Component Palladium Lead Finish - Specification Approved by Executive Board 1997-xx-xx August 22 Version

Size: px
Start display at page:

Download "Component Palladium Lead Finish - Specification Approved by Executive Board 1997-xx-xx August 22 Version"

Transcription

1 Component Palladium Lead Finish - Specification Approved by Executive Board 1997-xx-xx August 22 Version Appendices 1. User Commitment Form 2. Supplier Compliance Form Table of contents 1. Background 2. The Objectives of the Specification 3. The Scope of the Specification 4. Demonstration of Compliance with the Palladium Specification 5. Solder Joints to Leads with Palladium Finish 6. Definition of the Test Vehicle and the Soldering Process 6.1 The Test Vehicle The Printed Wiring Board The IC Packages 6.2 The Soldering Process 7. Properties 7.1 Properties of the Palladium Finish The Ductility of the Palladium Finish The Porosity of the Palladium Finish Thickness of the Palladium Finish Solderability of the Palladium Finish Shelf life of the Palladium Finish 7.2 Properties of Solder Joints to Leads with Palladium Finish Visual Appearance Destructive Testing Pull Forces at Fracture Analysis of the Fracture Area Fatigue of Solder Joints with Palladium Finish 8. Definitions 1

2 1 Background Component suppliers are switching over from SnPb (tin/lead) to NiPd (palladium) as component lead finish to gain cost benefits of simplified IC package assembly. Many commodity IC components have already leads with palladium finish. Test procedures and conditions for user acceptance need to be adjusted to reflect different failure mechanisms of solder joints to component leads with palladium finish compared to tin/lead finish. Palladium finish has lower environmental loading than the conventional tin/lead finish, due to absence of lead, which is an advantage. 2 The Objectives of the Specification Component leads with palladium finish have been around for some time. The objective of this specification is to define a quality specification for component leads with palladium finish. The specification is based on qualification requirements currently used by user members of HDP User Group International Inc. The requirements are applicable to both currently available and future concepts. This means that new suppliers of components with palladium lead finish shall meet the same requirements as for those already accepted by users. The specification is aimed at defining compatible qualification efforts on both the user (system supplier) and the supplier (component supplier) side reducing the efforts necessary on both sides. 3 The Scope of the Specification The specification applies to surface mounted component leads with palladium finish attached to printed wiring boards by a reflow soldering process. Through mount technology is not addressed. A test vehicle and parameters of a reflow soldering process to be used for conducting reproducible solderability and reliability tests are defined. Socketing for burn in and test is not addressed. A test plan defines the tests needed to get the specified quality. 4 Demonstration of Compliance with the Palladium Specification This palladium component lead finish specification is of value only if applied by users and suppliers. The compliance with this specification shall be demonstrated by presenting information in standardized form according to appendices 1 and 2. Commitments: Users commit to accept components with palladium from a reliability point of data according to form appendix 1 compliant with this specification Suppliers commit to deliver component leads compliant with this specification by presenting reliability data according to form appendix 2 compliant with this specification 2

3 The forms will facilitate an efficient communication between users and suppliers. 5 Solder Joints to Leads with Palladium Finish The palladium finish is considered as a sacrificial layer provided to protect the underlying ductile nickel finish from oxidation. The finish is applied to the base metal lead frame consisting of either nickel-iron or copper alloy. The solder joint is formed between the tin-based solder alloy and the underlying nickel plating. A good solder joint can be identified by: Visual inspection Measurement of pull forces at fracture. Determination of the exact location of the fracture Analysis of the fracture area between component lead and solder surface. The pull forces at fracture shall reach certain minimum values. The fracture region (between component lead and pad on the printed wiring board) shall be porous. The fracture shall take place in the solder rather than in the interface area between pin and solder. The visual appearance of the solder joints to palladium finished component leads differs from the appearance of leads having tin/lead finish. The results of the visual inspection are only partly in coincidence with the quality of the solder joints. 6 Definition of the Test Vehicle and the Soldering Process The described test vehicle and the soldering process, shall be used to conduct reproducible test data with respect to solderability, shelf life, and solder joint fatigue of components palladium lead finish. 6.1 Definition of the Test Vehicle The test vehicle consists of a printed wiring board with IC packages assembled using a reflow soldering process with defined parameters The Printed Wiring Board Specification of the printed wiring board. Substrate Type: FR4 with 4 layers of copper interconnection conformant with industry standard printed wiring boards. Dimensions: 203.2x152,4 mm (8" x 6"). Interconnection Layout: The layout shall fit the foot print pattern of the IC packages defined in Thermal properties: The xy coefficient of thermal expansion (CTE) shall be in the range of 10 to 20 ppm/k. Tg 125 C The IC Packages Specification of the IC packages. Package size: The body size shall be according to IC product under test (PUT). IC Package configuration: Package under test shall have a lead frame metalized with the plating supplied by the IC component supplier. No internal daisy chain is required. Only mechanical samples are required. Material of package according to PUT. 3

4 Number of I/O: s: The Package number of I/O: s shall be according to PUT. The number of pins per IC component available for pull force measurement depends on the lead pitch. 6.2 The Soldering Process Specification of the soldering process. General: Reflow conditions and soldering materials specified cover conditions critical to soldering IC components with palladium. lead finish I/O temperature: Peak temperature at I/O lead shall not exceed 215 C and not be lower than 210 C Peak temperature: Time above I83 C should be between 30 s and 60 s, preferably not much more than 30 s. Solder paste: No-clean solder paste, non water soluble type RMA with no silver compounds. Reflow atmosphere: The atmosphere shall be air rather than nitrogen. Nitrogen makes the solder joints look better but has no impact on their reliability. Temperature Profile: The peak area of the reflow temperature profile should be within the shaded area in fig. 1. With respect to palladium specific solderability issues, the reflow profile in use should be equal to the lower curve (i.e. lower curve +5 C at max, time above 183 C not much longer than 30 s). 7 Properties The following tests are of interest: Properties of the palladium finish Properties of the solder joints 7.1 Properties of the Palladium Finish The following properties are of interest: The ductility of the palladium finish The porosity of the palladium finish Thickness of the palladium finish Solderability of the palladium finish Shelf life of the palladium finish 4

5 7.1.1 The Ductility of the Palladium Finish Test conditions: To be resolved. Need help with straw man Test Plan: The test shall be done once by the component supplier for every palladium finish construction released Supplier process control to keep ductility within the specified limit Criteria for acceptance: Minimum elongation of 15% must be met The Porosity of the Palladium Finish Test conditions: To be resolved. Need help with straw man Test Plan: The test shall be done once by the component supplier for every palladium finish construction released Supplier process control to keep ductility within the specified limit Criteria for acceptance: To be resolved. Need help with straw man Thickness of the Palladium Finish Test conditions: Test method for thickness measurements shall be described Test Plan: 1. Characterization of the palladium thickness shall be done once by the component supplier for every palladium finish construction released 2. Supplier process control to keep the thickness within specified limits Criteria for acceptance: Thickness of Nickel and Palladium shall be measured at the top and the bottom of the component lead (not on the rails). Measured thickness, using X-ray fluorescence, shall be: Minimum Maximum Palladium: inch (0.076 micro-meter) inch (0.254 micro-meter) Nickel: inch (1.00 micro-meter) inch (3.00 micro-meter) Since the X-ray fluorescence method can only report total palladium and total nickel, this approach can be practically used on various plating-layer systems Solderability of the Palladium Finish Lead frames Test conditions: ANSI-J/Std 002 without steam age. Dry heat will be used instead of steam age as a preconditioning agent. Parameters of the solderability test: Hot Plate Temperature: 300ºC Time: seconds Flux: R type Time at the flux: 10 seconds Time at the pot: 5 seconds Test Plan: The test shall be done once by the component supplier for every palladium finish 5

6 construction released Supplier process control to keep solderability above specified limit Criteria for acceptance: ANSI-J/Std Components Test conditions: Ceramic Test Plate ANSI 638 Test Plan: The test shall be done once by the component supplier for every palladium finish construction released Supplier process control to keep solderability above specified limit Criteria for acceptance: ANSI Shelf Life of Palladium Finish Test conditions: A set of components shall be tested according to the following stress schedule, where n=30 components are removed from each stress cell at shown intervals. Battelle Class 2 Corrosive environment shall be used. Test Plan: The test shall be done once by the supplier for every palladium lead finishing construction delivered. Criteria for acceptance: Analysis Sequence: (see Table 1) Comparison of the degradation rate under expected worst case assembly conditions in presence/absence of airborne pollutants with/without the attenuation effect of shipping container. Battelle Class 2 environment shall be used. Preconditioning 24 hours in this climate is equivalent to 2 years shelf life in industrial environment. Variable data shall be collected by means of pull testing leads of package under test. After each stress exposure, the subjected packages are stored away in a dry nitrogen cabinet, until all remaining samples have completed exposure. All packages should be soldered at the same time to minimize process and time-dependent (random order) effects. Table 1: Test procedure to determine the influence of aggressive gas 7.2 Properties of Solder Joints to Palladium Finish The reliability of the solder joint is of major concern. The reliability is characterized by: Visual inspection Destructive testing Testing of solder joint fatigue Visual Appearance The visual appearance of the solder joints to palladium finished component leads differs from the appearance of leads having tin/lead finish. The results of the visual inspection are only partly in coincidence with the quality of the solder joints. Test conditions: Visual inspection shall be done according to ANSI/J-STD-001A level 2 Test Plan: The test shall be done once by the component supplier for every palladium finish construction released. Criteria for acceptance: ANSI / J-STD- 001A level 2 6

7 7.2.2 Destructive testing The destructive testing is done by: Measurement of pull forces at fracture Analysis of fracture areas Measurement of Pull Forces at Fracture Test conditions: Standard test method for pull force testing shall be used. A minimum number of 30 component leads shall be pulled off. Test Plan: The test shall be done once by the component supplier for every palladium finish construction released. Criteria for acceptance: The pull forces at fracture shall be??? Analysis of Fracture Area Test conditions: See pull forces at fracture for generating fractures. Microscope with x?? magnification. Test Plan: The test shall be done once by the component supplier for every palladium finish construction released. Criteria for acceptance: The fracture region (between lead and pad) shall be porous. The fracture shall take place in the solder rather than in the interface area between the lead and solder Fatigue of Solder Joints with Palladium Finish The crack growth of soldered connections shall be measured for test vehicles equipped with components which have: Tin/lead component lead finish. The purpose is to generate a reference set of data. Palladium component lead finish. Palladium thickness and deposit range shall be according to specification. The purpose is to generate to a fatigue set of data for palladium lead finish. Test conditions: Battelle Class 2 Corrosive environment shall be used. Prepare components for two groups of test vehicles, each consisting of 30 boards, shall be produced Expose the components of two groups to the equivalent 6 month shelf life acceleration; e. g. 24 hours exposure of Battelle Class 2 atmosphere. Reflow the test vehicles of both groups in the same process at the same time (randomized) using identical solder paste and reflow profile etc. Subject all test vehicles to temperature cycling stress according to schedule in Table 2 below, collection readout samples at the designated readout periods and statistically comparing degradation rates. Table 2: Test procedure to determine the influence of thermal cycling. 7

8 Test Plan: The test shall be done once by the component supplier for every palladium finish construction released. Criteria for acceptance: Results of all tests and the exact description of the tests performed shall be made available to the users. This would give them a chance to judge the conformance of the results with their requirements. 8 Definitions Component Lead: The connection of the component to the next level of packaging. Other names are: Lead, pin, terminal, I/O PWB: Printed Wiring Board the component is attached to. Other names are: Printed Circuit Board, substrate Supplier: Any supplier supplying components to a company assembling them to PWBs User: Any company assembling components to PWBs 8

9 Appendix 1 User Commitment Form Company: Business Unit: We accept the properties listed underneath if they are within the limits defined in document xxxxxxx Component Palladium Lead Finish - Specification. It is understood that the properties are established and maintained by: a. Results of the test performed by the supplier when releasing the palladium construction to the market. b. Process control applied to running production Properties: 7,1.1 Ductility Porosity Thickness Solderability Shelf Life Visual Appearance Pull Forces at Fracture Fracture Area Fatigue of Solder Joins 9

10 Appendix 2 Supplier Compliance Form Company: Business Unit: Name of Palladium Finish: Description of construction: Properties: Release Data Process Control Ductility Porosity Thickness Solderability Shelf Life: Visual Appearance Pull Forces at Fracture Fracture Area Fatigue of Solder Joins Released Data Results of the test performed by the supplier when releasing the palladium construction to the market. All data are generated in the framework of document xxxxxxx Component Palladium Lead Finish - Specification, Process Control Description of the process control principles applied to running production. 10

Lead Free Tin Whiskering Study. Grayhill DIP Switches

Lead Free Tin Whiskering Study. Grayhill DIP Switches Lead Free Tin Whiskering Study Grayhill DIP es May 11, 2004 Revision A TABLE OF CONTENTS 1. Introduction...3 2. Test Specification...4 2.1. Intent...4 2.2. Preconditioning...4 2.2.1. Wave Temperature Processing...4

More information

Effect of Process Variations on Solder Joint Reliability for Nickel-based Surface Finishes

Effect of Process Variations on Solder Joint Reliability for Nickel-based Surface Finishes Effect of Process Variations on Solder Joint Reliability for Nickel-based Surface Finishes Hugh Roberts Atotech USA Inc., Rock Hill, SC, USA Sven Lamprecht, Gustavo Ramos and Christian Sebald Atotech Deutschland

More information

Pulse White Paper Regarding RoHS Compliance

Pulse White Paper Regarding RoHS Compliance Pulse White Paper Regarding RoHS Compliance Table of Contents Executive Summary... 2 Background/History... 3 Materials Selection... 3 Testing/Validation... 4 Implementation/Conclusion... 5 References...

More information

Re tinning Components for Hi Rel Assembly

Re tinning Components for Hi Rel Assembly Hi rel Soldering Re tinning Components for Hi Rel Assembly Alan Cable, President, ACE Production Technologies Lead tinning has experienced a surge in popularity recently for a number of reasons, even though

More information

LEAD-FREE ASSEMBLY COMPATIBLE PWB FABRICATION AND ASSEMBLY PROCESSING GUIDELINES.

LEAD-FREE ASSEMBLY COMPATIBLE PWB FABRICATION AND ASSEMBLY PROCESSING GUIDELINES. LEAD-FREE ASSEMBLY COMPATIBLE PWB FABRICATION AND ASSEMBLY PROCESSING GUIDELINES. TECHNICAL BULLETIN As the industry has moved to lead-free assembly processing, the performance demands on the lead free

More information

Specification Reflow soldering of SMD assemblies - Solder paste / lead-free

Specification Reflow soldering of SMD assemblies - Solder paste / lead-free Previous Edition Specification 2009-06 Class: Electrical technology Class No.:53 Reflow soldering of SMD assemblies - JED solder paste of lead-free alloy 842 Part name (for databases) Solder paste / lead-free

More information

System Level Effects on Solder Joint Reliability

System Level Effects on Solder Joint Reliability System Level Effects on Solder Joint Reliability Maxim Serebreni 2004 2010 Outline Thermo-mechanical Fatigue of solder interconnects Shear and tensile effects on Solder Fatigue Effect of Glass Style on

More information

MARCH National Physical Laboratory Hampton Road Teddington Middlesex United Kingdom TW11 0LW

MARCH National Physical Laboratory Hampton Road Teddington Middlesex United Kingdom TW11 0LW NPL REPORT DEPC-MPR 044 Measuring the Impact of Land Size and Solder Joint Volume on Lead-free Solder Joint Reliability M Wickham, L Zou, M Dusek and C P Hunt NOT RESTRICTED MARCH 2006 National Physical

More information

NTC Thermistors. Mounting instructions. Date: January 2018

NTC Thermistors. Mounting instructions. Date: January 2018 NTC Thermistors Mounting instructions Date: January 2018 EPCOS AG 2018. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without

More information

SURFACE MOUNT ASSEMBLY OF MINI-CIRCUITS COMPONENTS

SURFACE MOUNT ASSEMBLY OF MINI-CIRCUITS COMPONENTS Application Note AN-40-014 SURFACE MOUNT ASSEMBLY OF MINI-CIRCUITS COMPONENTS DATE ISSUED: January 4, 2012 AN-40-014 Rev.: A M150261 (04/14/15) File: AN40014.doc Page 1 of 10 1.0 Introduction Mini-Circuits

More information

Palladium as diffusion barrier - a way to a multifunctional printed circuit board finish

Palladium as diffusion barrier - a way to a multifunctional printed circuit board finish Palladium as diffusion barrier - a way to a multifunctional printed circuit board finish Dr. Norbert Sitte, Schwaebisch Gmuend, Umicore Galvanotechnik GmbH 1. Introduction Due to the continuing miniaturization

More information

ELEC 6740 Electronics Manufacturing Chapter 5: Surface Mount Design Considerations

ELEC 6740 Electronics Manufacturing Chapter 5: Surface Mount Design Considerations ELEC 6740 Electronics Manufacturing Chapter 5: Surface Mount Design Considerations R. Wayne Johnson Alumni Professor 334-844 844-1880 johnson@eng.auburn. @eng.auburn.eduedu Outline System Design Issues

More information

ELEC 6740 Electronics Manufacturing Chapter 5: Surface Mount Design Considerations

ELEC 6740 Electronics Manufacturing Chapter 5: Surface Mount Design Considerations ELEC 6740 Electronics Manufacturing Chapter 5: Surface Mount Design Considerations R. Wayne Johnson Alumni Professor 334-844-1880 johnson@eng.auburn. @eng.auburn.eduedu Outline System Design Issues Package

More information

Design Objective

Design Objective Design Objective 108-115096 Low profile 5A battery connector 2015.03.03 REV:A 1.0 Scope: 1.1 Content: This specification covers the requirements for product performance, test methods and quality assurance

More information

Reflow Profiling: Time a bove Liquidus

Reflow Profiling: Time a bove Liquidus Reflow Profiling: Time a bove Liquidus AIM/David Suraski Despite much research and discussion on the subject of reflow profiling, many questions and a good deal of confusion still exist. What is clear

More information

Optimizing Immersion Silver Chemistries For Copper

Optimizing Immersion Silver Chemistries For Copper Optimizing Immersion Silver Chemistries For Copper Ms Dagmara Charyk, Mr. Tom Tyson, Mr. Eric Stafstrom, Dr. Ron Morrissey, Technic Inc Cranston RI Abstract: Immersion silver chemistry has been promoted

More information

Amphenol Amphenol Taiwan Corporation Sheet 1 of 8

Amphenol Amphenol Taiwan Corporation Sheet 1 of 8 Amphenol Amphenol Taiwan Corporation Sheet 1 of 8 Title: Part Number: Description: Micro Power Plus Product Specification G88MP Series 3.0 mm Pitch, PCB Mount / Cable Crimping Type Revisions Control Rev.

More information

Platform Flash PROM VOG48 Package Lead Finish Conversion to NiPdAu

Platform Flash PROM VOG48 Package Lead Finish Conversion to NiPdAu Platform Flash PROM VOG48 Package Lead Finish Conversion to NiPdAu Qualification Report Xilinx is disclosing this Qualification Report (the Documentation ) to you solely for use in the development of designs

More information

ATS Document Cover Page

ATS Document Cover Page 221-008 Item Rev Status: RELEASED printed 9/20/2017 2:27:42 PM by Les Deenin ATS: OPERATIN PROCEDURE ATS Document Cover Page Responsible Department: Supply Chain This copy is uncontrolled unless otherwise

More information

Interconnection Evaluation Technology for Printed Wiring Boards

Interconnection Evaluation Technology for Printed Wiring Boards Interconnection Evaluation Technology for Printed Wiring Boards Mitsuhiko Sugane Yoshihiro Morita (Manuscript received December 28, 2009) As a developer of world-class products including server and network

More information

The hand soldering process can therefore be defined by the following steps ;

The hand soldering process can therefore be defined by the following steps ; Hand Soldering with Lead Free Alloys Introduction As companies start to implement lead free soldering processes, hand soldering and associated techniques have been identified as key functions in the manufacturing

More information

Lead Free Solder for Flip Chip

Lead Free Solder for Flip Chip Lead Free Solder for Flip Chip Zhenwei Hou & R. Wayne Johnson Laboratory for Electronics Assembly & Packaging Auburn University 162 Broun Hall, ECE Dept. Auburn, AL 36489 USA 334-844-1880 johnson@eng.auburn.edu

More information

Lead-Free Connectors - An Overview

Lead-Free Connectors - An Overview Lead-Free Connectors - An Overview Pete Elmgren Molex Inc. 15 August 2003 Introduction For more than 50 years, lead-bearing solders have been used almost exclusively throughout the electronics industry

More information

Amphenol Amphenol Taiwan Corporation Sheet 1 of 9

Amphenol Amphenol Taiwan Corporation Sheet 1 of 9 Amphenol Amphenol Taiwan Corporation Sheet 1 of 9 Title: Part Number: Description: Micro Power Wafer Product Specification G881A / G881B / G881MA / G881H / G881C 3.0 mm Pitch, PCB Mount / SMT Type / CRIMPING

More information

OMIKRON IMMERSION WHITE TIN. Florida CirTech, Inc. Greeley, Colorado USA. Revised 2/19/98

OMIKRON IMMERSION WHITE TIN. Florida CirTech, Inc. Greeley, Colorado USA. Revised 2/19/98 OMIKRON TM IMMERSION WHITE TIN Revised 2/19/98 Florida CirTech, Inc. C T Florida CirTech, Inc. 1309 North 17th Avenue Greeley, CO 80631 Telephone: 1-800-686-6504 Fax: (970) 346-8331 Table of Contents Pages

More information

Composition/wt% Bal SA2 (SABI) Bal SA3 (SABI + Cu) Bal

Composition/wt% Bal SA2 (SABI) Bal SA3 (SABI + Cu) Bal Improving Thermal Cycle and Mechanical Drop Impact Resistance of a Lead-free Tin-Silver-Bismuth-Indium Solder Alloy with Minor Doping of Copper Additive Takehiro Wada 1, Seiji Tsuchiya 1, Shantanu Joshi

More information

Complete Solder Solutions

Complete Solder Solutions Complete Solder Solutions A NORDSON COMPANY 1 Our Vision EFD Solder Paste Group is the service leader in the solder dispensing market, delivering integrated process solutions through best-in-class performance

More information

ALPHA SACX Plus Product Guide

ALPHA SACX Plus Product Guide the product: Delivering the confidence you need to move to a lower silver alloy without sacrificing soldering performance or reliability ALPHA SACX Plus 0807 Product Guide the accuracy of this data. Liability

More information

Optimizing Immersion Silver Chemistries For Copper

Optimizing Immersion Silver Chemistries For Copper Optimizing Immersion Silver Chemistries For Copper Ms Dagmara Charyk, Mr. Tom Tyson, Mr. Eric Stafstrom, Dr. Ron Morrissey, Technic Inc Cranston RI Abstract: Immersion silver chemistry has been promoted

More information

2006 DMSMS Conference Pb-free Solder Technical Issues (Not Including Tin Whiskers)

2006 DMSMS Conference Pb-free Solder Technical Issues (Not Including Tin Whiskers) 2006 DMSMS Conference Pb-free Solder Technical Issues (Not Including Tin Whiskers) Dr. Stephan Meschter BAE Systems LEAP WG Technical Guidelines Handbook Leader Johnson City, NY Phone: 607-770-2332, Email:

More information

Amphenol Amphenol Taiwan Corporation Sheet 1 of 7

Amphenol Amphenol Taiwan Corporation Sheet 1 of 7 Amphenol Amphenol Taiwan Corporation Sheet 1 of 7 Title: Part Number: Description: Micro SD Card Connectors Product Specification GTFP08 SERIES Micro SD Card Connectors push-push type Revisions Control

More information

EN287. Switching to lead-free solder raises many issues and has consequences for all parts of the printed circuit board (PCB) assembly process.

EN287. Switching to lead-free solder raises many issues and has consequences for all parts of the printed circuit board (PCB) assembly process. EN287 Switching to lead-free solder raises many issues and has consequences for all parts of the printed circuit board (PCB) assembly process. This leaflet explains why companies need to consider making

More information

Qualification of Thin Form Factor PWBs for Handset Assembly

Qualification of Thin Form Factor PWBs for Handset Assembly Qualification of Thin Form Factor PWBs for Handset Assembly Mumtaz Y. Bora Kyocera Wireless Corporation San Diego, Ca. 92121 mbora@kyocera-wreless.com Abstract: The handheld wireless product market place

More information

Novel Technique for Flip Chip Packaging of High power Si, SiC and GaN Devices. Nahum Rapoport, Remtec, Inc.

Novel Technique for Flip Chip Packaging of High power Si, SiC and GaN Devices. Nahum Rapoport, Remtec, Inc. Novel Technique for Flip Chip Packaging of High power Si, SiC and GaN Devices Nahum Rapoport, Remtec, Inc. 1 Background Electronic Products Designers: under pressure to decrease cost and size Semiconductor

More information

Becoming Lead Free. Automotive Electronics. Antonio Aires Soldering Technical Specialist Visteon Corporation - Palmela Plant

Becoming Lead Free. Automotive Electronics. Antonio Aires Soldering Technical Specialist Visteon Corporation - Palmela Plant Automotive Electronics Becoming Lead Free Antonio Aires Soldering Technical Specialist Visteon Corporation - Palmela Plant 1 Agenda 1. Leadfree Electronics Drivers 2. Requirements 3. Areas of Impact 4.

More information

Reliability Testing of Ni-Modified SnCu and SAC305 - Vibration. Keith Sweatman, Nihon Superior Joelle Arnold, DfR Solutions March 2008

Reliability Testing of Ni-Modified SnCu and SAC305 - Vibration. Keith Sweatman, Nihon Superior Joelle Arnold, DfR Solutions March 2008 Reliability Testing of Ni-Modified SnCu and SAC305 - Vibration Keith Sweatman, Nihon Superior Joelle Arnold, DfR Solutions March 2008 2004-2008 Previous Work Accelerated Life Testing of SN100C for Surface

More information

Investigation of the recommended immersion Tin thickness for Pbfree

Investigation of the recommended immersion Tin thickness for Pbfree Investigation of the recommended immersion Tin thickness for Pbfree soldering Sven Lamprecht Atotech Deutschland GmbH Berlin Abstract First choices for Pb-free soldering are SnAgCu alloys, which are in

More information

Ceramic Column Grid Array Design and Manufacturing Rules for Flight Hardware

Ceramic Column Grid Array Design and Manufacturing Rules for Flight Hardware GODDARD TECHNICAL STANDARD GSFC-STD-6001 Goddard Space Flight Center Approved: 02-22-2011 Greenbelt, MD 20771 Expiration Date: 02-22-2016 Superseding GSFC-STD-XXXXR Ceramic Column Grid Array Design and

More information

Lead-Free Solder Bump Technologies for Flip-Chip Packaging Applications

Lead-Free Solder Bump Technologies for Flip-Chip Packaging Applications Lead-Free Solder Bump Technologies for Flip-Chip Packaging Applications Zaheed S. Karim 1 and Jim Martin 2 1 Advanced Interconnect Technology Ltd. 1901 Sunley Centre, 9 Wing Yin Street, Tsuen Wan, Hong

More information

JOINT INDUSTRY STANDARD

JOINT INDUSTRY STANDARD JOINT INDUSTRY STANDARD AUGUST 1999 Semiconductor Design Standard for Flip Chip Applications ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES Semiconductor Design Standard for Flip Chip Applications About

More information

Hard Gold Plating vs Soft Gold Plating Which is Right for My Application? By: Matt Lindstedt, Advanced Plating Technologies

Hard Gold Plating vs Soft Gold Plating Which is Right for My Application? By: Matt Lindstedt, Advanced Plating Technologies Hard Gold Plating vs Soft Gold Plating Which is Right for My Application? By: Matt Lindstedt, Advanced Plating Technologies When specifying gold plating for an application, the question of hard gold plating

More information

Reliability of Lead-Free Solder Connections for Area-Array Packages

Reliability of Lead-Free Solder Connections for Area-Array Packages Presented at IPC SMEMA Council APEX SM 2001 For additional information, please email marketing@amkor.com Reliability of Lead-Free Solder Connections for Area-Array Packages Ahmer Syed Amkor Technology,

More information

Fundamentals of Sealing and Encapsulation

Fundamentals of Sealing and Encapsulation Fundamentals of Sealing and Encapsulation Sealing and Encapsulation Encapsulation and sealing are two of the major protecting functions of IC packaging. They are used to protect IC devices from adverse

More information

PWB Dielectric Substrates for Lead-Free Electronics Manufacturing

PWB Dielectric Substrates for Lead-Free Electronics Manufacturing PWB Dielectric Substrates for Lead-Free Electronics Manufacturing Douglas Leys and Steven P. Schaefer* Park Electrochemical Corp. Anaheim, CA *Lake Success, NY Abstract In order to safely accommodate the

More information

Application Note AN-1023

Application Note AN-1023 Surface Mounting of Larger Devices by Pamela Dugdale and Arthur Woodworth Table of Contents Page Introduction...1 Board Materials...1 Thermal Resistance...1 Board Mounting...1 Board Attach Materials...2

More information

contaminated, or if the location of the assembly house is well above sea level.

contaminated, or if the location of the assembly house is well above sea level. VAPOR PHASE REFLOW S EFFECT ON SOLDER PASTE RESIDUE SURFACE INSULATION RESISTANCE Karen Tellefsen. Mitch Holtzer, Corne Hoppenbrouwers Alpha Assembly Solutions South Plainfield, NJ, USA Roald Gontrum SmartTech

More information

The Elimination of Whiskers from Electroplated Tin

The Elimination of Whiskers from Electroplated Tin The Elimination of Whiskers from Electroplated Tin by Masanobu Tsujimoto, Shigeo Hashimoto, Masayuki Kiso, Raihei Ikumoto,Toshikazu Kano and Genki Kanamori C. Uyemura & Co., Ltd. - Hirakata Japan & Don

More information

Question: Are RO4000 materials compatible with lead-free processes? Answer:

Question: Are RO4000 materials compatible with lead-free processes? Answer: Question: Are RO4 materials compatible with lead-free processes? Answer: RO4 cores and prepregs are among the most temperature stable products available. They easily meet or exceed all expectations for

More information

2ND LEVEL INTERCONNECT RELIABILITY OF CERAMIC AREA ARRAY PACKAGES

2ND LEVEL INTERCONNECT RELIABILITY OF CERAMIC AREA ARRAY PACKAGES 2ND LEVEL INTERCONNECT RELIABILITY OF CERAMIC AREA ARRAY PACKAGES Shingo Sato, Noriyuki Shimizu*, Shin Matsuda, Shoji Uegaki and Sachio Ninomiya Kyocera Corporation Kyoto, Japan Biography Noriyuki Shimizu

More information

THE EFFECTS OF PLATING MATERIALS, BOND PAD SIZE AND BOND PAD GEOMETRY ON SOLDER BALL SHEAR STRENGTH

THE EFFECTS OF PLATING MATERIALS, BOND PAD SIZE AND BOND PAD GEOMETRY ON SOLDER BALL SHEAR STRENGTH THE EFFECTS OF PLATING MATERIALS, BOND PAD SIZE AND BOND PAD GEOMETRY ON SOLDER BALL SHEAR STRENGTH Keith Rogers and Craig Hillman CALCE Electronic Products and Systems Center University of Maryland College

More information

Reliability of Interconnects in LED Lighting Assemblies Utilizing Metal Clad Printed Circuit Boards Stefano Sciolè BDM I.M.S.

Reliability of Interconnects in LED Lighting Assemblies Utilizing Metal Clad Printed Circuit Boards Stefano Sciolè BDM I.M.S. Reliability of Interconnects in LED Lighting Assemblies Utilizing Metal Clad Printed Circuit Boards Stefano Sciolè BDM I.M.S. Henkel Electronic Materials Agenda 1. Introduction 2. Motivation 3. Interconnect

More information

Jacques Matteau. NanoBond Assembly: A Rapid, Room Temperature Soldering Process. Global Sales Manager. indium.us/f018

Jacques Matteau. NanoBond Assembly: A Rapid, Room Temperature Soldering Process. Global Sales Manager. indium.us/f018 Jacques Matteau Global Sales Manager NanoBond Assembly: A Rapid, Room Temperature Soldering Process jmatteau@indium.com indium.us/f014 indium.us/f018 Terminology A few key terms NanoFoil is the heat source

More information

LGIT CSP Application NOTE. (Lighting)

LGIT CSP Application NOTE. (Lighting) LGIT CSP Application NOTE (Lighting) TABLE OF CONTENTS 1. LGIT CSP Detail -------------- P2 2. LGIT CSP PCB Design -------------- P3 2.1. LGIT CSP Footprint and PCB Pattern -------------- P3 2.2. PCB Substrate

More information

Lead Free Probe Series

Lead Free Probe Series Lead Free Probe Series INTERCONNECT DEVICES, INC. Introducing the Probe Series for Lead Free Test Lead Free Simulation Test Against Matte Tin For 100k Cycles Probing boards manufactured with lead-free

More information

XTSC SiCap 400µm - NiAu finishing - Assembly by soldering

XTSC SiCap 400µm - NiAu finishing - Assembly by soldering General description This document describes the attachment techniques recommended by Murata* for their XTSC silicon capacitors on the customer substrates. This document is non-exhaustive. Customers with

More information

SOLDER JOINT RELIABILITY TEST SUMMARY

SOLDER JOINT RELIABILITY TEST SUMMARY Project Number: SJR Tracking Code: TC0623-SEAF-SJR-1059 Requested by: Jeremy Wooldridge Date: 05/20/2008 Product Rev: D (SEAF), C (SEAM) Part #: SEAF-50-5.0-S-10-2-A/ SEAM-50-2.0-S-10-2-A SEAF-50-6.5-S-10-1-A/

More information

IPC-AJ-820A Assembly and Joining Handbook. The How and Why of All Things PCB & PCA

IPC-AJ-820A Assembly and Joining Handbook. The How and Why of All Things PCB & PCA IPC-AJ-820A Assembly and Joining Handbook The How and Why of All Things PCB & PCA 1 Scope To provide guidelines and supporting info for the mfg of electronic equipment To explain the HOW TO and WHY Discussions

More information

HTSC SiCap 400µm - NiAu finishing - Assembly by soldering

HTSC SiCap 400µm - NiAu finishing - Assembly by soldering General description This document describes the attachment techniques recommended by Murata* for their HTSC silicon capacitors on the customer substrates. This document is non-exhaustive. Customers with

More information

LPSC SiCap 100µm NiAu finishing - Assembly by soldering

LPSC SiCap 100µm NiAu finishing - Assembly by soldering General description This document describes the attachment techniques recommended by Murata* for their LPSC silicon capacitors on the customer substrates. This document is non-exhaustive. Customers with

More information

AN-400. Dimensions Format Pins Body Height Lead Pitch Thickness wide wide 0.100

AN-400. Dimensions Format Pins Body Height Lead Pitch Thickness wide wide 0.100 April 2008 AN-400 Surface Mount lastic ackages for High Reliability Applications Applications Note Introduction Holt Integrated Circuits specializes in the design and manufacture of components for military

More information

IPC -7095C Design and Assembly Process Implementation For BGAs

IPC -7095C Design and Assembly Process Implementation For BGAs IPC -7095C Design and Assembly Process Implementation For BGAs 1 Overview With the introduction of BGA components, things had to change: New design New assembly process New repair process New inspection

More information

Plating System Specifications and Inspection Techniques

Plating System Specifications and Inspection Techniques Fremont, CA 94555 SA Plating System s and Inspection Techniques 1 of 6 1.0 Scope 1.1 This document defines plating system specifications and inspection requirements for the plating systems required by

More information

Evaluation of Pb-free BGA Solder Joint Reliability on Ni-based Surface Finishes using Alternative Shear and Pull Metrologies

Evaluation of Pb-free BGA Solder Joint Reliability on Ni-based Surface Finishes using Alternative Shear and Pull Metrologies Evaluation of Pb-free BGA Solder Joint Reliability on Ni-based Surface Finishes using Alternative Shear and Pull Metrologies Kuldip Johal and Hugh Roberts Atotech USA Inc., Rock Hill, SC Sven Lamprecht,

More information

Failure Modes in Wire bonded and Flip Chip Packages

Failure Modes in Wire bonded and Flip Chip Packages Failure Modes in Wire bonded and Flip Chip Packages Mumtaz Y. Bora Peregrine Semiconductor San Diego, Ca. 92121 mbora@psemi.com Abstract The growth of portable and wireless products is driving the miniaturization

More information

Cu Bond Wire Reliability and Decapsulation Process

Cu Bond Wire Reliability and Decapsulation Process CMSE Los Angeles April 12 th and 13 th, 2017 Cu Bond Wire Reliability and Decapsulation Process Sultan Ali Lilani - Integra Technologies LLC Ph 510-830-9216 Email: sultan.lilani@integra-tech.com Web: www.integra.com

More information

Int. CI.*: B 32 B 15/01 B 32 B 15/18, B 32 B 3/00 C 25 D 5/14, H 01 L 21/48 H 01 L 23/02. Morristown, NJ 07960IUS)

Int. CI.*: B 32 B 15/01 B 32 B 15/18, B 32 B 3/00 C 25 D 5/14, H 01 L 21/48 H 01 L 23/02. Morristown, NJ 07960IUS) Europaisches Patentamt European Patent Office Office europeen des brevets Publication number: 0 175 901 A1 EUROPEAN PATENT APPLICATION Application number: 85110121.2 Date of filing: 13.08.85 Int. CI.*:

More information

Murata Silicon Capacitors - XTSC 400µm NiAu finishing Assembly by Soldering High temperature silicon capacitor. Table of Contents

Murata Silicon Capacitors - XTSC 400µm NiAu finishing Assembly by Soldering High temperature silicon capacitor. Table of Contents Table of Contents Table of Contents...1 Introduction...2 Handling precautions and storage...2 Pad opening...3 Process Flow...5 Solder print material and stencil printing recommendations...6 Pick and Place...7

More information

Lead Free Assembly: A Practical Tool For Laminate Materials Selection

Lead Free Assembly: A Practical Tool For Laminate Materials Selection Lead Free Assembly: A Practical Tool For Laminate Materials Selection Erik J. Bergum David Humby Isola Abstract: The impending European RoHS legislation, restricting the use of lead containing solders,

More information

Electrical and reliability properties of isotropic conductive adhesives on immersion silver printed-circuit boards

Electrical and reliability properties of isotropic conductive adhesives on immersion silver printed-circuit boards DOI 10.1007/s00542-008-0678-0 TECHNICAL PAPER Electrical and reliability properties of isotropic conductive adhesives on immersion silver printed-circuit boards J. Lee Æ C. S. Cho Æ J. E. Morris Received:

More information

Interconnection Reliability of HDI Printed Wiring Boards

Interconnection Reliability of HDI Printed Wiring Boards Presented in the ECWC 10 Conference at IPC Printed Circuits Expo, SMEMA Council APEX and Designers Summit 05 Interconnection Reliability of HDI Printed Wiring Boards Tatsuo Suzuki Nec Toppan Circuit Solutions,

More information

Lead-Free HASL: Balancing Benefits and Risks for IBM Server and Storage Hardware

Lead-Free HASL: Balancing Benefits and Risks for IBM Server and Storage Hardware Lead-Free HASL: Balancing Benefits and Risks for IBM Server and Storage Hardware November 19, 2009 M.Kelly, P.Eng, MBA Senior Engineer, ECAT Interconnect Technology Lead-Free Server Development Core Team

More information

FEMALE SOCKET CONNECTORS

FEMALE SOCKET CONNECTORS PRODUCT DESCRIPTION The Thomas & Betts Female Socket Connectors are designed to mate with a wide variety of Male Headers in PC board applications which require repeated connection and disconnection. The

More information

The Role Of Electroplates In Contact Reliability

The Role Of Electroplates In Contact Reliability The Role Of Electroplates In Contact Reliability W.H. Abbott Battelle-Columbus Abbott@battelle.org 10/24/02 1 Overview Electroplating Is A Process; i.e. It Should Not Be Viewed As Simply A Material The

More information

S3X48-M500C-5. Powerful Wetting Lead Free Solder Paste. Product information. Koki no-clean LEAD FREE solder paste. Contents.

S3X48-M500C-5. Powerful Wetting Lead Free Solder Paste. Product information. Koki no-clean LEAD FREE solder paste.   Contents. Koki no-clean LEAD FREE solder paste www.ko-ki.co.jp #50011E-0 Revised on JAN.22, 2013 Powerful Wetting Lead Free Solder Paste Product information This Product Information contains product performance

More information

WS488 WATER SOLUBLE SOLDER PASTE

WS488 WATER SOLUBLE SOLDER PASTE WS488 WATER SOLUBLE SOLDER PASTE FEATURES Excellent Wetting Extended Cleaning Window Superior Slump Resistance 8 Hour+ Stencil Life Wash With Water Alone Low Foaming DESCRIPTION AIM s WS488 water soluble

More information

PRODUCT PROFILE ELECTROLOY LEAD FREE BAR

PRODUCT PROFILE ELECTROLOY LEAD FREE BAR PRODUCT PROFILE ELECTROLOY LEAD FREE BAR Product Name Product Code SOLDER BAR LEAD FREE ALLOY Sn99.3/Cu0.7+Ni LF- 801B LEAD FREE ALLOY Sn99.6/Cu0.4+Ni LF- 801BE ( TOP UP ALLOY ) The information and statements

More information

T E C H N I C A L B U L L E T I N

T E C H N I C A L B U L L E T I N T E C H N I C A L B U L L E T I N SM1193 ALPHA CVP-390 SAC305- HIGH PERFORMANCE LEAD-FREE ALLOY SOLDER PASTE FOR AUTOMOTIVE ELECTRONICS DESCRIPTION CVP-390 SAC305 solder paste has been developed to provide

More information

PRODUCT SPECIFICATION

PRODUCT SPECIFICATION 1.0 SCOPE: 1 of 6 E 1.1 This specification sets forth the physical and performance parameters for the crimp to wire pin when mated with a Mini PV contact. 2.0 APPLICABLE DOCUMENTS: 2.1 The following documents

More information

Axiom Electronics LLC

Axiom Electronics LLC 1 of 8 1.0 PURPOSE and SCOPE This document defines Axiom s requirements for printed circuit board (PCB) fabrication, handling, and storage. Industry standards are referenced where appropriate. This document

More information

Lead Free Surface Mount Technology. Ian Wilding BSc Senior Applications Engineer Henkel Technologies

Lead Free Surface Mount Technology. Ian Wilding BSc Senior Applications Engineer Henkel Technologies Lead Free Surface Mount Technology Ian Wilding BSc Senior Applications Engineer Henkel Technologies Overview of the Presentation First contact: Impact on the production operator Packaging Labelling Impact

More information

A Novel Material for High Layer Count and High Reliability Printed Circuit Boards

A Novel Material for High Layer Count and High Reliability Printed Circuit Boards A Novel Material for High Layer Count and High Reliability Printed Circuit Boards Jie Wan, Junqi Tang, Xianping Zeng Shengyi Technology Co., Ltd. No.5 Western Industry Road, North Industry District SSL

More information

Via Life vs. Temperature Stress Analysis of Interconnect Stress Test

Via Life vs. Temperature Stress Analysis of Interconnect Stress Test Page 1 of 12 N P All BNP Media LINX Search H i 3 w Want to use this article? CLICK HERE for options!

More information

IMPACT OF MICROVIA-IN-PAD DESIGN ON VOID FORMATION

IMPACT OF MICROVIA-IN-PAD DESIGN ON VOID FORMATION IMPACT OF MICROVIA-IN-PAD DESIGN ON VOID FORMATION Frank Grano, Felix Bruno Huntsville, AL Dana Korf, Eamon O Keeffe San Jose, CA Cheryl Kelley Salem, NH Joint Paper by Sanmina-SCI Corporation EMS, GTS

More information

XBSC/UBDC/UBSC/BBSC/ULSC 100 µm & 400 µm - Assembly by soldering

XBSC/UBDC/UBSC/BBSC/ULSC 100 µm & 400 µm - Assembly by soldering Assembly by soldering General description This document describes the attachment techniques recommended by Murata* for their pre-bumped and un-bumped silicon capacitors on the customer substrates. This

More information

IPC Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures IPC-6015

IPC Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures IPC-6015 ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures February 1998 A standard developed

More information

Change Summary of MIL-PRF Revision K

Change Summary of MIL-PRF Revision K Throughout the document Add class Y. Add class Y non-hermetic for space application QML products to the MIL-PRF-38535., Class Y task group and Space community. Throughout the document Update Non-government

More information

EFFECT OF Ag COMPOSITION, DWELL TIME AND COOLING RATE ON THE RELIABILITY OF Sn-Ag-Cu SOLDER JOINTS. Mulugeta Abtew

EFFECT OF Ag COMPOSITION, DWELL TIME AND COOLING RATE ON THE RELIABILITY OF Sn-Ag-Cu SOLDER JOINTS. Mulugeta Abtew EFFECT OF Ag COMPOSITION, DWELL TIME AND COOLING RATE ON THE RELIABILITY OF Sn-Ag-Cu SOLDER JOINTS Mulugeta Abtew Typical PCB Assembly Process PCB Loading Solder Paste Application Solder Paste Inspection

More information

A. Feature Good wettability and antioxidation effect of flux

A. Feature Good wettability and antioxidation effect of flux A. Feature wettability and antioxidation effect of flux We have considered active temperature and persistence of flux, and selected activator newly. As results of this, J3-8843-KG has good wettability

More information

Optimizing the Insulated Metal Substrate Application with Proper Material Selection and Circuit Fabrication

Optimizing the Insulated Metal Substrate Application with Proper Material Selection and Circuit Fabrication Abstract Optimizing the Insulated Metal Substrate Application with Proper Material Selection and Circuit Fabrication Dave Sommervold, Chris Parker, Steve Taylor, Garry Wexler. The Bergquist Company Prescott,

More information

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards Qualification and Performance Specification for High Frequency (Microwave) Printed Boards Developed by the High Speed/High Frequency Board Performance Subcommittee (D-22) of the High Speed/High Frequency

More information

SPECIFICATION SHEET REQUIREMENTS FOR HRB SERIES FERRITE CHIP BEADS

SPECIFICATION SHEET REQUIREMENTS FOR HRB SERIES FERRITE CHIP BEADS 11525 Sorrento Valley Rd. San Diego, California 92121 (858) 481-0210 SPECIFICATION SHEET REQUIREMENTS FOR HRB SERIES FERRITE CHIP BEADS REVISION: A B C DATE: 4/01 3/02 5/03 DRAWN: Jeff Montgomery Drawing:

More information

Processor Performance, Packaging and Reliability Utilizing a Phase Change Metallic Alloy Thermal Interface System

Processor Performance, Packaging and Reliability Utilizing a Phase Change Metallic Alloy Thermal Interface System Processor Performance, Packaging and Reliability Utilizing a Phase Change Metallic Alloy Thermal Interface System Chris G. Macris, Thomas R. Sanderson, Robert G. Ebel, Christopher B. Leyerle Enerdyne Solutions,

More information

Murata Silicon Capacitors - LPSC 100µm NiAu finishing Assembly by Soldering. Table of Contents

Murata Silicon Capacitors - LPSC 100µm NiAu finishing Assembly by Soldering. Table of Contents Table of Contents Table of Contents...1 Introduction...2 Handling precautions and storage...2 Pad opening...3 Process Flow...5 Solder print material and stencil printing recommendations...6 Pick and Place...7

More information

ALPHA SACX Plus 0307, 0300 LEAD FREE WAVE SOLDER & REWORK ALLOY

ALPHA SACX Plus 0307, 0300 LEAD FREE WAVE SOLDER & REWORK ALLOY DESCRIPTION ALPHA SACX Plus 0307 is a next generation lead-free alloy suitable for use as a replacement for SnPb, SAC305 and other low silver SAC alloys including the original SACX 0307 in wave solder,

More information

ALPHA OM-5100 FINE PITCH SOLDER PASTE

ALPHA OM-5100 FINE PITCH SOLDER PASTE SM 797-7 ALPHA OM-5100 FINE PITCH SOLDER PASTE DESCRIPTION Cookson Electronics Assembly Material s ALPHA OM-5100, is a low residue, no-clean solder paste designed to maximize SMT line yields. The flux

More information

Adaption to scientific and technical progress under Directive 2002/95/EC

Adaption to scientific and technical progress under Directive 2002/95/EC . Adaption to scientific and technical progress under Directive 2002/95/EC Results previous evaluation Exemption No. 15 Lead in solders to complete a viable electrical connection between semiconductor

More information

Quality and Reliability Report

Quality and Reliability Report Quality and Reliability Report Product Qualification MASW-007921 2mm 8-Lead Plastic Package QTR-0148 M/A-COM Technology Solutions Inc. 100 Chelmsford Street Lowell, MA 01851 Tel: (978) 656-2500 Fax: (978)

More information

SnPb BGA Availability for High Rel Applications Supplier Perspective. Edgar R. Zuniga Texas Instruments September 28 th, 2006

SnPb BGA Availability for High Rel Applications Supplier Perspective. Edgar R. Zuniga Texas Instruments September 28 th, 2006 SnPb BGA Availability for High Rel Applications Supplier Perspective Edgar R. Zuniga Texas Instruments September 28 th, 2006 33 Background On January 27, 2003, European Union passed "Restriction on Use

More information