Rewards for good conduct(ivity)

Size: px
Start display at page:

Download "Rewards for good conduct(ivity)"

Transcription

1 42 Adhesives Rewards for good conduct(ivity) Thermally conductive bonding aids electrical and electronics assembly. By Arno Maurer, Polytec PT GmbH. Developments in electric vehicles, power electronics and LED lighting systems all create increasing demand for high-performance thermally conductive adhesives. Electrically conductive types may replace soldering and brazing. Others can be electrically insulating. New conductive adhesives offer an improved balance between conductivity and workability. Thermally conductive adhesives are an established means of joining electronic components and heat sinks in order to transfer heat from one surface to another. Recently, there has been a strong and increasing demand in innovative manufacturing concepts for electric and hybrid vehicle batteries, motors and fuel cells. This can be addressed at least in part by using thermally conductive adhesives. The same goes for new, energy-efficient components in electrical and power engineering, such as solar energy devices, heat exchangers or LED lamps. This paper presents developments on a new series of adhesives and potting compounds with high thermal conductivities of 3 W/mk and more, customised to the applications mentioned above in respect of processing parameters as well as thermal and mechanical properties. and thermal management of devices and vehicles become more critical and can be addressed by adhesive bonding solutions. As the electric vehicle industry is growing strongly, the market for electric power sources is estimated to increase threefold to about USD 6 billion in the next five years [1], with the share of fuel cell technology increasing. Traction batteries are expected to improve their cruising range by a factor of two by 2020, while decreasing weight and costs by half [2]. The crucial point is the assembly and integration of mass produced Li-ion or other single cells to build a secure and durable battery system (Figure 1) including mechanical fixing, thermal management, vibration damping and electronic control. This can be done by resin casting and sealing the battery units. Liquidcooled systems may also need bonding of cooling coils to the battery bracket. Suitable adhesives and potting compounds have to provide structural strength, good flexibility, moderate density, dielectric strength, high thermal conductivity, good chemical resistance and Figure 1: Li-ion battery pack. Source: Tennen-Gas (Own work), CC BY- SA 3.0, Wikimedia Commons. fast curing at room temperature. Apart from batteries, there is an increasing demand for adhesive bonding, sealing and encapsulation of other electric and hybrid vehicle parts such as motors, converters, control units and power electronics devices. Electric motors need impregnation and bonding of windings, magnets, rotors and stators. This is often accomplished by temperatureresistant epoxy resins which can in addition be thermally conductive to improve heat dissipation and to minimise thermal stress. Potting of hybrid motors for mechanical resilience, thermal management, and exclusion of moisture and corrosive agents can take up more than 1 kg of resin per part. Structural and thermal demands of power electronics Generally, power electronics are critical components in power supply and control of vehicles, trains, white goods and power generators such as wind turbines and photo- Figure 2: Power LED chip bonded onto aluminium heat sink. Electric vehicles drive a growing market Ensuring living comfort and mobility in times of shrinking fossil energy sources is a major challenge. Besides exploiting and developing renewable resources, there is a high demand for eco-efficient power engineering and energy-saving equipment. Both lightweight design

2 Adhesives 43 Results at a glance Developments in electric vehicles, power electronics and LED lighting systems all create an increasing demand for high-performance thermally conductive adhesives. Electrically conductive types may replace soldering and brazing processes, with the advantage that high thermal stresses are not produced during assembly. Other types may need to be electrically insulating. The conductivity data quoted by different manufacturers are shown to be not always directly comparable. It is notable that the conductivity depends mainly on the level of conductive filler in a formulation, and only to a small degree on the conductivity of the filler itself. Information is provided on a number of recently developed conductive adhesives which offer an improved balance between conductivity and workability (in particular, lower viscosities for a given filler/conductivity level). voltaics. High-power semiconductor devices may have to dissipate tens or hundreds of watts of waste heat. This is accomplished by heat sinks which transfer the thermal energy from the device to the surrounding medium. As miniaturisation continues and perfor- mance increases, this power dissipation requires ever more effective thermal management in order to ensure efficient, reliable and long-lasting operation of the components. In microelectronic assemblies, thermally conductive adhesives are an established means of joining and protecting components, such as die attachment, underfill, encapsulation and heat sinks [3]. The application of thermally stable epoxy-based resins allows for processing of temperature sensitive parts, so they can withstand reflow soldering, and improves operational stability. In the power electronics market, conductive adhesives are also a proven yet under-utilised bonding solution. A growing application trend is the mounting of high-performance LED chips on heat sinks (Figure 2). Current power LEDs may consume more than 500 mw per unit, where only 20% of the energy is converted to visible light. The larger portion of the energy has to be radiated or dissipated to keep the component temperature below 120 C. At higher temperatures, both the light yield and the service lifetime of the lamp will decrease. When mounting LED chips to a heat sink, thermally conductive adhesives excel because they provide both mechanical and thermal bonding over the whole area. Thus, the heat dissipates very efficiently, as is illustrated in Figure 3, which shows a thermal image of a power LED in operation. It is mounted on a heat sink by using a thermally conductive adhesive. The maximum temperature is about 66 C. Each 1 C incremental increase in operating temperature would reduce the lifetime of the LED significantly. Figure 3: Thermal image of a power LED assembly during operation.

3 44 Adhesives Power engineering: replacing brazing and welding Thermally conductive adhesives are increasingly requested for components and assemblies in general power engineering, for example solar thermal devices or heat exchangers found in vehicles, air conditioners, power plants or industrial processing plants. Adhesives can create the force-fitted and thermally conductive joints found in traditional soldering and welding, while avoiding high thermal loads during processing and consequent distortion or discolouration. Moreover, joining difficult material combinations like copper and aluminium, and even plastics and ceramics, is possible without restrictions. Compared to mechanical fixing, there is no need for aditional parts such as screws or clamps, and the heat transfer takes place over the whole area. Adhesive joints are gap-filling and resistant to most processing fluids including water, oil, refrigerants or gases. For example, tubing and U-bends in heat exchangers can be fixed and sealed by using Figure 4: Manufacture of solar thermal devices by adhesive bonding. adhesives. Figure 4 shows a new but already proven technology for manufacturing solar thermal devices by joining the piping to the absorber base. This is also suitable for hybrid (photovoltaic and thermal combined) modules. As the adhesive is cured at room temperature, the mechanical stresses associated with brazing and welding are not introduced into the structure. Design principles of thermally conductive adhesives Thermally conductive adhesives are composed of single or two-component epoxies, as well as other systems like silicones. The advantages of epoxies are thermal, chemical and structural stability. Epoxies, like other polymers, generally have a poor intrinsic thermal conductivity of W/mK. When these epoxies are filled with ceramic or metallic powders such as alumina, boron nitride, aluminium or copper, heat transfer increases substantially. The bulk thermal conductivity of these particles ranges between 30 and > 300 W/mK [4]. In the respective composites, thermal conductivity depends on the relative ratio of the filler to the epoxy [5], but not linearly. A well-acknowledged model for thermal conductivity is the equation found by Lewis and Nielsen [6]: Where λ C is the thermal conductivity of the composite, λ M is the thermal conductivity of the matrix, and the remaining part of the equation consists of various parameters including Φ, which is the volume fraction of the filler. The parameters A, B, and Ψ take account of the particle form, the thermal conductivity and the maximum possible packing density of the filler. Data generated using this equation (Figure 5) shows that the volume fraction of the filler should be 50% or more just to achieve a thermal conductivity above 1 W/mK. Even more significant is that similar levels of thermal conductivity are found regardless of whether the filler conductivity is 10, 100 or 1000 W/mK. Considering these properties, the goal of maximising thermal conductivity therefore requires a high ratio of filler content. However, a high ratio of abrasive particles reduces the flow properties that will be needed to mix and apply the adhesive. Furthermore, mechanical strength may suffer as filler displaces epoxy. As a consequence, any product development team will have to find a compromise between thermal conductivity and processing parameters. Manufacturers test values are not always comparable Commercially available thermally conductive epoxies feature conductivities ranging from <1 to 1.5 W/mK if electrically insulating, and up to 2-3 W/mK when filled with metal powders. Large discrepancies in manufacturers specifications can result from non-standardised parameters including bond line thickness, curing temperature and duration, interface conditions, as well as the measurement principle itself. There is a wide range of testing methods to determine thermal parameters and it is therefore important to confirm that marketing data derived from a convenient testing method satisfies real-world requirements Figure 5: Modelling of thermal conductivity of a composite material. Figure 6: Thermal conductivity and viscosity of experimental samples.

4 WHERE INDUSTRY MEETS SCIENCE Future Dialogue March 2016 Berlin THE CONFERENCE FOR R&D MANAGERS, INNOVATORS, AND SCIENTISTS > Preview of future coatings technology > Exhibition of cutting-edge research projects > Exchange between academia and industry > Inspirational key note presentation EUROPEAN C OATINGS future dialogue Vincentz Network P.O. Box Hannover Germany T lena.witte@vincentz.net

5 46 Adhesives in the application. This must be considered when developing new products. Testing of commercially available products has revealed significant differences between stated and observed values (Table 1). The values have been determined by the transient hot bridge (THB) method which had been calibrated against the well-known laser flash method. Next generation thermally conductive adhesives When considering future application requirements, thermally conductive adhesives are fairly flexible. Based on the relationship quoted above between conductivity and filler loading, systematic testing has been carried out to create a new series of improved adhesives and potting compounds [7]. After an appropriate type of filler has been selected, there are several design parameters that can be manipulated in order to optimise the result. These include viscosity and rheological properties of the resin matrix, filler load, grain size, aspect ratio, size distribution and surface properties of the filler particles. Correctly selected additives will enhance the performance of the composites. Lastly, the desired adhesion properties, mechanical specifications including strength and service durability etc. need to be addressed. Prior investigations have resulted in adhesives with thermal conductivities of 2-3 W/mK, which also maintain full electrical insulation. Figure 6 shows some results relating to thermally conductive adhesives filled with different types of alumina at various filler loadings. It can be seen that at higher thermal conductivities, the viscosity also increases. By selecting special grain shapes for the filler, the problem can be addressed to a certain extent. For instance, Sample 3 has a thermal conductivity of 2.5 W/mK while maintaining a moderate viscosity of ca. 40,000 mpa s while Sample 1 offers only about 2 W/mK and a viscosity of 60,000 mpa s. At very high filler loadings, the resulting material becomes highly viscous and difficult to process (Sample 4). In the case of metallic fillers where dielectric strength is not explicitly required, even higher thermal conductivities of around 5 W/mK can be achieved. Despite manufacturers claims to have reached even higher conductivities, it is important to proceed with caution and critically examine data sheet specifications with respect to the measurement ambiguities already mentioned. Applications for recently introduced adhesives In co-ordination with customer requirements, the project has brought about some first development products. For thermally conductive potting of power circuits and batteries, a new, flexible adhesive system sold as TC 418 is available featuring room temperature casting and curing, a moderate Shore hardness and a thermal conductivity of about 1.6 ± 0.2 W/mK. LED mounting on heat sinks can be improved by TC 433, a boron nitride filled thixotropic adhesive that gives 2 W/mK after thermal curing. There is a corresponding version ( TC 432 ) featuring room temperature curing and a slightly lower conductivity of 1.8 W/mK. In order to meet even higher demands regarding thermal conductivity, TC 423 is available, offering 3 W/mK while still being electrically insulating (Figure 7). For high-power applications, the new EC 242 silver-filled adhesive features > 4 W/mK while being easy to process at about 20,000 mpas. Finally, the copper-filled, paste-like VP 2026 reaches values as high as 6.5 W/mK. All of the adhesives are packed and processed appropriately for their respective application type. Room- and heat-cured two-component versions are available in separate containers, in dual cartridges with static mixer, or premixed and frozen bottled in syringes. Frozen pre-mixed dual components are ready for use after thawing and must be handled with care to prevent air bubbles from forming. Singlecomponent versions are even easier to process as they do not need to be metered or mixed and can be stored in a refrigerator. Regardless of the application, good thermal management improves the durability of the end product and hence positively affects its energy efficiency and eco-friendliness. With regard to the improvement in thermal conductivity, the new products make adhesive bonding an increasingly attractive alternative to welding, soldering and mechanical joining. The epoxy-based adhesives in particular pro- Table 1: Comparison of specified thermal conductivities of commercial products with those found by using the same standardised measuring procedure. Competitor product No. Filler type Specified thermal conductivity W/mK Measured thermal conductivity W/mK 1 Alumina 2,4 1,2 2 Aluminium 5 1,0 3 Alumina 1,8 0,5 4 n.a. 2,5 0,7 5 Boron 0,7-1,5 0,9 nitride 6 Silver 3,2 1,4-1,6 7 Silver 2,4 2,3 8 n.a. 1,4 0,7-0,9 vide both structural strength and durability in the adhesive joint. ACKNOWLEDGEMENTS These investigations are supported by the German Federal Ministry for Economic Affairs and Energy through the Central Innovation Program SME (Zentrales Innovationsprogramm Mittelstand ZIM). References [1] electric Vehicle Industry Experiencing a Boom with Next-Generation Vehicles, search.com/pressroom/fcb/electric-vehicle- Industry-Experiencing-a-Boom-with-Next- Generation-Vehicles, January 16, [2] Bosch kündigt die Batterie-Revolution an, elektroauto-bosch-batterie, February 10, [3] Maurer A., Using conductive adhesives for thermal management in micro- and power electronics, Adhes. & Seal. Ind., Feb. 2015, pp 14-17: articles/93604-adhesives-at-work-usingconductive-adhesives-for-thermal-management-in-micro--and-power-electronics [4] petrie E.M., Epoxy Adhesive Formulations, McGraw-Hill, New York. 2006, pp [5] Bigg D.M., Thermal conductivity of heterophase polymer compositions, Adv. Polymer Sci., 1995, Vol. 119 pp [6] nielsen L., Thermal conductivity of particulatefilled polymers, Appl. Polym. Sci., 1973, Vol. 17, p [7] Maurer A., Adhesives with high thermal conductivity and reliability for power engineering and e-mobility, European Coatings Congress 2015, Nuremberg, Figure 7: Battery module assembly using TC-423 thermally conductive adhesive.

6 Adhesives 47 Dr Arno Maurer Research & Development Polytec PT GmbH polytec-pt.de Electrically conductive adhesives have made great progress. Three questions to Arno Maurer In what cases can soldering and brazing be replaced by the usage of conductive adhesives? There are several cases where adhesive bonding may be advantageous. First, when materials cannot be soldered or brazed at all, for instance glass or ceramics. Furthermore, if adverse effects of thermal treatment are not accepted, for example in case of distortions or discolorations. Regarding semiconductor mounting, electrically conductive adhesive bonding can be widely applied instead of soldering; except when thermal dissipation requirements are high. What do you think are the reasons that conductive adhesives are under-utilised in the power electronics market? There is a great variety of established bonding processes for power chips like soldering, sintering and others adhesive bonding is relatively new in this application. However, electrically conductive adhesives have made great progress with regard to electrical and thermal performance in the last few years. There may be a lack of industrial experience but results from recent research projects are very promising. What does die attachment entail? Die attachment describes the process of fixing a bare semiconductor directly on a printed circuit board or on a package device. In micro electronics, die attachment using epoxy adhesives is well proven. The adhesive may be either dispensed, screen printed or pad printed before the chip is being mounted and the joint is cured by moderate temperature. Epoxy-based joints will then withstand even subsequent flow soldering processes. Book Tip Formulating Adhesives and Sealants Bodo Müller and Walter Rath ISBN: Order no.: 519, Price:

Thermally Conductive Adhesives from Polytec PT

Thermally Conductive Adhesives from Polytec PT Description offers a range of thermally conductive adhesives for technology applications. The products are two-part and single-part epoxy systems designed for all applications where heat transfer is essential,

More information

Features Conductive Room Temperature Cure. Product Ref IP 4525IP Low viscosity adhesive & coating. High thermal conductivity

Features Conductive Room Temperature Cure. Product Ref IP 4525IP Low viscosity adhesive & coating. High thermal conductivity Properties and Part Selection Overview Selection Table - Epoxy-Based Adhesive Properties Features Conductive Room Temperature Cure Product Ref 120 132 4461IP 42IP 438 700 Properties High electrical conductivity

More information

Optical Adhesives & Encapsulants from Polytec PT

Optical Adhesives & Encapsulants from Polytec PT Description offers a range of high performance optical adhesives for use in optical and medical applications. The materials are either optically clear or black opaque. Features & Benefits Products with

More information

Imagine. Innovative Thermally Conductive Silicone Solutions. Selection Guide. Enhancing the Performance and Reliability of Your PCB System Assemblies

Imagine. Innovative Thermally Conductive Silicone Solutions. Selection Guide. Enhancing the Performance and Reliability of Your PCB System Assemblies PCB and Systems Assembly Selection Guide Innovative Thermally Conductive Silicone Solutions Enhancing the Performance and Reliability of Your PCB System Assemblies Imagine Image FPO Image FPO Heat Is the

More information

Thermal Management of LEDs: Looking Beyond Thermal Conductivity Values

Thermal Management of LEDs: Looking Beyond Thermal Conductivity Values Thermal Management of LEDs: Looking Beyond Thermal Conductivity Values Specifically designed and formulated chemical products are widely used in the electronics industry for a vast array of applications.

More information

Microelectronic Materials. Catalog

Microelectronic Materials. Catalog Microelectronic Materials Catalog LORD partners with customers to leverage expertise in multiple chemistries and diverse applications to develop customized solutions. Design Without Compromise At LORD,

More information

Microelectronic Materials CATALOG

Microelectronic Materials CATALOG Microelectronic Materials CATALOG LORD partners with customers to leverage expertise in multiple chemistries and diverse applications to develop customized solutions. Design Without Compromise At LORD,

More information

Enhancing the Performance & Reliability of Your Electronics Designs. Innovative Thermally Conductive Silicone Solutions IMAGINE

Enhancing the Performance & Reliability of Your Electronics Designs. Innovative Thermally Conductive Silicone Solutions IMAGINE Enhancing the Performance & Reliability of Your Electronics Designs Innovative Thermally Conductive Silicone Solutions IMAGINE Heat Is the Enemy of Electronic Devices The reasons why may vary from application

More information

CREATING TOMORROW S SOLUTIONS MOBILITY. e-novation FOR BATTERIES POWERED BY SILICONES

CREATING TOMORROW S SOLUTIONS MOBILITY. e-novation FOR BATTERIES POWERED BY SILICONES CREATING TOMORROW S SOLUTIONS MOBILITY e-novation FOR BATTERIES POWERED BY SILICONES AT THE HEART OF e-mobility Batteries, and their power storage ability, can be seen as at the heart of e-vehicles. As

More information

3M Boron Nitride Cooling Fillers For thermally conductive and electrically insulating plastics and adhesives. The next level of thermal management.

3M Boron Nitride Cooling Fillers For thermally conductive and electrically insulating plastics and adhesives. The next level of thermal management. 3M Boron Nitride Cooling Fillers For thermally conductive and electrically insulating plastics and adhesives. The next level of thermal management. 3M Boron Nitride Cooling Fillers For thermally conductive

More information

ELECTRONIC POTTING & ENCAPSULATING compounds

ELECTRONIC POTTING & ENCAPSULATING compounds EPIC RESINS COMPOUNDS AND RESINS FOR INDUSTRY ELECTRONIC POTTING & ENCAPSULATING compounds EPIC RESINS quality ElECtRoNIC PottINg and ENCaPSulatINg ComPouNdS for your application At Epic Resins, we specialize

More information

Silicones for Air Conditioning Units

Silicones for Air Conditioning Units Silicones for Air Conditioning Units Overview Silicones for Air Conditioning Units: From potting and encapsulation products to adhesives, additives, hardcoats and packaging, Momentive has been leading

More information

Industrial Adhesives PRODUCT SELECTION GUIDE

Industrial Adhesives PRODUCT SELECTION GUIDE Industrial Adhesives PRODUCT SELECTION GUIDE CASS Industrial Adhesives Located in Irvine, California, Bacon Industries specializes in the field of adhesives, bonding, potting, impregnating, sealing and

More information

Novel Approaches to Thermal Management for Power LED Packaging

Novel Approaches to Thermal Management for Power LED Packaging 50 Novel Approaches to Thermal Management for Power LED Packaging Thermal management is crucial for the efficiency and reliability of LED products which have become very popular during the past few years.

More information

HIGH QUALITY THERMALLY CONDUCTIVE MATERIALS

HIGH QUALITY THERMALLY CONDUCTIVE MATERIALS 14.february.2011 HIGH QUALITY THERMALLY CONDUCTIVE MATERIALS Table of contents Non-silicone compounds (Tim4xx series)... section 1 Silicone compounds (Tim5xx series)... section 1 Dielectric silicone grease

More information

Thermal Management Solutions for Automotive, Lighting and Industrial Applications

Thermal Management Solutions for Automotive, Lighting and Industrial Applications Thermal Management Solutions for Automotive, Lighting and Industrial Applications UL Prospector Webinar, January 25, 2018 Presented by Florian Damrath & Julien Renaud Technical Service & Development, Advanced

More information

Potting & Encapsulation Materials CATALOG

Potting & Encapsulation Materials CATALOG Potting & Encapsulation Materials CATALOG LORD Partners with Customers to Leverage Expertise in Multiple Chemistries and Diverse Applications to Develop Customized Solutions. Design Compromise Not An Option?

More information

Physical Properties of Materials

Physical Properties of Materials Physical Properties of Materials Manufacturing Materials, IE251 Dr M. Saleh King Saud University Manufacturing materials --- IE251 lect-7, Slide 1 PHYSICAL PROPERTIES OF MATERIALS 1. Volumetric and Melting

More information

Keeping Cool!: selecting high performance thermal materials for LED Lighting applications. Ian Loader 25/03/14

Keeping Cool!: selecting high performance thermal materials for LED Lighting applications. Ian Loader 25/03/14 Keeping Cool!: selecting high performance thermal materials for LED Lighting applications Ian Loader 25/03/14 1 Target Points to cover Basics of Thermal Management Considerations for thermal materials

More information

CATALOG. Potting & Encapsulation Materials

CATALOG. Potting & Encapsulation Materials CATALOG Potting & Encapsulation Materials Design Compromise Not An Option? Ask Us How. At, we have been developing custom potting and encapsulant solutions for more than 40 years. Whether utilizing epoxy,

More information

CREATING TOMORROW S SOLUTIONS BRIGHT IDEAS. Silicone Solutions for High-Performance LEDs

CREATING TOMORROW S SOLUTIONS BRIGHT IDEAS. Silicone Solutions for High-Performance LEDs CREATING TOMORROW S SOLUTIONS BRIGHT IDEAS Silicone Solutions for High-Performance LEDs LUMISIL SILICONES BRIGHT PERSPECTIVES FOR LED MANUFACTURERS LED lighting brings out the best in silicones they are

More information

Coating and impregnating protection

Coating and impregnating protection Rhodorsil Silicone Grades for Coating and impregnating protection > Advantages of Rhodorsil resins Bluestar Silicones offer a broad range of Silicone resins. After drying and crosslinking, these resins

More information

Low Stress Silicone Encapsulant Enables Distributed Power Generation

Low Stress Silicone Encapsulant Enables Distributed Power Generation Low Stress Silicone Encapsulant Enables Distributed Power Generation Guy Beaucarne Kent Larson Dow Corning Corporation Introduction The way electric power is generated, distributed and used is presently

More information

Small and Lightweight Reactor for Boost Converter

Small and Lightweight Reactor for Boost Converter FEATURED TOPIC Small and Lightweight Reactor for Boost Converter Shinichiro YAMAMOTO*, Kazushi KUSAWAKE, Junji IDO, Hajime KAWAGUCHI, Atsushi ITO and Masayuki KATO The number of motorized vehicles, such

More information

Gap Filler Liquid Dispensed Materials

Gap Filler Liquid Dispensed Materials 26 Thermal Interface Selection Guide Gap Filler Liquid Dispensed Materials Introduction Effective thermal management is key to ensuring consistent performance and long-term reliability of many electronic

More information

Potting & Encapsulating

Potting & Encapsulating Potting & Encapsulating Potting and encapsulating compounds are used to provide mechanical reinforcement to housed assemblies, to fill large voids, and to protect components from the effects of exposure

More information

Gap Filler 1000 (Two-Part)

Gap Filler 1000 (Two-Part) Gap Filler 1000 (Two-Part) Thermally Conductive, Liquid Gap Filling Material Thermal conductivity: 1.0 W/m-K Ultra-conforming, designed for fragile and low-stress applications Ambient and accelerated cure

More information

LED Die Attach Selection Considerations

LED Die Attach Selection Considerations LED Die Attach Selection Considerations Gyan Dutt & Ravi Bhatkal Alpha, An Alent plc Company Abstract Die attach material plays a key role in performance and reliability of mid, high and super-high power

More information

About Thermal Interface Materials

About Thermal Interface Materials About Thermal Interface Materials Thermal management is to ensure a long-term lifetime and functioning of electronic components such as power semiconductors in electronic circuits. All starts with a profound

More information

Optimizing the Assembly Process with Cure-On-Demand UV/Visible Light-Curable Adhesives

Optimizing the Assembly Process with Cure-On-Demand UV/Visible Light-Curable Adhesives Optimizing the Assembly Process with Cure-On-Demand UV/Visible Light-Curable Adhesives Virginia P. Read Industrial Market Segment Manager DYMAX Corporation Torrington, CT www.dymax.com Introduction Manufacturers

More information

Two-Part Acrylic Elastic Epoxy that Cures at Room Temperature

Two-Part Acrylic Elastic Epoxy that Cures at Room Temperature ThreeBond Technical News Issued January 1, 213 81 Introduction Two-Part Acrylic Elastic Epoxy that Cures at Room Temperature SGAs (second generation acrylic adhesives) are two-part mixture acrylic adhesives

More information

BondaTherm Key Features of the BondaTherm Equalizer Kits: Eliminates improper ratios and mixing errors Reduces material waste Eliminates employee contact with resins Eliminates messy hand mixing and transferring

More information

RAMPF Polymer Solutions GmbH & Co. KG Thilo Heuft / High performance reactive resins for component protection in extreme environments

RAMPF Polymer Solutions GmbH & Co. KG Thilo Heuft / High performance reactive resins for component protection in extreme environments RAMPF Polymer Solutions GmbH & Co. KG Thilo Heuft / 05.11.2015 High performance reactive resins for component protection in extreme environments The RAMPF Group RAMPF stands for Engineering and Chemical

More information

Illuminating Innovations

Illuminating Innovations Illuminating Innovations TM Silicone Solutions for LED Packaging Emir Debastiani Application Engineer Dow Corning Brazil Email: emir.debastiani@dowcorning.com Table of Contents Dow Corning Introduction

More information

ELECTRONIC POTTING & ENCAPSULATING COMPOUNDS

ELECTRONIC POTTING & ENCAPSULATING COMPOUNDS ELECTRONIC POTTING & ENCAPSULATING COMPOUNDS Epoxies Product UL Recognized Mix Ratio by Weight Mix Ratio by Volume Mixed Viscosity @ 25 C (in cps) Gel Time @25 C Glass Transition Temp. (Tg) 0155 No 1 Component

More information

CATALOG. Potting & Encapsulation Materials

CATALOG. Potting & Encapsulation Materials CATALOG Potting & Encapsulation Materials Design Compromise Not An Option? At LORD, we have been developing custom potting and encapsulant solutions for more than 50 years. Whether utilizing epoxy, silicone

More information

Enhanced Thermal Conductivity of Polyimide Films via a Hybrid of Micro- and Nano-Sized Boron Nitride

Enhanced Thermal Conductivity of Polyimide Films via a Hybrid of Micro- and Nano-Sized Boron Nitride The 2012 World Congress on Advances in Civil, Environmental, and Materials Research (ACEM 12) Seoul, Korea, August 26-30, 2012 Enhanced Thermal Conductivity of Polyimide Films via a Hybrid of Micro- and

More information

LORD Automotive Solutions PROVIDING INNOVATIVE TECHNOLOGIES AND VALUE FOR OUR CUSTOMERS

LORD Automotive Solutions PROVIDING INNOVATIVE TECHNOLOGIES AND VALUE FOR OUR CUSTOMERS LORD Automotive Solutions PROVIDING INNOVATIVE TECHNOLOGIES AND VALUE FOR OUR CUSTOMERS LORD Technologies for Automotive OEMs and Tier Suppliers HEM-FLANGE COMPOSITES AND PLASTIC WEATHERSTRIP & GLASS AUTOMOTIVE

More information

Residual Stress Distribution and Adhesive Interface Strength Analysis of Thermosetting Resin Molding

Residual Stress Distribution and Adhesive Interface Strength Analysis of Thermosetting Resin Molding Residual Stress Distribution and Adhesive Interface Strength Analysis of Thermosetting Resin Molding GANBE, Tatsuya ASAI, Tatsuhiko OKAMOTO, Kenji ABSTRACT The number of products sealed with a thermosetting

More information

RAMPF Polymer Solutions GmbH & Co. KG Albert Schmid / Solutions for the lighting industry

RAMPF Polymer Solutions GmbH & Co. KG Albert Schmid / Solutions for the lighting industry RAMPF Polymer Solutions GmbH & Co. KG Albert Schmid / 19.03.2015 Solutions for the lighting industry Index 1. General Information 2. Fields of application: sealing 3. Fields of application: bonding 4.

More information

United Adhesives. Aerospace Automotives Computers Electronics Green Energy Semiconductors Telecommunications

United Adhesives. Aerospace Automotives Computers Electronics Green Energy Semiconductors Telecommunications United Adhesives Aerospace Automotives Computers Electronics Green Energy Semiconductors Telecommunications Welcome to United Adhesives, Inc. United Adhesives Inc. formulates and manufactures special adhesives

More information

Realizing Possibilities: Thermal Management for Electric Vehicles and Electronics

Realizing Possibilities: Thermal Management for Electric Vehicles and Electronics Realizing Possibilities: Thermal Management for Electric Vehicles and Electronics TABLE OF CONTENTS I. Introduction Customer Expectations Are Driving Innovation Today s Market Requires Tailored Thermal

More information

McKinney, Texas. McKinney, Texas, Cheshire, CT, Morrisville, NC USA

McKinney, Texas. McKinney, Texas, Cheshire, CT, Morrisville, NC USA McKinney, Texas McKinney, Texas, Cheshire, CT, Morrisville, NC USA http://www.m-coat.com Just like an old friend, we can do it all Military Microelectronics Electronics Medical Conductive silvers Encapsulants

More information

Adhesives, Sealants & Coatings for the. Electronic Industry

Adhesives, Sealants & Coatings for the. Electronic Industry Adhesives, Sealants & Coatings for the Electronic Industry Master Bond Inc. is a leading manufacturer of adhesives, sealants, coatings, potting and encapsulation compounds. We offer an extensive product

More information

BondaTherm Key Features of the BondaTherm Equalizer Kits: Eliminates improper ratios and mixing errors Reduces material waste Eliminates employee contact with resins Eliminates messy hand mixing and transferring

More information

Information About Dow Corning brand Dielectric Gels

Information About Dow Corning brand Dielectric Gels P R O D U C T I N F O R M A T I O N Information About Dow Corning brand s Silicones and Electronics Long-term, reliable protection of sensitive circuits and components is becoming more important in many

More information

pure excellence. pure energy.

pure excellence. pure energy. pure excellence. pure energy. The heart of a high-quality photovoltaic system is a high class photovoltaic module. The Austrian technology company Energetica produces photovoltaic modules, which are characterized

More information

AlSiC for Optoelectronic Thermal Management and Packaging Designs

AlSiC for Optoelectronic Thermal Management and Packaging Designs for Optoelectronic Thermal Management and Packaging Designs Mark A. Occhionero, Richard W. Adams, Dave Saums Ceramics Process Systems Chartley, MA 02712-0338 Abstract Aluminum silicon carbide () metal

More information

PowerOak W400 Marine Wind Generator

PowerOak W400 Marine Wind Generator PowerOak W400 Marine Wind Generator PowerOak W400 wind turbine system is one of the most successful small wind generator system in the international markets. The main superiority of this 300W small wind

More information

Wind Turbine Technologies. Sika Wind Turbine Technologies Imagine New Solutions. Renewable Energies_1

Wind Turbine Technologies. Sika Wind Turbine Technologies Imagine New Solutions. Renewable Energies_1 Wind Turbine Technologies Sika Wind Turbine Technologies Imagine New Solutions Renewable Energies_1 Sika Product Solutions It is no coincidence that so many of the world s leading wind turbine producers

More information

IPC-AJ-820A Assembly and Joining Handbook. The How and Why of All Things PCB & PCA

IPC-AJ-820A Assembly and Joining Handbook. The How and Why of All Things PCB & PCA IPC-AJ-820A Assembly and Joining Handbook The How and Why of All Things PCB & PCA 1 Scope To provide guidelines and supporting info for the mfg of electronic equipment To explain the HOW TO and WHY Discussions

More information

Innovative, Thermally Conductive Silicone Solutions for LED Lighting

Innovative, Thermally Conductive Silicone Solutions for LED Lighting Innovative, Silicone Solutions for LED Lighting Better Performance and Reliability for your Lighting Designs With Dow Corning, You Have a Powerful Ally for Thermal Management Heat remains the enemy of

More information

Epoxy. Epoxy 90, ,000. Epoxy. Epoxy. low ion content, Encapsulation of electronic

Epoxy. Epoxy 90, ,000. Epoxy. Epoxy. low ion content, Encapsulation of electronic - - and Light Curing Adhesives Our comprehensive range of systems covers a multitude of applications and offers many advantages: systems are used in many fields in both trade and industry. adhesives and

More information

3 Epoxy and Hot Melt Adhesives for Electronics. Products and Specifications

3 Epoxy and Hot Melt Adhesives for Electronics. Products and Specifications 3 Epoxy and Hot Melt Adhesives for Electronics Products and Specifications 3M Epoxy and Hot Melt Adhesives have the characteristics an 3M Epoxy and Hot Melt Specifications ➀ Typical Physical Properties

More information

Dow Corning Protection, Assembly and Optical Materials Solutions for Lighting. LED Lighting Product Selection Guide

Dow Corning Protection, Assembly and Optical Materials Solutions for Lighting. LED Lighting Product Selection Guide Dow Corning Protection, Assembly and Optical Materials Solutions for Lighting LED Lighting Product Selection Guide your ideas WE MAKE LED Headlamp Assembly Adhesives Moldable Silicones Reflective Coatings

More information

Processor Performance, Packaging and Reliability Utilizing a Phase Change Metallic Alloy Thermal Interface System

Processor Performance, Packaging and Reliability Utilizing a Phase Change Metallic Alloy Thermal Interface System Processor Performance, Packaging and Reliability Utilizing a Phase Change Metallic Alloy Thermal Interface System Chris G. Macris, Thomas R. Sanderson, Robert G. Ebel, Christopher B. Leyerle Enerdyne Solutions,

More information

c/bach, 2-B Pol. Ind Foinvasa Montcada i Reixac (Barcelona) SPAIN Tel FAX

c/bach, 2-B Pol. Ind Foinvasa Montcada i Reixac (Barcelona) SPAIN Tel FAX 1- What is 2- How does it work? 3- How do we make it? 4- Applications 5- Processing? WHAT IS? Thick aluminium based substrate, cladded in ED copper foil. Designed for an effective thermal dissipation and

More information

Smart Card Adhesive Excellence and Process Intelligence. Smart card

Smart Card Adhesive Excellence and Process Intelligence. Smart card Smart Card Adhesive Excellence and Process Intelligence Smart card adhesives manufacturer The worldwide leader in products for the smart card industry DELO supplies a comprehensive product range adapted

More information

Thermal Management Solutions. Created to perform when the heat is on

Thermal Management Solutions. Created to perform when the heat is on Thermal Management Solutions Created to perform when the heat is on Thermal Management Solutions Silicone & Non-Silicone Pastes Phase Change Materials Silicone & Non-Silicone Gap Pads RTVs and Bonding

More information

Thermal Management

Thermal Management your REACH OUT TO US Thermal Management www.richardsonrfpd.com THERMAL MANAGEMENT Richardson RFPD offers a wide range of thermal management products and services from Wakefield-Vette for applications utilizing

More information

Dow Corning Protection, Assembly and Optical Materials Solutions for Lighting. LED Lighting Product Selection Guide

Dow Corning Protection, Assembly and Optical Materials Solutions for Lighting. LED Lighting Product Selection Guide Dow Corning Protection, Assembly and Optical Materials Solutions for Lighting LED Lighting Product Selection Guide WE MAKE yourideas LED Headlamp Assembly Adhesives Moldable Silicones Reflective Coatings

More information

Packaging Technologies for SiC Power Modules

Packaging Technologies for SiC Power Modules Packaging Technologies for SiC Power Modules Masafumi Horio Yuji Iizuka Yoshinari Ikeda ABSTRACT Wide bandgap materials such as silicon carbide (SiC) and gallium nitride (GaN) are attracting attention

More information

Fundamentals of Sealing and Encapsulation

Fundamentals of Sealing and Encapsulation Fundamentals of Sealing and Encapsulation Sealing and Encapsulation Encapsulation and sealing are two of the major protecting functions of IC packaging. They are used to protect IC devices from adverse

More information

Low Pressure Molding Overview. Henkel Electronics

Low Pressure Molding Overview. Henkel Electronics Low Pressure Molding Overview Henkel Electronics Agenda 1 Technology 2 Process 3 Solutions 2 Agenda Low Pressure Molding Overview of Technology Definition Value Proposition Applications Processing Equipment

More information

Frequently Asked Questions about Platinum RTD Elements

Frequently Asked Questions about Platinum RTD Elements Frequently Asked Questions about Platinum RTD Elements Platinum RTD Specifications... 2 What is the difference between the IEC 60751 specification and the DIN EN 60751 specification? What is the difference

More information

THERMAL INTERFACE MATERIALS: TECHNOLOGIES, APPLICATIONS AND GLOBAL MARKETS. SMC071B April Andrew McWilliams Project Analyst ISBN: X

THERMAL INTERFACE MATERIALS: TECHNOLOGIES, APPLICATIONS AND GLOBAL MARKETS. SMC071B April Andrew McWilliams Project Analyst ISBN: X THERMAL INTERFACE MATERIALS: TECHNOLOGIES, APPLICATIONS AND GLOBAL MARKETS SMC071B April 2013 Andrew McWilliams Project Analyst ISBN: 1-56965-185-X BCC Research 49 Walnut Park, Building 2 Wellesley, MA

More information

Adhesives silicones solutions

Adhesives silicones solutions Bluesil Adhesives silicones solutions for electronic devices & electrical engineering www.bluestarsilicones.com Silicones solutions for on board electronics Silicones materials ensure that electrical and

More information

The Optimal Passive Thermal Management Soldering and Electrically-Isolating Power Semiconductors to Within 33-micron (1.3 mil) of The Heat Sink

The Optimal Passive Thermal Management Soldering and Electrically-Isolating Power Semiconductors to Within 33-micron (1.3 mil) of The Heat Sink The Optimal Passive Thermal Management ing and Electrically-Isolating Power Semiconductors to Within 33-micron (1.3 mil) of The Heat Sink Jim Fraivillig Fraivillig Technologies 3315 Toro Canyon Road Austin,

More information

ViscoTec Pumpen- u. Dosiertechnik GmbH. Adhesives & Chemicals

ViscoTec Pumpen- u. Dosiertechnik GmbH. Adhesives & Chemicals ViscoTec Pumpen- u. Dosiertechnik GmbH Adhesives & Chemicals ViscoTec ViscoTec. We are an international company situated outside of Munich specializing in the design of systems for pumping, dosing, applying,

More information

Economical aluminum substrates make light work of visible LED circuits

Economical aluminum substrates make light work of visible LED circuits Economical aluminum substrates make light work of visible LED circuits Advances in solid state light emitting diodes (LEDs) over the last several years have opened new applications for these devices. Traditionally

More information

Stockmeier Urethanes Stobicoll. Adhesives and sealants for industrial applications

Stockmeier Urethanes Stobicoll. Adhesives and sealants for industrial applications Stockmeier Urethanes Stobicoll Adhesives and sealants for industrial applications We hold the world together Maybe that s a bit of an exaggeration, but there is a kernel of truth there. Increasingly, in

More information

Multiple bonds in e-motors. Adhesives for E-Motors

Multiple bonds in e-motors. Adhesives for E-Motors Adhesives for E-Motors Multiple bonds in e-motors Magnet bonding Shaft bonding Bonding the stator to the housing Adhesives for e-motors DELO s adhesives for FAST PROCESSES (LIGHT FIXATION < 10 S) DB, DELO

More information

EPOXY POTTING & ENCAPSULATING COMPOUNDS

EPOXY POTTING & ENCAPSULATING COMPOUNDS ONE COMPANY MANY SOLUTIONS EPOXY POTTING & ENCAPSULATING COMPOUNDS AUTOMOTIVE AEROSPACE TRANSPORT MARINE MEDICAL TELECOMMUNICATIONS CONSUMER ELECTRONICS UTILITIES ISO 9001:2008 Registered Quality System

More information

Capstan drive units Mechanical handling rollers

Capstan drive units Mechanical handling rollers PRODUCT INFORMATION PROVISIONAL TECHNICAL DATASHEET 8/6/2013 Introduction MONOTHANE is a range of single component, ready formulated polyesterbased polyurethane elastomers, available in the hardness range

More information

Henkel Smart Chemistry Hub Event: Advanced Gasketing Solutions Madison Heights, May 17

Henkel Smart Chemistry Hub Event: Advanced Gasketing Solutions Madison Heights, May 17 Henkel Smart Chemistry Hub Event: Advanced Gasketing Solutions Madison Heights, May 17 Power Up! Sealing battery packs and electronic components Bill Brown Manager - Applications Engineering Agenda 1.

More information

Low Pressure Molding Overview. Henkel Electronics

Low Pressure Molding Overview. Henkel Electronics Low Pressure Molding Overview Henkel Electronics Agenda 1 Technology 2 Process 3 Solutions 2 February 25, 2016 Low Pressure Molding Overview Agenda TECHNOMELT Low Pressure Molding 1. Overview of Technology

More information

Building HDI Structures using Thin Films and Low Temperature Sintering Paste

Building HDI Structures using Thin Films and Low Temperature Sintering Paste Building HDI Structures using Thin Films and Low Temperature Sintering Paste Catherine Shearer, James Haley and Chris Hunrath Ormet Circuits Inc. - Integral Technology California, USA chunrath@integral-hdi.com

More information

Power Electronics Packaging Solutions for Device Junction Temperature over 220 o C

Power Electronics Packaging Solutions for Device Junction Temperature over 220 o C EPRC 12 Project Proposal Power Electronics Packaging Solutions for Device Junction Temperature over 220 o C 15 th August 2012 Page 1 Motivation Increased requirements of high power semiconductor device

More information

Selection and Application of Board Level Underfill Materials

Selection and Application of Board Level Underfill Materials Selection and Application of Board Level Underfill Materials Developed by the Underfill Materials Design, Selection and Process Task Group (5-24f) of the Assembly and Joining Committee (5-20) of IPC Supersedes:

More information

Lecture 7. Lecture 7. Characterization of Components. Cooling at Component Level. Cooling at Component Level. Cooling at Component Level

Lecture 7. Lecture 7. Characterization of Components. Cooling at Component Level. Cooling at Component Level. Cooling at Component Level Characterization of Components Hans Jonsson Heat flow from chip to heat sink - Thermal Component Models Interface resistance (Contact resistance) TIM Thermal Interface Materials Project assignment The

More information

Thermally Conductive Silicone with High Position Tack. Zheng Lu, Chris Verosky ASC Conference, Atlanta, GA, April 3-5, 2017

Thermally Conductive Silicone with High Position Tack. Zheng Lu, Chris Verosky ASC Conference, Atlanta, GA, April 3-5, 2017 Thermally Conductive Silicone with High Position Tack Zheng Lu, Chris Verosky ASC Conference, Atlanta, GA, April 3-5, 2017 Agenda 1. Background information 2. Thermal conductivity with particle packing

More information

POTTING & ENCAPSULATING

POTTING & ENCAPSULATING POTTING & ENCAPSULATING ASSEMBLY PRODUCTS 38 POTTING & ENCAPSULATING Potting and Encapsulating Compounds are used to provide mechanical reinforcement to housed assemblies, to fill large voids, and to protect

More information

fax

fax / tel. 2.33.61.16.26 www.elitaliaweb.it fax 2.26.26.1.9 info@elitaliaweb.it tel. 2.33.61.16.26 www.elitaliaweb.it fax 2.26.26.1.9 info@elitaliaweb.it TEL-M-SI ly and ly Conductive Silicone Foil TEL-M-SI

More information

The use of printed thermal transfer pastes to improve thermal dissipation on printed circuit boards

The use of printed thermal transfer pastes to improve thermal dissipation on printed circuit boards The use of printed thermal transfer pastes to improve thermal dissipation on printed circuit boards Characteristics, application, rationalization and cost saving potential, e g. in the field of LEDs and

More information

Adhesives, Inks and Encapsulants

Adhesives, Inks and Encapsulants Selector Guide Electronic Materials Series Adhesives, Inks and Encapsulants Printed Electronics Conductive Inks Non-Conductive Inks Stretchables Microelectronic Assembly Electrically Conductive Adhesives

More information

A Thermal Comparison of Power Device Mounting Technologies

A Thermal Comparison of Power Device Mounting Technologies A Thermal Comparison of Power Device Mounting Technologies Miksa de Sorgo Chomerics Div., Parker Hannifin Corporation. Woburn MA 01888 (mdesorgo@parker.com) This paper examines different power semiconductor

More information

What are the 3 ways in which energy can travel? Explain what. conduction is. Does conduction happen best in solids, liquids or gases?

What are the 3 ways in which energy can travel? Explain what. conduction is. Does conduction happen best in solids, liquids or gases? What are the 3 ways in which energy can travel? Explain what conduction is What type of materials are good conductors and what type of materials are bad conductors (good insulators)? Does conduction happen

More information

Selector Guide. Providing the Connections for your Success. Automotive ele c tronics

Selector Guide. Providing the Connections for your Success. Automotive ele c tronics Providing the Connections for your Success Selector Guide Automotive ele c tronics Conductive Adhesives - Materials for Harsh Environment Protection - Underfill Encapsulants Electrically Conductive Adhesives

More information

EPIC RESINS COMPOUNDS AND RESINS FOR INDUSTRY STRUCTURAL. adhesives

EPIC RESINS COMPOUNDS AND RESINS FOR INDUSTRY STRUCTURAL. adhesives EPIC RESINS COMPOUNDS AND RESINS FOR INDUSTRY STRUCTURAL adhesives EPIC RESINS quality AdhESIvES for your APPlICAtIoN At Epic Resins, we specialize in formulating quality adhesives that meet our customers

More information

High-quality connections for lighting fixtures

High-quality connections for lighting fixtures High-quality connections for lighting fixtures A shining example in terms of quality A rtificial lighting is an economic factor that is often underestimated. It turns night into day, makes it possible

More information

Joining Sub Platform

Joining Sub Platform Joining Sub Platform to Manufuture Joining A Core Element to Innovative and Sustainable Manufacturing Top Level Objectives Support the European 2020 Strategy in addressing the grand challenges in the areas

More information

Advanced Power Modules with AlN-Substrates Extending Current Capability and Lifetime

Advanced Power Modules with AlN-Substrates Extending Current Capability and Lifetime Advanced Power Modules with AlN-Substrates Extending Current Capability and Lifetime U.Scheuermann SEMIKRON Elektronik GmbH, Sigmundstraße 2, 9431 Nuremberg, Germany Tel.: ++49-911-6559-381 Fax: ++49-911-6559-414

More information

The perfect adhesive for any potting or encapsulation. Potting Compounds and Encapsulants Reliable Protection of Components

The perfect adhesive for any potting or encapsulation. Potting Compounds and Encapsulants Reliable Protection of Components Potting Compounds and Encapsulants Reliable Protection of Components The perfect adhesive for any potting or encapsulation The perfect product for your potting or encapsulation project Rigid potting compounds

More information

Potting Compounds and Encapsulants Reliable Protection of Components. The perfect adhesive for any potting or encapsulation

Potting Compounds and Encapsulants Reliable Protection of Components. The perfect adhesive for any potting or encapsulation Potting Compounds and Encapsulants Reliable Protection of Components The perfect adhesive for any potting or encapsulation potting or encapsulation project Rigid potting compounds and encapsula Application

More information

EIU 105 Types of Non-Electrical Insulation Materials

EIU 105 Types of Non-Electrical Insulation Materials Potting compound in Housing EIU 105 Types of Non-Electrical Insulation Materials Section 1 General Description 1.1 The categories and terms used in this general category are used in reference to Electrical

More information

HOME APPLIANCES START WITH SMART SOLUTIONS

HOME APPLIANCES START WITH SMART SOLUTIONS HOME APPLIANCES START WITH SMART SOLUTIONS 1 OUR CORE COMPETENCIES CONTENT Manufacturers of home appliances strive for aesthetic appeal and functionality as well as process optimization and innovation.

More information

Thermal Management Solutions. Created to perform when the heat is on

Thermal Management Solutions. Created to perform when the heat is on Thermal Management Solutions Created to perform when the heat is on Thermal Management Solutions Silicone & Non-Silicone Pastes Phase Change Materials Silicone & Non-Silicone Gap Pads RTVs and Bonding

More information

WIND TURBINE TECHNOLOGY IMAGINE NEW SOLUTIONS

WIND TURBINE TECHNOLOGY IMAGINE NEW SOLUTIONS WIND TURBINE TECHNOLOGY IMAGINE NEW SOLUTIONS SIKA PRODUCT SOLUTIONS IT IS NO COINCIDENCE THAT SO MANY OF THE WORLD S LEADING WIND TURBINE PRODUCERS RELY ON SIKA PRODUCTS AND SOLUTIONS. Wind turbines must

More information