Discrete Capacitor & Resistor Issues. Anthony Primavera Boston Scientific CRM 11/13/06

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1 Discrete Capacitor & Resistor Issues Anthony Primavera Boston Scientific CRM 11/13/06

2 Goal: Drive the Industry towards common test methods and best practices in manufacturing to reduce and or eliminate certain undesirable failure modes in medical grade components.

3 Undesirable Characteristics in discrete components Plating Issues Many components have plating issues or shortcomings that lead to latent defects, manufacturing yield loss and scrap Possible Failure Locations UBM or base layer plating Barrier layer to base layer Finish plating to barrier layer Solder to barrier layer

4 Examples of Plating Issues Incomplete base layers Leads to the following possible defects Voiding Weak solder adhesion Exposure of base Ceramic Micro Cracking Layer Separation Electrical Failure or Leakage

5 Examples of Plating Issues Poor Base Layer Adhesion Leads to the following possible defects Weak solder adhesion Exposure of base Ceramic Micro Cracking Layer Separation Electrical Failure or Leakage Peeling of plating Full Failure of Solder Joint

6 Examples of Plating Issues Voiding and base material adhesion issues

7 Examples of Plating Issues Poor Base Layer Adhesion Examples 200C reflow Sn/Pb Good Plating Separated plating

8 Plating Failure / Cracking Poor adhesion can result in separation and failure near the bottom heel fillet region. This is made worse by design limitations on PCB real estate

9 Platinum-Silver Metallization 0402 Ceramic Resistor Screen printed Pt:Ag metallization Separation of layer after reflow Reflow = C for 1 minute

10 Base layer / Barrier layer Issues Barrier Layer Plating Issues Cracks and separation of Ni or other barrier metals can lead to full failure of the joint following subsequent assembly and handling

11 Base layer / Barrier layer Issues Base Layer Separation Issues Cracks and separation of barrier metals can lead to full failure of the joint following subsequent assembly and handling

12 Ceramic Cracking Pre Existing flaws and cracks in components can lead to post assembly failures. Especially true in large ceramic capacitor and resistor arrays

13 Ceramic Cracking Corner Cracks Can lead to post assembly plating failures at termination

14 Circuit Boards Processing conditions by the OEM and assembly house can lead to defects in the PCB Possible Causes Reflow and Rework Cycle Cleaning Chemicals Bending / Folding Handling Material Defects

15 Torsion Test Results FR4 failures (12 by 2000 cycles) 6 Layer single side (1 at 10,248 cycles) 6 Layer double sided (4 failures by 4000 cycles) 4 Layer single side (no failures by 15,000 cycles) 4 Layer double sided (no failures by 9,500 cycles) 6 layer flex, single side failure 10,248 cycles

16 Mechanical Robustness Component mass / joint drives failure Experiments performed to determine dynamic rupture point of solder in drop testing. Weights incrementally added to components Results from 2 sets of experiments (CSPs and BGAs) show an approximate dynamic rupture stress for 1000G drop testing to be 250psi. Compare to low strain rate rupture (shear testing for example) which give approximately 4,500 to 6,000 psi failure rates for 63/37 Sn/Pb solder at room temp.

17 Cleanliness continued Breakdown of circuit board materials, components, and adhesives is possible with multiple cleaning steps. Flex board materials, specifically adhesives and polyimide are very susceptible to moisture and solvent damage and swelling. This may lead to other defects such as via interface failures. Via interface failure

18 Component Finish RoHS & Sn/Pb Component Finish can lead to post assembly issues and failures. Finishes acceptable to commercial products may not work in medical products. 100 % Sn finish Even in Sn/Pb assembly, 100% Sn finish can lead to whisker growth. The environment can accelerate the growth. Concern commercial components have driven towards 100% Sn. May not be fully acceptable for high reliability applications

19 Component Finish RoHS & Sn/Pb Component Finish can lead to post assembly issues and failures. Finishes acceptable to commercial products may not work in medical products. Ag hospitals use lots of chlorine in cleaning. Silver reacts with Cl and can lead to voiding and growth of Ag-Cl dendrites on the solder joints and PCB surface. Au Electrolytic gold. Gold concentrations lead to potential failures in components burned in for medical applications due to (Au-Ni)Sn 4 formation. This results in a brittle solder joint and BGA ball failure.

20 BGA / CSP Ni-Au Issues Can be on Component or PCB Side! Different causes including: Ni-phosphase ENIG plating problems, excessive gold, oxidized Ni layers etc. CSP - Ni/Au Failure BGA - PCB side Failure

21 PCB Issues Continued Processing Conditions can lead to other defects such as solder mask lifting. Made worse by higher temperatures associated with RoHS assembly conditions.

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