Thin Films: Stresses and Mechanical Properties II
|
|
- Vernon Lane
- 6 years ago
- Views:
Transcription
1
2
3 MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS VOLUME 188 Thin Films: Stresses and Mechanical Properties II Symposium held April 16-19, 1990, San Francisco, California, U.S.A. EDITORS: M. F. Doerner IBM General Products Division, San Jose, California, U.S.A. W. C. Oliver Oak Ridge National Laboratory, Oak Ridge, Tennessee, U.S.A. G. M. Pharr Rice University, Houston, Texas, U.S.A. F. R. Brotzen Rice University, Houston, Texas, U.S.A. IM1RTSI MATERIALS RESEARCH SOCIETY Pittsburgh, Pennsylvania
4 cambridge university press Cambridge, New York, Melbourne, Madrid, Cape Town, Singapore, São Paulo, Delhi, Mexico City Cambridge University Press 32 Avenue of the Americas, New York ny , USA Published in the United States of America by Cambridge University Press, New York Information on this title: / Materials Research Society 506 Keystone Drive, Warrendale, pa Materials Research Society 1990 This publication is in copyright. Subject to statutory exception and to the provisions of relevant collective licensing agreements, no reproduction of any part may take place without the written permission of Cambridge University Press. This publication has been registered with Copyright Clearance Center, Inc. For further information please contact the Copyright Clearance Center, Salem, Massachusetts. First published 1990 First paperback edition 2012 Single article reprints from this publication are available through University Microfilms Inc., 300 North Zeeb Road, Ann Arbor, mi CODEN: MRSPDH isbn Paperback Cambridge University Press has no responsibility for the persistence or accuracy of URLs for external or third-party internet websites referred to in this publication, and does not guarantee that any content on such websites is, or will remain, accurate or appropriate.
5 Contents PREFACE xi ACKNOWLEDGMENTS xiii MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS xiv PART I: STRESSES: MEASUREMENT AND THEORY STRESSES IN PASSIVATED FILMS 3 Paul A. Flinn FINITE ELEMENT CALCULATIONS OF THERMAL STRESSES IN PASSIVATED AND UNPASSIVATED LINES BONDED TO SUBSTRATES 15 Anne I. Sauter and W.D. Nix DEFLECTION SHAPES DUE TO INTRINSIC STRESS IN THIN FILMS 21 Christine B. Masters, N.J. Salamon, and D.E. Fahnline MEASUREMENT OF STRESSES IN THIN FILMS USING HOLOGRAPHIC INTERFEROMETRY: DEPENDENCE ON ATMOSPHERIC CONDITIONS 29 Michele A. Maden, Kun Tong, and Richard J. Farris A VIBRATIONAL TECHNIQUE FOR STRESS MEASUREMENT IN FILMS 35 A. Jagota, S. Mazur, and R.J. Farris THE IN-SITU MEASUREMENT OF BIAXIAL MODULUS AND RESIDUAL STRESS OF MULTI-LAYER POLYMERIC THIN FILMS 41 Pinyen Lin and Stephen D. Senturia ANALYSIS OF STRESS VARIATIONS IN EPITAXIAL FILMS USING CATHODOLUMINESCENCE MICROSCOPY AND SPECTROSCOPY 47 B.G. Yacobi and P. Sheldon NON-DESTRUCTIVE ASSESSMENT OF THIN FILM STRESSES AND CRYSTAL QUALITY OF SILICON ON INSULATOR MATERIALS WITH RAMAN SPECTROSCOPY 53 Ingrid De Wolf, Jan Vanhellemont, and Herman E. Maes PART II: STRESSES: PROCESSING AND MICROSTRUCTURAL EFFECTS IN SITU STRESS MEASUREMENTS DURING THE FORMATION OF TiSi 2 C49 ON Si WAFERS J.F. Jongste, G.C.A.M. Janssen, and S, Radelaar Invited Paper
6 IN SITU STUDY OF STRESSES GENERATED DURING THE FORMATION OF COBALT DISILICIDE AND THE EFFECT OF POST SILICIDE PROCESSING 67 A.R. Sitaram, J.C. Kalb, Jr., and S.P. Murarka PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION OF DIELECTRIC FILMS: CORRELATION OF STRESS TO FILM STRUCTURE AND PLASMA CHARACTERISTICS 73 Radhika Srinivasan, B.C. Nguyen, and A.P. Short CORRELATION BETWEEN PROCESSING, COMPOSITION, AND MECHANICAL PROPERTIES OF PECVD-SiN x THIN FILMS 79 D.C.H. Yu and J.A. Taylor INTRINSIC STRESS OF PECVD SILICON OXYNITRIDE FILMS DEPOSITED IN A HOT-WALL REACTOR 85 K. Aite and R. Koekoek STRESSES IN AMORPHOUS Gd-Fe ALLOY THIN FILMS DEPOSITED BY MAGNETRON SPUTTERING 91 Zhi-Feng Zhou, Qi-Gang Zhou, and Yu-Dian Fan INTERNAL STRESSES AND ADHESION PROPERTIES OF FILM/ SUBSTRATE INTERFACES 97 M. Ignat, A. Chouaf, and Ph. Normandon TEMPERATURE DEPENDENCE OF STRESS FOR COPPER, COPPER-SILVER AND COPPER-TIN FILMS 103 Richard Haynes PART III: MICROINDENTATION *THE INFLUENCE OF ION IMPLANTATION ON THE NEAR-SURFACE MECHANICAL PROPERTIES OF CERAMICS 111 C.J. McHargue, M.E. O'Hern, and D.L. Joslin MECHANICAL PROPERTIES OF CARBON-IMPLANTED NIOBIUM 121 S.J. Zinkle and J.S. Huang MECHANICAL PROPERTIES OF COATINGS AND INTERFACES 127 B.D. Fabes and W.C. Oliver MECHANICAL PROPERTIES OF SILICA COATINGS 133 Kenneth D. Cornett, B.D. Fabes, and W.C. Oliver THE HARDNESS AND ELASTIC MODULUS OF TiN FILMS AS DETERMINED BY ULTRA-LOW LOAD INDENTATION 139 M.E. O'Hern, W.C. Oliver, C.J. McHargue, D.S. Rickerby, and S.J. Bull PART IV: TIME DEPENDENT DEFORMATION DETERMINATION OF ELASTIC CONSTANTS AND VISCOSITY OF AMORPHOUS THIN FILMS FROM SUBSTRATE CURVATURE 147 Ann Witvrouw and Frans Spaepen *Invited Paper
7 X-RAY STRESS STUDIES OF PASSIVATED AND UNPASSIVATED NARROW ALUMINUM METALLIZATIONS 153 C.A. Paszkiet, M.A. Korhonen, and Che-Yu Li MEASUREMENT OF STRESS RELAXATION IN THIN ALUMINUM METALLIZATIONS BY CONTINUOUS INDENTATION AND X-RAY TECHNIQUES 159 M.A. Korhonen, W.R. LaFontaine, C.A. Paszkiet, R.D. Black, and Che-Yu Li INDENTATION LOAD RELAXATION EXPERIMENTS ON Al-Si METALLIZATIONS 165 W.R. LaFontaine, B. Yost, R.D. Black, and Che-Yu Li CREEP BEHAVIOR OF SPUTTERED TiN FILMS USING INDENTATION TESTING 171 V. Raman and R. Berriche MECHANICAL PROPERTIES OF THIN FILM ALUMINUM FIBERS: GRAIN SIZE EFFECTS 177 James E. Steinwall and H.H. Johnson STUDYING MECHANICAL PROPERTIES OF THIN FILMS UNDER HIGH PRESSURES 183 B.C. Cai, D. Kuhlmann-Wilsdorf, and R.B. Nelson PART V: TRIBOLOGY *MICROSCRATCH TEST FOR ULTRA-THIN FILMS 191 T.W. Wu MICROSCRATCH TEST ON CARBON FILMS AS THIN AS 20 nm 207 T.W. Wu, A.L. Shull, and J. Lin MECHANICAL PROPERTIES OF CARBON FILMS FOR THIN FILM DISKS 213 Richard L. White, Mary F. Doerner, and George W. Walker NANOTRIBOLOGY OF DIAMOND FILMS STUDIED BY ATOMIC FORCE MICROSCOPY 219 Gabi Neubauer, Sidney R. Cohen, Gary M. McClelland, and Hajime Seki ION BEAM ANNEALING OF VAPOR-DEPOSITED CARBON FILM 225 Kazuo Higuchi, Shoji Noda, Sumiko Iritani, Tomoji Ishiguro, and Osami Kamigaito DIAMOND-LIKE FILMS AS OPTICAL AND PROTECTIVE COATINGS 231 D. Das Gupta, F. Demichelis, R. Spagnolo, and A. Tagliaferro EXPERIMENTS ON, AND A TWO-COMPONENT MODEL FOR, THE BEHAVIOR OF WATER NANO-FILMS ON METALS 237 Chao Gao and D. Kuhlmann-Wilsdorf Invited Paper vii
8 PART VI: FRACTURE AND ADHESION MEASUREMENT OF INTERFACE STRENGTH BY LASER PULSE INDUCED SPALLATION 245 V. Gupta and A.S. Argon COMPRESSIVE STRESSES, BUCKLING AND SPALLING OF TUNGSTEN LPD FILMS 251 Aidan Borer and Brian Derby CRACKING AND DELAMINATION OF VAPOUR-DEPOSITED TANTALUM FILMS 257 R.M. Fisher, J.Z. Duan, and J.B. Liu INDENTATION FRACTURE OF BRITTLE MATERIALS 263 Barry N. Lucas, W.C. Oliver, and J.J. Wert MOLECULAR DYNAMICS COMPUTER SIMULATION OF THE RUPTURE OF THE TWO-DIMENSIONAL LENNARD-JONES FILM 269 John F. Maguire and Chun-Pok Leung FRACTURE-EXAFS: A NEW METHOD FOR THE STUDY OF INTERFACES IN THIN FILMS AND POLYCRYSTALLINE MATERIALS 275 E.V. Barrera, Benji Maruyama, and S.M. Heald PROPERTIES OF A SUBMICRON-HONEYCOMB THIN FILM 281 R.C. Furneaux, J.S. Crompton, and D.J. Fitchett PART VII: MULTILAYERS MECHANICAL PROPERTIES OF COMPOSITIONALLY MODULATED Au-Ti THIN FILMS USING INDENTATION AND MICROBEAM DEFLECTION TECHNIQUES 289 Shefford P. Baker, Alan F. Jankowski, Soonil Hong, and William D. Nix MECHANICAL PROPERTIES OF MULTILAYERED COPPER-NICKEL THIN FILMS MEASURED BY INDENTATION TECHNIQUES 295 T.E. Schlesinger, R.C. Cammarata, C. Kim, S.B. Qadri, and A.S. Edelstein TRIBOLOGICAL AND MECHANICAL PROPERTIES OF Fe/Ti MULTILAYERED FILMS 301 M. Nastasi, J-P. Hirvonen, T.R. Jervis, and S.N. Basu THE MECHANICAL PROPERTIES OF Cu/TiB 2 MULTILAYER STRUCTURES 307 Kevin M. Hubbard, S.N. Basu, J-P. Hirvonen, T.R. Jervis, and M. Nastasi PART VIII: MICROSTRUCTURE AND DEFECTS MECHANISMS AND KINETICS OF MISFIT DISLOCATION FORMATION IN HETEROEPITAXIAL THIN FILMS 315 W.D. Nix, D.B. Noble, and J.F. Turlo *Invited Paper viii
9 MECHANICAL PROPERTIES OF NANOCOMPOSITE COATINGS FABRICATED BY SPUTTERING 331 G.M. Chow, R.L. Holtz, C.Cm. Wu, A.S. Edelstein, T.E. Schlesinger, and R.C. Cammarata *HARD COATINGS 337 S.J. Bull and D.S. Rickerby PHOTOREFLECTANCE CHARACTERIZATION OF SILICON FILMS ON INSULATOR 349 Adriana Giordana, R. Glosser, Joseph G. Pellegrino, S. Qadri, M.E. Twigg, E.D. Richmond, Keith Joyner, and Gordon Pollack STRUCTURAL DEPENDENCE OF THE ELASTIC CONSTANTS OF POLYMERIC LANGMUIR-BLODGETT FILMS STUDIED USING BRILLOUIN SCATTERING 355 Sukmock Lee, J.R. Dutcher, B. Hillebrands, G.I. Stegeman, W. Knoll, G. Duda, G. Wegner, and F. Nizzoli AUTHOR INDEX 361 SUBJECT INDEX 363 MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS 365 *Invited Paper
10
11 Preface This volume is a compilation of papers presented at the 1990 Spring Meeting of the Materials Research Society in a symposium entitled "Thin Films: Stresses and Mechanical Properties II". As indicated by the title, the symposium was the second in a series, the first of which was held at the Fall Meeting in Interest in thin film mechanical properties continues to grow. The symposium was attended by a large international audience representing universities, national laboratories and industry who presented basic and applied research results in fields such as semiconductor technology, magnetic recording technology, and hard coating technology. The importance of thin film mechanical properties in these fields is now recognized to the extent that basic characterization techniques such as microindentation and thin film stress measurement are performed routinely, and new characterization techniques are being developed on a daily basis. Many of the papers in the symposium dealt with the developments in these characterization methods and their application to a broad spectrum of materials such as compositionally modulated structures, ion implanted materials, optical coatings, and the numerous metals, ceramics and organics used in semiconductor device manufacture. The editors are encouraged by the rapidly growing interest in thin film mechanical properties. It is hoped that this volume will be useful to newcomers to the field, as well as stimulate new ideas for those who are already familiar with it. Mary F. Doerner Warren C. Oliver George M. Pharr Franz R. Brotzen June 1990
12
13 Acknowledgments The editors gratefully acknowledge financial support provided by: Nano Instruments, Inc. Knoxville, Tennessee IBM General Products Division San Jose, California UltraTherm, Inc. Kingston, Tennessee Oak Ridge National Laboratory Oak Ridge, Tennessee The organizational and typing assistance provided by Ms. Gwen Sims, Oak Ridge National Laboratory, is also appreciated. Mary F. Doerner Warren C. Oliver George M. Pharr Franz R. Brotzen June 1990 xiii
14 MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS Recent Materials Research Society Symposium Proceedings Volume 157 Beam-Solid Interactions: Physical Phenomena, J.A. Knapp, P. Borgesen, R.A. Zuhr, 1989, ISBN Volume 158 In-Situ Patterning: Selective Area Deposition and Etching, R. Rosenberg, A.F. Bernhardt, J.G. Black, 1989, ISBN Volume 159 Atomic Scale Structure of Interfaces, R.D. Bringans, R.M. Feenstra, J.M. Gibson, 1989, ISBN X Volume 160 Layered Structures: Heteroepitaxy, Superlattices, Strain, and Metastability, B.W. Dodson, LJ. Schowalter, J.E. Cunningham, F.H. Pollak, 1989, ISBN Volume 161 Properties of II-VI Semiconductors: Bulk Crystals, Epitaxial Films, Quantum Well Structures and Dilute Magnetic Systems, J.F. Schetzina, F.J. Bartoli, Jr., H.F. Schaake, 1989, ISBN Volume 162 Diamond, Boron Nitride, Silicon Carbide and Related Wide Bandgap Semiconductors, J.T. Glass, R.F. Messier, N. Fujimori, 1989, ISBN X Volume 163 Impurities, Defects and Diffusion in Semiconductors: Bulk and Layered Structures, J. Bernholc, E.E. Haller, DJ. Wolford, 1989, ISBN Volume 164 Materials Issues in Microcrystalline Semiconductors, P.M. Fauchet, C.C. Tsai, K. Tanaka, 1989, ISBN Volume 165 Characterization of Plasma-Enhanced CVD Processes, G. Lucovsky, D.E. Ibbotson, D.W. Hess, 1989, ISBN Volume 166 Neutron Scattering for Materials Science, S.M. Shapiro, S.C. Moss, J.D. Jorgensen, 1989, ISBN Volume 167 Advanced Electronic Packaging Materials, A. Barfknecht, J. Partridge, C-Y. Li, CJ. Chen, 1989, ISBN Volume 168 Chemical Vapor Deposition of Refractory Metals and Ceramics, T.M. Besmann, B.M. Gallois, 1989, ISBN Volume 169 High Temperature Superconductors: Fundamental Properties and Novel Materials Processing, J. Narayan, C.W. Chu, L.F. Schneemeyer, D.K. Christen, 1989, ISBN Volume 170 Tailored Interfaces in Composite Materials, C.G. Pantano, EJ.H. Chen, 1989, ISBN Volume 171 Polymer Based Molecular Composites, D.W. Schaefer, J.E. Mark, 1989, ISBN Volume 172 Optical Fiber Materials and Processing, J.W. Fleming, G.H. Sigel, S. Takahashi, P.W. France, 1989, ISBN Volume 173 Electrical, Optical and Magnetic Properties of Organic Solid-State Materials, L.Y. Chiang, D.O. Cowan, P. Chaikin, 1989, ISBN Volume 174 Materials Synthesis Utilizing Biological Processes, M. Alper, P.D. Calvert, P.C. Rieke, 1989, ISBN Volume 175 Multi-Functional Materials, D.R. Ulrich, F.E. Karasz, A.J. Buckley, G. Gallagher-Daggitt, 1989, ISBN Volume 176 Scientific Basis for Nuclear Waste Management XIII, V.M. Oversby, P.W. Brown, 1989, ISBN X Volume 177 Macromolecular Liquids, C.R. Safinya, S.A. Safran, P.A. Pincus, 1989, ISBN Volume 178 Fly Ash and Coal Conversion By-Products: Characterization, Utilization and Disposal VI, F.P. Glasser, R.L. Day, 1989, ISBN
15 MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS Volume 179 Specialty Cements with Advanced Properties, H. Jennings, A.G. Landers, B.E. Scheetz, I. Odler, 1989, ISBN Volume 180 Better Ceramics Through Chemistry IV, C.J. Brinker, D.E. Clark, D.R. Ulrich, B.J.J. Zelinsky, 1990, ISBN: Volume 181 Advanced Metallizations in Microelectronics, A. Katz, S.P. Murarka, A. Appelbaum, 1990, ISBN: Volume 182 Polysilicon Thin Films and Interfaces, B. Raicu, T.Kamins, C.V. Thompson, 1990, ISBN: Volume 183 High-Resolution Electron Microscopy of Defects in Materials, R. Sinclair, DJ. Smith, U. Dahmen, 1990, ISBN: Volume 184 Degradation Mechanisms in III-V Compound Semiconductor Devices and Structures, V. Swaminathan, SJ. Pearton, O. Manasreh, 1990, ISBN: Volume 185 Materials Issues in Art and Archaeology II, J.R. Druzik, P.B. Vandiver, G. Wheeler, 1990, ISBN: Volume 186 Alloy Phase Stability and Design, G.M. Stocks, D.P. Pope, A.F. Giamei, 1990, ISBN: Volume 187 Thin Film Structures and Phase Stability, B.M. Clemens, W.L. Johnson, 1990, ISBN: Volume 188, W.C. Oliver, M. Doerner, G.M. Pharr, F.R. Brotzen, 1990, ISBN: Volume 189 Microwave Processing of Materials II, W.B. Snyder, W.H. Sutton, D.L. Johnson, M.F. Iskander, 1990, ISBN: X Volume 190 Plasma Processing and Synthesis of Materials III, D. Apelian, J. Szekely, 1990, ISBN: Volume 191 Laser Ablation for Materials Synthesis, D.C. Paine, J.C. Bravman, 1990, ISBN: Volume 192 Amorphous Silicon Technology, P.C. Taylor, M.J. Thompson, P.G. LeComber, Y. Hamakawa, A. Madan, 1990, ISBN: X Volume 193 Atomic Scale Calculations of Structure in Materials, M.A. Schluter, M.S. Daw, 1990, ISBN: Volume 194 Intermetallic Matrix Composites, D.L. Anton, R. McMeeking, D. Miracle, P. Martin, 1990, ISBN: Volume 195 Physical Phenomena in Granular Materials, T.H. Geballe, P. Sheng, G.D. Cody, 1990, ISBN: Volume 196 Superplasticity in Metals, Ceramics, and Intermetallics, M.J. Mayo, J. Wadsworth, M. Kobayashi, A.K. Mukherjee, 1990, ISBN: Volume 197 Materials Interactions Relevant to the Pulp, Paper, and Wood Industries, J.D. Passaretti, D. Caulfield, R. Roy, V. Setterholm, 1990, ISBN: Volume 198 Epitaxial Heterostructures, D.W. Shaw, J.C. Bean, V.G. Keramidas, P.S. Peercy, 1990, ISBN: Volume 199 Workshop on Specimen Preparation for Transmission Electron Microscopy of Materials II, R. Anderson, 1990, ISBN: Volume 200 Ferroelectric Thin Films, A.I. Kingon, E.R. Myers, 1990, ISBN: Earlier Materials Research Society Symposium Proceedings listed in the back.
Materials Science and Engineering: An Introduction
Materials Science and Engineering: An Introduction Callister, William D. ISBN-13: 9780470419977 Table of Contents List of Symbols. 1 Introduction. 1.1 Historical Perspective. 1.2 Materials Science and
More informationSuperplasticity in Metals, Ceramics, and Intermetallics
Superplasticity in Metals, Ceramics, and Intermetallics in this web service in this web service MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS VOLUME 196 Superplasticity in Metals, Ceramics, and Intermetallics
More informationCo-Evolution of Stress and Structure During Growth of Polycrystalline Thin Films
Co-Evolution of Stress and Structure During Growth of Polycrystalline Thin Films Carl V. Thompson and Hang Z. Yu* Dept. of Materials Science and Engineering MIT, Cambridge, MA, USA Effects of intrinsic
More informationINTRODUCTION TO THE HIGH-TEMPERATURE OXIDATION OF METALS
INTRODUCTION TO THE HIGH-TEMPERATURE OXIDATION OF METALS A straightfoward treatment describing the oxidation processes of metals and alloys at elevated temperatures. This new edition retains the fundamental
More informationHydrogen in Semiconductors
Hydrogen in Semiconductors SEMICONDUCTORS AND SEMIMETALS Volume 34 Volume Editors JACQUES I. PANKOVE UNIVERSITY OF COLORADO AT BOULDER BOULDER, COLORADO NOBLE M. JOHNSON XEROX PALO ALTO RESEARCH CENTER
More informationFABRICATION ENGINEERING MICRO- NANOSCALE ATTHE AND. Fourth Edition STEPHEN A. CAMPBELL. of Minnesota. University OXFORD UNIVERSITY PRESS
AND FABRICATION ENGINEERING ATTHE MICRO- NANOSCALE Fourth Edition STEPHEN A. CAMPBELL University of Minnesota New York Oxford OXFORD UNIVERSITY PRESS CONTENTS Preface xiii prrt i OVERVIEW AND MATERIALS
More informationMicrostructure, morphology and their annealing behaviors of alumina films synthesized by ion beam assisted deposition
Nuclear Instruments and Methods in Physics Research B 206 (2003) 357 361 www.elsevier.com/locate/nimb Microstructure, morphology and their annealing behaviors of alumina films synthesized by ion beam assisted
More informationAvailable online at ScienceDirect. Procedia Engineering 79 (2014 )
Available online at www.sciencedirect.com ScienceDirect Procedia Engineering 79 (2014 ) 212 217 37th National Conference on Theoretical and Applied Mechanics (37th NCTAM 2013) & The 1st International Conference
More informationMaterials Aspects of GaAs and InP Based Structures
AT&T Materials Aspects of GaAs and InP Based Structures V. Swaminathan AT&T Belt Laboratories Breinigsvil/e, Pennsylvania A. T. Macrander Argonne National Laboratory Argonne, Illinois m Prentice Hall,
More informationMicro-Electro-Mechanical Systems (MEMS) Fabrication. Special Process Modules for MEMS. Principle of Sensing and Actuation
Micro-Electro-Mechanical Systems (MEMS) Fabrication Fabrication Considerations Stress-Strain, Thin-film Stress, Stiction Special Process Modules for MEMS Bonding, Cavity Sealing, Deep RIE, Spatial forming
More informationMetallurgical and Ceramic Protective Coatings
Metallurgical and Ceramic Protective Coatings Metallurgical and Ceramic Protective Coatings Edited by Chemistry Division Naval Research Laboratory Washington D.C. lun! CHAPMAN & HALL London Weinheim. New
More informationMaterials Characterization
Materials Characterization C. R. Abernathy, B. Gila, K. Jones Cathodoluminescence (CL) system FEI Nova NanoSEM (FEG source) with: EDAX Apollo silicon drift detector (TE cooled) Gatan MonoCL3+ FEI SEM arrived
More informationSimulation of Mechanical Deformation and Tribology of Nano-Thin Amorphous Hydrogenated Carbon (a:ch) Films Using Molecular Dynamics. J.N.
Y @&vf- 940w 71 0- UCRL-JC-124063 PREPRINT Simulation of Mechanical Deformation and Tribology of Nano-Thin Amorphous Hydrogenated Carbon (a:ch) Films Using Molecular Dynamics J.N. Glosli M.R. Philpott
More informationChapter 1 - Introduction
Chapter 1 - Introduction What is materials science? Why should we know about it? Materials drive our society Stone Age Bronze Age Iron Age Now? Silicon Age? Polymer Age? Chapter 1-1 Chapter 1-2 Hardness
More informationTribomechanical Properties of DLC Coatings Deposited by Magnetron Sputtering on Metallic and Insulating Substrates
Tribomechanical Properties of DLC Coatings Deposited by Magnetron Sputtering on Metallic and Insulating Substrates Dr. Iván Fernández Martínez Indianapolis, May 10th, 2016 Diamond Like Carbon (DLC) Diamond-like
More informationMetallization deposition and etching. Material mainly taken from Campbell, UCCS
Metallization deposition and etching Material mainly taken from Campbell, UCCS Application Metallization is back-end processing Metals used are aluminum and copper Mainly involves deposition and etching,
More information1 MARCH 2017 FILM DEPOSITION NANOTECHNOLOGY
1 MARCH 2017 FILM DEPOSITION NANOTECHNOLOGY PRESENTATION Pedro C. Feijoo E-mail: PedroCarlos.Feijoo@uab.cat FABRICATION TECHNOLOGIES FOR NANOELECTRONIC DEVICES. PEDRO C. FEIJOO 2 FILM GROWTH Chemical vapor
More information2 9 & 3 0 J U N E, P A R I S - F R A N C E
2 9 & 3 0 J U N E, 2 0 1 4 P A R I S - F R A N C E HIGH-TECH MATERIALS FOR TOMORROW'S LARGE SCALE INDUSTRIAL DEVELOPMENTS: ENERGY GENERATION AND TRANSPORT, ADVANCED STRUCTURAL DESIGNS, AND DATA PROCESSING
More informationMicro-Electro-Mechanical Systems (MEMS) Fabrication. Special Process Modules for MEMS. Principle of Sensing and Actuation
Micro-Electro-Mechanical Systems (MEMS) Fabrication Fabrication Considerations Stress-Strain, Thin-film Stress, Stiction Special Process Modules for MEMS Bonding, Cavity Sealing, Deep RIE, Spatial forming
More informationCONTENTS. Preface to the 3rd Edition Acknowledgments
CONTENTS Preface to the 3rd Edition Acknowledgments vii ix CHAPTER 1 INTRODUCTION 1 1.1 Definition of materials degradation 1 1.2 Definition and significance of surface engineering 4 1.3 Classification
More informationAnalysis and modeling of residual stress in diamond thin film deposited by the hot-filament chemical vapor deposition process
Analysis and modeling of residual stress in diamond thin film deposited by the hot-filament chemical vapor deposition process Seung I. Cha and Soon H. Hong Department of Materials Science and Engineering,
More informationMicro-Electro-Mechanical Systems (MEMS) Fabrication. Special Process Modules for MEMS. Principle of Sensing and Actuation
Micro-Electro-Mechanical Systems (MEMS) Fabrication Fabrication Considerations Stress-Strain, Thin-film Stress, Stiction Special Process Modules for MEMS Bonding, Cavity Sealing, Deep RIE, Spatial forming
More informationDevelopment of New Generation Of Coatings with Strength-Ductility Relationship, Wear, Corrosion and Hydrogen Embrittlement Resistance Beyond the
Development of New Generation Of Coatings with Strength-Ductility Relationship, Wear, Corrosion and Hydrogen Embrittlement Resistance Beyond the Current Materials Accomplishments till date As the structural
More informationARTICLE IN PRESS. Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing ] (]]]]) ]]] ]]] Contents lists available at ScienceDirect Materials Science in Semiconductor Processing journal homepage: www.elsevier.com/locate/mssp High-dielectric
More informationCopper Interconnect Technology
Tapan Gupta Copper Interconnect Technology i Springer Contents 1 Introduction 1 1.1 Trends and Challenges 2 1.2 Physical Limits and Search for New Materials 5 1.3 Challenges 6 1.4 Choice of Materials 7
More informationFUNDAMENTALS OF SEMICONDUCTOR PROCESSING TECHNOLOGY
FUNDAMENTALS OF SEMICONDUCTOR PROCESSING TECHNOLOGY FUNDAMENTALS OF SEMICONDUCTOR PROCESSING TECHNOLOGY by Badih EI-Kareh IBM Corporation Graphics and Layout: Richard J. Bombard SPRINGER SCIENCE+BUSINESS
More informationWhat is Materials Science and Engineering??
Materials Science and Engineering What is Materials Science and Engineering?? Engineering is Doing? Engineers use science and math to design new products and services Engineers solve problems They make
More informationThermal Conductivity. Theory, Properties, and Applications. Terry M. Tritt. Kluwer Academic/Plenum Publishers
Thermal Conductivity Theory, Properties, and Applications Edited by Terry M. Tritt Clemson University Clemson, South Carolina Kluwer Academic/Plenum Publishers New York, Boston, Dordrecht, London, Moscow
More informationMEMSAND MICROSYSTEMS Design, Manufacture, and Nanoscale Engineering
MEMSAND MICROSYSTEMS Design, Manufacture, and Nanoscale Engineering Second Edition TAI-RAN HSU Microsystems Design and Packaging Laboratory Department of Mechanical and Aerospace Engineering San Jose State
More informationSupporting Information
Copyright WILEY VCH Verlag GmbH & Co. KGaA, 69469 Weinheim, Germany, 2012. Supporting Information for Small, DOI: 10.1002/smll. 201102654 Large-Area Vapor-Phase Growth and Characterization of MoS 2 Atomic
More informationAtomic structure, arrangement, and movement Introduction to Materials Introduction Types of Materials Structure-Property-Processing Relationship
Atomic structure, arrangement, and movement to Materials Types of Materials Structure-Property-Processing Relationship Environmental Effects on Material Behavior Materials Design and Selection Atomic Structure
More informationCzochralski Crystal Growth
Czochralski Crystal Growth Crystal Pulling Crystal Ingots Shaping and Polishing 300 mm wafer 1 2 Advantage of larger diameter wafers Wafer area larger Chip area larger 3 4 Large-Diameter Wafer Handling
More informationME 206: Materials Science
ME 206: Materials Science Course Objective... Introduce fundamental concepts in Materials Science You will learn about: material structure how structure dictates properties how processing can change structure
More informationPrecursors with Metal-Nitrogen Bonds for ALD of Metals, Nitrides and Oxides
Precursors with Metal-Nitrogen Bonds for ALD of Metals, Nitrides and Oxides Abstract Roy Gordon Gordon@chemistry.harvard.edu, Cambridge, MA To achieve ALD s unique characteristics, ALD precursors must
More informationAdvanced Gate Stack, Source/Drain, and Channel Engineering for Si-Based CMOS 6: New Materials, Processes, and Equipment
Advanced Gate Stack, Source/Drain, and Channel Engineering for Si-Based CMOS 6: New Materials, Processes, and Equipment Editors: E. P. Gusev Qualcomm MEMS Technologies San Jose, California, USA D-L. Kwong
More informationAdhesion enhancement of DLC hard coatings by HiPIMS metal ion etching pretreatment and its tribological properties José Antonio Santiago Varela
Adhesion enhancement of hard coatings by HiPIMS metal ion etching pretreatment and its tribological properties José Antonio Santiago Varela Bilbao, October 19 th 2016 E-mail: jose.santiago@imdea.org Aim
More informationPolycrystalline Silicon Produced by Joule-Heating Induced Crystallization
Polycrystalline Silicon Produced by Joule-Heating Induced Crystallization So-Ra Park 1,2, Jae-Sang Ro 1 1 Department of Materials Science and Engineering, Hongik University, Seoul, 121-791, Korea 2 EnSilTech
More informationPrevious Lecture. Vacuum & Plasma systems for. Dry etching
Previous Lecture Vacuum & Plasma systems for Dry etching Lecture 9: Evaporation & sputtering Objectives From this evaporation lecture you will learn: Evaporator system layout & parts Vapor pressure Crucible
More informationExtended Abstracts of the Sixth International Workshop on Junction Technology
IWJT-2006 Extended Abstracts of the Sixth International Workshop on Junction Technology May.15-16, 2006, Shanghai, China Editors: Yu-Long Jiang, Guo-Ping Ru, Xin-Ping Qu, and Bing-Zong Li IEEE Press IEEE
More informationContents. Abbreviations and Symbols... 1 Introduction... 1
Contents Abbreviations and Symbols... XIII 1 Introduction... 1 2 Experimental Techniques... 5 2.1 Positron Sources... 7 2.2 Positron Lifetime Spectroscopy... 9 2.2.1 Basics of the Measurement... 10 2.2.2
More informationPHS6317 NANO-ENGINEERING OF THIN FILMS
PHS6317 NANO-ENGINEERING OF THIN FILMS Ludvik Martinu, ing., PhD Professor Chairholder: NSERC Multisectorial Industrial Research Chair in Coatings and Surface Engineering ludvik.martinu@polymtl.ca www.polymtl.ca/larfis
More informationNucleation and growth of nanostructures and films. Seongshik (Sean) Oh
Nucleation and growth of nanostructures and films Seongshik (Sean) Oh Outline Introduction and Overview 1. Thermodynamics and Kinetics of thin film growth 2. Defects in films 3. Amorphous, Polycrystalline
More information1.1 Research Background of Copper Metallization for GaAs-based
Chapter 1 Introduction 1.1 Research Background of Copper Metallization for GaAs-based Devices In the past decades, GaAs ICs are generally used for military purposes, such as satellite, radar and etc. With
More informationDIFFUSION PHENOMENA IN THIN FILMS AND MICROELECTRONIC MATERIALS
DIFFUSION PHENOMENA IN THIN FILMS AND MICROELECTRONIC MATERIALS Edited by Devendra Gupta and Paul S. Ho IBM Thomas J. Watson Research Center Yorktown Heights, New York np NOYES PUBLICATIONS Park Ridge,
More informationDeposition of Diamond-like Carbon Films and Metal-DLC thin films on PCBN Substrates by RF Magnetron Sputtering Method
Deposition of Diamond-like Carbon Films and Metal-DLC thin films on PCBN Substrates by RF Magnetron Sputtering Method Authors & affiliations: Chii-Ruey Lin a,*, Chun-Hsi Su a, Chien-Kuo Chang b, Da-Hua
More informationTechnology. Semiconductor Manufacturing. Hong Xiao INTRODUCTION TO SECOND EDITION SPIE PRESS
INTRODUCTION TO Semiconductor Manufacturing Technology SECOND EDITION Hong Xiao TECHNISCHE INFORMATIONSBiBUOTHEK UNIVERSITATSBIBLIOTHEK HANNOVER SPIE PRESS Bellingham,Washington USA Contents Preface to
More informationCHEMICAL DEPTH PROFILING OF TOOL MATERIALS USING GLOW DISCHARGE OPTICAL EMISSION SPECTROSCOPY (GD-OES)
CHEMICAL DEPTH PROFILING OF TOOL MATERIALS USING GLOW DISCHARGE OPTICAL EMISSION SPECTROSCOPY (GD-OES) T. Björk Swedish Institute for Metals Researc Drottning Kristinas väg 48 114 28 Stockholm Sweden Abstract
More informationEE 5344 Introduction to MEMS. CHAPTER 3 Conventional Si Processing
3. Conventional licon Processing Micromachining, Microfabrication. EE 5344 Introduction to MEMS CHAPTER 3 Conventional Processing Why silicon? Abundant, cheap, easy to process. licon planar Integrated
More informationLecture Day 2 Deposition
Deposition Lecture Day 2 Deposition PVD - Physical Vapor Deposition E-beam Evaporation Thermal Evaporation (wire feed vs boat) Sputtering CVD - Chemical Vapor Deposition PECVD LPCVD MVD ALD MBE Plating
More informationTensile Testing of Polycrystalline Silicon Thin Films Using Electrostatic
Paper Tensile Testing of Polycrystalline Silicon Thin Films Using Electrostatic Force Grip Member Toshiyuki Tsuchiya (Toyota Central Labs., Inc.) Member Osamu Tabata (Ritsumeikan University) Jiro Sakata
More informationCharacterization of carbon nitride thin films deposited by microwave plasma chemical vapor deposition
Ž. Surface and Coatings Technology 17 000 60 65 Characterization of carbon nitride thin films deposited by microwave plasma chemical vapor deposition Y.P. Zhang a,, Y.S. Gu a, X.R. Chang a, Z.Z. Tian a,
More informationengineering of light alloys
Surface engineering of light alloys Aluminium, magnesium and titanium alloys Edited by Hanshan Dong TECHNISCHE INFORMATIONSBIBLIOTHEK UNIVERSITATSBIBLIOTHEK HANNOVER Boca Raton CRC Press Boston New York
More informationEngineering Materials and Processes
Engineering Materials and Processes Series Editor Professor Brian Derby, Professor of Materials Science Manchester Materials Science Centre, Grosvenor Street, Manchester, M1 7HS, UK Other titles published
More informationThermal Annealing Effects on the Thermoelectric and Optical Properties of SiO 2 /SiO 2 +Au Multilayer Thin Films
American Journal of Materials Science 2015, 5(3A): 31-35 DOI: 10.5923/s.materials.201502.05 Thermal Annealing Effects on the Thermoelectric and Optical Properties of SiO 2 /SiO 2 +Au Multilayer Thin Films
More informationSilver Diffusion Bonding and Layer Transfer of Lithium Niobate to Silicon
Chapter 5 Silver Diffusion Bonding and Layer Transfer of Lithium Niobate to Silicon 5.1 Introduction In this chapter, we discuss a method of metallic bonding between two deposited silver layers. A diffusion
More informationChapter 1. Introduction to Thin Film Technology
Chapter 1. Introduction to Thin Film Technology Thin films are deposited onto bulk materials (substrates) to achieve properties unattainable or not easily attainable by substrates alone. How thin? 1 Properties:
More informationLecture 22: Integrated circuit fabrication
Lecture 22: Integrated circuit fabrication Contents 1 Introduction 1 2 Layering 4 3 Patterning 7 4 Doping 8 4.1 Thermal diffusion......................... 10 4.2 Ion implantation.........................
More informationENCAPSULATION OF ORGANIC LIGHT EMITTING DIODES
ENCAPSULATION OF ORGANIC LIGHT EMITTING DIODES Bhadri Visweswaran Sigurd Wagner, James Sturm, Electrical Engineering, Princeton University, NJ Siddharth Harikrishna Mohan, Prashant Mandlik, Jeff Silvernail,
More informationCOOPERATIVE PATENT CLASSIFICATION
CPC C COOPERATIVE PATENT CLASSIFICATION CHEMISTRY; METALLURGY (S omitted) METALLURGY C22 METALLURGY (of iron C21); FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS (production of
More informationReview of CMOS Processing Technology
- Scaling and Integration Moore s Law Unit processes Thin Film Deposition Etching Ion Implantation Photolithography Chemical Mechanical Polishing 1. Thin Film Deposition Layer of materials ranging from
More informationCity University of Hong Kong
City University of Hong Kong Information on a Course offered by the Department of Physics and Materials Science with effect from Semester A in 2013 / 2014 Part I Course Title: Thin Film Technology and
More informationElementary Materials Science
Elementary Materials Science William F. Hosford ASM International Materials Park, Ohio 44073-0002 www.asminternational.org Copyright 2013 by ASM International All rights reserved No part of this book may
More information3.46 OPTICAL AND OPTOELECTRONIC MATERIALS
Badgap Engineering: Precise Control of Emission Wavelength Wavelength Division Multiplexing Fiber Transmission Window Optical Amplification Spectrum Design and Fabrication of emitters and detectors Composition
More informationSubject Index. STP1169-EB/Sep.1992
STP1169-EB/Sep.1992 Subject Index A Acoustic spectroscopy, frequency response in Ta and Nb, 358 Aluminum ceramic-reinforced, 76 pure, dislocations in, 199 Aluminum-indium alloys, melting-related internal
More informationHandbook Of Thin Film Deposition Processes And Techniques (materials And Processing Technology)
Handbook Of Thin Film Deposition Processes And Techniques (materials And Processing Technology) R. Glang, in: Handbook of Thin Film Technology (L. I. Maissel and R. Glang, eds.) T. A. Delchar, Vacuum Physics
More informationMethod to obtain TEOS PECVD Silicon Oxide Thick Layers for Optoelectronics devices Application
Method to obtain TEOS PECVD Silicon Oxide Thick Layers for Optoelectronics devices Application ABSTRACT D. A. P. Bulla and N. I. Morimoto Laboratório de Sistemas Integráveis da EPUSP São Paulo - S.P. -
More informationGrowth and Doping of SiC-Thin Films on Low-Stress, Amorphous Si 3 N 4 /Si Substrates for Robust Microelectromechanical Systems Applications
Journal of ELECTRONIC MATERIALS, Vol. 31, No. 5, 2002 Special Issue Paper Growth and Doping of SiC-Thin Films on Low-Stress, Amorphous Si 3 N 4 /Si Substrates for Robust Microelectromechanical Systems
More informationThermal Durability and Abradability of Plasma Sprayed Al-Si-Polyimide Seal Coatings p. 85
Trends in Automotive Applications of Thermal Spray Technology in Japan p. 1 Production Plasma in the Automotive Industry: A European Viewpoint p. 7 The Effect of Microstructure on the Wear Behavior of
More informationChapter 6: Mechanical Properties
Chapter 6: Mechanical Properties ISSUES TO ADDRESS... Stress and strain: What are they and why are they used instead of load and deformation? Elastic behavior: When loads are small, how much deformation
More informationLow Thermal Budget NiSi Films on SiGe Alloys
Mat. Res. Soc. Symp. Proc. Vol. 745 2003 Materials Research Society N6.6.1 Low Thermal Budget NiSi Films on SiGe Alloys S. K. Ray 1,T.N.Adam,G.S.Kar 1,C.P.SwannandJ.Kolodzey Department of Electrical and
More information2.0 Kinetic Phenomena in Thin Film Electronic Materials
2.0 Kinetic Phenomena in Thin Film Electronic Materials Academic and Research Staff Prof. C.V. Thompson, Prof. C.G. Fonstad, Prof. H.I. Smith, Dr. R.C. Cammarata, Dr. J. Melngailis Visiting Scientist H.
More informationبسم الله الرحمن الرحیم. Materials Science. Chapter 7 Mechanical Properties
بسم الله الرحمن الرحیم Materials Science Chapter 7 Mechanical Properties 1 Mechanical Properties Can be characterized using some quantities: 1. Strength, resistance of materials to (elastic+plastic) deformation;
More informationSurface composites: A new class of engineered materials
Journal of MATERIALS RESEARCH Welcome Comments Help Surface composites: A new class of engineered materials Rajiv Singh and James Fitz-Gerald Department of Materials Science and Engineering, University
More informationContents. 1. Introduction to Materials Processing Starting Materials 21. Acknowledgements
Preface Acknowledgements xiii xv 1. Introduction to Materials Processing 1 1.1 Materials Processing: Definition and Scope 1 1.2 Three Approaches to Materials Processing 4 1.3 Materials Processing Steps
More informationDeposition and characterization of sputtered ZnO films
Superlattices and Microstructures 42 (2007) 89 93 www.elsevier.com/locate/superlattices Deposition and characterization of sputtered ZnO films W.L. Dang, Y.Q. Fu, J.K. Luo, A.J. Flewitt, W.I. Milne Electrical
More informationPhysical Vapor Deposition (PVD) Zheng Yang
Physical Vapor Deposition (PVD) Zheng Yang ERF 3017, email: yangzhen@uic.edu Page 1 Major Fabrication Steps in MOS Process Flow UV light Mask oxygen Silicon dioxide photoresist exposed photoresist oxide
More informationThermal Evaporation. Theory
Thermal Evaporation Theory 1. Introduction Procedures for depositing films are a very important set of processes since all of the layers above the surface of the wafer must be deposited. We can classify
More informationDeposition of TiN/CrN hard superlattices by reactive d.c. magnetron sputtering
Bull. Mater. Sci., Vol. 26, No. 2, February 2003, pp. 233 237. Indian Academy of Sciences. Deposition of TiN/CrN hard superlattices by reactive d.c. magnetron sputtering HARISH C BARSHILIA and K S RAJAM*
More informationMetal-containing diamond-like carbon with self-assembled alternating nano-scaled layers
Metal-containing diamond-like carbon with self-assembled alternating nano-scaled layers Wan-Yu Wu, Jyh-Ming Ting* Mina Materials Laboratory, Department of Materials Science and Engineering, National Cheng
More informationSynthesis of nanoscale CN x /TiAlN multilayered coatings by ion-beam-assisted deposition
Synthesis of nanoscale / multilayered coatings by ion-beam-assisted deposition M. Cao, D. J. Li, a and X. Y. Deng College of Physics and Electronic Information Science, Tianjin Normal University, Tianjin
More information5. A round rod is subjected to an axial force of 10 kn. The diameter of the rod is 1 inch. The engineering stress is (a) MPa (b) 3.
The Avogadro's number = 6.02 10 23 1 lb = 4.45 N 1 nm = 10 Å = 10-9 m SE104 Structural Materials Sample Midterm Exam Multiple choice problems (2.5 points each) For each problem, choose one and only one
More informationA Nano-thick SOI Fabrication Method
A Nano-thick SOI Fabrication Method C.-H. Huang 1, J.T. Cheng 1, Y.-K. Hsu 1, C.-L. Chang 1, H.-W. Wang 1, S.-L. Lee 1,2, and T.-H. Lee 1,2 1 Dept. of Mechanical Engineering National Central University,
More informationTHIN NICKEL OXIDE LAYERS PREPARED BY ION BEAM SPUTTERING: FABRICATION AND THE STUDY OF ELECTROPHYSICAL PARAMETERS
THIN NICKEL OXIDE LAYERS PREPARED BY ION BEAM SPUTTERING: FABRICATION AND THE STUDY OF ELECTROPHYSICAL PARAMETERS Pavel HORÁK a,b, Václav BEJŠOVEC b, Vasyl LAVRENTIEV b, Jiří VACÍK b, Martin VRŇATA a,
More informationAjay Kumar Gautam [VLSI TECHNOLOGY] VLSI Technology for 3RD Year ECE/EEE Uttarakhand Technical University
2014 Ajay Kumar Gautam [VLSI TECHNOLOGY] VLSI Technology for 3RD Year ECE/EEE Uttarakhand Technical University Page1 Syllabus UNIT 1 Introduction to VLSI Technology: Classification of ICs, Scale of integration,
More informationChapter 3 Silicon Device Fabrication Technology
Chapter 3 Silicon Device Fabrication Technology Over 10 15 transistors (or 100,000 for every person in the world) are manufactured every year. VLSI (Very Large Scale Integration) ULSI (Ultra Large Scale
More informationEffects of Film Thickness on the Yielding Behavior of Polycrystalline Gold Films
Effects of Film Thickness on the Yielding Behavior of Polycrystalline Gold Films H.D. Espinosa and B.C. Prorok Department of Mechanical Engineering, Northwestern University Evanston, IL 628-3111, USA ABSTRACT
More informationThe University of Jordan School of Engineering Chemical Engineering Department
The University of Jordan School of Engineering Chemical Engineering Department 0905351 Engineering Materials Science Second Semester 2016/2017 Course Catalog 3 Credit hours.all engineering structures and
More informationAmorphous and Polycrystalline Thin-Film Transistors
Part I Amorphous and Polycrystalline Thin-Film Transistors HYBRID AMORPHOUS AND POLYCRYSTALLINE SILICON DEVICES FOR LARGE-AREA ELECTRONICS P. Mei, J. B. Boyce, D. K. Fork, G. Anderson, J. Ho, J. Lu, Xerox
More informationThe Effect of Annealing on Resistivity Measurements of TiSi 2 and TiN Using the collinear Four Point Probe Technique
The Effect of Annealing on Resistivity Measurements of TiSi 2 and TiN Using the collinear Four Point Probe Technique Eman Mousa Alhajji North Carolina State University Department of Materials Science and
More informationAMCR Fabrication of Intermetallic Compounds by Solid State Reaction of Roll-Bonded Materials. Office of Naval Research Arlington, VA 22217
AMCR-85-721 (Letter Report I Fabrication of Intermetallic Compounds by Solid State Reaction of Roll-Bonded Materials lk " Contract No. N00014-85-C0857. CI O Prepared for: Office of Naval Research Arlington,
More informationEffect of High Energy Milling on the Microstruture and Properties of Wc-Ni Composite
Materials Research. 2010; 13(3): 293-298 2010 Effect of High Energy Milling on the Microstruture and Properties of Wc-Ni Composite Camila dos Santos Torres*, Lírio Schaeffer Laboratory of Mechanical Transformation
More informationLect. 2: Basics of Si Technology
Unit processes Thin Film Deposition Etching Ion Implantation Photolithography Chemical Mechanical Polishing 1. Thin Film Deposition Layer of materials ranging from fractions of nanometer to several micro-meters
More informationEE 330 Lecture 9. IC Fabrication Technology Part 2
EE 330 Lecture 9 IC Fabrication Technology Part 2 Quiz 8 A 2m silicon crystal is cut into wafers using a wire saw. If the wire diameter is 220um and the wafer thickness is 350um, how many wafers will this
More informationAnnealing Effect on Elastic Constant of Ultrathin Films Studied by Acoustic-Phonon Resonance Spectroscopy
1st International Symposium on Laser Ultrasonics: Science, Technology and Applications July 16-18 28, Montreal, Canada Annealing Effect on Elastic Constant of Ultrathin Films Studied by Acoustic-Phonon
More informationDoping and Oxidation
Technische Universität Graz Institute of Solid State Physics Doping and Oxidation Franssila: Chapters 13,14, 15 Peter Hadley Technische Universität Graz Institute of Solid State Physics Doping Add donors
More informationAgeing Resistance (12 years) of Hard and Oxidation Resistant SiBCN Coatings
Ageing Resistance (12 years) of Hard and Oxidation Resistant SiBCN Coatings Jiri Houska Department of Physics and NTIS - European Centre of Excellence, University of West Bohemia, Czech Republic Acknowledgment
More informationResearch in Experimental Solid Mechanics. Krishna Jonnalagadda Mechanical Engineering Indian Institute of Technology Bombay
Research in Experimental Solid Mechanics Krishna Jonnalagadda Mechanical Engineering Indian Institute of Technology Bombay TEQIP Workshop - Experimental Solid Mechanics Indian Institute of Technology Bombay
More informationChapter 2 OVERVIEW OF MEMS
6 Chapter 2 OVERVIEW OF MEMS 2.1 MEMS and Microsystems The term MEMS is an abbreviation of microelectromechanical system. MEMS contains components ofsizes in 1 micrometer to 1 millimeter. The core element
More informationGeneral Introduction to Microstructure Technology p. 1 What is Microstructure Technology? p. 1 From Microstructure Technology to Microsystems
General Introduction to Microstructure Technology p. 1 What is Microstructure Technology? p. 1 From Microstructure Technology to Microsystems Technology p. 9 The Parallels to Microelectronics p. 15 The
More informationTHE INFLUENCE OF NITROGEN CONTENT ON THE MECHANICAL PROPERTIES OF TiN x THIN FILMS PREPARED BY REACTIVE MAGNETRON SPUTTERING
Bulletin of the Transilvania University of Braşov Series I: Engineering Sciences Vol. 5 (54) No. 2-2012 THE INFLUENCE OF NITROGEN CONTENT ON THE MECHANICAL PROPERTIES OF TiN x THIN FILMS PREPARED BY REACTIVE
More information