Investigation of the oxidation process at the coppersolder interface with atomic force microscopy

Size: px
Start display at page:

Download "Investigation of the oxidation process at the coppersolder interface with atomic force microscopy"

Transcription

1 Investigation of the oxidation process at the coppersolder interface with atomic force microscopy Attila Bonyár, Tamás Hurtony Department of Electronics Technology Budapest University of Technology and Economics Budapest, Hungary Szabolcs Dávid Preclinical Imaging and Biomarker Center Gedeon Richter Plc. Budapest, Hungary Abstract In this work the investigation of copper-solder interface with Atomic Force Microscope (AFM) is presented. Multiple contact and tapping-mode AFM images were made on presoldered cross-sectional SAC (Sn-Ag-Cu) solder joint samples. The formation of oxide layer was observed and the structural properties of oxide were monitored in time. Our aim was to determine the maximum idle time between the sample preparation and the further analysis, based on only the monitored corrosion profile of the copper-solder interface. Keywords intermetallic compounds, Atomic Force Microscope (AFM), corrosion I. INTRODUCTION The mechanical properties of the lead free solder alloys are mainly depending on the microstructure and the shape of the formed joint, so during metallographic observations the above mentioned properties are aimed to be highlighted. Nowadays the most common method for the microstructure investigation of solder joints is the cross-sectioning combined with different microscopy techniques [1]. The quality of the cross-section sample preparation defines the possible information that can be obtained by the observation. The resistance of materials used in lead-free solders against corrosion in aqueous solutions has already been investigated [2], and it has been exposed that the corrosion of tin actually determines the behavior of corrosion of the solder itself. Hence several publications mention tin to be corrosion resistant. However, even if the sample was prepared with the gentlest care and precision under laboratory environment a thin film of native oxide usually forms on the surface of the tin sample. In spite of the fact that the polycrystalline tin oxide is an n-type semiconductor it is still transparent in the visible light region (widely used as transparent electrodes) [3], thus the presence of the native oxide is generally cannot be observed by optical microscope. However, former studies have shown that under natural conditions tarnishing of tin can sometimes be observed in indoor atmospheric conditions [4 6]. Sometimes tin may also suffer from corrosion by mineral acids and organic acids in the presence of air [5]. For revealing the fine microstructure of intermetallic compounds in lead free solder alloys, we have recently developed a sample preparation method which is based on selective electrochemical etching [7, 8]. During this special preparation technique we use the polished surface of the sample as a working electrode, so it has to be electronically conductive. Since the electrical conductivity of the tin oxide is far behind the conductivity of the tin, this oxide layer could insulate the samples from the electrolyte and it could mask the surface during the etching process as can be seen in the images made with scanning electron microscope (SEM) in Fig. 1. In this study the formation of oxide layer at the copper-solder interface was investigated with atomic force microscope (AFM) and the structural properties of oxide were monitored in time. The aims of our investigation were: 1) to determine whether the formation of the fine tin oxide layer which is invisible to the optical microscope could be examined with AFM or not and 2) to determine whether it is possible to monitor the overall corrosion state of the specimen (including the tin surface) based on only the oxidation state of the copper surface, which could be much more easily monitored.

2 Fig. 1. Scanning electron microscope images of intermetallic solder joint microstructures. Left: after the complete and selective removal of the Sn phase; right: the oxide layer masks the selective etching. II. MATERIALS AND METHODS For the soldering experiments SENJU Sn96.5Ag3.0Cu0.5 solder paste was printed onto a single Cu sheet and was soldered with hot air soldering. For the metallographic inspections the samples were embedded in an acryl based (Technovit 4006) resin. First they were ground by SiC grinding papers (grit size: 80, 320, 500, 1200) and polished by 9 m, 3 m and 1 m and finally OP-S (0.04 m) diamond and SiC suspensions. The optical microscopic images were taken by an Olympus BX51 upright microscope. Atomic force microscope measurements were done with a Veeco (lately Bruker) diinnova type microscope in full contact- and tapping-mode with 1024x1024 resolution. The PID values were optimized according to the user manual. Budget Sensors SiNi soft contact tips were used for contact-mode imaging, while Bruker RTESPA-CP chips were used for tapping mode. Scanning electron microscope images were made with a FEI Inspect S50 microscope with a Bruker Quantax EDX (energy dispersive X-ray analysis) system. Selective electrochemical etching of the solder joints were done in 1 % H 2SO 4 with an amperometric method as described in our previous publications [7, 8]. For the controlled oxidation of the samples they were put into an ESPEC SH-241 HAST (highly accelerated stress test) chamber with the following conditions: relative humidity (RH) 90%, temperature 25 o C. Two time intervals (90 min and 180 min) were examined. AFM measurements were done at three different areas of the samples copper surface, copper-solder interface, solder surface as can be seen in Fig 2. Fig. 2. Optical microscope image of the specimen with the three measurement areas highlighted. A. Area 1 Copper surface III. RESULTS AND DISCUSSIONS In this chapter we investigate the effect of oxidation on the copper surface. Fig. 3 left shows a contact-mode AFM image from the Cu part of the sample (area 1) directly after the sample preparation. No sign of oxidation can be observed.

3 Fig. 3. Contact-mode AFM images of the Cu part (area 1) of the specimen. Left: directly after the sample preparation; right after 90 min in the HAST chamber. Scan areas: 50x50 m 2. After 90 min in the HAST chamber small dots appear on the surface as can be seen in Fig. 3 right and Fig. 4 in higher magnifications. The size of the oxide grains is in the nm range and their distribution is not homogeneous. After 90 min in the HAST chamber the oxidation of the Cu surface started at specific spots, but there is no continuous oxide formed on the surface yet. Fig. 4. Contact-mode AFM images of the Cu part (area 1) of the specimen. Left: after 90 min in the HAST chamber, scan area: 30x30 m 2 ; right the highlighted area in 10x10 m 2. Following the 180 min in the HAST chamber the surface of the copper seems more homogenous at smaller magnifications (e.g. 30x30 m 2 ), as can be seen on Fig. 5. At first sight the surface looks more like a freshly prepared sample (Fig. 3 left) than an oxidized one. However, in higher magnifications we can see that a continuous oxide layer consisting of scallopy grains covers the Cu surface. Based on the 2x2 m 2 image in Fig. 6 right, the estimated size of the oxide grains is in the nm range, which is significantly smaller than the particle size observed after 90 min in the HAST chamber. Fig. 5. Contact-mode AFM images of the Cu part (area 1) of the specimen. Left: after 180 min in the HAST chamber, scan area: 30x30 m 2 ; right the highlighted area in 10x10 m 2.

4 Fig. 6. Contact-mode AFM images of the Cu part (area 1) of the specimen. Left: after 120 min in the HAST chamber, scan area: 5x5 m 2, highlighted area from Fig. 5; right the highlighted area in 2x2 m 2. Conclusively based on these images we can say that the oxidation of the Cu surface can be monitored well with AFM. The oxidation of the surface starts as oxide-spots which connect with each other and form a continuous oxide given enough time. B. Area 2 Copper-solder interface Fig. 7 presents contact-mode AFM images from the copper-solder interface of the sample. The OP-S suspension at the late stages of the sample preparation (polishing) process slightly etches the Sn phase so the fine intermetallic microstructures are revealed in the bulk solder. Various IMCs can be identified on the AFM images: scallopy type Cu 6Sn 5 intermetallic layer (IML), Cu 6Sn 5 hexagonal tube and other particles, Ag 3Sn fibers which form cells with diameters in the 10 m range. Fig. 7. Contact-mode AFM images of the Cu-solder interface part (area 2) of the freshly prepared specimen. Left: scan area: 50x50 m 2 ; right 16x16 m 2. Fig. 8 presents images which illustrate the intermediary phase of the continuous oxide layer formation on the Cu part of the interface. These samples were stored in the laboratory for 30 and 150 min subsequently at approximately 25 o C temperature and 87 % RH. Fig. 8. Contact-mode AFM images of the Cu-solder interface part (area 2) of the specimen. The images were recorded after storing the sample in approx 25 o C in 87 % RH for 30 min (left) and 150 min (right). Scan areas: 30x30 m 2. Higher magnification images from the interface after 180 min in the HAST chamber are presented in Fig. 9. It can clearly be seen that the continuous oxide formation stops at the borderline of the Cu 6Sn 5 intermetallic layer. The surface of the scallopy IML seems to be completely smooth as it was directly after the polishing. Fig. 9. Contact-mode AFM images of the Cu-solder interface part (area 2) of the specimen after 180 min in the HAST chamber. Left: 10x10 m 2 ; right 5x5 m 2 from the highlighted area. C. Area 3 solder surface Fig. 10 present contact mode AFM images from the freshly polished solder surface in two magnifications. In smaller magnifications the various intermetallic compounds (Cu 6Sn 5, Ag 3Sn) can clearly be identified in the bulk solder. However, the fine microstructure of the Sn phase is blurred by the polishing (Fig. 9 right).

5 Fig. 10. Contact-mode AFM images of the solder part (area 3) of the freshly polished specimen. Left: scan area: 30x30 m 2 ; right 2x2 m 2. Unlike to the copper surface, after 180 min in the HAST chamber no significant change can be observed on the solder surface (Fig 11). Fig. 11. Contact-mode AFM images of the solder part (area 3) of the specimen after 180 min in the HAST chamber. Left: scan area: 30x30 m 2 ; right 2x2 m 2. Selective electrochemical etching were performed on the sample as a control measurement after 180 min in the HAST chamber and we found that the etching was not blocked by the tin oxide which formed during this time interval. This means that it is not possible to monitor the corrosion state of the tin surface based on the oxidation state of the copper surface, because the copper reaches the full oxide covered stage much faster than the current blocking oxide builds on the tin surface. D. Tapping-mode imaging Tapping-mode AFM images are often used to distinguish materials with different hardness properties, because the phase information of the signal is very sensitive regarding these parameters. Fig. 12 illustrates a case when due to inadequate polishing of the sample, contaminations remained on the surface. Based on only the height map (Fig. 12 right) it could be hard to distinguish the contamination from the Ag 3Sn intermetallic particles present in the solder. In this case the phase information (Fig. 12 left) helps to reveal the contamination with high contrast between the different types of materials. Hence our aim was to determine whether we could gain any more information regarding the oxidation process with the help of the tapping-mode imaging. Fig. 12. Tapping-mode AFM images of the solder part (area 3) of the specimen. Left: phase map; right height map. Scan area: 10x10 m 2. Arrows mark the contamination on the surface after an unsuccessful polishing treatment Figures 14 and 15 present tapping-mode images from the Cu-solder interface after 180 min in the HAST chamber.

6 Fig. 13. Tapping-mode AFM images of the Cu-solder interface part (area 2) of the specimen after 180 min in the HAST chamber. Left: phase map; right height map. Scan area: 10x10 m 2. It can clearly be seen, that the phase map shows very good contrast compared to the contact mode images regarding the oxide covered area. It can also be seen, that unlike to the Cu surface the Cu 6Sn 5 intermetallic layer is not covered with oxide. However, no significant change can be observed regarding the tin surface before and after the 180 min treatment in the HAST chamber (data not shown). In order to be able to monitor the oxidation process on the tin surface, in the future gentler sample preparation approach (to avoid the blurring of the fine tin microstructures) and longer oxidation times should be applied. Fig. 14. Tapping-mode AFM images of the Cu-solder interface part (area 2) of the specimen after 180 min in the HAST chamber. Left: phase map; right height map. Scan area: 3x3 m 2. IV. CONCLUSIONS The oxidation of a copper-solder interface was investigated with AFM. We found that the oxidation process of the copper surface could be monitored well, however no significant changes could be observed on the tin surface after 180 min in a HAST chamber with 25 o C and 90 % RH. This means that it is not possible to monitor the overall oxidation state of the solder based on only the oxidation state of the copper. We also found that the Cu 6Sn 5 intermetallic layer is also free of any visible oxide traces after this treatment. ACKNOWLEDGMENT The work reported in the paper has been developed in the framework of the project Talent care and cultivation in the scientific workshops of BME project. This project is supported by the grant TÁMOP e B-10/ REFERENCES [1] Lin F, Bi W, Ju G, Wang W, Wei X. Evolution of Ag3Sn at Sn 3.0Ag 0.3Cu 0.05Cr/Cu joint interfaces during thermal aging. J Alloys Compd 2011; 509: [2] Masato Mori, Kazuma Miura, Takeshi Sasaki, Corrosion Science Volume 44, Issue 4, April 2002, pp [3] Jong-Heun Lee and Soon-Ja Park, Temperature Dependence of Electrical Conductivity in Polycrystalline Tin Oxide, Am Ceram. SOC 73. (9), 1990, pp [4] T. Stambolov, The Corrosion and Conservation of Metallic Antiquities and Works of Art, Central Research Laboratory for Objects of Art and Science, Amsterdam, [5] S.C. Britton, The Corrosion Resistance of Tin and Tin alloys, Tin Research Institute, [6] H. Leidheiser, The Corrosion of Copper, Tin and their Alloys,Wiley, NewYork, 1971 [7] Tamás Hurtony, Attila Bonyár, Péter Gordon, Gábor Harsányi, Investigation of intermetallic compounds (IMCs) in electrochemically stripped solder joints with SEM, Microelectronics Reliability 52, 2012, pp [8] Attila Bonyár, Tamás Hurtony, Gábor Harsányi, Selective electrochemical etching for the investigation of solder joint microstructures, Proc. of the 35th International Spring Seminar on Electronics Technology. Salzburg, Austria, IEEE, pp

EFFECT OF THERMAL AGING ON THE IMC LAYER BETWEEN SnAgSb SOLDER AND Cu SUBSTRATE. Universiti Kebangsaan Malaysia, 43600, Bangi, Selangor, Malaysia

EFFECT OF THERMAL AGING ON THE IMC LAYER BETWEEN SnAgSb SOLDER AND Cu SUBSTRATE. Universiti Kebangsaan Malaysia, 43600, Bangi, Selangor, Malaysia EFFECT OF THERMAL AGING ON THE IMC LAYER BETWEEN SnAgSb SOLDER AND Cu SUBSTRATE W. Shualdi 1, I. Ahmad 1, G. Omar 2 and A. Isnin 3 1 Department of Electrical, Electronic and System, Faculty of Engineering,

More information

Cu-Al intermetallic growth behaviour study under high temperature thermal aging

Cu-Al intermetallic growth behaviour study under high temperature thermal aging Cu-Al intermetallic growth behaviour study under high temperature thermal aging C.L Cha, H.J Chong, Yaw HG, Chong MY, Teo CH Infineon Technologies, Melaka, Malaysia Abstract Copper (Cu) wire always gains

More information

A study aimed at characterizing the interfacial structure in a tin silver solder on nickel-coated copper plate during aging

A study aimed at characterizing the interfacial structure in a tin silver solder on nickel-coated copper plate during aging Sādhanā Vol. 33, Part 3, June 2008, pp. 251 259. Printed in India A study aimed at characterizing the interfacial structure in a tin silver solder on nickel-coated copper plate during aging D C LIN 1,

More information

Advanced Manufacturing Choices

Advanced Manufacturing Choices Advanced Manufacturing Choices Table of Content Mechanical Removing Techniques Ultrasonic Machining (USM) Sputtering and Focused Ion Beam Milling (FIB) Ultrasonic Machining In ultrasonic machining (USM),

More information

EFFECTS OF THERMAL AGING ON INTERMETALLIC COMPOUNDS AND VOIDS FORMATION IN AuAl WIRE BONDING. A. Jalar, M. F. Rosle and M. A. A.

EFFECTS OF THERMAL AGING ON INTERMETALLIC COMPOUNDS AND VOIDS FORMATION IN AuAl WIRE BONDING. A. Jalar, M. F. Rosle and M. A. A. EFFECTS OF THERMAL AGING ON INTERMETALLIC COMPOUNDS AND VOIDS FORMATION IN AuAl WIRE BONDING A. Jalar, M. F. Rosle and M. A. A. Hamid School of Applied Physics, Faculty of Science and Technology, Universiti

More information

Development and characterization of novel metallic joint in power electronic device

Development and characterization of novel metallic joint in power electronic device Development and characterization of novel metallic joint in power electronic device Guillaume LACOMBE 1-a, Jean-Marc HEINTZ 1-b, Akira KAWASAKI 2-c, Jean-François SILVAIN 1-d 1 CNRS, Université de Bordeaux,

More information

Microstructure and Microhardness of an Al-Zr-Ti-Fe Alloy

Microstructure and Microhardness of an Al-Zr-Ti-Fe Alloy Proceedings of the 12th International Conference on Aluminium Alloys, September 5-9, 2010, Yokohama, Japan 2010 2010 The Japan Institute of Light Metals pp. 1004-1008 1004 Microstructure and Microhardness

More information

Intermetallic Phase Growth and Reliability of Sn-Ag-Soldered Solar Cell Joints

Intermetallic Phase Growth and Reliability of Sn-Ag-Soldered Solar Cell Joints Vailable online at www.sciencedirect.com Energy Procedia 27 (2012 ) 664 669 SiliconPV 2012, 03-05 April 2012, Leuven, Belgium Intermetallic Phase Growth and Reliability of Sn-Ag-Soldered Solar Cell Joints

More information

Ball shear strength and fracture mode of lead-free solder joints prepared using nickel nanoparticle doped flux

Ball shear strength and fracture mode of lead-free solder joints prepared using nickel nanoparticle doped flux Ball shear strength and fracture mode of lead-free solder joints prepared using nickel nanoparticle doped flux G. K. Sujan a, A. S. M. A. Haseeb a, *, Chong Hoe Jian b, Amalina Afifi a a Department of

More information

Unique Failure Modes from use of Sn-Pb and Lead-Free (mixed metallurgies) in PCB Assembly: CASE STUDY

Unique Failure Modes from use of Sn-Pb and Lead-Free (mixed metallurgies) in PCB Assembly: CASE STUDY Unique Failure Modes from use of Sn-Pb and Lead-Free (mixed metallurgies) in PCB Assembly: CASE STUDY Frank Toth, and Gary F. Shade; Intel Corporation, Hillsboro, OR, USA {francis.toth.jr@intel.com, (503)-696-1546}

More information

Influence of Thermal Cycling on the Microstructure and Shear Strength of Sn3.5Ag0.75Cu and Sn63Pb37 Solder Joints on Au/Ni Metallization

Influence of Thermal Cycling on the Microstructure and Shear Strength of Sn3.5Ag0.75Cu and Sn63Pb37 Solder Joints on Au/Ni Metallization 68 J. Mater. Sci. Technol., Vol.23 No.1, 2007 Influence of Thermal Cycling on the Microstructure and Shear Strength of Sn3.5Ag0.75Cu and Sn63Pb37 Solder Joints on Au/Ni Metallization Hongtao CHEN 1,2),

More information

Effects of Lead on Tin Whisker Elimination

Effects of Lead on Tin Whisker Elimination Effects of Lead on Tin Whisker Elimination Wan Zhang and Felix Schwager Rohm and Haas Electronic Materials Lucerne, Switzerland inemi Tin Whisker Workshop at ECTC 0 May 30, 2006, in San Diego, CA Efforts

More information

Nanyang Technological University School of Materials Science & Engineering

Nanyang Technological University School of Materials Science & Engineering Final Year Project Proposal 1 3D Assembly of Nano/Micro Zirconia Particles for Enhanced Energy Damping Capacity Dr Du Zehui (duzehui@ntu.edu.sg) To develop the best possible method to assemble micro/nano-scale

More information

Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys. Balázs Illés, Tamás Hurtony and Bálint Medgyes

Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys. Balázs Illés, Tamás Hurtony and Bálint Medgyes Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys Balázs Illés, Tamás Hurtony and Bálint Medgyes Department of Electronics Technology, Budapest University of Technology

More information

Final Year Project Proposal 1

Final Year Project Proposal 1 Final Year Project Proposal 1 Mechanical testing for high temperature polymers Mr Eric Phua Jian Rong (JRPhua@ntu.edu.sg) In offshore subsea drilling, different types of microelectronics devices and sensors

More information

MACROSTRUCTURE, MICROSTRUCTURE AND MICROHARDNESS ANALYSIS

MACROSTRUCTURE, MICROSTRUCTURE AND MICROHARDNESS ANALYSIS 109 Chapter 5 MACROSTRUCTURE, MICROSTRUCTURE AND MICROHARDNESS ANALYSIS 5.1 INTRODUCTION The microstructural studies of friction welding helps in understanding microstructural changes occurred during friction

More information

SUPPLEMENTARY INFORMATION

SUPPLEMENTARY INFORMATION High Electrochemical Activity of the Oxide Phase in Model Ceria- and Ceria-Ni Composite Anodes William C. Chueh 1,, Yong Hao, WooChul Jung, Sossina M. Haile Materials Science, California Institute of Technology,

More information

Corrosion behavior of Al Si Cu (Sn, Zn) brazing filler metals

Corrosion behavior of Al Si Cu (Sn, Zn) brazing filler metals Materials Characterization 47 (2001) 401 409 Corrosion behavior of Al Si Cu (Sn, Zn) brazing filler metals S.S. Wang, M.D. Cheng, L.C. Tsao, T.H. Chuang* Institute of Materials Science and Engineering,

More information

1P1b: Introduction to Microscopy

1P1b: Introduction to Microscopy 1P1b: Introduction to Microscopy Central to the study and characterisation of metals and many other materials is the microscope, ranging from the magnification of, say, 1 to 35 in a simple stereo binocular

More information

The Effect of Cu and Ni on the Structure and Properties of the IMC Formed by the Reaction of Liquid Sn-Cu Based Solders with Cu Substrate

The Effect of Cu and Ni on the Structure and Properties of the IMC Formed by the Reaction of Liquid Sn-Cu Based Solders with Cu Substrate WDS'08 Proceedings of Contributed Papers, Part III, 220 224, 2008. ISBN 978-80-7378-067-8 MATFYZPRESS The Effect of Cu and Ni on the Structure and Properties of the IMC Formed by the Reaction of Liquid

More information

Growth of Intermetallic Compounds during Isothermal Annealing of a Sn-Ag-Cu Lead-free Solder

Growth of Intermetallic Compounds during Isothermal Annealing of a Sn-Ag-Cu Lead-free Solder Accepted for publication in Soldering & Surface Mount Technology, Emerald, United Kingdom, 2004, in press. Growth of Intermetallic Compounds during Isothermal Annealing of a Sn-Ag-Cu Lead-free Solder S.L.

More information

Microscope Analysis for the Study of the Ageing Processes of Solid Oxide Fuel Cells Fueled by Blends of Hydrogen and Natural Gas.

Microscope Analysis for the Study of the Ageing Processes of Solid Oxide Fuel Cells Fueled by Blends of Hydrogen and Natural Gas. Microscope Analysis for the Study of the Ageing Processes of Solid Oxide Fuel Cells Fueled by Blends of Hydrogen and Natural Gas. Renate Hiesgen, Jürgen Kraut, Jürgen Haiber, Gerhard Buchinger*, Thomas

More information

Sr and Pb additions. L. Affleck, C. Leach *

Sr and Pb additions. L. Affleck, C. Leach * Microstructures of BaTiO 3 based PTC thermistors with Ca, Sr and Pb additions Abstract L. Affleck, C. Leach * Manchester Materials Science Centre University of Manchester and UMIST Grosvenor Street, Manchester

More information

Microstructural development at weld interface between Zr-based glassy alloy and stainless steel by resistance microwelding

Microstructural development at weld interface between Zr-based glassy alloy and stainless steel by resistance microwelding Journal of Physics: Conference Series Microstructural development at weld interface between Zr-based glassy alloy and stainless steel by resistance microwelding To cite this article: S Fukumoto et al 2012

More information

Characterization of Coatings on Grey Cast Iron Fabricated by Hot-dipping in Pure Al, AlSi11 and AlTi5 Alloys

Characterization of Coatings on Grey Cast Iron Fabricated by Hot-dipping in Pure Al, AlSi11 and AlTi5 Alloys A R C H I V E S o f F O U N D R Y E N G I N E E R I N G Published quarterly as the organ of the Foundry Commission of the Polish Academy of Sciences ISSN (1897-3310) Volume 14 Issue 1/2014 85 90 20/1 Characterization

More information

Comprehensive study of intermetallic compounds in solar cell interconnections and their growth kinetics

Comprehensive study of intermetallic compounds in solar cell interconnections and their growth kinetics Comprehensive study of intermetallic compounds in solar cell interconnections and their growth kinetics T. Geipel, M. Moeller, A. Kraft, U. Eitner Fraunhofer Institute for Solar Energy Systems ISE 6 th

More information

Silver Diffusion Bonding and Layer Transfer of Lithium Niobate to Silicon

Silver Diffusion Bonding and Layer Transfer of Lithium Niobate to Silicon Chapter 5 Silver Diffusion Bonding and Layer Transfer of Lithium Niobate to Silicon 5.1 Introduction In this chapter, we discuss a method of metallic bonding between two deposited silver layers. A diffusion

More information

A Comparison of Corrosion Behavior of a Super Duplex Stainless Steel and an Austenitic Stainless Steel in a Molten Sn 3.0Ag 0.5Cu Lead-Free Solder

A Comparison of Corrosion Behavior of a Super Duplex Stainless Steel and an Austenitic Stainless Steel in a Molten Sn 3.0Ag 0.5Cu Lead-Free Solder Materials Transactions, Vol. 53, No. 6 (2012) pp. 1148 to 1153 2012 The Japan Institute of Metals A Comparison of Corrosion Behavior of a Super Duplex Stainless Steel and an Austenitic Stainless Steel

More information

Effectiveness of Conformal Coat to Prevent Corrosion of Nickel-palladium-goldfinished

Effectiveness of Conformal Coat to Prevent Corrosion of Nickel-palladium-goldfinished As originally published in the IPC APEX EXPO Conference Proceedings. Effectiveness of Conformal Coat to Prevent Corrosion of Nickel-palladium-goldfinished Terminals Michael Osterman Center for Advanced

More information

IMC Layers Formed with Various Combinations of Solders and Surface Finishes and Their Effect on Solder Joint Reliability

IMC Layers Formed with Various Combinations of Solders and Surface Finishes and Their Effect on Solder Joint Reliability IMC Layers Formed with Various Combinations of Solders and Surface Finishes and Their Effect on Solder Joint Reliability Per-Erik Tegehall, Swerea IVF 4 th Electronic Materials and Assembly Processes for

More information

Metallurgical Defect: Manufacturing of a Reference Specimen for NDE Studies

Metallurgical Defect: Manufacturing of a Reference Specimen for NDE Studies 13th International Symposium on Nondestructive Characterization of Materials (NDCM-XIII), 20-24 May 2013, Le Mans, France www.ndt.net/?id=15501 More Info at Open Access Database www.ndt.net/?id=15501 Metallurgical

More information

High-Temperature-Resistant Interconnections Formed by Using Nickel Micro-plating and Ni Nano-particles for Power Devices

High-Temperature-Resistant Interconnections Formed by Using Nickel Micro-plating and Ni Nano-particles for Power Devices Kato et al.: High-Temperature-Resistant Interconnections (1/6) [Technical Paper] High-Temperature-Resistant Interconnections Formed by Using Nickel Micro-plating and Ni Nano-particles for Power Devices

More information

Introduction. 1. Sputtering process, target materials and their applications

Introduction. 1. Sputtering process, target materials and their applications Sputtering is widely used in the production of electronic devices such as liquid crystal displays (LCDs), optical media, magnetic media and semiconductors. The Kobelco Research Institute, Inc. has been

More information

Characteristics of the Fine Grained CVD Diamond Film and its Industrial Applications. K. Kazahaya, A. Yamakawa and T. Fukunisi

Characteristics of the Fine Grained CVD Diamond Film and its Industrial Applications. K. Kazahaya, A. Yamakawa and T. Fukunisi Key Engineering Materials Online: 2004-02-15 ISSN: 1662-9795, Vols. 257-258, pp 553-558 doi:10.4028/www.scientific.net/kem.257-258.553 2004 Trans Tech Publications, Switzerland Characteristics of the Fine

More information

National Physical Laboratory Hampton Road Teddington Middlesex United Kingdom TW11 0LW

National Physical Laboratory Hampton Road Teddington Middlesex United Kingdom TW11 0LW NPL REPORT MAT 1 Susceptibility of Lead-Free Systems to Electrochemical Migration Ling Zou and Chris Hunt NOT RESTRICTED May 200 National Physical Laboratory Hampton Road Teddington Middlesex United Kingdom

More information

Removal of JSR THB-S375N Photoresist Using a Photoresist Stripper with an Improved EHS Profile Abstract Key words

Removal of JSR THB-S375N Photoresist Using a Photoresist Stripper with an Improved EHS Profile Abstract Key words Removal of JSR THB-S375N Photoresist Using a Photoresist Stripper with an Improved EHS Profile Yuanmei Cao, Kimberly Pollard, Travis Acra, Nichelle Gilbert, Richie Peters, Donald Pfettscher Abstract Negative

More information

INVESTIGATING THE MICROSTRUCTURAL AND MECHANICAL PROPERTIES OF PURE LEAD-FREE SOLDERING MATERIALS (SAC305 & SAC405)

INVESTIGATING THE MICROSTRUCTURAL AND MECHANICAL PROPERTIES OF PURE LEAD-FREE SOLDERING MATERIALS (SAC305 & SAC405) Powder Metallurgy Progress, Vol.18 (2018), No.1, p.049-057 http://dx.doi.org/10.1515/pmp-2018-0006 INVESTIGATING THE MICROSTRUCTURAL AND MECHANICAL PROPERTIES OF PURE LEAD-FREE SOLDERING MATERIALS (SAC305

More information

Effect of Heat Treatment on Interfacial Strengthening Mechanisms of Second Phase Particulate Reinforced Aluminium Alloy

Effect of Heat Treatment on Interfacial Strengthening Mechanisms of Second Phase Particulate Reinforced Aluminium Alloy 24-26.5.2005, Hradec nad Moravici Effect of Heat Treatment on Interfacial Strengthening Mechanisms of Second Phase Particulate Reinforced Aluminium Alloy S.T. Hasan Faculty of Arts, Computing, Engineering

More information

Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder

Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder Materials Transactions, Vol. 45, No. 3 (24) pp. 741 to 746 Special Issue on Lead-Free Soldering in Electronics #24 The Japan Institute of Metals Effect of Iron Plating Conditions on Reaction in Molten

More information

Future Electronic Devices Technology in Cosmic Space and Electroless Ni/Pd/Au Plating for High Density Semiconductor Package Substrate

Future Electronic Devices Technology in Cosmic Space and Electroless Ni/Pd/Au Plating for High Density Semiconductor Package Substrate JAXA 25 rd Microelectronics Workshop Future Electronic Devices Technology in Cosmic Space and Electroless Ni/Pd/Au Plating for High Density Semiconductor Package Substrate November 2, 2012 Yoshinori Ejiri

More information

Results are presented in Table 1. The tube was fabricated from a Type 347 and no unusual conditions were noted.

Results are presented in Table 1. The tube was fabricated from a Type 347 and no unusual conditions were noted. 1. Introduction Hydroprocessing units such as isomax in oil refineries upgrade hydrocarbon feedstocks by converting heavier feeds into more valuable lighter products. The reactions occur under a hydrogen-rich

More information

New I.R. Thermography methodology for failure analysis on tantalum capacitors

New I.R. Thermography methodology for failure analysis on tantalum capacitors New I.R. Thermography methodology for failure analysis on tantalum capacitors F. Gonnet a *, J.C. Clément a, J. Perraud a, D. Carisetti a a Thales Research & Technology, 91767 Palaiseau, France Abstract

More information

Micro-Structural Observation of the Bonding Interface between Au Wire and a Platinum Electrode

Micro-Structural Observation of the Bonding Interface between Au Wire and a Platinum Electrode Micro-Structural Observation of the Bonding Interface between Au Wire and a Platinum Electrode WATANABE Hirohiko *, ISHIKAWA Sumihisa **, ITO Mototaka **, SAKO Hideki **, KIMURA Kosuke **, NAKAGAWA Yoshitsugu

More information

IMAGING OF MICROSTRUCTURAL FEATURES AND LOCAL STIFFNESS OF Α- AND Β-PHASES IN THE TITANIUM ALLOY TI- 6AL-4V BY ATOMIC FORCE ACOUSTIC MICROSCOPY

IMAGING OF MICROSTRUCTURAL FEATURES AND LOCAL STIFFNESS OF Α- AND Β-PHASES IN THE TITANIUM ALLOY TI- 6AL-4V BY ATOMIC FORCE ACOUSTIC MICROSCOPY IMAGING OF MICROSTRUCTURAL FEATURES AND LOCAL STIFFNESS OF Α- AND Β-PHASES IN THE TITANIUM ALLOY TI- 6AL-4V BY ATOMIC FORCE ACOUSTIC MICROSCOPY Jonas O. RABE, Ute RABE, Sigrun HIRSEKORN Fraunhofer Institute

More information

Lead-Free Solder Bump Technologies for Flip-Chip Packaging Applications

Lead-Free Solder Bump Technologies for Flip-Chip Packaging Applications Lead-Free Solder Bump Technologies for Flip-Chip Packaging Applications Zaheed S. Karim 1 and Jim Martin 2 1 Advanced Interconnect Technology Ltd. 1901 Sunley Centre, 9 Wing Yin Street, Tsuen Wan, Hong

More information

Shear Strength in Solder Bump Joints for High Reliability Photodiode Packages

Shear Strength in Solder Bump Joints for High Reliability Photodiode Packages Materials Transactions, Vol. 44, No. 10 (2003) pp. 2163 to 2168 #2003 The Japan Institute of Metals Shear Strength in Solder Bump Joints for High Reliability Photodiode Packages Chong-Hee Yu 1, Kyung-Seob

More information

Specimen Preparation Technique for a Microstructure Analysis Using the Focused Ion Beam Process

Specimen Preparation Technique for a Microstructure Analysis Using the Focused Ion Beam Process Specimen Preparation Technique for a Microstructure Analysis Using the Focused Ion Beam Process by Kozue Yabusaki * and Hirokazu Sasaki * In recent years the FIB technique has been widely used for specimen

More information

Transmission Electron Microscopy (TEM) Prof.Dr.Figen KAYA

Transmission Electron Microscopy (TEM) Prof.Dr.Figen KAYA Transmission Electron Microscopy (TEM) Prof.Dr.Figen KAYA Transmission Electron Microscope A transmission electron microscope, similar to a transmission light microscope, has the following components along

More information

Study of the Interface Microstructure of Sn-Ag-Cu Lead-Free Solders and the Effect of Solder Volume on Intermetallic Layer Formation.

Study of the Interface Microstructure of Sn-Ag-Cu Lead-Free Solders and the Effect of Solder Volume on Intermetallic Layer Formation. Study of the Interface Microstructure of Sn-Ag-Cu Lead-Free Solders and the Effect of Solder Volume on Intermetallic Layer Formation. B. Salam +, N. N. Ekere, D. Rajkumar Electronics Manufacturing Engineering

More information

Heteroepitaxy of Monolayer MoS 2 and WS 2

Heteroepitaxy of Monolayer MoS 2 and WS 2 Supporting Information Seed Crystal Homogeneity Controls Lateral and Vertical Heteroepitaxy of Monolayer MoS 2 and WS 2 Youngdong Yoo, Zachary P. Degregorio, James E. Johns* Department of Chemistry, University

More information

Global Journal of Engineering Science and Research Management

Global Journal of Engineering Science and Research Management DIFFUSION BONDING OF AL ALLOY USING DIFFERENT IINTERLAYERS Assist. Prof. Dr. Ahmed A. Akbar*, Samer K. Khaleel * Asst. Prof. Dr. at University of Technology, Production Engineering and Metallurgy, Iraq

More information

Characterization of Oxide Film Formed on Ck45 Steel by Plasma Electrolytic Oxidation Method

Characterization of Oxide Film Formed on Ck45 Steel by Plasma Electrolytic Oxidation Method Journal of Mechanical Research and Application ISSN: 2251-7383, eissn: 2251-7391 Vol. 4, No. 2, 2012, 57-61 Characterization of Oxide Film Formed on Ck45 Steel by Plasma Electrolytic Oxidation Method JMRA

More information

The Preparation of Fine Particulate for Electron Microscopy Investigations Using Dental Amalgam

The Preparation of Fine Particulate for Electron Microscopy Investigations Using Dental Amalgam Ames Laboratory Conference Papers, Posters, and Presentations Ames Laboratory 4-1990 The Preparation of Fine Particulate for Electron Microscopy Investigations Using Dental Amalgam L. Scott Chumbley Iowa

More information

A Parametric Study on the Electrodeposition of Copper Nanocrystals on a Gold Film Electrode. Andrea Harmer Co-op term #1 April 25, 2003

A Parametric Study on the Electrodeposition of Copper Nanocrystals on a Gold Film Electrode. Andrea Harmer Co-op term #1 April 25, 2003 A Parametric Study on the Electrodeposition of Copper Nanocrystals on a Gold Film Electrode Andrea Harmer Co-op term #1 April 25, 2003 Outline of Presentation: Introduction Purpose General method Parameters:

More information

RoHS Compliance Document

RoHS Compliance Document D2-Pak RoHS Compliance Document Contents: 1. 2. Solder Reflow 3. Tin Whisker Report D2-pak (3 or 5 Lead) BOM 1 90598-46-2 0.05808 11% 3.8% Lead Frame Copper 0.94840 Die Attach Soft Solder 0.01200 Cu 7440-50-8

More information

MECHANICAL PROPERTIES OF LEAD FREE SOLDER ALLOY FOR GREEN ELECTRONICS UNDER HIGH STRAIN RATE AND THERMAL AGING

MECHANICAL PROPERTIES OF LEAD FREE SOLDER ALLOY FOR GREEN ELECTRONICS UNDER HIGH STRAIN RATE AND THERMAL AGING MECHANICAL PROPERTIES OF LEAD FREE SOLDER ALLOY FOR GREEN ELECTRONICS UNDER HIGH STRAIN RATE AND THERMAL AGING Muhammad Aamir 1*, Riaz Muhammad 1, Naseer Ahmed 1, Muhammad Sadiq 2, Muhammad Waqas 3, Izhar

More information

JSM-7800F Field Emission Scanning Electron Microscope

JSM-7800F Field Emission Scanning Electron Microscope JSM-7800F catalogue JSM-7800F Field Emission Scanning Electron Microscope We provide high performance The Ultimate Research Tool for Multi-Disciplinary Research Institutions Extreme resolution The super

More information

Metallurgical Analysis of 303 SS Raw Material and Customer Return

Metallurgical Analysis of 303 SS Raw Material and Customer Return Metallurgical Analysis of 303 SS Raw Material and Customer Return Background: In the process of forming a crimp on ground 303 stainless steel, cracking was discovered. In order to determine what caused

More information

Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishes

Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishes Journal of Mechanical Engineering and Sciences (JMES) ISSN (Print): 2289-4659; e-issn: 2231-8380; Volume 9, pp. 1572-1579, December 2015 Universiti Malaysia Pahang, Malaysia DOI: http://dx.doi.org/10.15282/jmes.9.2015.4.0152

More information

Analysis of plating grain size effect on whisker

Analysis of plating grain size effect on whisker Journal of Mechanical Science and Technology 23 (2009) 2885~2890 Journal of Mechanical Science and Technology www.springerlink.com/content/1738-494x DOI 10.1007/s12206-009-0720-x Analysis of plating grain

More information

Effect of the Substrate Distance on the Microstructure and Properties of SnBi-χAl 2 O 3 Joint Welded by Ultrasonic-assisted Brazing

Effect of the Substrate Distance on the Microstructure and Properties of SnBi-χAl 2 O 3 Joint Welded by Ultrasonic-assisted Brazing 3rd International Conference on Machinery, Materials and Information Technology Applications (ICMMITA 2015) Effect of the Substrate Distance on the Microstructure and Properties of SnBi-χAl 2 O 3 Joint

More information

Various Techniques for Reliability Estimation and Failure Analysis of Electronic Products and Components

Various Techniques for Reliability Estimation and Failure Analysis of Electronic Products and Components JFE No. 13 2006 8 p. 97 102 Various Techniques for Reliability Estimation and Failure Analysis of Electronic Products and Components BAN Mitsuyuki SHIMAUCHI Yutaka JFE JFE JFE X IC Pb Abstract: JFE Techno-Research

More information

Sn-RICH PHASE COARSENING DURING ISOTHERMAL ANNEALING ON Sn-Ag-Cu SOLDER. N. Saud and A. Jalar

Sn-RICH PHASE COARSENING DURING ISOTHERMAL ANNEALING ON Sn-Ag-Cu SOLDER. N. Saud and A. Jalar International Journal of Mechanical and Materials Engineering (IJMME), Vol. 4 (2009), No. 2, 147-151 Sn-RICH PHASE COARSENING DURING ISOTHERMAL ANNEALING ON Sn-Ag-Cu SOLDER. N. Saud and A. Jalar School

More information

STRUCTURE EVOLUTION OF AlCr5.5Fe2Ti1 ALLOY DURING ITS COMPACTIZATION

STRUCTURE EVOLUTION OF AlCr5.5Fe2Ti1 ALLOY DURING ITS COMPACTIZATION STRUCTURE EVOLUTION OF AlCr5.5Fe2Ti1 ALLOY DURING ITS COMPACTIZATION Alena MICHALCOVÁ a,b, Dalibor VOJTĚCH a, Pavel NOVÁK a, Jan DRAHOKOUPIL c, Kamil KOLAŘÍK d a Institute of Chemical Technology, Prague,

More information

Mechanical Properties and Microstructure of Pure Copper Joints Brazed with Amorphous Cu68.5Ni15.7Sn9.3P6.5 Filler Metal

Mechanical Properties and Microstructure of Pure Copper Joints Brazed with Amorphous Cu68.5Ni15.7Sn9.3P6.5 Filler Metal Mechanical Properties and Microstructure of Pure Copper Joints Brazed with Amorphous Cu68.5Ni15.7Sn9.3P6.5 Filler Metal Jing Zhang 1,*, Weiyuan Yu 2, Wenjiang Lu 2 1 School of Physics and Mechanical-Electrical

More information

AP 5301/8301 LABORATORY MANUAL

AP 5301/8301 LABORATORY MANUAL AP 5301/8301 LABORATORY MANUAL Department of Physics & Materials Science City University of Hong Kong Contents Table of Contents. 1 Project 1: Scanning Electron Microscopy (SEM). 2 Project 2: Microscopic

More information

MICROSTRUCTURE CHARACTERIZATION AND IMAGING IN TITANIUM ALLOYS BY ATOMIC FORCE ACOUSTIC MICROSCOPY

MICROSTRUCTURE CHARACTERIZATION AND IMAGING IN TITANIUM ALLOYS BY ATOMIC FORCE ACOUSTIC MICROSCOPY MICROSTRUCTURE CHARACTERIZATION AND IMAGING IN TITANIUM ALLOYS BY ATOMIC FORCE ACOUSTIC MICROSCOPY Sigrun HIRSEKORN, Jonas RABE, Ute RABE, FRAUNHOFER IZFP, Campus E3 1, 66123 Saarbrücken, Germany INTRODUCTION

More information

The Effect of La Addition on the Microstructure and Tensile Properties of Hot-Extruded Al 15%Mg 2 Si Composite

The Effect of La Addition on the Microstructure and Tensile Properties of Hot-Extruded Al 15%Mg 2 Si Composite The Effect of La Addition on the Microstructure and Tensile Properties of Hot-Extruded Al 15%Mg 2 Si Composite Paper Presenter: S.H. Allameh 1 A. Akhlaghi 2, M. Noghani 3, M. Emamy 4. 1,4- School of Metallurgy

More information

Coatings and potting compounds for LED applications capabilities, limitations and trouble shooting

Coatings and potting compounds for LED applications capabilities, limitations and trouble shooting Coatings and potting compounds for LED applications capabilities, limitations and trouble shooting Content Some theory on conformal coatings and potting compounds Conformal coatings for lighting applications

More information

Research Paper. Isothermal solidification bonding of Bi2Te2.55Se0.45 thermoelectric material with Cu electrodes

Research Paper. Isothermal solidification bonding of Bi2Te2.55Se0.45 thermoelectric material with Cu electrodes Engineering & Technology Research 3(3): 000-000, February 2019 DOI: 10.15413/etr.2019.0001 2019 Academia Publishing Research Paper Isothermal solidification bonding of Bi2Te2.55Se0.45 thermoelectric material

More information

Corrosion Testing of Several Waterwall Coatings

Corrosion Testing of Several Waterwall Coatings Corrosion Testing of Several Waterwall Coatings Prepared for Dominion Power April 15, 2013 Prepared by John N. DuPont, PhD Energy Research Center Lehigh University Bethlehem, PA 18015 Objective: The objective

More information

A. Feature Good wettability and antioxidation effect of flux

A. Feature Good wettability and antioxidation effect of flux A. Feature wettability and antioxidation effect of flux We have considered active temperature and persistence of flux, and selected activator newly. As results of this, J3-8843-KG has good wettability

More information

Fully-integrated, Bezel-less Transistor Arrays Using Reversibly Foldable Interconnects and Stretchable Origami Substrates

Fully-integrated, Bezel-less Transistor Arrays Using Reversibly Foldable Interconnects and Stretchable Origami Substrates Electronic Supplementary Material (ESI) for Nanoscale. This journal is The Royal Society of Chemistry 2016 Fully-integrated, Bezel-less Transistor Arrays Using Reversibly Foldable Interconnects and Stretchable

More information

Lead Free Surface Mount Technology. Ian Wilding BSc Senior Applications Engineer Henkel Technologies

Lead Free Surface Mount Technology. Ian Wilding BSc Senior Applications Engineer Henkel Technologies Lead Free Surface Mount Technology Ian Wilding BSc Senior Applications Engineer Henkel Technologies Overview of the Presentation First contact: Impact on the production operator Packaging Labelling Impact

More information

THE EFFECTS OF Bi AND AGING ON THE MICROSTRUCTURE AND MECHANICAL PROPERTIES OF Sn-RICH ALLOYS

THE EFFECTS OF Bi AND AGING ON THE MICROSTRUCTURE AND MECHANICAL PROPERTIES OF Sn-RICH ALLOYS THE EFFECTS OF Bi AND AGING ON THE MICROSTRUCTURE AND MECHANICAL PROPERTIES OF Sn-RICH ALLOYS André Delhaise and Doug Perovic University of Toronto Toronto, ON, Canada andre.delhaise@mail.utoronto.ca Polina

More information

Biomimetic synthesis of gold nanocrystals using a reducing amphiphile. Ferdinand Gonzaga, Sherdeep Singh and Michael A. Brook. Department of Chemistry

Biomimetic synthesis of gold nanocrystals using a reducing amphiphile. Ferdinand Gonzaga, Sherdeep Singh and Michael A. Brook. Department of Chemistry Biomimetic synthesis of gold nanocrystals using a reducing amphiphile. Ferdinand Gonzaga, Sherdeep Singh and Michael A. Brook Department of Chemistry 1280 Main St. W. Hamilton ON L8S 4M1 Canada Outline

More information

Improvement of Cu-Pillar Structure Using Advanced Plating Method

Improvement of Cu-Pillar Structure Using Advanced Plating Method Journal of Materials Science and Engineering B 7 (11-12) (2017) 247-251 doi: 10.17265/2161-6221/2017.11-12.001 D DAVID PUBLISHING Improvement of Cu-Pillar Structure Using Advanced Plating Method Jong-Young

More information

Interfacial Reactions between the Sn-9Zn Solder and Au/Ni/SUS304 Multi-layer Substrate

Interfacial Reactions between the Sn-9Zn Solder and Au/Ni/SUS304 Multi-layer Substrate , July 6-8, 2011, London, U.K. Interfacial Reactions between the Sn-9Zn Solder and Au/Ni/SUS304 Multi-layer Substrate *Yee-Wen Yen 1, Chien-Chung Jao 2, Kuo-Sing Chao 1, Shu-Mei Fu Abstract Sn-9Zn lead-free

More information

Reliability and Microstructure of Lead-Free Solder Joints in Industrial Electronics after Accelerated Thermal Aging

Reliability and Microstructure of Lead-Free Solder Joints in Industrial Electronics after Accelerated Thermal Aging Reliaility and Microstructure of Lead-Free Solder Joints in Industrial Electronics after Accelerated Thermal Aging Francesca Scaltro, Mohammad H. Biglari, Alexander Kodentsov, Olga Yakovleva, Erik Brom

More information

Comparison of the Corrosion Behavior of High Strength Aluminum Alloys after Exposure to ASTM B117 Environment. S.N. Grieshop*, R.G. Buchheit* Abstract

Comparison of the Corrosion Behavior of High Strength Aluminum Alloys after Exposure to ASTM B117 Environment. S.N. Grieshop*, R.G. Buchheit* Abstract Comparison of the Corrosion Behavior of High Strength Aluminum Alloys after Exposure to ASTM B117 Environment S.N. Grieshop*, R.G. Buchheit* *Ohio State University, Department of Materials Science and

More information

Many different metals and alloys

Many different metals and alloys CASE HISTORIES Stress Corrosion Cracking of Various Alloys Part 1 S.J. SUESS, Stork Technimet, Inc., New Berlin, Wisconsin Stress corrosion cracking (SCC) can lead to rapid and catastrophic failure in

More information

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish Julie Silk 1, Jianbiao Pan 2, Mike Powers 1 1 Agilent Technologies, 1400 Fountaingrove Parkway, Santa Rosa,

More information

Ceramic Processing Research

Ceramic Processing Research Journal of Ceramic Processing Research. Vol. 11, No. 1, pp. 100~106 (2010) J O U R N A L O F Ceramic Processing Research Factors affecting surface roughness of Al 2 O 3 films deposited on Cu substrates

More information

PHYSICAL PROPERTIES OF La 0.9 Sr 0.1 Cr 1-X Ni X O 3-δ (X = 0-0.6) SYNTHESIZED VIA CITRATE GEL COMBUSTION

PHYSICAL PROPERTIES OF La 0.9 Sr 0.1 Cr 1-X Ni X O 3-δ (X = 0-0.6) SYNTHESIZED VIA CITRATE GEL COMBUSTION PHYSICAL PROPERTIES OF La 0.9 Sr 0.1 Cr 1-X Ni X O 3-δ (X = 0-0.6) SYNTHESIZED VIA CITRATE GEL COMBUSTION Anuchit Ruangvittayanon * and Sutin Kuharuangrong Received: Sept 29, 2009; Revised: Nov 17, 2009;

More information

Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls

Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls Materials Transactions, Vol. 5, No. 3 () pp. 75 to 75 Special Issue on Lead-Free Soldering in Electronics # The Japan Institute of Metals Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored

More information

Effect of lactic acid on nucleation morphology and surface roughness of electroless Ni P deposition in nanoscale

Effect of lactic acid on nucleation morphology and surface roughness of electroless Ni P deposition in nanoscale Bull. Mater. Sci., Vol. 35, No. 4, August 2012, pp. 561 566. c Indian Academy of Sciences. Effect of lactic acid on nucleation morphology and surface roughness of electroless Ni P deposition in nanoscale

More information

Chapter 5: Atom and Ion Movements in Materials

Chapter 5: Atom and Ion Movements in Materials Slide 1 Chapter 5: Atom and Ion Movements in Materials 5-1 Slide 2 Learning Objectives 1. Applications of diffusion 2. Stability of atoms and ions 3. Mechanisms for diffusion 4. Activation energy for diffusion

More information

Effect of the Formation of CuO Flowers and SnO 2 on the Growth of Tin Whiskers on Immersion Tin Surface Finish

Effect of the Formation of CuO Flowers and SnO 2 on the Growth of Tin Whiskers on Immersion Tin Surface Finish WVCARMEA 2014 ID-119 Effect of the Formation of CuO Flowers and SnO 2 on the Growth of Tin Whiskers on Immersion Tin Surface Finish @ WVCARMEA 2014 22-26 th SEPT 2014 Tin surface 2 Outlines 1. Introduction

More information

An XPS and Atomic Force Microscopy Study of the Micro-Wetting Behavior of Water on Pure Chromium* 1

An XPS and Atomic Force Microscopy Study of the Micro-Wetting Behavior of Water on Pure Chromium* 1 Materials Transactions, Vol. 44, No. 3 (2003) pp. 389 to 395 #2003 The Japan Institute of Metals An XPS and Atomic Force Microscopy Study of the Micro-Wetting Behavior of Water on Pure Chromium* 1 Rongguang

More information

Welding and post weld heat treatment of 2.25%Cr-1%Mo steel

Welding and post weld heat treatment of 2.25%Cr-1%Mo steel University of Wollongong Thesis Collections University of Wollongong Thesis Collection University of Wollongong Year 2005 Welding and post weld heat treatment of 2.25%Cr-1%Mo steel Benjamin King University

More information

COMPUTER SIMULATION AND EXPERIMENTAL RESEARCH OF CAST PISTON POROSITY

COMPUTER SIMULATION AND EXPERIMENTAL RESEARCH OF CAST PISTON POROSITY Tome V (year 2007), Fascicole 2, (ISSN 1584 2665) COMPUTER SIMULATION AND EXPERIMENTAL RESEARCH OF CAST PISTON POROSITY D. KAKAS, L. KOVACEVIC, P. TEREK UNIVERSITY OF NOVI SAD, FACULTY OF TECHNICAL SCIENCES,

More information

Structure and Microhardness of Steel Samples after Pulse Plasma Flows Processing *

Structure and Microhardness of Steel Samples after Pulse Plasma Flows Processing * Materials Sciences and Applications, 2013, 4, 35-41 http://dx.doi.org/10.4236/msa.2013.47a2006 Published Online July 2013 (http://www.scirp.org/journal/msa) 35 Structure and Microhardness of Steel Samples

More information

Conductivity Mapping with Resolution of 140 nm in Diameter by Eddy Current Method Using Small Solenoid Coil

Conductivity Mapping with Resolution of 140 nm in Diameter by Eddy Current Method Using Small Solenoid Coil Materials Transactions, Vol. 43, No. 12 (2002) pp. 3217 to 3221 c 2002 The Japan Institute of Metals Conductivity Mapping with Resolution of 140 nm in Diameter by Eddy Current Method Using Small Solenoid

More information

Effect of the Substrate Distance on the Mechanical Properties of SnBi-χAl2O3 Joint Welded by Ultrasonic-assisted Brazing

Effect of the Substrate Distance on the Mechanical Properties of SnBi-χAl2O3 Joint Welded by Ultrasonic-assisted Brazing 3rd International Conference on Machinery, Materials and Information Technology Applications (ICMMITA 2015) Effect of the Substrate Distance on the Mechanical Properties of SnBi-χAl2O3 Joint Welded by

More information

Analytical Methods for Materials

Analytical Methods for Materials Analytical Methods for Materials Lesson 4 Metallography Suggested Reading Y. Leng, Materials Characterization, 2 nd Edition, (2013), Wiley, Hoboken, NJ Chapter 1. Reference Goodhew, Humphreys and Beanland,

More information

Advanced Materials Technology Key Expertise Theme. astutewales.com

Advanced Materials Technology Key Expertise Theme. astutewales.com Advanced Materials Technology Key Expertise Theme astutewales.com Understanding the Behaviour of Materials. Materials used to manufacture components is a key area for ensuring efficient production and

More information

Layer Thickness Analysis of Thin Metal Coatings with. Bruker Nano Analytics, Berlin, Germany Webinar, June 8 th 2017

Layer Thickness Analysis of Thin Metal Coatings with. Bruker Nano Analytics, Berlin, Germany Webinar, June 8 th 2017 Layer Thickness Analysis of Thin Metal Coatings with micro-xrf on SEM Bruker Nano Analytics, Berlin, Germany Webinar, June 8 th 2017 09.06.2017 Presenters Stephan Boehm Product Manager Micro-XRF/SEM Bruker

More information

Syllabus: Different levels of structure in materials. Relation among material processing, structure, properties, and performance

Syllabus: Different levels of structure in materials. Relation among material processing, structure, properties, and performance Syllabus: Types of materials Properties of materials Different levels of structure in materials Relation among material processing, structure, properties, and performance The main objective is to understand

More information

Fabrication of Single-Layer Touch Screen Panel with Corrosion Resistant Metal-Mesh Electrodes

Fabrication of Single-Layer Touch Screen Panel with Corrosion Resistant Metal-Mesh Electrodes Sensors and Materials, Vol. 29, No. 9 (2017) 1285 1290 MYU Tokyo 1285 S & M 1422 Fabrication of Single-Layer Touch Screen Panel with Corrosion Resistant Metal-Mesh Electrodes Kyoung Soo Chae, 1,2 Sung

More information

Study on erosion resistance characteristics of Fe-MWCNT composite plating with respect to lead-free solder

Study on erosion resistance characteristics of Fe-MWCNT composite plating with respect to lead-free solder Journal of Physics: Conference Series Study on erosion resistance characteristics of -MWCNT composite plating with respect to lead-free solder To cite this article: J Watanabe et al 2012 J. Phys.: Conf.

More information