Immersion Tin SN 30 1
|
|
- Silvester Black
- 6 years ago
- Views:
Transcription
1 Immersion Tin SN 30 1 Immersion Tin SN 30 1 is a process for the electroless deposition of tin on copper and copper alloys in charge exchange. The process is so also be suitable to brighten lead- or tin-lead coatings. Smooth bright tin layers approx. 1-2 µm thick are deposited on copper surfaces at a temperature of 70 C, still enabling solderability after tempering (e. g. 4 h/155 C). Immersion Tin SN 30 1 is renewable. The copper accumulated in the electrolyte during operation can be separated. Components required for deposition can be replenished according to analysis. Therefore it s not necessary to dispose the tin plating solution like usual for the conventional immersion tin processes. The additives required for electrolyte make-up and operation do not contain any alkylphenol ethoxylates (nonylphenol ethoxylates). The layers deposited from this electrolyte meet the requirements of the RoHS (Restriction of (the use of certain) Hazardous Substances) EU Directive 2011/65/EU relating to the limit of lead, mercury, cadmium, Cr(VI), Polybrominated Biphenyls and Polybrominated Diphenyl Ethers. The information in this data sheet is based on laboratory as well as practical experience. Figures quoted for operating limits and replenishment quantities are for guidance. Actual values necessary will depend on the components being plated (material and geometry), their application and plating plant conditions. Important: Please read this instruction carefully prior to the use of the process and carefully follow all the parameters that have a direct influence on the operation. We reserve the right to make technical changes. In the interest of safety, please pay attention to the hazard warnings on the labels of the containers. The minimum shelf life of the products is included on the labels and is also available in the appropriate Quality Assurance (QA03). The current IMDS number of the layer deposited from the process is available on the internet at For the storage of chemical products the TRGS 510 must be followed. If the additives used in this process contain a SVHC-substance, then this will be specified in the corresponding Material Safety Data Sheet, section 15. BATH E Page 1 of 5 Issue
2 1.0 TECHNICAL INFORMATION AND EQUIPMENT REQUIREMENTS Tanks: Local Exhaust Ventilation: Part-/Electrolyt Agitation: Filtration: Heating/Cooling: polypropylene, no PVC required recommended recommended; always make sure that no PVC pipes are used; PVC is attacked by Immersion Tin SN 30 1 and leads to interferences in the tin plating solution; in case of doubt the quality to be used must be verified on its applicability porcelain or PTFE coated immersion heaters 2.0 MAKE-UP AND OPERATING CONDITIONS 2.1 Product names List of products required Product name Article no. (AN) SG Make-up Concentrate SN Make-up Concentrate SN Activating Salt SN Additive CULMO AN Requirements for a 100 litre bath AN SG Quantity Make-up Concentrate SN ltr. Make-up Concentrate SN ltr. Activating Salt SN kg Additive CULMO AN ltr. 2.3 Make-up sequence for a 100 litre bath All tanks and associated equipment must be thoroughly cleaned prior to use. fill 50 litres water into tank add 10 kg of Activating Salt SN 33 and dissolve while stirring add 11.3 litres of Make-up Concentrate SN 31 mix thoroughly add 16 litres of Make-up Concentrate SN 32 add 1 litre of Additive CULMO AN 11 1 mix well make up with water to final volume The electrolyte is ready for use when the operating temperature has been reached. BATH E Page 2 of 5 Issue
3 2.4 Concentrations and operating conditions Range Optimum Tin g/l Make-up Concentrate SN ml/l Activating Salt SN g/l Additive CULMO AN ml/l Temperature Range C Exposition time depends on the required layer thickness, see table below Layer thickness [µm] depends on temperature and exposition time: Exposition time [min] Temperature [ C] Consumption and replenishment Deposition basis is the charge exchange reaction between copper and tin. Depending on the quantity of tin deposited an equivalent amount of copper is dissolving. As soon as a copper concentration of 6-8 g/l is reached, copper can be separated as a good crystallizing compound by cooling down to room temperature. To avoid caking of the crystal compound, constant stirring of the solution is recommended while cooling to room temperature. The crystallized copper compounds are easy to filter using simple bag filters. In the filtrate free acid, tin content and the concentration of Activating Salt SN 33 will be analyzed and replenished accordingly. 3.0 PROCESS SEQUENCE 3.1 Pre-treatment The parts to be plated are pre-treated as usual. Detailed information on suitable pre-treatment products are given upon request. 3.1 Process sequence Electroless tin plating of PCBs BATH E Cleaner SLOTOCLEAN S 20 activating in BATH E Copper Activator S 40 activating in 75 ml/l of Acid Concentrate FF (AN ) Immersion Tin SN 30 1 drying BATH E Page 3 of 5 Issue
4 4.0 MAINTENANCE AND FUNCTION OF THE INDIVIDUAL BATH COMPONENTS 4.1 Make-up Concentrate SN 31 Make-up Concentrate SN 31 contains the acid required for the operation of Immersion Tin SN An analytical determination of the acid content is possible. Lack of acid is replenished by Make-up Concentrate SN 31. Lack of 1 g/l of acid is replenished with 0.75 ml/l of Make-up Concentrate SN Make-up Concentrate SN 32 Besides acid, Make-up Concentrate SN 32 contains also the tin necessary for the operation of Immersion Tin SN Tin concentration shouldn t fall below 10 g/l of tin when tin is deposited onto copper. The tin concentration may be monitored analytically. To raise the tin concentration by 1 g/l, the electrolyte must be replenished with 8 ml/l of Make-up Concentrate SN Activating Salt SN 33 Activating Salt SN 33 is required for a trouble-free tin deposition. The concentration of Activating Salt SN 33 shouldn t drop below 75 g/l, and can be monitored analytically. The difference between the required value and the value determined by analysis is directly for replenishment of Activating Salt SN Additive CULMO AN 11 1 Additive CULMO AN 11 1 is a special wetting agent which improves wetting of the copper surface and helps to produce a fine crystalline, silky deposit. Lack of Additive CULMO AN 11 1 may result in step plating respectively uneven, stained deposition. In this case, additions of 5 ml/l of Additive CULMO AN 11 1 should be made. The consumption is mainly due to drag-out. The continuous replenishment should be performed in the same ratio like Activating Salt SN 33. For each 1 kg of Activating Salt SN 33, 0.1 litre of Additive CULMO AN 11 1 must be replenished. 5.0 TROUBLE SHOOTING 5.1 Fault finding chart Fault Cause Correction stained deposition lack of Activating Salt SN 33 analysis of Activating Salt SN 33, replenish to optimum black surface contamination by organics treatment with 4 g/l activated carbon, filtration stained surface lack of Additive CULMO AN 11 1 addition of 5 ml/l Additive CULMO AN 11 1, repeat if required BATH E Page 4 of 5 Issue
5 6.0 EFFLUENT Legal regulations must be observed for disposal of the Immersion Tin SN Different regulations normally apply for the additives and the ready-made electrolyte. Please refer to section 13 of the appropriate Material Safety Data Sheet for disposal code and recommendations. The following detoxification sequence is only considered to be an aid: Effluent treatment can be performed either with Precipitant AW 10 (organosulfide) according to the usual method or according to method described below: dilute effluent in ratio 1 : 10 up to 1 : 25 (related to the electrolyte volume) add 25 ml/l of hydrogen peroxide, (30 %) to a dilution of 1 : 10 and 10 ml/l to 1 : 25 min. 6 h reaction time (preferably over night) adjust ph to 9.0 using lime milk filtrate after 2-6 h through a filter press Caution Copper compounds separated off from the solution during regeneration must be dumped as heavy metal residues. 7.0 SAFETY Reasonable care is required when handling chemical products. Only personnel specially trained on working with chemicals should be deployed with their handling. EC Material Safety Data Sheets must be made available to all personnel dealing with the chemicals to ensure they have all required information about product composition, hazards identification, first-aid measures, handling and storage, exposure controls, toxicological and ecological information, etc. It is required to ensure the supply and use of suitable protective clothing and -equipment. The user must verify the designated purpose of the electrolyte. Previous experience has shown that not all metal surfaces are suitable for a trouble-free electroplating. The above mentioned data are made according to our best knowledge. Consistent operation of the working solution requires appropriate maintenance. Immersion Tin SN 30 1 is a process of GmbH & Co KG. It can only be operated with the products described in this technical data sheet. Use of other chemicals (also partly) will impair quality and invalidates our service- and quality commitments (quality assurance). BATH E Page 5 of 5 Issue
Bright Tin CULMO 20. Bright Tin CULMO 20 is extraordinary stable and easy to handle.
Bright Tin CULMO 20 Brigt Tin CULMO 20 is based upon sulphuric acid, free from formalin and deposits bright tin layers. These layers are resistant to fingerprints and show good solderability, even after
More informationNB SEMIPLATE AG 100 Ag electroplating process
NB SEMIPLATE AG 100 Ag electroplating process INTRODUCTION NB SEMIPLATE AG 100 is an alkaline, non-cyanide electroplating formulation, which produces satin bright silver deposits. Deposits from the NB
More informationTinmac Stannolyte Bright Acid Tin Solution
Tinmac Stannolyte Bright Acid Tin Solution # EU86305 Tinmac Stannolyte is a bright acid tin solution that is effective for the production of bright electroplated tin deposits which have applications in
More informationNITEC CRYSTAL 1. Elektrolyt to achieve uniform and non reflective Nickel deposits
Postfach 169 CH-9545 Wängi TG 25.07.2014 NITEC CRYSTAL 1 Elektrolyt to achieve uniform and non reflective Nickel deposits In contrast to bright nickel, the NITEC CRYSTAL electroplating process produces
More informationNB SEMIPLATE AU 100 Bright Au electroplating process, sulfite based, arsenic grain refiner
NB SEMIPLATE AU 100 Bright Au electroplating process, sulfite based, arsenic grain refiner INTRODUCTION NB SEMIPLATE AU 100 is an alkaline, non-cyanide electroplating formulation based on arsenic grain
More informationNB SEMIPLATE AU 100 TH Bright Au electroplating process, sulfite-based, arsenic-free
NB SEMIPLATE AU 100 TH Bright Au electroplating process, sulfite-based, arsenic-free INTRODUCTION NB SEMIPLATE AU 100 TH is an alkaline, non-cyanide electroplating formulation which produces a bright,
More informationSurTec 881 Trivalent Decorative Chromium Process
Protection upgraded SurTec 881 Trivalent Decorative Chromium Process (Anti Salts Type) Properties environmentally friendly, hexavalent chromium free plating process high corrosion protection against calcium
More informationTriPass ELV 1500LT Iridescent Trivalent Chromium Passivate
TriPass ELV 1500LT Iridescent Trivalent Chromium Passivate Version 6.2 # 187396 Description TriPass ELV 1500LT is a trivalent passivate based upon trivalent chromium, for use with electroplated zinc and
More informationManufactured for North America exclusively by Automated Chemical Solutions, Inc E. Roeser Road Phoenix, Arizona 85040
NICKEL 5000 BRIGHT NICKEL INTRODUCTION The Nickel 5000 process has been developed to produce fully bright, highly leveled, ductile nickel deposits. The process can be used for rack or barrel plating. BENEFITS
More information4831 S. Whipple Avenue Chicago IL Phone: Fax:
ACCU-LABS INC. 4831 S. Whipple Avenue Chicago IL 60632 Phone: 773.523.3100 Fax: 773.523.4008 www.accu-labs.com A2LA Accredited ISO/IEC 17025:2005 Certificate # 2558.01 377 Electroless Nickel-Boron Process
More informationSILVERON TM GT-101 Bright Silver Cyanide-Free Bright Electrolytic Silver For Electronic, Decorative and Industrial Finishing Applications
Technical Data Sheet SILVERON TM GT-101 Bright Silver Cyanide-Free Bright Electrolytic Silver For Electronic, Decorative and Industrial Finishing Applications Regional Product Availability Description
More informationMetal Finishing Products and Service META-MATE ZINCATE 40 "A CONCENTRATED LIQUID ZINCATE FORMULATION FOR THE PRETREATMENT OF ALUMINUM AND ITS ALLOYS"
Metal Chem,inc. Metal Finishing Products and Service 29 Freedom Court Greer, SC 29650 864.877.6175 Fax 864.877.6176 DATA SHEET META-MATE ZINCATE 40 "A CONCENTRATED LIQUID ZINCATE FORMULATION FOR THE PRETREATMENT
More informationSurTec 717 Alkaline Zinc/Nickel Electroplating Process (Electrolyte based on Sodium)
SurTec 717 Alkaline Zinc/Nickel Electroplating Process (Electrolyte based on Sodium) Properties tolerates higher temperatures superior metal distribution produces Zn/Ni alloy deposits containing 12-15
More informationTechnical Data Sheet. Physical Specifications
Cu/ETCH ME-40A A General Purpose Copper Micro-Etch Product Description Cu/ETCH ME-40 (ME-40) is a two component liquid, designed to provide optimum micro-roughening and cleaning of copper surfaces prior
More informationToward Cleaner Production technologies in surface treatment of metals
Waste Management and the Environment III 57 Toward Cleaner Production technologies in surface treatment of metals A. Nakonieczny & M. Kieszkowski Institute of Precision Mechanics, Warsaw, Poland Abstract
More informationP.T. SINAR CEMARAMAS ABADI
HR 101 Electroless Nickel Process 1. DESCRIPTION The electroless nickel process HR 101 is an extremely economic proceeding, distinguishing by highbright deposits and a very high deposition speed. Deposition
More informationTechnical Data Sheet
Cu/ETCH ME-35 A General Purpose Copper Microetch Product Description Cu/ETCH ME-35 (ME-35) is a single component liquid, designed to provide optimum micro-roughening and cleaning of copper surfaces prior
More informationRITTER Pickling Fluids finished blending VA 10 concentrate 1:1 VA 15 concentrate 1:2 VA 20
How to use RITTER Pickling Products RITTER Pickling Fluids finished blending VA 10 concentrate 1:1 VA 15 concentrate 1:2 VA 20 30 kg 200 kg 1000 kg RITTER Pickling Fluids for diving, spraying and revolving
More informationEnerox Nickel Additive E 44 Product Code: Revised Date: 09/26/2007
Enerox Nickel Additive E 44 INSTRUCTIONS FOR BRIGHT NICKEL PLATING USING ENE NICKEL ADDITIVES The Ene Bright Nickel Plating Process is designed and formulated to produce high quality bright nickel deposits.
More informationCHROME GLEAM 3C Jet Black Trivalent Chromium Plating Process
Technical Data sheet CHROME GLEAM 3C Jet Black Trivalent Chromium Plating Process For Industrial Finishing Applications Regional Product Availability Description N. America Japan/Korea Asia Europe CHROME
More informationENVIRO/Etch Replenisher
ENVIRO/Etch Replenisher Copper Etchant Product Description ENVIRO/Etch (ENVIRO/Etch) is a stabilized formulation designed to provide optimum micro-roughening and cleaning of copper surfaces prior to dry
More informationNON-CYANIDE ZINC NICKEL PROCESS
NON-CYANIDE ZINC NICKEL PROCESS PHYSICAL PROPERTIES: ZINNI AL 451: Dark-blue liquid ZINNI AL 452: Transparent violet liquid ZINNI AL 453: Transparent yellowish liquid DESCRIPTION: The process is an alkaline
More informationCOPPER GLEAM RG 11 Acid Copper Plating Process
Technical Data sheet COPPER GLEAM RG 11 Acid Copper Plating Process For Industrial Finishing Applications REGIONAL PRODUCT AVAILABILITY DESCRIPTION N. America COPPER GLEAM RG 11 Acid Copper Plating Process
More informationNON-CYANIDE ZINC-IRON PROCESS ZI NF E R S
NON-CYANIDE ZINC-IRON PROCESS ZI NF E R 5 9 0 S PHYSICAL PROPERTIES: ZINFER 591: Brown Liquid ZINFER 595: Yellowish Liquid ZINFER 596: Clear Liquid ZINFER 597: Brown Liquid DESCRIPTION: The ZINFER 590
More informationEnerox Nickel Additive E 66 Product Code: Revised Date: 02/28/2012. Enerox Nickel Additive E 66 High End Rack Plating
Enerox Nickel Additive E 66 High End Rack Plating INSTRUCTIONS FOR BRIGHT NICKEL PLATING USING ENEROX NICKEL ADDITIVES The Enerox Bright Nickel E-66 Plating Process is designed and formulated to produce
More informationHAVACHROME CR3 TRIVALENT BRIGHT CHROMIUM PROCESS
HAVACHROME CR3 TRIVALENT BRIGHT CHROMIUM PROCESS HAVACHROME CR3 Process is a unique trivalent chromium plating process, that is used to deposit a bright chromium deposit over bright nickel deposits. IMPORTANT:
More informationSurTec 759 Acidic Bright Zinc Process
Protection upgraded SurTec 759 Acidic Bright Zinc Process Properties produces very bright and ductile zinc layers highly concentrated additives, very economic consumption excellent covering and throwing
More informationNB SEMIPLATE CU 200 Copper electroplating process
NB SEMIPLATE CU 200 Copper electroplating process INTRODUCTION The NB SEMIPLATE CU 200 process is an acid copper plating formulation engineered for wafer plating applications including copper bump plating,
More informationSOLDERON SC Process. For Electronic Finishing Applications. Deposits meet or exceed Military Specification Method 202F, Method 208F.
Technical Data sheet SOLDERON SC Process For Electronic Finishing Applications REGIONAL PRODUCT AVAILABILITY DESCRIPTION N. America Japan/Korea Asia Europe SOLDERON SC is a low-foaming, organic sulfonate
More informationPALLAMERSE SMT 2000 For PWB Metallization Applications
PALLAMERSE SMT 2000 For PWB Metallization Applications Regional Product Availability N.America Japan/Korea Asia Europe DESCRIPTION The Pallamerse SMT 2000 is an autocatalytic palladium process designed
More informationAURALL 305M Electrolytic Gold For Electronic Finishing Applications
Technical Data Sheet AURALL 305M Electrolytic Gold For Electronic Finishing Applications Regional Product Availability Description Advantages North America AURALL 305M Electrolytic Gold produces semibright,
More informationPROBLEM CAUSE SOLUTION
Technical Data Sheet HAVASHINE AZ PROCESS Trouble Shooting Guide HCD burning Low HAVASHINE Add 1% HAVASHINE AZ AZ CARRIER CARRIER. Low ammonium chloride Keep the ammonium chloride level at 4 6 opg (30
More informationDirect Copper Metalization of Aluminum: Elimination of Zincate
June 2018 Direct Copper Metalization of uminum: Elimination of Zincate Richard DePoto, Business Development Doug Duda, Laboratory Manager Uyemura International Corporation Southington CT rdepoto@uyemura.com
More informationDURNI-COAT DNC
RIAG Oberflächentechnik AG Postfach 169 CH-9545 Wängi TG 25.04.2014 DURNI-COAT DNC 520-12-50 Electroless plating nickel bath for high wear and corrosion resistant applications DNC 520-12-50 is a process
More informationTECHNICAL DATA SHEET GARDOBOND G 4040
Phosphating process for iron materials to reduce sliding friction. Application by immersion. SCOPE Gardobond G 4040 is a phosphating process for iron materials on the basis of manganese phosphate. Gardobond
More informationPALLAMET 500 Palladium-Nickel
Technical Data Sheet PALLAMET 500 Palladium-Nickel For Electronic Finishing Applications Regional Product Availability Description North America Asia-Pacific The PALLAMET 500 Palladium-Nickel electrolyte
More informationSOLDERON BLS For Electronic Finishing Applications
SOLDERON BLS For Electronic Finishing Applications DESCRIPTION Solderon BLS is a low-speed tin-lead plating process designed to produce bright deposits from an organic sulfonate electrolyte. Fully-solderable
More informationSurTec 712 Alkaline Cyanide-Free Zinc/Iron Process
Protection upgraded SurTec 712 Alkaline Cyanide-Free Zinc/Iron Process (Electrolyte based on Potassium) Properties for rack and barrel plating, with excellent metal distribution good covering and throwing
More information4831 S. Whipple Avenue Chicago IL Phone: Fax:
ACCU-LABS INC. 4831 S. Whipple Avenue Chicago IL 60632 Phone: 773.523.3100 Fax: 773.523.4008 www.accu-labs.com A2LA Accredited ISO/IEC 17025:2005 Certificate # 2558.01 855 Electroless Copper Plating Process
More informationRONOVEL C AUROSPEED CVD
RONOVEL C AUROSPEED CVD COBALT-ALLOYED ELECTROLYTIC GOLD For Electronic Finishing Applications Regional Product Availability N.America Japan/Korea Asia Europe DESCRIPTION Ronovel C and Aurospeed CVD electrolytic
More informationSurTec 704 Cyanide-Free Alkaline Bright Zinc Process of the New Generation
Protection upgraded SurTec 704 Cyanide-Free Alkaline Bright Zinc Process of the New Generation (Electrolyte based on Sodium) Properties excellent metal distribution (only about 25 % of variance on a 1
More informationSurTec 704 Cyanide-Free Alkaline Bright Zinc Process of the New Generation
Protection upgraded SurTec 704 Cyanide-Free Alkaline Bright Zinc Process of the New Generation (Electrolyte based on Potassium) Properties excellent metal distribution (only about 25 % of variance on a
More informationTest Report Pentagal. Test with Cookson SACX alloy for the HASL process
Test Report Pentagal Test with Cookson SACX alloy for the HASL process 1. Introduction From 16.05.06 untill 16.09.06 a long term test was carried out at PENTAGAL Chemie und Maschinenbau GmbH with the Cookson
More informationSEMMPF3-031 Finishing materials by electroplating methods
Overview This standard identifies the competencies you need to carry out electroplating processes to various substrates, in accordance with approved procedures. The electroplating activities carried out
More informationHyProTec. Hexavalent free RoHS, ELV and WEEE compliant. HyPro System
HyPro System is a high performance, trivalent passivate for zinc and zinc-nickel electrodeposits. will provide outstanding performance of corrosion resistance per ASTM B 117. Exceeds 120 hours to white
More informationSurTec 650 chromital TCP
Protection upgraded SurTec 650 chromital TCP Pre-Treatment for Aluminium prior to Coating Properties hexavalent chromium-free pre-treatment, suitable before painting, powder coating and gluing liquid concentrate
More informationTechnical Data Sheet. Physical Specifications. ph 6-7. Storage Requirements
AUTO / Prep DS-2 Alkaline Permanganate Desmear Process Product Description AUTO/Prep DS-2 is the second step in the AUTO/Prep Desmear-Etchback Process and is designed to remove resin smear and expose interconnects,
More informationSEALER 700 W. SEALER 700 W is a water dilutable, inorganic sealing system based on silicon.
SEALER 700 W PHYSICAL PROPERTIES: Clear, colourless, ph neutral liquid DESCRIPTION: SEALER 700 W is a water dilutable, inorganic sealing system based on silicon. SEALER 700 W contains no chromates in the
More informationTINGLO CULMO Bright Acid Tin Electroplating (with Starter/Brightener 2.5X) For Electronic Finishing Applications
Technical Data Sheet TINGLO CULMO Bright Acid Tin Electroplating (with Starter/Brightener 2.5X) For Electronic Finishing Applications Regional Product Availability North America Description Advantages
More informationNB SEMIPLATE CU 150 Copper electroplating process
NB SEMIPLATE CU 150 Copper electroplating process INTRODUCTION The NB SEMIPLATE CU 150 process is an acid copper plating formulation engineered for wafer plating applications including copper bump plating,
More informationHOUGHTO-PHOS 6300 LOW TEMPERATURE MANGANESE PHOSPHATE
Process Instructions HOUGHTO-PHOS 6300 LOW TEMPERATURE MANGANESE PHOSPHATE Houghto-Phos 6300 is a manganese phosphate product designed to be used for break-in lubrication of iron and steel materials. Houghto-Phos
More informationCIRCUPOSIT Electroless Copper (USING CUPOSIT Z AND Y-1) For PWB Metallization Applications
Technical Data Sheet CIRCUPOSIT 3350-1 Electroless Copper (USING CUPOSIT Z AND Y-1) For PWB Metallization Applications Regional Product North America Availability Description CIRCUPOSIT 3350-1 Electroless
More informationSurTec 717 R Alkaline Zinc/Nickel Process
Protection upgraded SurTec 717 R Alkaline Zinc/Nickel Process Properties optimized for rack plating tolerates higher temperatures with high burning limit achieves superior metal distribution produces uniform
More informationSEALER 300 W CT. Clear colourless liquid
SEALER 300 W CT PHYSICAL PROPERTIES: Clear colourless liquid DESCRIPTION: SEALER 300 W CT is a water dilutable, inorganic sealing system based on silicon. SEALER 300 W CT contains no chromates in the dry
More informationNon-Cyanide, Non-Pyrophosphate Alkaline Copper Plating
E-Brite Ultra Cu-Pb Non-Cyanide, Non-Pyrophosphate Alkaline Copper Plating E-Brite Ultra Cu-Pb plates copper directly onto lead resulting in excellent adhesion and appearance. It eliminates the necessity
More informationActivated Black Magic Plus Product Code: Revised Date: 10/26/2016. Activated Black Magic Plus Black Oxide Finish for Steel
Activated Black Magic Plus Black Oxide Finish for Steel Activated Black Magic Plus produces the ultimate in black oxide finishes with its unique patented combination of activators, rectifiers, catalysts,
More informationHAVALLOY Z-C ACID CHLORIDE ZINC / COBALT PROCESS
ACID CHLORIDE ZINC / COBALT PROCESS provides a bright, ductile electro-deposited zinc-cobalt alloy containing from 0.1% to 0.5% cobalt that is evenly distributed at low, mid and high current densities.
More informationPavCoTing. Chromium appearance and corrosion resistance Ease of plating bath control Wide current density range
is an environmentally friendly alternative to chromium electroplating. is a cobalt alloy that, when plated over nickel, has the appearance and corrosion resistance of decorative chromium. is diverse enough
More informationVerification Result :.
Verification Report. No. Date: 08 May 2018. Page 1 30. WUHU DELUX MOBILE INTERNET DEVICE CO.,LTD. WUHU MACHINERY INDUSTRIAL PARK, ANHUI, CHINA.. Name :. Designer Keyboard. SGS Job No. : RP17-012525 - SZ.
More informationSOLDERON MHS-W MATTE TIN AND TIN-LEAD PROCESS
SOLDERON MHS-W MATTE TIN AND TIN-LEAD PROCESS For Electronic Finishing Applications Regional Product Availability N.America Japan/Korea Asia Europe DESCRIPTION Solderon MHS-W is a high-speed, non-foaming
More informationE-Brite Ultra Cu-Mg. Non-Cyanide, Non-Pyrophosphate Alkaline Copper Plating
E-Brite Ultra Cu-Mg Non-Cyanide, Non-Pyrophosphate Alkaline Copper Plating E-Brite Ultra Cu-Mg plates copper directly on zincated magnesium casting (AZ91) resulting in excellent adhesion and corrosion
More informationAlkzinc 818. Mirror bright finish Good zinc deposit distribution Very good adhesion and ductility Excellent chromate receptivity
Zinc Plating Systems Pavco s process is an alkaline zinc brightener system that offers mirror bright deposits that do not dull or fade during high temperature baking. The deposit easily accepts all chromate
More informationTechnology update plating on plastic for sustainability TOP ZECROM PROCESS
23 June 2017 Surface and Coatings Forum 2017 1 Technology update plating on plastic for sustainability TOP ZECROM PROCESS Toshimitsu NAGAO OKUNO CHEMICAL INDUSTRIES CO., LTD. OSAKA JAPAN Outline: Plating
More informationFLO KING CARBON/RESIN CANISTER INSTRUCTIONS
CRC Instructions Page 1 FLO KING CARBON/RESIN CANISTER INSTRUCTIONS CAUTION! Do not attempt to carbon treat a solution before you have thoroughly filtered it! This almost certainly will result in poor
More informationLaser ACB 50 Product Code: Revised Date: 03/17/2009. Laser ACB 50
DESCRIPTION Laser ACB 50 Laser ACB 50 is a peroxide/sulfuric acid system that replaces bichromate, chromic acid, or nitricsulfuric acid pickles commonly used for pickling copper, brass and bronze alloys.
More informationSurTec 609 EC Pre-Treatment prior to E-Coat
Protection upgraded SurTec 609 EC Pre-Treatment prior to E-Coat Properties suitable as multimetal passivation prior to painting (steel, aluminium, HDG and EG zinc and zinc die cast) yields in uniform nano-size
More informationLaser EX 50 Product Code: Revised Date: 03/17/2009. Laser EX 50
DESCRIPTION Laser EX 50 Laser EX 50 is a peroxide-based chemical polishing product that will provide a high luster on brass and most copper alloys. In many cases the Laser EX 50 will give a chemical alternative
More informationPALLADURE 200 Pure Palladium Process
Technical Data sheet PALLADURE 200 Pure Palladium Process For Electronic Finishing Applications REGIONAL PRODUCT AVAILABILITY DESCRIPTION N. America Asia The PALLADURE TM 200 Process is characterized by
More informationNIPOSIT PM-980 W Semi-Bright Electroless Nickel Process For Industrial Finishing Applications
Technical Data Sheet NIPOSIT PM-980 W Semi-Bright Electroless Nickel Process For Industrial Finishing Applications Regional Product Availability Description North America The NIPOSIT PM-980 W process is
More informationCoolex L. Brief description. Product description
Coolex L Heat transfer fluid for applications in the food or pharmaceutical industry, based on 1,2-propylene glycol (MPG), offering protection against frost and corrosion in technical systems. Brief description
More informationCIRCUPOSIT 71 Full Build Electroless Copper Nitrate Bath (Generic Concentrates) For Electronic Finishing Applications
CIRCUPOSIT 71 Full Build Electroless Copper Nitrate Bath (Generic Concentrates) For Electronic Finishing Applications Regional Product Availability Description N. American Asia CIRCUPOSIT 71 Full Build
More informationLead-free electroless plating nickel bath for high wear and corrosion resistant applications
RIAG Oberflächentechnik AG Postfach 169 CH-9545 Wängi TG 24.08.2009 DURNI-COAT DNC 571 Lead-free electroless plating nickel bath for high wear and corrosion resistant applications DNC 571 is a process
More informationTECHNICAL DATA SHEET CUPROBRITE Revolutionary & New generation Bright Acid Copper Plating Process
TECHNICAL DATA SHEET CUPROBRITE 3006 Revolutionary & New generation Bright Acid Copper Plating Process Cuprobrite 3006 is a bright acid copper plating process which produces highly levelled, brilliant,
More informationSILVER GLO 3KBP. With SILVER GLO 33BP Silver Plating Process For Electronic Finishing Applications. Silver M etal as Silver: Cyanide (80.
Technical Data sheet SILVER GLO 3KBP With SILVER GLO 33BP Silver Plating Process For Electronic Finishing Applications REGIONAL PRODUCT AVAILABILITY DESCRIPTION N. America SILVER GLO 3KBP Process is designed
More informationCHAPTER 3 DEVELOPMENT OF ELECTROPLATING SETUP FOR PLATING ABS AND POLYAMIDES
82 CHAPTER 3 DEVELOPMENT OF ELECTROPLATING SETUP FOR PLATING ABS AND POLYAMIDES 3.1 BACKGROUND OF ELECTROPLATING 83 3.2 DETAILS OF THE DEVELOPMENT OF ELECTROPLATING SETUP 83 3.2.1 Polypropylene Tank for
More informationTechnical Information Leaflet
XZ77 Series Alkali Soluble Plating Resists PRODUCT REFERENCE XZ77 Alkali Soluble Plating Resist Blue CGSN7005 XZ77LB Alkali Soluble Plating Resist Light Blue CGSN7028 XZ77LVDB Alkali Soluble Plating Resist
More informationLumina. Bright, leveled deposits in less time Excellent ductility Good chromium reception Very low additive consumption rate. Nickel Plating System
is the ultimate fast leveling bright nickel electroplating system, specially designed for low thickness deposits, while being unparalleled for high spec nickel plating as well. Existing nickel baths can
More informationTest Report. MDL Element. Other Polymers and metals Composite material Polymers material
No.R011512542R Date: Feb. 17, 2016 Page 2 of 13 Test Method: A. Screening test by XRF spectroscopy XRF screening limits in mg/kg for regulated elements according to IEC 62321-3-1:2013. Limit of IEC 62321-3-1:2013.
More informationIN-TANK TECHNOLOGY INSTRUCTIONS FOR USING FLO KING IN-TANK CARBON BAG
Carbon Bag Instructions Page 1 INSTRUCTIONS FOR USING FLO KING IN-TANK CARBON BAG Do not attempt to carbon treat a solution before you have thoroughly filtered it! This almost certainly will result in
More informationPREPOSIT Etch 748. For PWB Metallization Applications. For use in the CIRCUPOSIT 3000 Process. Bath Make-up Metric (for 100 liters)
Technical Data sheet PREPOSIT Etch 748 For PWB Metallization Applications REGIONAL PRODUCT AVAILABILITY DESCRIPTION N. America Japan/Korea Asia For use in the CIRCUPOSIT 3000 Process. PREPOSIT Etch 748
More information-.O oz/gal. It is again desirable to have some means of mechanical agitation.
. THE ALDOA COMPANY 12727 WESTWOOD 0 DETROIT, MICHIGAN 4822 NOVALYTE 421-D CYANIDE FREE, ALKALINE ZINCATE PLATING PROCESS INTRODUCTION Novalyte 421-D is a completely cyanide free system, utilizing only
More informationAUTONIC MX, 440. AUTONIC MX Matrix 440 PROCESS: FEATURES: Stapleton Technologies Inc, Rev /99 Page 1 of 8
AUTONIC MX, 440 MID PHOSPHORUS, FUNCTIONAL MATRIX ELECTROLESS NICKEL PROCESS: AUTONIC MX is a functional, midphosphorus (7-9.5 %P) electroless nickel process designed for high production processing in
More informationSOLDERON ST-200 For Electronic Finishing Applications
SOLDERON ST-200 For Electronic Finishing Applications Regional Product Availability N.America Japan/Korea Asia Europe 5. Solderon ST-200 6. Solderon AO-52/Solderon RD Concentrate *Dependent on region DESCRIPTION
More informationSTORM S PROPRIETARY SILVER SOLUTION
Links to Website Back to Custom Components Back to Engineering & Testing Back to Design Resources STORM S PROPRIETARY SILVER SOLUTION Introduction 1 BACKGROUND Electroplated silver is used in an increasingly
More informationCertificate of Compliance
Certificate of Compliance DUNS Document Date URL for Additional Information 00-489-5751 Jan 13, 2017 Fairchildsemi.com Contact Title Phone Email Jolene Small Product Ecology Manager 207-761-6214 jolene.small@fairchildsemi.com
More informationMETAL FINISHING. (As per revised VTU syllabus: )
METAL FINISHING (As per revised VTU syllabus: 2015-16) Definition: It is a process in which a specimen metal (article) is coated with another metal or a polymer in order to modify the surface properties
More informationStripol NI Ultra Product Code: Revised Date: 12/11/2012. Stripol NI Ultra
Stripol NI Ultra DESCRIPTION Stripol NI Ultra is a non-regulated, one component liquid designed to rapidly strip nickel and nickel alloys from all substrates typically encountered in the metal finishing
More informationUse vigorous air agitation while adding the components in the order shown: 2.7% by volume CIRCUPOSIT LC-9100C Electroless Copper
Technical Data Sheet CIRCUPOSIT LC-9100 Electroless Copper For PWB Metallization Applications Regional Product Availability Description Asia-Pacific CIRCUPOSIT LC-9100 Electroless Copper is an integral
More informationElectroplating. Data Sheet # PMS1112EP Page 1 of 6
Data Sheet # PMS1112EP Page 1 of 6 1 CLEANING PROCESS THE CLEANING PROCESS IS STEP 1 IN A 3 STEP PROCESS PAYING CLOSE ATTENTION TO EACH STEP IS CRITICAL FOR PRODUCING HIGH QUALITY PLATING FINISHES Electro
More informationUltrex CAA Product Code: Revised Date: 10/09/2006. Ultrex CAA Heavy Duty Alkaline Product Derusting - Descaling - Activation
Ultrex CAA Heavy Duty Alkaline Product Derusting - Descaling - Activation Ultrex CAA is a powdered, highly alkaline product, blended with selected sequestrants and alkaline agents. It's unique formulation
More informationTwo pack solder resists are screen printed thermally curable products that give a highly resistant film on both tin/lead and copper PCB's.
T Series - Two Pack Thermally Curing Solder Resists From the T Series family of Solder masks 1. Description Two pack solder resists are screen printed thermally curable products that give a highly resistant
More informationSurTec 650 chromital TCP
Protection upgraded SurTec 650 chromital TCP Properties hexavalent chromium-free passivation for aluminium suitable as post-treatment of anodic coatings 1) suitable as conversion coating of magnesium 1)
More informationUltrex EDM Product Code: Revised Date: 07/26/2006. Ultrex EDM Heavy Duty Alkaline Product Derusting - Descaling - Activation
Ultrex EDM Heavy Duty Alkaline Product Derusting - Descaling - Activation Ultrex EDM is a powdered, highly alkaline product, blended with selected sequestrants and alkaline agents. It's unique formulation
More informationCLEARLYTE PLUS CATHODIC ELECTROPHORETIC CLEAR / TINTED CLCQUERING PROCESS
CLEARLYTE PLUS CATHODIC ELECTROPHORETIC CLEAR / TINTED CLCQUERING PROCESS Introduction Clearlyte Plus is an advanced version of the earlier popular electophoretic Clearlyte lacquer. It is a water-based
More informationALODINE 1200S. Alodine 1200S is usually made up at 7.5 kg per 1,000 litres of bath.
TECHNICAL BULLETIN 135-141 Canterbury Road, Kilsyth Victoria 3137 Phone : (613) 9728 7200 Fax : (613) 9761 7179 ALODINE 1200S A. SUMMARY 1. INTRODUCTION Alodine* 1200S is a powdered chemical, used for
More informationZERO Pollution Discharge
Company Approaches ZERO Pollution Discharge BY Bruce Mottweiler Peter 1. Veit Project Engineer & Manager, Midwest Region Elkhart Products Division, Gould, Inc. Lancy laboratories REPRINTED FROM PLATING
More informationCOMPLETE BARREL. ZINC PLATING SYSTEMS ZCl K3 MAINTENANCE
Zinc Plating Systems ZCl K 3 MAINTENANCE is a single add replenishment component for barrel ZCl K 3 systems. Using simplifies the maintenance of the ZCl K 3 process. ZCl K 3 Maintenance Complete Barrel
More informationPulse White Paper Regarding RoHS Compliance
Pulse White Paper Regarding RoHS Compliance Table of Contents Executive Summary... 2 Background/History... 3 Materials Selection... 3 Testing/Validation... 4 Implementation/Conclusion... 5 References...
More informationCIRCUPOSIT Neutralizer 3313 For PWB Metallization Applications
CIRCUPOSIT Neutralizer 3313 For PWB Metallization Applications Regional Product Availability Description N. American Asia CIRCUPOSIT Neutralizer 3313 has been developed as a replacement for the Sulfuric-Peroxide
More informationSurTec 680 Chromiting Chromitierung
Protection upgraded SurTec 680 Chromiting Chromitierung Thick Layer Passivation for Zinc Alloys Properties liquid concentrate, based on chromium(iii) exceeds the requirements for yellow chromates in the
More information