Discrete Capacitor & Resistor Issues. Anthony Primavera Boston Scientific CRM 11/13/06
|
|
- Angelica Cunningham
- 6 years ago
- Views:
Transcription
1 Discrete Capacitor & Resistor Issues Anthony Primavera Boston Scientific CRM 11/13/06
2 Goal: Drive the Industry towards common test methods and best practices in manufacturing to reduce and or eliminate certain undesirable failure modes in medical grade components.
3 Undesirable Characteristics in discrete components Plating Issues Many components have plating issues or shortcomings that lead to latent defects, manufacturing yield loss and scrap Possible Failure Locations UBM or base layer plating Barrier layer to base layer Finish plating to barrier layer Solder to barrier layer
4 Examples of Plating Issues Incomplete base layers Leads to the following possible defects Voiding Weak solder adhesion Exposure of base Ceramic Micro Cracking Layer Separation Electrical Failure or Leakage
5 Examples of Plating Issues Poor Base Layer Adhesion Leads to the following possible defects Weak solder adhesion Exposure of base Ceramic Micro Cracking Layer Separation Electrical Failure or Leakage Peeling of plating Full Failure of Solder Joint
6 Examples of Plating Issues Voiding and base material adhesion issues
7 Examples of Plating Issues Poor Base Layer Adhesion Examples 200C reflow Sn/Pb Good Plating Separated plating
8 Plating Failure / Cracking Poor adhesion can result in separation and failure near the bottom heel fillet region. This is made worse by design limitations on PCB real estate
9 Platinum-Silver Metallization 0402 Ceramic Resistor Screen printed Pt:Ag metallization Separation of layer after reflow Reflow = C for 1 minute
10 Base layer / Barrier layer Issues Barrier Layer Plating Issues Cracks and separation of Ni or other barrier metals can lead to full failure of the joint following subsequent assembly and handling
11 Base layer / Barrier layer Issues Base Layer Separation Issues Cracks and separation of barrier metals can lead to full failure of the joint following subsequent assembly and handling
12 Ceramic Cracking Pre Existing flaws and cracks in components can lead to post assembly failures. Especially true in large ceramic capacitor and resistor arrays
13 Ceramic Cracking Corner Cracks Can lead to post assembly plating failures at termination
14 Circuit Boards Processing conditions by the OEM and assembly house can lead to defects in the PCB Possible Causes Reflow and Rework Cycle Cleaning Chemicals Bending / Folding Handling Material Defects
15 Torsion Test Results FR4 failures (12 by 2000 cycles) 6 Layer single side (1 at 10,248 cycles) 6 Layer double sided (4 failures by 4000 cycles) 4 Layer single side (no failures by 15,000 cycles) 4 Layer double sided (no failures by 9,500 cycles) 6 layer flex, single side failure 10,248 cycles
16 Mechanical Robustness Component mass / joint drives failure Experiments performed to determine dynamic rupture point of solder in drop testing. Weights incrementally added to components Results from 2 sets of experiments (CSPs and BGAs) show an approximate dynamic rupture stress for 1000G drop testing to be 250psi. Compare to low strain rate rupture (shear testing for example) which give approximately 4,500 to 6,000 psi failure rates for 63/37 Sn/Pb solder at room temp.
17 Cleanliness continued Breakdown of circuit board materials, components, and adhesives is possible with multiple cleaning steps. Flex board materials, specifically adhesives and polyimide are very susceptible to moisture and solvent damage and swelling. This may lead to other defects such as via interface failures. Via interface failure
18 Component Finish RoHS & Sn/Pb Component Finish can lead to post assembly issues and failures. Finishes acceptable to commercial products may not work in medical products. 100 % Sn finish Even in Sn/Pb assembly, 100% Sn finish can lead to whisker growth. The environment can accelerate the growth. Concern commercial components have driven towards 100% Sn. May not be fully acceptable for high reliability applications
19 Component Finish RoHS & Sn/Pb Component Finish can lead to post assembly issues and failures. Finishes acceptable to commercial products may not work in medical products. Ag hospitals use lots of chlorine in cleaning. Silver reacts with Cl and can lead to voiding and growth of Ag-Cl dendrites on the solder joints and PCB surface. Au Electrolytic gold. Gold concentrations lead to potential failures in components burned in for medical applications due to (Au-Ni)Sn 4 formation. This results in a brittle solder joint and BGA ball failure.
20 BGA / CSP Ni-Au Issues Can be on Component or PCB Side! Different causes including: Ni-phosphase ENIG plating problems, excessive gold, oxidized Ni layers etc. CSP - Ni/Au Failure BGA - PCB side Failure
21 PCB Issues Continued Processing Conditions can lead to other defects such as solder mask lifting. Made worse by higher temperatures associated with RoHS assembly conditions.
Future Electronic Devices Technology in Cosmic Space and Electroless Ni/Pd/Au Plating for High Density Semiconductor Package Substrate
JAXA 25 rd Microelectronics Workshop Future Electronic Devices Technology in Cosmic Space and Electroless Ni/Pd/Au Plating for High Density Semiconductor Package Substrate November 2, 2012 Yoshinori Ejiri
More informationIPC -7095C Design and Assembly Process Implementation For BGAs
IPC -7095C Design and Assembly Process Implementation For BGAs 1 Overview With the introduction of BGA components, things had to change: New design New assembly process New repair process New inspection
More informationFuture Electronic Devices Technology in Cosmic Space and Lead-free Solder Joint Reliability
The 22nd Microelectronics Work Future Electronic Devices Technology in Cosmic Space and Lead-free Solder Joint Reliability Key Points (1) High Speed Solder Ball Shear Test (2) Relationship between Surface
More informationWelcome to SMTA Brazil Chapter Brook Sandy-Smith Dr. Ron Lasky Tim Jensen
Welcome to SMTA Brazil Chapter 2013 Presented by Authors Ivan Castellanos Edward Briggs Brook Sandy-Smith Dr. Ron Lasky Tim Jensen Advantages / Concerns HP testing Mechanical properties New work Area ratio
More informationA.R.E.A. Consortium 2010 Study Plans
Universal Instruments Advanced Process Laboratory September, 2009 A.R.E.A. Consortium 2010 Study Plans EXECUTIVE SUMMARY The Advanced Research on Electronics Assembly Consortium will continue to fund manufacturing
More informationIMC Layers Formed with Various Combinations of Solders and Surface Finishes and Their Effect on Solder Joint Reliability
IMC Layers Formed with Various Combinations of Solders and Surface Finishes and Their Effect on Solder Joint Reliability Per-Erik Tegehall, Swerea IVF 4 th Electronic Materials and Assembly Processes for
More informationTHE EFFECTS OF PLATING MATERIALS, BOND PAD SIZE AND BOND PAD GEOMETRY ON SOLDER BALL SHEAR STRENGTH
THE EFFECTS OF PLATING MATERIALS, BOND PAD SIZE AND BOND PAD GEOMETRY ON SOLDER BALL SHEAR STRENGTH Keith Rogers and Craig Hillman CALCE Electronic Products and Systems Center University of Maryland College
More informationand Current Reliability Concerns Craig Hillman
and Pb-Free: Current Reliability Concerns Craig Hillman RoHS Abstract Like the rest of the electronics industry, your products will transition to Removal of Hazardous Substances (RoHS) compliance prior
More informationReliability of Lead-Free Solder Connections for Area-Array Packages
Presented at IPC SMEMA Council APEX SM 2001 For additional information, please email marketing@amkor.com Reliability of Lead-Free Solder Connections for Area-Array Packages Ahmer Syed Amkor Technology,
More informationImages of Failures in Microelectronics Packaging and Assembly
Images of Failures in Microelectronics Packaging and Assembly Ed Hare, Ph.D./SEM Lab, Inc. IMAPS NW - Feb. 11th 2004 Redmond, WA http://www.semlab.com 1 What is this? http://www.semlab.com 2 Inner Layer
More informationKoki no-clean LEAD FREE solder paste. High-reliability Low Ag Lead Free Solder Paste
www.ko-ki.co.jp #514- Revised on Feb.4, 214 Koki no-clean LEAD FREE solder paste High-reliability Low Ag Lead Free Solder Paste S1XBIG58-M5-4 Product information S1XBIG SAC35 After -4/125ºC, 1 cycles This
More informationPb-free Challenges for High Complexity Products. inemi Jan 16 th 2008
Pb-free Challenges for High Complexity Products inemi Jan 16 th 2008 All Rights Reserved Alcatel-Lucent 2007 Agenda RoHS 101 Typical complex of telecom products (different from consumable) Pb-free Concerns
More informationNovel Technique for Flip Chip Packaging of High power Si, SiC and GaN Devices. Nahum Rapoport, Remtec, Inc.
Novel Technique for Flip Chip Packaging of High power Si, SiC and GaN Devices Nahum Rapoport, Remtec, Inc. 1 Background Electronic Products Designers: under pressure to decrease cost and size Semiconductor
More informationALT of Lead Free CCAs
ALT of Lead Free CCAs OPS Value Propositions Ops A La Carte is a Professional Reliability Engineering firm focused on providing confidence in reliability. Flexible method of engagement from end to end
More informationEffect of Process Variations on Solder Joint Reliability for Nickel-based Surface Finishes
Effect of Process Variations on Solder Joint Reliability for Nickel-based Surface Finishes Hugh Roberts Atotech USA Inc., Rock Hill, SC, USA Sven Lamprecht, Gustavo Ramos and Christian Sebald Atotech Deutschland
More informationSome Examples of Whiskers. Tin-Based Alloys
Some Examples of Whiskers from Tin-Based Alloys Alternate Title: Sometimes Tin Whiskers Adverb Noun Verb -- Quote attributed to Lyudmyla y Panashchenko as Compiled by Jay Brusse/Perot Systems July 2009
More informationComposition/wt% Bal SA2 (SABI) Bal SA3 (SABI + Cu) Bal
Improving Thermal Cycle and Mechanical Drop Impact Resistance of a Lead-free Tin-Silver-Bismuth-Indium Solder Alloy with Minor Doping of Copper Additive Takehiro Wada 1, Seiji Tsuchiya 1, Shantanu Joshi
More informationAustralian Journal of Basic and Applied Sciences. Pb-Free Solder Ball Robustness Comparison under AC and TC Reliability Test
AENSI Journals Australian Journal of Basic and Applied Sciences ISSN:1991-8178 Journal home page: www.ajbasweb.com Pb-Free Solder Ball Robustness Comparison under AC and TC Reliability Test 1,2 Tan Cai
More informationTAIYO PSR-4000 AUS21
TAIYO PSR-4000 AUS21 LIQUID PHOTOIMAGEABLE SOLDER MASK Specifically Designed for Polyimide Film for TAB-BGA Low Warpage Halogen-Free Green, Glossy Finish Hard Surface Finish Fine Dam Resolution Develops
More informationTECHNICAL DATA SHEET 1 P a g e Revised January 9, 2014
1 P age Revised January 9, 2014 TAIYO PSR-4000 CC01SE (UL Name: PSR-4000JV / CA-40JV) LIQUID PHOTOIMAGEABLE CURTAIN COAT SOLDER MASK Curtain Coat Application Aqueous Developing Solder Mask RoHS Compliant
More informationManufacturing Capacity
Capability List Manufacturing Capacity QTA & Prototype Layer : 1L ~32 L Impedance Board Ball Grid Array ( BGA ) Blind/ Buried Via Micro Via ( Laser Drilling) Flex /Rigid Flexible PCB Series Orders Layer
More informationTAIYO PSR-2000 ECLiPSE
Revised December 2011 TAIYO PSR-2000 ECLiPSE Revised August 2013 LIQUID PHOTOIMAGEABLE SOLDER MASK Screen Print or Spray Application A low-cost alternative to PSR-4000 RoHS Compliant Halogen-Free Compatible
More informationAcceptance Testing Of Low-Ag Reflow Solder Alloys
Acceptance Testing Of Low-Ag Reflow Solder Alloys Kris Troxel 1, Aileen Allen 2, Elizabeth Elias Benedetto 3, Rahul Joshi 3 Hewlett-Packard Company 1 Boise, ID, USA 2 Palo Alto, CA, USA 3 Houston, TX,
More informationIMPACT OF MICROVIA-IN-PAD DESIGN ON VOID FORMATION
IMPACT OF MICROVIA-IN-PAD DESIGN ON VOID FORMATION Frank Grano, Felix Bruno Huntsville, AL Dana Korf, Eamon O Keeffe San Jose, CA Cheryl Kelley Salem, NH Joint Paper by Sanmina-SCI Corporation EMS, GTS
More informationSystem Level Effects on Solder Joint Reliability
System Level Effects on Solder Joint Reliability Maxim Serebreni 2004 2010 Outline Thermo-mechanical Fatigue of solder interconnects Shear and tensile effects on Solder Fatigue Effect of Glass Style on
More informationReliability Testing of Ni-Modified SnCu and SAC305 - Vibration. Keith Sweatman, Nihon Superior Joelle Arnold, DfR Solutions March 2008
Reliability Testing of Ni-Modified SnCu and SAC305 - Vibration Keith Sweatman, Nihon Superior Joelle Arnold, DfR Solutions March 2008 2004-2008 Previous Work Accelerated Life Testing of SN100C for Surface
More informationFreescale Semiconductor Tape Ball Grid Array (TBGA) Overview
Freescale Semiconductor Tape Ball Grid Array (TBGA) Overview Revision 0 2006 Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the
More informationIBM Platform Symposium September 14-15, Artesyn s Approach to RoHS Compliance
IBM Platform Symposium September 14-15, 2004 Artesyn s Approach to RoHS Compliance RoHS summary Project implementation strategy Process development status Reliability test plan Reliability test status
More informationRELIABILITY OF DOPED LEAD-FREE SOLDER JOINTS UNDER ISOTHERMAL AGING AND THERMAL CYCLING
As originally published in the SMTA Proceedings RELIABILITY OF DOPED LEAD-FREE SOLDER JOINTS UNDER ISOTHERMAL AGING AND THERMAL CYCLING Cong Zhao, Thomas Sanders, Chaobo Shen, Zhou Hai, John L. Evans,
More informationMaterial Testing & Mitigation Techniques for Pad Crater Defects. John McMahon P.Eng.
1 Material Testing & Mitigation Techniques for Pad Crater Defects John McMahon P.Eng. Agenda Introduction Pad Crater Defects Bend Test Methods Process Strain Limits Laminate Susceptibility Package Compliance
More informationLeveraging Existing Market Knowledge to Ensure a Successful Transition to Pb-Free Medical Products
Leveraging Existing Market Knowledge to Ensure a Successful Transition to Pb-Free Medical Products Randy Schueller, Ph.D. & Cheryl Tulkoff DfR Solutions Outline Intro Medical Electronics Testing Reliability
More informationNo-Clean Flux Activity under Low Standoff Components
No-Clean Flux Activity under Low Standoff Components Bruno Tolla, Ph.D, Jennifer Allen, Kyle Loomis, Denis Jean ~ KESTER Corporation Mike Bixenman, DBA ~ KYZEN Corporation Electronic Devices More complex
More informationDestructive Physical Analysis (DPA) Program Methodology
Destructive Physical Analysis (DPA) Program Methodology DPA: Introduction Destructive Physical Analysis (DPA) is a comprehensive quality assessment for workmanship on Printed Circuit Board Assemblies (PCBAs).
More informationTEMPERATURE CYCLING AND FATIGUE IN ELECTRONICS
TEMPERATURE CYCLING AND FATIGUE IN ELECTRONICS Gilad Sharon, Ph.D. DfR Solutions Beltsville, MD, USA gsharon@dfrsolutions.com Greg Caswell DfR Solutions Liberty Hill, TX, USA gcaswell@dfrsolutions.com
More informationTHE SEVEN SINS OF LEAD FREE SOLDERING TRAINING CERTIFICATION TEST (DVD-70C) v.2
This test consists of twenty multiple-choice questions. All questions are from the video: The Seven Sins of Lead Free Soldering (DVD-70C). Each question has only one most correct answer. Circle the letter
More informationLead-Free Inspection Methods. Tom Perrett Marketing Manager Soldertec & Keith Bryant European Sales Manager Dage Precision Industries
Lead-Free Inspection Methods Tom Perrett Marketing Manager Soldertec & Keith Bryant European Sales Manager Dage Precision Industries Overview Look at the solder!! ICP 610D Lead detection fluids Microsectioning
More informationELCOSINT Webinar NPL. Sept 2015
ELCOSINT Webinar NPL Sept 2015 1 About NPL The UK s national standards laboratory 36,000 m 2 national laboratory Founded in 1900 World leading National Measurement Institute 600+ specialists in Measurement
More informationQuestion: Are RO4000 materials compatible with lead-free processes? Answer:
Question: Are RO4 materials compatible with lead-free processes? Answer: RO4 cores and prepregs are among the most temperature stable products available. They easily meet or exceed all expectations for
More informationICDs (InterConnect Defects) What are they? Where do they come from? How can we make them go away? Doug Trobough Suixin Zhang
ICDs (InterConnect Defects) What are they? Where do they come from? How can we make them go away? Doug Trobough Suixin Zhang Definition of ICD ICDs are any defect that occurs adjacent to the innerlayer
More informationManufacturability and Reliability Impacts of Alternate Pb-Free BGA Ball Alloys. June 2007
Manufacturability and Reliability Impacts of Alternate Pb-Free BGA Ball Alloys Greg Henshall Michael Roesch Kris Troxel Helen Holder Jian Miremadi HP Global Engineering Services The information contained
More informationAdaption to scientific and technical progress under Directive 2002/95/EC
. Adaption to scientific and technical progress under Directive 2002/95/EC Results previous evaluation Exemption No. 15 Lead in solders to complete a viable electrical connection between semiconductor
More informationSCV Chapter, CPMT Society, IEEE September 14, Voids at Cu / Solder Interface and Their Effects on Solder Joint Reliability
Voids at / Solder Interface and Their Effects on Solder Joint Reliability Zequn Mei, Mudasir Ahmad, Mason Hu, Gnyaneshwar Ramakrishna Manufacturing Technology Group Cisco Systems, Inc. Acknowledgement:
More informationAdaption to scientific and technical progress under Directive 2002/95/EC
. Adaption to scientific and technical progress under Directive 2002/95/EC Results previous evaluation Exemption No. 7 a a) Lead in high melting temperature type solders (i.e. lead-based alloys containing
More informationManufacturing and Reliability Modelling
Manufacturing and Reliability Modelling Silicon Chip C Bailey University of Greenwich London, England Printed Circuit Board Airflow Temperature Stress at end of Reflow Stress Product Performance in-service
More informationA STUDY OF THE ENEPIG IMC FOR EUTECTIC AND LF SOLDERS
A STUDY OF THE ENEPIG IMC FOR EUTECTIC AND LF SOLDERS G.Milad, D.Gudeczauskas, G.Obrien, A.Gruenwald Uyemura International Corporation Southington, CT ABSTRACT: The solder joint formed on an ENEPIG surface
More informationComposition/wt% Bal SA2 (SABI) Bal SA3 (SABI + Cu) Bal
Improving Thermal Cycle and Mechanical Drop Impact Resistance of a Lead-free Tin-Silver-Bismuth-Indium Solder Alloy with Minor Doping of Copper Additive Takehiro Wada 1, Seiji Tsuchiya 1, Shantanu Joshi
More informationGreen IC packaging: A threath to electronics reliability
Green IC packaging: A threath to electronics reliability Geert Willems Steven Thijs, Bart Vandevelde imec 13 juni 2012 Bits & Chips Hardware Conference Content 1. Plastic Molding Compounds 2. Towards Green,
More informationReliability Modeling of Electronics for Co-Designed System Applications Greg Caswell, DfR Solutions, LLC (o)
DesignCon 2013 Reliability Modeling of Electronics for Co-Designed System Applications Greg Caswell, DfR Solutions, LLC gcaswell@dfrsolutions.com 301-640-5825 (o) 1 Abstract Complex electronic systems
More informationQualification of Thin Form Factor PWBs for Handset Assembly
Qualification of Thin Form Factor PWBs for Handset Assembly Mumtaz Y. Bora Kyocera Wireless Corporation San Diego, Ca. 92121 mbora@kyocera-wreless.com Abstract: The handheld wireless product market place
More informationAxiom Electronics LLC
1 of 8 1.0 PURPOSE and SCOPE This document defines Axiom s requirements for printed circuit board (PCB) fabrication, handling, and storage. Industry standards are referenced where appropriate. This document
More informationTHE EFFECTS OF INTERNAL STRESSRS IN BGA Ni LAYER ON THE STRENGTH OF Sn/Ag/Cu SOLDER JOINT
THE EFFECTS OF INTERNAL STRESSRS IN BGA Ni LAYER ON THE STRENGTH OF Sn/Ag/Cu SOLDER JOINT C.H. Chien 1, * C.J. Tseng 1,2 T.P. Chen 1,3 1 Department of Mechanical and Electro-Mechanical Engineering, National
More informationBOARD LEVEL RELIABILITY COMPARISON OF LEAD FREE ALLOYS
BOARD LEVEL RELIABILITY COMPARISON OF LEAD FREE ALLOYS Robert Darveaux, Corey Reichman, Sabira Enayet, Wen-Sung Hsu, and Win Thandar Swe Amkor Technology, Inc. Chandler, AZ, USA rdarv@amkor.com ABSTRACT
More informationRoHS Compliance Document
D2-Pak RoHS Compliance Document Contents: 1. 2. Solder Reflow 3. Tin Whisker Report D2-pak (3 or 5 Lead) BOM 1 90598-46-2 0.05808 11% 3.8% Lead Frame Copper 0.94840 Die Attach Soft Solder 0.01200 Cu 7440-50-8
More informationTECHNICAL DATA SHEET 1 P a g e Revised August, 2014
1 P a g e Revised August, 2014 TAIYO PSR-4000 CC01SE (UL Name: PSR-4000JV / CA-40JV) LIQUID PHOTOIMAGEABLE CURTAIN COAT SOLDER MASK Curtain Coat Application Aqueous Developing Solder Mask RoHS Compliant
More informationEVALUATION OF HIGH RELIABILITY REWORKABLE EDGE BOND ADHESIVES FOR BGA APPLICATIONS
As originally published in the SMTA Proceedings. EVALUATION OF HIGH RELIABILITY REWORKABLE EDGE BOND ADHESIVES FOR BGA APPLICATIONS Fei Xie, Ph.D., Han Wu, Daniel F. Baldwin, Ph.D., Swapan Bhattacharya,
More informationEnvironmental Management and Materials Information
Environmental Management and Materials Information Product Content Information for: MAX44285FAWA+ Links Qualifications Package Description Chemical Composition Detailed Package Component Data Other Component
More informationRework of Mixed Lead-Free Alloys - A Guide
Rework of Mixed Lead-Free Alloys - A Guide Martin Wickham, Alan Brewin & Christopher Hunt April 2002 April 2002 Rework of Mixed Lead-Free Alloys - A Guide Martin Wickham, Alan Brewin & Christopher Hunt
More informationWF6317. A superactive low-volatile/high heat-resistant water-soluble flux for ball soldering
WF637 A superactive low-volatile/high heat-resistant water-soluble flux for ball soldering Low viscosity and high tacking power stabilize ball holding force and ensures excellent solder wettability Easy
More informationCharacterizing the Lead-Free Impact on PCB Pad Craters
Characterizing the Lead-Free Impact on PCB Pad Craters Brian Roggeman and Wayne Jones Advanced Process Lab Universal Instruments Corp. Binghamton, NY 13902 Abstract Pad cratering in Printed Circuit Boards
More informationTECHNICAL DATA SHEET 1 P a g e Revised June, 2015
1 P a g e Revised June, 2015 TAIYO PSR-4000 CC01SE (UL Name: PSR-4000JV / CA-40JV) LIQUID PHOTOIMAGEABLE CURTAIN COAT SOLDER MASK Curtain Coat Application Aqueous Developing Solder Mask RoHS Compliant
More informationPSR-4000 CC01SE (UL Name: PSR-4000JV / CA-40JV)
PSR-4000 CC01SE (UL Name: PSR-4000JV / CA-40JV) LIQUID PHOTOIMAGEABLE SOLDER MASK Spray and Curtain Coat Application Designed to work on the latest DI equipment Aqueous Developing Solder Mask RoHS Compliant
More informationroom and cold readouts were performed every 250 cycles. Failure data and Weibull plots were generated. Typically, the test vehicles were subjected to
SOLDER JOINT RELIABILITY ASSESMENT OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER Fay Hua 1, Raiyo Aspandiar 2, Cameron Anderson 3, Greg Clemons 3, Chee-key Chung 4, Mustapha Faizul 4 Intel
More informationMaterials Declaration Form
Materials Declaration Form IPC 1752 Version 2 Form Type * Distribute Sectionals * Material Info Subsectionals * A-D Manufacturing Info * : Required Field Supplier Information Company Name * STMicroelectronics
More informationCleaning Before Coating. Presented by Jigar Patel, Senior Process Engineer
Cleaning Before Coating Presented by Jigar Patel, Senior Process Engineer Cleaning Before Coating Influencing factors Failure mechanisms Coating failures Cleaning before coating Analytics and test methods
More informationEFFECT OF Ag COMPOSITION, DWELL TIME AND COOLING RATE ON THE RELIABILITY OF Sn-Ag-Cu SOLDER JOINTS. Mulugeta Abtew
EFFECT OF Ag COMPOSITION, DWELL TIME AND COOLING RATE ON THE RELIABILITY OF Sn-Ag-Cu SOLDER JOINTS Mulugeta Abtew Typical PCB Assembly Process PCB Loading Solder Paste Application Solder Paste Inspection
More informationPSR-4000 CC01SE (SM-SP) (UL Name: PSR-4000JV / CA-40JV)
PSR-4000 CC01SE (SM-SP) (UL Name: PSR-4000JV / CA-40JV) LIQUID PHOTOIMAGEABLE SOLDER MASK Spray and Screen Print Application Aqueous Developing Solder Mask RoHS Compliant Halogen-Free Compatible with Lead-Free
More informationLead Free Soldering Technology
Lead Free Soldering Technology Chung-Ang University Young-Eui Shin Trend of Package Small, Light, High performance High speed, Large capacity High integrity, High density Comparison of package size 45mm
More informationA Roadmap to Low Cost Flip Chip Technology and Chip Size Packaging using Electroless Nickel Gold Bumping
A Roadmap to Low Cost Flip Chip Technology and Chip Size Packaging using Electroless Nickel Gold Bumping T. Oppert, T. Teutsch, E. Zakel Pac Tech Packaging Technologies GmbH Am Schlangenhorst 15-17, Germany
More informationSilver and Sulfur: Case Studies, Physics, and Possible Solutions. C. Hillman, S. Binfield, J. Seppi, and J. Arnold DfR Solutions April 15, 2009
Silver and Sulfur: Case Studies, Physics, and Possible Solutions C. Hillman, S. Binfield, J. Seppi, and J. Arnold DfR Solutions April 15, 2009 2004-2007 Introduction Silver is a common metal in electronics
More informationENHANCING MECHANICAL SHOCK PERFORMANCE USING EDGEBOND TECHNOLOGY
ENHANCING MECHANICAL SHOCK PERFORMANCE USING EDGEBOND TECHNOLOGY Steven Perng, Tae-Kyu Lee, and Cherif Guirguis Cisco Systems, Inc. San Jose, CA, USA sperng@cisco.com Edward S. Ibe Zymet, Inc. East Hanover,
More informationSolder Joint Reliability Study for Plastic Ball Grid Array Packages
Intl. Journal of Microcircuits and Electronic Packaging Solder Joint Reliability Study for Plastic Ball Grid Array Packages L. Y. Yang and Y. C. Mui Advanced Packaging Advanced Micro Devices (AMD) 512
More informationElectroless Nickel / Electroless Palladium / Immersion Gold Process For Multi-Purpose Assembly Technology
ckel / Palladium / Gold Process For Multi-Purpose Assembly Technology Kuldip Johal and Hugh Roberts, Atotech USA Inc. Sven Lamprecht, Atotech Deutschland GmbH ABSTRACT As the second part to a paper presented
More informationIonic Cleanliness Testing Research of Printed Wiring Boards for Purposes of Process Control
Ionic Cleanliness Testing Research of Printed Wiring Boards for Purposes of Process Control Mike Bixenman, Kyzen Corp. Ning Chen Lee, Indium Corp. Steve Stach, Austin American Technology Agenda Background
More information4.10 Exemption no. 8a stakeholder proposal part C (i)
4.10 Exemption no. 8a stakeholder proposal part C (i) Lead in high melting temperature solders, i.e. lead based solder alloys containing above 80% by weight of lead 4.10.2 Description of exemption ACEA
More informationInfluence of an Immersion Gold Plating Layer on Reliability of a Lead-Free Solder Joint
Materials Transactions, Vol. 46, No. 12 (2005) pp. 2725 to 2729 Special Issue on Growth of Ecomaterials as a Key to Eco-Society II #2005 The Japan Institute of Metals Influence of an Immersion Gold Plating
More informationDeepen your knowledge
FLEX & RIGID-FLEX PRINTED CIRCUIT BOARDS Deepen your knowledge What are Flex & Rigid-flex Printed Circuit Boards? What are their similarities and differences? Their capabilities? And the design rules.
More informationPSR-4000 HFX Satin Colors (UL Name: PSR-4000DE / CA-40HF)
PSR-4000 HFX Satin Colors (UL Name: PSR-4000DE / CA-40HF) LIQUID PHOTOIMAGEABLE SOLDER MASK Application by Screen Printing Available in Black, Blue, Clear, Red and White Satin Finish All Colors are Halogen-Free
More informationUBSC/ULSC 60 + GHz Ultra Broadband Silicon Capacitors Surface Mounted
Rev 2.5 UBSC/ULSC 60 + GHz Ultra Broadband Silicon Capacitors Surface Mounted Key Features Ultra broadband performance up to 60 + GHz Resonance free Phase stability Ultra high stability of capacitance
More informationMurata Silicon Capacitors - XTSC 400µm NiAu finishing Assembly by Soldering High temperature silicon capacitor. Table of Contents
Table of Contents Table of Contents...1 Introduction...2 Handling precautions and storage...2 Pad opening...3 Process Flow...5 Solder print material and stencil printing recommendations...6 Pick and Place...7
More informationACEA/JAMA/KAMA/CLEPA/ et. al. request the exemption of: Lead in high melting temperature solder with lead content > 80%
No. Criteria 1 Wording of the exemption Materials and components: 1. Lead in high melting temperature solder i.e. lead based solder alloys containing above 80% by weight of lead. Scope and expiry date
More informationJacques Matteau. NanoBond Assembly: A Rapid, Room Temperature Soldering Process. Global Sales Manager. indium.us/f018
Jacques Matteau Global Sales Manager NanoBond Assembly: A Rapid, Room Temperature Soldering Process jmatteau@indium.com indium.us/f014 indium.us/f018 Terminology A few key terms NanoFoil is the heat source
More informationNPL REPORT MAT 6. Preliminary Measurements for Thermoplastic Electronics: Developing a Stress Screening Test. M WICKHAM, L ZOU and C HUNT
NPL REPORT MAT 6 Preliminary Measurements for Thermoplastic Electronics: Developing a Stress Screening Test M WICKHAM, L ZOU and C HUNT NOT RESTRICTED NOVEMBER 7 Preliminary Measurements for Thermoplastic
More informationThermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishes
Journal of Mechanical Engineering and Sciences (JMES) ISSN (Print): 2289-4659; e-issn: 2231-8380; Volume 9, pp. 1572-1579, December 2015 Universiti Malaysia Pahang, Malaysia DOI: http://dx.doi.org/10.15282/jmes.9.2015.4.0152
More information1.3.2 Nanotechnology Nanoporosity Deposition Methods Dissolution Methods
Table of Contents 1. Metal Finishing 1 1.1 Introduction 1 1.1.1 Description of Industrial Activity Covered 1 1.1.2 Environmental and Legislative Background 3 1.1.3 Emerging Technology or Research? 4 1.2
More informationEffect of Reflow Profile (RSP Vs RTP) on Sn/Ag/Cu Solder Joint Strength in Electronic Packaging
ISSN 2231-8798 2012 UniKLBMI Effect of Reflow Profile (RSP Vs RTP) on Sn/Ag/Cu Solder Joint Strength in Electronic Packaging I. Ahmad 1, A. Jalar 2 Z. Kornain 3 & U. Hashim 4 1 Universiti Tenaga Nasional
More informationLead-Free Solder Bump Technologies for Flip-Chip Packaging Applications
Lead-Free Solder Bump Technologies for Flip-Chip Packaging Applications Zaheed S. Karim 1 and Jim Martin 2 1 Advanced Interconnect Technology Ltd. 1901 Sunley Centre, 9 Wing Yin Street, Tsuen Wan, Hong
More informationS3X58-G801. High Performance Low Voiding LF Solder Paste. Product Information. Koki no-clean LEAD FREE solder paste.
www.ko-ki.co.jp #55001-3 First issue: Jan.13, 2017 Revised: Jun. 28, 2017 Koki no-clean LEAD FREE solder paste High Performance Low Voiding LF Solder Paste S3X58-G801 Product Information 0603R 0603R Disclaimer
More information2006 DMSMS Conference Pb-free Solder Technical Issues (Not Including Tin Whiskers)
2006 DMSMS Conference Pb-free Solder Technical Issues (Not Including Tin Whiskers) Dr. Stephan Meschter BAE Systems LEAP WG Technical Guidelines Handbook Leader Johnson City, NY Phone: 607-770-2332, Email:
More informationWS488 WATER SOLUBLE SOLDER PASTE
WS488 WATER SOLUBLE SOLDER PASTE FEATURES Excellent Wetting Extended Cleaning Window Superior Slump Resistance 8 Hour+ Stencil Life Wash With Water Alone Low Foaming DESCRIPTION AIM s WS488 water soluble
More informationPAD CRATERING. Chris Hunrath VP of Technology Integral Technology Lake Forest, California THE INVISIBLE THREAT TO THE ELECTRONICS INDUSTRY
PAD CRATERING THE INVISIBLE THREAT TO THE ELECTRONICS INDUSTRY Presented by Chris Hunrath VP of Technology Integral Technology Lake Forest, California IPC-9708 What is Pad Cratering? 1.2.4 Pad Cratering
More informationMaterials and basic processes in microelectronics
Materials and basic processes in microelectronics Frøydis Oldervoll SINTEF ICT Instrumentation department Oldervoll Mars 2009 IKT 1 Introduction Materials and basic processes Die attach Interconnect Encapsulation
More informationOptimizing Immersion Silver Chemistries For Copper
Optimizing Immersion Silver Chemistries For Copper Ms Dagmara Charyk, Mr. Tom Tyson, Mr. Eric Stafstrom, Dr. Ron Morrissey, Technic Inc Cranston RI Abstract: Immersion silver chemistry has been promoted
More informationEffect of Bath Life of Ni(P) on the Brittle-Fracture Behavior of Sn-3.0Ag-0.5Cu/ENIG
Journal of ELECTRONIC MATERIALS, Vol. 43, No. 12, 2014 DOI: 10.1007/s11664-014-3395-8 Ó 2014 The Minerals, Metals & Materials Society Effect of Bath Life of Ni(P) on the Brittle-Fracture Behavior of Sn-3.0Ag-0.5Cu/ENIG
More informationS3X58-M ICT Compatible Lead Free Solder Paste. Product Information. Koki no-clean LEAD FREE solder paste. Contents.
Koki no-clean LEAD FREE solder paste www.ko-ki.co.jp #53002 Revised on Mar. 3, 2015 ICT Compatible Lead Free Solder Paste Product Information Conventional Product Picture of ICT Checker Probe The product
More informationVarious Techniques for Reliability Estimation and Failure Analysis of Electronic Products and Components
JFE No. 13 2006 8 p. 97 102 Various Techniques for Reliability Estimation and Failure Analysis of Electronic Products and Components BAN Mitsuyuki SHIMAUCHI Yutaka JFE JFE JFE X IC Pb Abstract: JFE Techno-Research
More informationHigh Temperature Circuit Reliability Testing Updated February, 2003
High Temperature Circuit Reliability Testing Updated February, 23 Milton Watts Quartzdyne, Inc. milt@quartzdyne.com Abstract As a manufacturer of pressure transducers designed for high temperature use,
More informationSolder Alloy Evolution and Development
Solder Alloy Evolution and Development SMTA Boston November 4, 2018 Presented by Timothy O Neill, Technical Marketing Manager, AIM A Brief Review of Electronic Solders 1960 s to 2006 Tin/Lead (Sn/Pb) Solder
More informationManufacturing and Reliability Challenges With QFN
Manufacturing and Reliability Challenges With QFN Dr. Craig Hillman and Cheryl Tulkoff DfR Solutions SMTA DC Chapter Ashburn, VA February 25, 2009 QFN as a Next Generation Technology What is Next Generation
More informationOptimizing Immersion Silver Chemistries For Copper
Optimizing Immersion Silver Chemistries For Copper Ms Dagmara Charyk, Mr. Tom Tyson, Mr. Eric Stafstrom, Dr. Ron Morrissey, Technic Inc Cranston RI Abstract: Immersion silver chemistry has been promoted
More information