs Process ID: R21 CMOS Technology: CMOS 0.8µm Technology Process Location: Fab 1 - San Jose, CA Cypress Test No. Stress/Test Reference Method Actual Conditions Status * Qualification Data Reference Test Result Temp/Bias Hrs/Cyc SS/Fail Pass Fail 22 HTOL - EFR C/5.75V 12 Hrs 80 Hrs 0/1763 0/3053 C QTP# X 22A HTOL - LFR C/5.75V 168 Hrs 336 Hrs 36 High Temp. Bake/DRET 23 HAST C/5.5V 100 Hrs 200 Hrs 0/400 0/400 0/55 0/55 C QTP# X C QTP# X 24 Steam Test/Autoclave/PCT C,100%RH 15 psig 96 Hrs 288 Hrs 0/110 C QTP# X 1/ Temperature Cycle Cond. C --65C to 150C 100 Cycs 900 Cycs 1000 Cycs 37A HTSSL C, 5.75V 0/165 0/55 10/161 2 C QTP# X 20 Mechanical Sequence 26 X-Ray 6 ESD-HBM Corner Pins Internal Pins ---- C QTP# X 6 ESD-CDM Corner Pins Internal Pins ---- C QTP# X 33 Latch-up C QTP# X 50 Flammability & Oxygen Index 14 Moisture Resistance 9 Internal Water Vapor 2 Solvent Resistance 4 Internal Visual 1 Physical Dimensions 1 Assembly bonding problem 2 9 Assembly bonding defects, 1 Functional
10 PAGE 10 7 Lead Integrity 5 Bond Strength
Qualification Report. June, 1994, QTP# Version 1.1 CY7C46X/47X, MINNESOTA FAB MARKETING PART NUMBER DEVICE DESCRIPTION. Cascadable 32K x 9 FIFO
Qualification Report June, 1994, QTP# 92361 Version 1.1 CY7C46X/47X, MINNESOTA FAB MARKETING PART NUMBER CY7C460 CY7C462 CY7C464 CY7C470 CY7C472 CY7C474 DEVICE DESCRIPTION Cascadable 8K x 9 FIFO Cascadable
More informationCypress Semiconductor Qualification Report QTP# 97092VERSION 1.0 June, 1997
Cypress Semiconductor Qualification Report QTP# 97092VERSION 1.0 June, 1997 SST SONET/SDH Serial Transceiver CY7B952 SST is a trademark of Cypress Semiconductor Corporation SST SONET/SDH Serial Transceiver
More informationQualification Report. March 1996, QTP# 96056, Version 1.0. CY7B8392 (Ethernet Coax Transceiver Interface)
Qualification Report March 1996, QT# 96056, Version 1.0 CY7B8392 (Ethernet Coax Transceiver Interface) RODUCT DESCRITION (for qualification) Information provided in this document is intended for generic
More informationQualification Report. PALCE16V8 (Flash Erasable, Reprogramable CMOS PAL ) April 1996, QTP# 96023, Version 1.0
Qualification Report April 1996, QT# 96023, Version 1.0 ALCE16V8 (Flash Erasable, Reprogramable CMOS AL ) AL is registered trademark of Advanced Micro Devices, Inc. RODUCT DESCRITION (for qualification)
More informationCypress Semiconductor Qualification Report
Cypress Semiconductor Qualification Report QTP# 97185 VERSION 1. November, 1997 CY7C342B (128Macrocell MAX EPLD) 128 Macrocell MAX EPLD P26 Technology Page 2 of 8 PRODUCT DESCRIPTION (for qualification)
More informationCYPRESS SEMICONDUCTOR ADVANCED PRODUCT CHANGE NOTIFICATION
CYPRESS SEMICONDUCTOR ADVANCED PRODUCT CHANGE NOTIFICATION PCN: 020040 DATE: December 16, 2002 Subject: 32 SOJ Mold Compound Changed to EME6600HR & EME9600HR at OMEDATA To: Description of change: The mold
More informationCypress Semiconductor Mold Compound Qualification Report
Cypress Semiconductor Mold Compound Qualification Report QTP# 010601 VERSION 2.0 (G3) October 2004 28-44 Lead SOJ/20-32 Lead SOIC/28 Lead SNC s Sumitomo EME 6600HR Mold Compound, MSL3 Assembly CYPRESS
More informationCypress Semiconductor Package Qualification Report
Cypress Semiconductor Package Qualification Report QTP# 041007 VERSION 1.0 September 2004 28Ld SNC, 32Ld SOIC, 28/32/36/44Ld SOJ Packages 11 mils Wafer Thickness and Saw Step Cut MSL 3, 220C Reflow Cypress
More informationCypress Semiconductor Automotive Package Qualification Report
Automotive ackage Qualification Report QT# 090405 VERSION 1.0 May 2009 Automotive 56-Lead QFN NidAu, MSL3, 260C Reflow Amkor-Korea (L) CYRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Rene Rodgers Reliability
More informationCypress Semiconductor Mold Compound Qualification Report
Cypress Semiconductor Mold Compound Qualification Report QT# 002403 VERSION 1.0 January, 2001 Sumitomo EME 7320 Mold Compound Thin Quad Flat ack, (TQF), MSL3 ASE Taiwan CYRESS TECHNICAL CONTACT FOR QUALIFICATION
More informationCypress Semiconductor Process Qualification Report
Cypress Semiconductor rocess Qualification Report QT# 063003 VERSION 1.0 June 2007 Nitride Seal Mask (NSM) Qualification S4AD-5 Technology, Fab 2 All S4 Devices CYRESS TECHNICAL CONTACT FOR QUALIFICATION
More informationCypress Semiconductor Package Qualification Report. 60 FBGA (8 x 20 x 1.2mm) SnPb, MSL3, 220 C Reflow Unisem-Indonesia
ackage Qualification Report QT# 080805 VERSION 1.0 July 2008 60 FBGA (8 x 20 x 1.2mm) Snb, MSL3, 220 C Reflow Unisem-Indonesia CYRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Rene Rodgers Reliability
More informationCypress Semiconductor Package Qualification Report
ackage Qualification Report QT# 080906 VERSION 1.0 April 2008 28-Lead SSO (209 mils) (with Downbond) b-free, MSL3, 260 C Reflow Amkor-Anam hilippines (HIL-M) CYRESS TECHNICAL CONTACT FOR QUALIFICATION
More informationCypress Semiconductor Package Qualification Report
Cypress Semiconductor ackage Qualification Report QT# 034003 VERSION 2.0 January 2006 52-lead Thin Quad Flat ack 10 x 10 x 1.0mm, MSL1, 235C Reflow Amkor Bupyeong Korea Assembly CYRESS TECHNICAL CONTACT
More informationCypress Semiconductor Snap Cure Epoxy Qualification Report
Cypress Semiconductor Snap Cure Epoxy Qualification Report QT# 002602 VERSION 1.1 January, 2001 28-lead SOJ and Narrow SOIC ackage Level 3 Cypress hilippines (CSI-R) CYRESS TECHNICAL CONTACT FOR QUALIFICATION
More informationQuality and Reliability Report
Quality and Reliability Report Product Qualification MASW-007921 2mm 8-Lead Plastic Package QTR-0148 M/A-COM Technology Solutions Inc. 100 Chelmsford Street Lowell, MA 01851 Tel: (978) 656-2500 Fax: (978)
More informationCypress Semiconductor 2-Die Stacked & Molding Compound Package Qualification Report
Cypress Semiconductor 2-Die Stacked & Molding Compound ackage Qualification Report QT# 023607 VERSION 1.0 March, 2003 CYM52KQT36AV25 18Mb ipelined MCM with QDR Architecture in 165-ball FBGA package (2-die)
More informationCypress Semiconductor Package Qualification Report
ackage Qualification Report QT# 070201 VERSION 1.1 December 2007 Wafer Level CS Image Sensor (WLCS) (6.6 x 6.4mm) SnAgCu, MSL3, 245C Reflow XINTEC, Taiwan CYRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:
More informationQuality and Reliability Report
Quality and Reliability Report Product Qualification MAAM-008819 2mm 8-Lead PDFN Plastic Package QTR-0147 M/A-COM Technology Solutions Inc. 100 Chelmsford Street Lowell, MA 01851 Tel: (978) 656-2500 Fax:
More informationProduct Qualification Report
e Product Qualification Report Part Number: SKY65111-348LF Package Type: 16L MLQP (3.0 X 3.0 mm) Report No: 301028 Qualification Team Product Engineer: Peter J. DiCarlo Requester: Peter J. DiCarlo Product/Package
More information12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Add Cu as Alternative Wire Base Metal for Selected Device(s) Change Notification / Sample Request Date: 7/30/2015 To: Newark/Farnell PCN Dear Customer:
More informationDS32KHZ 0.8um Fab Process 6" to 8" Conversion. Dallas Semiconductor
1/5/27 RELIABILITY REPORT FOR DS32KHZ.8um Fab Process 6" to 8" Conversion Dallas Semiconductor 441 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas
More informationIPC RELIABILITY - CASTELLETTO. Reliability Report. Combo IC for PFC and ballast control Assembly plant location
General Information Locations Product Line Product Description Product division U337 Combo IC for PFC and ballast control I&PC Wafer fab location Assembly plant location ANG MO KIO MUAR Package SO20 Silicon
More informationIf you have any questions concerning this change, please contact:
February 17, 2014 PPCN #130027 PROCESS/ PRODUCT CHANGE NOTIFICATION This is to inform you that Micrel Inc has qualified Exposed Pad (E-Pad) SOIC packages at STARS Microelectronics, Thailand as an alternative
More informationPRODUCT/PROCESS CHANGE NOTICE (PCN)
3545 North First Street San Jose, CA 95134 USA PRODUCT/PROCESS CHANGE NOTICE (PCN) PCN Number: 06-07 Date Issued: December 13, 2006 Product(s) Affected: Products using TQFN/TDFN type packages Manufacturing
More informationReliability Qualification Report. for
Reliability Qualification Report for SDR SDRAM with Pb/Halogen Free (16M 16, 63nm SDRAM AS4C16M16SA-7TCN/6TCN/7BCN) Issued Date: April 18, 2014 Rev.2 2/14 CONTENTS 0. RELIABILITY TEST SUMMARY.........1
More informationCONTENTS 0. RELIABILITY TEST SUMMARY INTRODUCTION PRODUCT INFORMATION RELIABILITY...2
Reliability Qualification Report for DDR SDRAM with Pb/Halogen Free (Industrial) (64M 8, 45nm SDRAM AS4C64M8D1-5TIN-5BIN) Issued Date: April 18, 2014 Alliance Memory Inc. 511 Taylor Way, San Carlos, CA
More informationSE2618F with Cu wire at Carsem Package Qualification Plan
SE2618F with Cu wire at Carsem Package Qualification Plan Part Number: SE2618F with Cu wire Product Type: 2.4GHz 802.11b/g/n WLAN FEM Package Type: QFN 2.5 x 2.5 x 0.45mm 16L Report No: Qual-QP-12-01106
More informationReport Title: ADSP-BF538F8 /ADSP-BF539F8 Alternate Fab Site Qualification
Report Title: ADSP-BF538F8 /ADSP-BF539F8 Alternate Fab Site Qualification Report Number: 9127 Revision: Date: 15 April 2011 A Summary Reliability Report: 9127 This report documents the successful completion
More information12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Qualification of CLARK-AT as new assembly site for affected device(s) moving from SCSAT, corresponding package change from punched RTK to sawn RGP and change
More information12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 PCN# 20121105000 Qualification of CLARK-AT as an additional Assembly Site for affected device(s) Change Notification / Sample Request Date: 11/7/2012 To:
More informationFINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16230A Generic Copy
Generic Copy Issue Date: 11-Feb-2011 TITLE: Dual Sourcing at Gresham; General Sales Devices PROPOSED FIRST SHIP DATE: 11-May-2011 or earlier at customer request AFFECTED CHANGE CATEGORY(S): Wafer Fab Process
More information12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Qualification of CLARK-AT as new assembly site for affected device(s) moving from SCSAT, corresponding package change from punched RTK to sawn RGP and change
More information12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Qualification of CLARK-AT as new assembly site for affected device(s) moving from SCSAT, corresponding package change from punched RSP to sawn RHH and associated
More information12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 PCN# 20121120000 Qualification of CLARK-AT as new assembly site for affected device(s) moving from SCSAT, corresponding package change from punched RSP
More informationPCN Title: Additional FAB Source (TPSCo), Additional Assembly/Test Site (SAT) and BOM (Bill of Materials) on select devices
DATE: 18 th July, 2016 PCN #: 2239 PCN Title: Additional FAB Source (TPSCo), Additional Assembly/Test Site (SAT) and BOM (Bill of Materials) on select devices Dear Customer: This is an announcement of
More information800 W. 6 th Street, Austin, TX 78701
800 W. 6 th Street, Austin, TX 78701 Assembly Site Transfer from StatsChipPac Kuala Lumpur, Malaysia (SCM) to ANST Wuxi CHINA for the CS8422-CNZ(R) component Process/Product Change Notification (Reference
More informationRELIABILITY EVALUATION QUALIFICATION OF SOIC8L Narrow & SOIC8L E-PAD XDLF-IDF (EXTREAM DENSITY LEAD FRAME) ATP1 (AMKOR PHILIPPINES SUBCON)
AMG Analog & Mems -Group Industrial & Power Conversion Div. Quality & Reliability B-END RR000116CT6004 RELIABILITY EVALUATION QUALIFICATION OF SOIC8L Narrow & SOIC8L E-PAD XDLF-IDF (EXTREAM DENSITY LEAD
More informationAnalog, MEMS and Sensors Group
28-october-2015 Report ID 2015-W44 -SOAG PRODUCT/PROCESS CHANGE NOTIFICATION PCN AMS/15/9514 Analog, MEMS and Sensors Group New material set in ST Bouskoura for AMS products in SO8 and SO14 packages October
More informationPCN Title: Addition of New Fab/Assembly Site and Design Change
DATE: 6 December 2016 PCN #: 2254 PCN Title: Addition of New Fab/Assembly Site and Design Change Dear Customer: This is an announcement of change(s) to products that are currently being offered by Diodes
More informationIf you have any questions concerning this change, please contact: NAME: Hank Chou PHONE:
January 20, 2014 Preliminary December 8, 2014 Final PPCN #140001 PROCESS/ PRODUCT CHANGE NOTIFICATION This is to inform you that Amkor, a Micrel assembly subcontractor, is transferring TQFP/LQFP production
More informationAutomotive AEC-Q100 Grade 2 Compliance
Automotive AEC-Q100 Grade 2 Compliance Reliability Qualification Report for SDR SDRAM with Pb/Halogen Free (4M 16, 63nm SDRAM AS4C4M16SA-6TAN/6BAN) Issued Date: Dec 15, 2014 1 CONTENTS 0. RELIABILITY TEST
More information800 W. 6 th Street, Austin, TX 78701
800 W. 6 th Street, Austin, TX 78701 Assembly Site Transfer from StatsChipPac Kuala Lumpur, Malaysia (SCM) to ANST Wuxi CHINA for the CS8421-CNZ(R) component Process/Product Change Notification (Reference
More informationAnalog & MEMS Group (AMS)
16-March-2017 Report ID 2018-W11 SO16-SHZ PRODUCT/PROCESS CHANGE NOTIFICATION PCN AMS/18/10777 Analog & MEMS Group (AMS) Qualification of ST Shenzhen as Assembly and Test & Finishing site for selected
More information12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Qualification of TIPI as Additional Assembly and Test Site for Select SOT-23 Package Devices Change Notification / Sample Request Date: 8/25/2016 To: PREMIER
More informationPRODUCT CHANGE NOTIFICATION
Cypress Semiconductor Corporation, 198 Champion Court, San Jose, CA 95134. Tel: (408) 943-2600 PRODUCT CHANGE NOTIFICATION PCN: PCN145305 Date: June 14, 2014 Subject: Qualification of Manufacturing Changes
More informationDallas Semicoductor DS80C320 Microcontroller
Construction Analysis Dallas Semicoductor DS80C320 Microcontroller Report Number: SCA 9702-525 Global Semiconductor Industry the Serving Since 1964 15022 N. 75th Street Scottsdale, AZ 85260-2476 Phone:
More informationAnalog, MEMS and Sensor Group (AMS)
05-13-2015 Report ID 2015-W20AMKOR-TRANSFER PRODUCT/PROCESS CHANGE NOTIFICATION PCN AMS/15/9324 Analog, MEMS and Sensor Group (AMS) Production transfer from Amkor Korea to Amkor Philippines for component
More informationQualification Report T3 Mixer In CQG Package
Qualification Report T3 Mixer In CQG Package Table of Contents Page Introduction 6 CQG Package 8 Summary of Test Results 10 Summary of Performance Variation 10 Environmental / Operational Maximum Ratings
More informationAssembly Site: JCET, China Package Types: SOT-23 3L, SOD-323, SC-79 Report No: QUAL08-WB
e Package / Assembly Site Qualification Interim Report 9/25/08 Assembly Site: JCET, China Package Types: SOT-23 3L, SOD-323, SC-79 Report No: 302747-QUAL08-WB Qualification Team Package Engineer: Mike
More information12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Qualification of RFAB as an additional FAB site option for selected devices in the C05 Process Change Notification Date: 8/15/2012 To: MOUSER PCN Dear Customer:
More informationPCN Title: Change of Assembly Materials, Assembly Process and Mechanical Specification
DATE: 7 December, 2016 PCN #: 2250 PCN Title: Change of Assembly Materials, Assembly Process and Mechanical Specification Dear Customer: This is an announcement of change(s) to products that are currently
More informationMosel Vitelic MS62256CLL-70PC 256Kbit SRAM
Construction Analysis Mosel Vitelic MS62256CLL-70PC 256Kbit SRAM Report Number: SCA 9703-499 Global Semiconductor Industry the Serving Since 1964 17350 N. Hartford Drive Scottsdale, AZ 85255 Phone: 602-515-9780
More informationLattice ispmach 4000 V/B/C/ZC/ZE Product Family Qualification Summary
Lattice ispmach 4000 V/B/C/ZC/ZE Product Family Qualification Summary Lattice Document # 25-105900 October 2012 2012 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents,
More informationLattice ispclock Product Family Qualification Summary
Lattice Lattice Document # 25-106041 July 2009 2009 Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are listed at www.latticesemi.com/legal. All other brand or product names
More information12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 PCN# 20150603002 Qualification of ASEN as Additional Assembly Site for Select Devices Change Notification / Sample Request Date: 6/5/2015 To: Newark/Farnell
More information12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Qualification of TIEM (Melaka, MLA) as an Additional Assembly and Test Site option for select devices in the DCQ package Change Notification Date: March
More informationMicron Semiconductor MT5C64K16A1DJ 64K x 16 SRAM
Construction Analysis Micron Semiconductor MT5C64K16A1DJ 64K x 16 SRAM Report Number: SCA 9412-394 Global Semiconductor Industry the Serving Since 1964 17350 N. Hartford Drive Scottsdale, AZ 85255 Phone:
More informationQUALIFICATION PLAN RELIABILITY LABORATORY
QUALIFICATION PLAN RELIABILITY LABORATORY PCN #: CYER-22JGDE810 Date: Aug 9, 2010 Qualification of 28L SOIC package with SG-8300GM mold compound at MTAI assembly site and the 18L SOIC package will qualify
More informationMaximum MAX662 12V DC-DC Converter
Construction Analysis Maximum MAX662 12V DC-DC Converter Report Number: SCA 9512-445 Global Semiconductor Industry the Serving Since 1964 17350 N. Hartford Drive Scottsdale, AZ 85255 Phone: 602-515-9780
More information800 W. 6 th Street, Austin, TX 78701
800 W. 6 th Street, Austin, TX 78701 Assembly and Test Site Transfer from StatsChipPac Kuala Lumpur, Malaysia (SCM) to ANST Wuxi CHINA for the CS42L52-CNZ(R) and CS43L22-CNZ(R) components Process/Product
More informationReliability Report AEC-Q100-REV G Automotive Qualification for IXDD604SI, IXDF604SI, IXDI604SI, IXDN604SI VIS Foundry Process CU05UMS12010
Reliability Report AEC-Q100-REV G Automotive Qualification for IXDD604SI, IXDF604SI, IXDI604SI, IXDN604SI Report Title: AEC-Q100-REV G Automotive Qualification for IXDD604SI, IXDF604SI, IXDI604SI, IXDN604SI
More informationMotorola MPA1016FN FPGA
Construction Analysis Motorola MPA1016FN FPGA Report Number: SCA 9711-561 Global Semiconductor Industry the Serving Since 1964 17350 N. Hartford Drive Scottsdale, AZ 85255 Phone: 602-515-9780 Fax: 602-515-9781
More informationPCN Number: PCN Date: 02/05/2016
PCN Number: 20160202001 PCN Date: 02/05/2016 Title: Qualification of ASEN as Additional Assembly and Test Site for Select UQFN Package Devices Customer Contact: PCN Manager Dept: Quality Services Proposed
More informationFOR OFFICIAL USE ONLY
REVISION RECORD REV DESCRIPTION DATE 0 INITIAL RELEASE 10/05/10 CAUTION: ELECTROSTATIC DISCHARGE SENSITIVE PART REVISION PAGE NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 INDEX REVISION 0 0 0 0 0 0 0 0 0 0
More informationCPG (CMPG) Quality & Reliability Monitoring Program
CPG (CMPG) Quality & Reliability Monitoring Program Quarterly Report Ending March 2018 DMS #PD-000190820 / DivDocID #129870 Microsemi s Commitment to You We at Microsemi s Communication Medical Products
More informationFINAL PRODUCT/PROCESS CHANGE NOTIFICATION Generic Copy. 11-Apr SUBJECT: ON Semiconductor Final Product/Process Change Notification #15507
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION Generic Copy 11-Apr-26 SUBJECT: ON Semiconductor Final Product/Process Change Notification #1557 TITLE: Qualification of OSPI for Assembly/Test of 8/14/16 Lead
More information800 W. 6 th Street, Austin, TX 78701
800 W. 6 th Street, Austin, TX 78701 Assembly and Test Site Transfer from StatsChipPac Kuala Lumpur, Malaysia (SCM) to ANST Wuxi CHINA for the CS42L52-CNZ(R) and CS43L22-CNZ(R) components Process/Product
More informationMotorola MC68360EM25VC Communication Controller
Construction Analysis EM25VC Communication Controller Report Number: SCA 9711-562 Global Semiconductor Industry the Serving Since 1964 17350 N. Hartford Drive Scottsdale, AZ 85255 Phone: 602-515-9780 Fax:
More informationAnalog & MEMS Group (AMG)
PRODUCT/PROCESS CHANGE INFORMATION PCI AMG/17/10616 Analog & MEMS Group (AMG) Introduction of a new Lead-frame in ST Bouskoura for AMG products (Analog & MEMS Group) in SO8 package 1 WHAT: Progressing
More informationPackage Qualification Report Reliability By Design
Package Qualification Report Reliability By Design Qualification Description: The information contained herein represents proof of Reliability and Performance of the Package Series listed below in accordance
More information12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Qualification of as Additional Assembly/Test Site for Select Devices Change Notification / Sample Request Date: 1/25/2016 To: Newark/Farnell PCN Dear Customer:
More information12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Qualification of NFME as additional Assembly and Test Site for Select Devices Change Notification / Sample Request Date: June 29, 2017 To: MOUSER PCN Dear
More information12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 PCN# 20130708002 Qualification of TI Clark as an Additional Assembly, Bump, and Test site for Select Devices on WCSP and QFN Package Change Notification
More informationReliability Qualification Report
Reliability SUF-1000 SUF-2000 SUF-3000 SUF-4000 SUF-5000 The information provided herein is believed to be reliable at press time. Sirenza Microdevices assumes no responsibility for inaccuracies or omissions.
More informationQUALIFICATION REPORT RELIABILITY LABORATORY
QUALIFICATION REPORT RELIABILITY LABORATORY PCN #: IIRA-19WCBW841 Date: Jan 21, 2014 Qualification of 28L QFN (6x6x0.9mm) package at MTAI assembly site. The 28L QFN (5x5x0.9mm), 20L QFN (5x5x0.9mm, 4x4x0.9mm)
More informationProduct Change Notification - GBNG-28HRUQ041
Product Change Notification - GBNG-28HRUQ041-12 Apr 2017 - CCB 2840 Initial No... http://www.microchip.com/mymicrochip/notificationdetails.aspx?pcn=gbng-28hruq0... Page 1 of 2 4/13/2017 Product Change
More informationEnvironmental Management and Materials Information
Environmental Management and Materials Information Product Content Information for: MAX3622CUE+ Links Qualifications Package Description Chemical Composition Detailed Package Component Data Qualifications
More informationPublic Products List. Subject : Public Products List. Dear Customer, Please find below the Standard Public Products List impacted by the change.
Public Products List PCN Title : VIPower M02: AMK6 Second Source Activation beside CT6 for additional products PCN Reference : ADG/16/9979 PCN Created on : 28-Oct-2016 Subject : Public Products List Dear
More informationEnvironmental Management and Materials Information
Environmental Management and Materials Information Product Content Information for: MAX3674ECM+T Links Qualifications Package Description Chemical Composition Detailed Package Component Data Qualifications
More information12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 PCN# 20150608000 Qualification of TSMC-WF3 as an additional wafer fab site option for select devices Change Notification / Sample Request Date: 6/15/2015
More informationReliability Report AEC-Q100-REV G Automotive Qualification for IXDD609SI, IXDI609SI, IXDN609SI VIS Foundry Process CU05UMS12010
Reliability Report AEC-Q100-REV G Automotive Qualification for IXDD609SI, IXDI609SI, IXDN609SI VIS Foundry Report Title: AEC-Q100-REV G Automotive Qualification for IXDD609SI, IXDI609SI, IXDN609SI VIS
More informationEnvironmental Management and Materials Information
Environmental Management and Materials Information Product Content Information for: MAX3637ETM+ Links Qualifications Package Description Chemical Composition Detailed Package Component Data Qualifications
More informationREVISION RECORD AND DESCRIPTION CONTINUED ON NEXT PAGE.
REVISION RECORD REV DESCRIPTION DATE 0 INITIAL RELEASE 06/18/08 REVISION RECORD AND DESCRIPTION CONTINUED ON NEXT PAGE. CAUTION: ELECTROSTATIC DISCHARGE SENSITIVE PART REVISION PAGE NO. 1 2 3 4 5 6 7 8
More information12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 PCN# 20160627001 Qualification of AMKOR P1 as Additional Assembly and Test Site for Select SOIC Package Devices Change Notification / Sample Request Date:
More information12500 TI Boulevard, MS 8640, Dallas, Texas PCN# A Qualification of RFAB for Select LBC8 Devices Change Notification / Sample Request
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Qualification of RFAB for Select LBC8 Devices Change Notification / Sample Request Date: 4/28/2016 To: Newark/Farnell PCN Dear Customer: The purpose of
More informationCrosslink Product Family Qualification Summary
Crosslink Product Family Qualification Summary Lattice Document # 25 107656 June 2017 2015 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are listed
More informationThe Packaging and Reliability Qualification of MEMS Resonator Devices
The Packaging and Reliability Qualification of MEMS Resonator Devices Pavan Gupta Vice President, Operations Yin-Chen Lu, Preston Galle Quartz and MEMS Oscillators source: www.ecliptek.com Quartz Oscillators:
More informationAN-400. Dimensions Format Pins Body Height Lead Pitch Thickness wide wide 0.100
April 2008 AN-400 Surface Mount lastic ackages for High Reliability Applications Applications Note Introduction Holt Integrated Circuits specializes in the design and manufacture of components for military
More informationVLSI Design and Simulation
VLSI Design and Simulation CMOS Processing Technology Topics CMOS Processing Technology Semiconductor Processing How do we make a transistor? Fabrication Process Wafer Processing Silicon single crystal
More informationLattice isplsi1032e CPLD
Construction Analysis Lattice isplsi1032e CPLD Report Number: SCA 9612-522 Global Semiconductor Industry the Serving Since 1964 15022 N. 75th Street Scottsdale, AZ 85260-2476 Phone: 602-998-9780 Fax: 602-948-1925
More informationVTC VM365830VSJ Pre-Amp
Construction Analysis VTC VM365830VSJ Pre-Amp Report Number: SCA 9708-549 Global Semiconductor Industry the Serving Since 1964 17350 N. Hartford Drive Scottsdale, AZ 85255 Phone: 602-515-9780 Fax: 602-515-9781
More informationPackage Qualification Report
Package Qualification Report Reliability By Design Qualification Description: The information contained herein represents proof of Reliability and Performance of the Package Series listed below in accordance
More informationRockwell R RF to IF Down Converter
Construction Analysis Rockwell R6732-13 RF to IF Down Converter Report Number: SCA 9709-552 Global Semiconductor Industry the Serving Since 1964 17350 N. Hartford Drive Scottsdale, AZ 85255 Phone: 602-515-9780
More informationPRODUCT/PROCESS CHANGE NOTICE (PCN)
PCN #: A0902-04R1 DATE: September 24, 2009 MEANS OF DISTINGUISHING CHANGED DEVICES: Product Affected: 14 mm x 14 mm x 1.4 mm TQFP-100 & 10 mm x 10 mm x 1.4 mm TQFP-64 Product Mark Back Mark (RoHS) Date
More information12500 TI Boulevard, MS 8640, Dallas, Texas 75243
12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Additional Pb Free Lead Finish and expansion of capacity (ASE-Shanghai) for Selected SOIC (D) products. Change Notification / Sample Request Date: 3/28/2013
More informationUMC UM F-7 2M-Bit SRAM
Construction Analysis UMC UM 613264F-7 2M-Bit SRAM Report Number: SCA 9609-511 Global Semiconductor Industry the Serving Since 1964 15022 N. 75th Street Scottsdale, AZ 85260-2476 Phone: 602-998-9780 Fax:
More informationCAUTION: ELECTROSTATIC DISCHARGE SENSITIVE PART
REVISION RECORD REV DESCRIPTION DATE 0 INITIAL RELEASE 06/14/99 A PAGE 9, FIGURE 4, CHANGED θja 09/29/99 B PAGE 3, PARAGRAPH 3. 8 CHANGED VERBIAGE ADDED HEREIN AFTER TABLE 1. 01/04/00 PAGE 4, PARAGRAPH
More informationHigh Reliability Optoelectronic Devices
High Reliability Optoelectronic Devices Sensors and Specialist Components BI Technologies and OPTEK Technology Hi-Rel products, Hi-Rel service from OPTEK Technology TT Electronics OPTEK Technology solves
More informationSGS-Thomson M28C K EEPROM
Construction Analysis SGS-Thomson M28C64-121 64K EEPROM Report Number: SCA 9710-559 Global Semiconductor Industry the Serving Since 1964 17350 N. Hartford Drive Scottsdale, AZ 85255 Phone: 602-515-9780
More information