Becoming Lead Free. Automotive Electronics. Antonio Aires Soldering Technical Specialist Visteon Corporation - Palmela Plant

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1 Automotive Electronics Becoming Lead Free Antonio Aires Soldering Technical Specialist Visteon Corporation - Palmela Plant 1

2 Agenda 1. Leadfree Electronics Drivers 2. Requirements 3. Areas of Impact 4. Manufacturing Implementation 2

3 Drivers - Legislation RoHS directive TOTALLY bans lead in affected products from 1 July 2006 at the point of sale to an end-used. WEEE directive gives minimum recycling/recovery/reuse targets that MUST be achieved by 31 December 2006 and MANDATES that the producer of the EEE device takes back plus the producer MUST finance the collection of waste EEE products from both end-users (consumers) and trade. Automotive Electronics are currently exempt. 3

4 Areas of Impact Impact s A to Z on Leadfree Electronics Implementation Printed Circuit Boards Quality Components Reliability PWB Pb Free Finish s Electrical Test Environmental Testing Aut. Inspect. Visual Inspection New process temp. Sepc. Components Temperature resistance Pb free Screen Printing Reflow Solder Processes Wave Solder Solder Joint Metal. Selective Solder Charact. Product PSW Solder Paste Solder Bar Materials Solder Wire Solder Flux Temperature resistance Product Design PWB Layout Components 4

5 Impact on Product Design Design Rules PWB leadfree solder pad geometries, SMD & through hole Unique or replacement components with unique geometries Component orientation restriction Component Availability standard & unique Connector System Thermal Loading Layout 5

6 Impact on Reflow Process 250 Temperature Process Window will Shrink Significantly 250 ºC Maximum Solder Process Temperature and Temperature Exposure of Sensitive Components 240 Soldering Temperatures T = 15 ºC Leadfree Reflow Process Window Temperature ºC ºC Soldering Temperatures T = 25 ºC Eutectic Reflow Process Window 235 ºC ~217 ºC Minimum Solder Process Temperature Liquidus, SAC ºC Leadfree Solder Process ~183 ºC Liquidus, Eutectic leaded solder ML 24-Aug-2005 Leaded Solder Process 6

7 Impact on Reflow Solder Solder Surface Tension Impact on Solder Joint Voiding Solder Paste Bare Copper Solder Powder Reflow surface tension of melted solder High surface tension makes Voids more difficult to escape Sn-Pb Leaded Solder Sn-Ag-Cu Leadfree Solder Also aggravated by the shorter profiles to save flux actvity 7

8 Impact on Soldering Process Leadfree Solder Alloys do not Wet as well as Sn/Pb Change from processing Sn/Pb LF Wave soldering requires adjustments in board design, component selection and fillet QA standards Recommended Process Adjustments Preheat at the high range and use a high temperature more active flux for better surface preparation Implications to the Overall Process May need convection preheaters Higher risk of solder bridging and incomplete hole fill / top fillet Time to 2/3 maximum wetting force (secs.) Flux = pure rosin Air Nitrogen Temperature ( 0 C) Reference: Senju Corp. 8

9 Impact on Wave Solder Comparison between acceptable windows for SnPb and SACS for Nitrogen* Preheating temp. (ºC) Conveyor Speed (cm/min.) Immersion depth 1st wave (mm) Solder Temp. (ºC) Immersion depth 2nd wave (mm) Contact Time (s) Flux Amount (ml/bd.) SnPb SACS * IDEALS Project 9

10 Impact on Wave Solder SnPb Vs Lead-Free drossing rates Mass Lost (g/min 1 ) Loss of Solder Mass due to Dross Removal Lead-Free Wave Study* Sn/Cu SAC 305 SAC 405 Sn/Ag Sn/Ag/Bi/Cu Estimated Sn/Pb mass loss rate Reference: Senju Corp. 10

11 Impact on Wave Solder Equipment Compatibility Without protection, Solder pot materials will degrade after 6-18 months in contact with the high tin content solders. 11

12 Impact on S.Joint Surface Cooling Rate 1 deg/sec 3 deg/sec 30deg/sec Upside Underside Magnification of Upside Direct correlation as well with Microstructure 12

13 Impact on PWB & Components Lead-Free Board & Component Finishes Board Finish: OSP, Au/Ni, Cu, Im. Ag, Im.Sn These are the most common leadfree capable board finishes used in the electronic industry today. Selection is determined by many factors based on product design, manufacturing and cost. Component Plating: Lead finishes of Pd/Ni, Pd/Ag, Au/Ni, Sn, Sn/Bi. Component plating play a key role in defining manufacturing process capability and product reliability. 13

14 Impact on Components Components: Leadfree component capability to higher temperature processing, leadfree soldering without damage or shift in performance specifications. Component backward compatibility to eutectic solder. Other LCD displays, sensors, stepper motors, and other unique product specific materials or devices. 14

15 Impact on Product Quality Lead-Free Wave Soldering Product Reliability Typical defects Tin Whiskers Fillet Lifting Reference: Senju Corp. 15

16 Key Challenges Leadfree Electronics Technology - Key Challenges Components Availability and reliability after high temperature leadfree processing in automotive environments. Backward compatibility. Product Design Design rules and unique product requirement Material incompatibility (CTE, chemical, etc.) Qualification requirements Manufacturing Process materials, equipment and control plan capability for higher temp with a narrower process window. Manufacturing capability and through-put Product reliability Meeting stringent automotive electronics product requirements. 16

17 The Manufacturing Approach Solder Paste Screen Printer Component Automatic Placement SMD Line Equipment Reflow Oven 17

18 The Manufacturing Approach Lead Free Prove-out out Line: Wave Solder Machine Selective Solder Machine 18

19 The Manufacturing Approach P Diagram Pb free SIGNAL Product Design: Component package types Process response Temp. resistence response Design Rules PWBCharacteristics Equipment: Raw Materials: Solder Paste type (Pb free) SYSTEM: NOISE VARIABLES Enviroment Conditions (Humidity, Temp., Pressure, Dust, etc) Pwb and component solderability Paste (quality, flux separation, metal flakes) Component placement accuracy Oven Stability: SMD REFLOW PROCESS Pb Free RESPONSE Y Defect Count (PPM) as per Visteon s acept. Criterias: 2 ND LEVEL OF RESPONSE CONTROL VARIABLES Xs Cross Section Analysis Thermal cycling/ aging Micro strain measurements Oven Profile Optimization Prior to DOE Paste Printing Definition / Hight Preliminary RESPONSE Solder paste height Solder paste printing defenition Solder paste printability 19

20 Solder Paste Measurements The Manufacturing Approach Solder Raw Materials process Temperatures Specification BOM Full verification with Component Supliers 7.3 Mils Thermoprofiling Full Assembly Process Thermoprofiling Solder Wave Height & Parallelism Micro Strain Measurements Thermal Cycling Flux Coverage Cross Section Analysis Solidification structure Intermetalics Grain size Voids 20

21 The Manufacturing Approach Sensitive Electronic Components Time versus Temperature Requirements for Sensitive Components on Radio Electrolytic Caps Nichicon C max for 5 s Inductors TDK C max for 5 s Resonators Murata C max for 10 s Crystal NDK C max for 5 s IC Packages All IC packages are capable of Pb-free soldering temperatures 21

22 The Manufacturing Approach Electrolitic Capacitor s recomended profile: 22

23 The Manufacturing Approach Solder paste supplier recommended profile: (96.5 Sn 3.0 Ag 0.5 Cu) Senju M705-GNR360 GNR360-K) Soak Time Peak Temp Time above 220 C 90 +/- 30 sec. 230 to 250 C 30 to 40 sec. Reference: Senju Corp. 23

24 The Manufacturing Approach Process Window Development Study s

25 The Manufacturing Approach 25

26 The Manufacturing Approach External Shape Analysis 26

27 The Manufacturing Approach Cross Section Analysis 27

28 The Manufacturing Approach Solder Joint Characterization Grain Size Calculations for solder joint Using ASTM Grain size determination for non-equiaxed grains in accordance to ASTM methods E

29 The Manufacturing Approach Solder Joint Cross-sections for an IC (Reflow) 29

30 The Manufacturing Approach SEM Grey Solder Joint Metallurgy (Reflow) X-ray Maps for IC Sn X-Ray Map Cu X-Ray Map Ag X-Ray Map 30

31 The Manufacturing Approach Solder Joint SEM Cross-sections for ENC Lead (Selective Soldering) IMC Solder Cu Solder Cu IMC 31

32 The Manufacturing Approach Automotive Electronics Leadfree Summary Acceptable leadfree product designs and manufacturing processes are possible for the demanding automotive electronics industry. Implementation of leadfree electronics in the automotive industry is being paced by: customer requirements, new product design cycles, cost, and technology readiness. Further leadfree development is still required to address unique automotive product design requirements, severe environment applications, and high volume manufacturing process optimization. 32

33 Obrigado Thank You 33

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