RoHS Compliance Document
|
|
- Bethany Lawson
- 6 years ago
- Views:
Transcription
1 D2-Pak RoHS Compliance Document Contents: Solder Reflow 3. Tin Whisker Report
2 D2-pak (3 or 5 Lead) BOM % 3.8% Lead Frame Copper Die Attach Soft Solder Cu % 62.4% Sn % 0.1% Pb % 0.8% In % 0.0% Ag % 0.0% Sn % 0.2% over Nickel* Ni % 0.0% Total
3 D2-pak (3 or 5 Lead) BOM % 3.8% Lead Frame Copper Cu % 62.4% Sn % 0.1% Pb % 0.8% Sn % 0.0% Ag % 0.0% Sn % 0.2% over Nickel* Ni % 0.0% Total
4 D2-pak (3 or 5 Lead) BOM % 3.8% Lead Frame Copper Die Attach Soft Soldier Cu % 62.4% Sn % 0.1% Pb % 0.8% Sn % 0.0% Ag % 0.0% * Sn % 0.2% Total *Tin whisker mitigation strategy is 150 C anneal for 1 hour within 24 hours of plating. 3
5 D2-pak (7 Lead) BOM % 3.8% Lead Frame Copper Cu % 62.4% Sn % 0.1% Pb % 0.7% In % 0.0% Ag % 0.0% Sn % 0.2% Over Nickel* Ni % 0.0% Total
6 D2-pak (7 Lead) BOM % 3.8% Lead Frame Copper Cu % 62.4% Sn % 0.1% Pb % 0.7% Sn % 0.0% Ag % 0.0% Sn % 0.2% Over Nickel* Ni % 0.0% Total
7 D2-pak (Long Lead) BOM % 3.8% Lead Frame Copper Cu % 62.4% Sn % 0.1% Pb % 0.7% Sn % 0.0% Ag % 0.0% Sn % 0.2% Over Nickel* Ni % 0.0% Total
8 D2-pak (Long Lead) BOM % 3.8% Lead Frame Copper Cu % 62.4% Sn % 0.1% Pb % 0.8% Sn % 0.0% Ag % 0.0% Sn % 0.2% Over Nickel* Ni % 0.0% Total
9 D2-pak Test Definition Room Temperature Humidity Temperature Storage Humidity Unbiase d Temperature Cycling Test Conditions Inspection Interval Class 1 and 2 Products Total Duration Class 1 and 2 Products Maximum Whisker Length (µm) 30± 2 C/60± 3% RH 1000 hours 4000 hours 20 55± 3 C/85± 3% RH 1000 hours 4000 hours to 55 C to 80 to 95 C, air to air, 10 min soak, approx 3 cycles 500 cycles 1500 cycles 45 Tin Whisker testing per JESD201, Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finish Tin Whisker Results (number of failing whiskers) Test 1000 Hours 2000 Hours 3000 Hours 4000 Hours Room Temperature Humidity Storage 0/60 0/60 0/60 0/60 Temperature Humidity 0/60 0/60 0/60 0/60 Unbiase Test 500 Cycles 1000 Cycles 1500 Cycles Temperature Cycling 0/60 0/60 0/60 8
RoHS Compliance Document
D-Pak RoHS Compliance Document Contents: 1. 2. Solder Reflow 3. Tin Whisker Report D-pak BOM 1 Chip Silicon.713 Si 744-21-3.713 1% 1.9% Encapsulant Epoxy Resin.11419 Lead Frame Copper.244 Die Attach Soft
More informationTin Whisker Test Report
Tin Whisker Test Report The assessment of Pb-free termination finishes on TT Electronics resistors with regard to susceptibility to tin whisker growth 1 Introduction Tin whiskers are metallic filaments
More informationTin/Nickel Plated Leads Qualification Summary
5980 N. Shannon Road, Tucson, AZ 85741-5230 Phone (520) 690-8600 Fax (520) 888-3329 https://www.apexanalog.com ISO9001 Certified Tin/Nickel Plated Leads Qualification Summary Prepared by Mark Collingham
More informationTin Whisker Prevention with SnBi Plating
Tin Whisker Prevention with SnBi Plating Issei Fujimura, Manager of R&D Section No. 2, Ishihara Chemical Co., Ltd. 5-26 Nishiyanagiwara-cho, Hyogo-ku, Kobe, Hyogo 652-0806, Japan E. Jan Vardaman and Dr.
More informationThe Role Of Electroplates In Contact Reliability
The Role Of Electroplates In Contact Reliability W.H. Abbott Battelle-Columbus Abbott@battelle.org 10/24/02 1 Overview Electroplating Is A Process; i.e. It Should Not Be Viewed As Simply A Material The
More informationPulse White Paper Regarding RoHS Compliance
Pulse White Paper Regarding RoHS Compliance Table of Contents Executive Summary... 2 Background/History... 3 Materials Selection... 3 Testing/Validation... 4 Implementation/Conclusion... 5 References...
More informationSMC Lead Free and RoHS Compliance Document
SMC Lead Free and RoHS Compliance Document Contents: 1. Composition 2. Solder Reflow 3. TIn Whisker Report 4. RoHS Certification 5. Independent Laboratory Analysis http://www.irf.com/ehs/ SMC Component
More informationTSSOP-8 Lead Free and RoHS Compliance Document
TSSOP-8 Lead Free and RoHS Compliance Document Contents: 1. Composition 2. Solder Reflow 3. TIn Whisker Report 4. RoHS Certification 5. Independent Laboratory Analysis http://www.irf.com/ehs/ TSSOP-8 Component
More informationAllegro MicroSystems, Inc.
Allegro MicroSystems, Inc. Materials Declaration Report 4/30/2008 11:08:31AM Report ID: MDR4118LW1672JFTR Allegro Part #: A6841SLWTR-T B.O.M. ID: 106 Package Code: LW / LW Lead Count: 18 Assy Location:
More informationAnalysis of plating grain size effect on whisker
Journal of Mechanical Science and Technology 23 (2009) 2885~2890 Journal of Mechanical Science and Technology www.springerlink.com/content/1738-494x DOI 10.1007/s12206-009-0720-x Analysis of plating grain
More informationHumidity Effects on Sn Whisker Formation. ECTC NEMI workshop June 1, 2005 Dr. Marc Dittes, Dr. Pascal Oberndorff, Peng Su, Paolo Crema
Humidity Effects on Sn Whisker Formation ECTC NEMI workshop June 1, 25 Dr. Marc Dittes, Dr. Pascal Oberndorff, Peng Su, Paolo Crema Outline Overview on experimental approach Results from cross referencing
More informationAustralian Journal of Basic and Applied Sciences. Pb-Free Solder Ball Robustness Comparison under AC and TC Reliability Test
AENSI Journals Australian Journal of Basic and Applied Sciences ISSN:1991-8178 Journal home page: www.ajbasweb.com Pb-Free Solder Ball Robustness Comparison under AC and TC Reliability Test 1,2 Tan Cai
More informationThe Elimination of Whiskers from Electroplated Tin
The Elimination of Whiskers from Electroplated Tin by Masanobu Tsujimoto, Shigeo Hashimoto, Masayuki Kiso, Raihei Ikumoto,Toshikazu Kano and Genki Kanamori C. Uyemura & Co., Ltd. - Hirakata Japan & Don
More informationWhisker free tin Jan Feb 2012-stripped:Metal Tech Speaking Template USE THIS.qxd 2/24/ :07 AM Page 1
Whisker free tin Jan Feb 2012-stripped:Metal Tech Speaking Template USE THIS.qxd 2/24/2012 11:07 AM Page 1 BY GEORGE MILAD, NATIONAL ACCOUNTS MANAGER FOR TECHNOLOGY, UYEMURA USA, SOUTHINGTON, CONN. The
More informationPRODUCT/PROCESS CHANGE NOTICE (PCN)
3545 North First Street San Jose, CA 95134 USA PRODUCT/PROCESS CHANGE NOTICE (PCN) PCN Number: 06-07 Date Issued: December 13, 2006 Product(s) Affected: Products using TQFN/TDFN type packages Manufacturing
More informationTin Whisker Mitigation User Perspective. Joe Smetana (and inemi Tin Whisker User Group) inemi Tin Whisker Workshop, ECTC 2007
Tin Whisker Mitigation User Perspective Joe Smetana (and inemi Tin Whisker User Group) inemi Tin Whisker Workshop, ECTC 2007 Overview Pure Tin (and High Tin Content Alloy Pb-Free) Finishes are a reliability
More informationSMD RFI CLIP Data Sheet
1/14 Attn : Data Sheet - CONDITION : 1. 2. 3. 4. We approved the product as above. WRITE REVIEW APPROVAL ICT NAME S.P. HONG J.E. KIM S.K,JUNG SIGNATURE Supplier : Innochips Technology CO., LTD By President
More informationFuture Electronic Devices Technology in Cosmic Space and Lead-free Solder Joint Reliability
The 22nd Microelectronics Work Future Electronic Devices Technology in Cosmic Space and Lead-free Solder Joint Reliability Key Points (1) High Speed Solder Ball Shear Test (2) Relationship between Surface
More information2006 DMSMS Conference Pb-free Solder Technical Issues (Not Including Tin Whiskers)
2006 DMSMS Conference Pb-free Solder Technical Issues (Not Including Tin Whiskers) Dr. Stephan Meschter BAE Systems LEAP WG Technical Guidelines Handbook Leader Johnson City, NY Phone: 607-770-2332, Email:
More informationCurrent investigation focuses of inemi's Sn whisker committee. Peng Su, Ph.D. 2nd International Symposium on Tin Whiskers Tokyo, Japan April 24, 2008
Current investigation focuses of inemi's Sn whisker committee Peng Su, Ph.D. 2nd International Symposium on Tin Whiskers Tokyo, Japan April 24, 2008 Outline Committee Introduction Past achievements Current
More informationSn623-5T-E SOLDER PASTE
Sn623-5T-E SOLDER PASTE INTRODUCTION Singapore Asahi s solder paste Sn623-5T-E is a silver bearing paste to prevent silver migration and brittleness. It is formulated for fine pitch applications up to
More informationSome Examples of Whiskers. Tin-Based Alloys
Some Examples of Whiskers from Tin-Based Alloys Alternate Title: Sometimes Tin Whiskers Adverb Noun Verb -- Quote attributed to Lyudmyla y Panashchenko as Compiled by Jay Brusse/Perot Systems July 2009
More informationGreen Semiconductor Packaging: Addressing the Environmental Concerns of the 21st Century
Green Semiconductor Packaging: Addressing the Environmental Concerns of the 21st Century Green semiconductor packaging: Addressing the environmental concerns of the 21st century While integrated circuit
More informationEnvironmental Management and Materials Information
Environmental Management and Materials Information Product Content Information for: MAX3622CUE+ Links Qualifications Package Description Chemical Composition Detailed Package Component Data Qualifications
More informationEnvironmental Management and Materials Information
Environmental Management and Materials Information Product Content Information for: MAX3674ECM+T Links Qualifications Package Description Chemical Composition Detailed Package Component Data Qualifications
More information3M MetPak 2-FB Power Socket 2 mm 4/5-Row, Right Angle, Solder or Press-Fit Tail MP2 Series
6.50 Amps per contact End-to-end stackable Press or heat stake peg (solder tail) Futurebus+ compatible See the Regulatory Information Appendix (RIA) in the RoHS compliance section of www.mconnectors.com
More informationGREEN SEMICONDUCTOR PACKAGING
GREEN SEMICONDUCTOR PACKAGING Addressing 21st-Century Environmental Concerns Addressing 21st-century environmental concerns While integrated circuit (IC) designers and systems manufacturers have typically
More informationVarious Techniques for Reliability Estimation and Failure Analysis of Electronic Products and Components
JFE No. 13 2006 8 p. 97 102 Various Techniques for Reliability Estimation and Failure Analysis of Electronic Products and Components BAN Mitsuyuki SHIMAUCHI Yutaka JFE JFE JFE X IC Pb Abstract: JFE Techno-Research
More informationEnvironmental Management and Materials Information
Environmental Management and Materials Information Product Content Information for: MAX3637ETM+ Links Qualifications Package Description Chemical Composition Detailed Package Component Data Qualifications
More informationBecoming Lead Free. Automotive Electronics. Antonio Aires Soldering Technical Specialist Visteon Corporation - Palmela Plant
Automotive Electronics Becoming Lead Free Antonio Aires Soldering Technical Specialist Visteon Corporation - Palmela Plant 1 Agenda 1. Leadfree Electronics Drivers 2. Requirements 3. Areas of Impact 4.
More informationWhisker Generation Mechanism of Lead-free Soldered Joints
Whisker Generation Mechanism of Lead-free Soldered Joints Mutsumi YOSHINO Masaki SANJI Syuntaro IGURO Due to the environmental restriction of SOC (Substances of Concern) in Europe, the lead-free solder
More informationPlatform Flash PROM VOG48 Package Lead Finish Conversion to NiPdAu
Platform Flash PROM VOG48 Package Lead Finish Conversion to NiPdAu Qualification Report Xilinx is disclosing this Qualification Report (the Documentation ) to you solely for use in the development of designs
More informationApplication Report. Donald C. Abbott, Stu Grenney, Larry Nye, Douglas W. Romm... SLL Logic ABSTRACT
Application Report Whisker Evaluation of Pb-Free Component Leads Donald C. Abbott, Stu Grenney, Larry Nye, Douglas W. Romm... SLL Logic ABSTRACT Integrated circuits (ICs) with both tin-lead (SnPb) and
More informationDISCONTINUED. Replaced by
M DIN R-Form Plug Inverse Mount, Vertical, Solder Tail or Press-Fit Termination DIN 41612 Series Early mate late break (EMLB) grounding contacts for hot swapping Select load capability Expanded pin counts
More informationEffect of the Formation of CuO Flowers and SnO 2 on the Growth of Tin Whiskers on Immersion Tin Surface Finish
WVCARMEA 2014 ID-119 Effect of the Formation of CuO Flowers and SnO 2 on the Growth of Tin Whiskers on Immersion Tin Surface Finish @ WVCARMEA 2014 22-26 th SEPT 2014 Tin surface 2 Outlines 1. Introduction
More informationLPSC SiCap 100µm NiAu finishing - Assembly by soldering
General description This document describes the attachment techniques recommended by Murata* for their LPSC silicon capacitors on the customer substrates. This document is non-exhaustive. Customers with
More informationLEAD FREE ALLOY DEVELOPMENT
LEAD FREE ALLOY DEVELOPMENT Karl F. Seelig, VP of Technology AIM Cranston, RI. USA. kseelig@aimsolder.com Abstract. When lead-free solders were first introduced to the electronics industry in the early
More informationCopper & Copper Alloys CuZn40Pb2 (OF 2357)
Copper and Copper Alloys Page 1 of 6 no responsibility is taken for the correctness of this information 02/2014 Cu Zn Pb Sn Fe Mn Ni Al Si As Co Cr Others min. 57.0 Rem. 1.6 - - - - - - - - - - max. 59.0-2.2
More informationPb V LFH02-E INTRODUCTION SPECIFICATIONS
Pb V347 3-5LFH02-E NO CLEAN SOLDER PASTE INTRODUCTION Singapore Asahi has developed the Viromet* Series Lead Free alloys. Asahi s No Clean Viromet Lead Free Solder Paste V347 3-5LFH02-E, with a composition
More informationC27200 CuZn37 Industrial Rolled
C272 Alloy Designation EN DIN CEN/TS 13388 (2.321) CW58L JIS C 272 BS CZ 17 UNS C272 Brass Rolled Products KME offers a wide range of brass rolled products in the form of strips, sheets and discs in order
More informationTin whisker mitigation. research into mechanisms & strategies: part 1: effect of plating methodologies.
Loughborough University Institutional Repository Tin whisker mitigation research into mechanisms & strategies: part 1: effect of plating methodologies This item was submitted to Loughborough University's
More informationQuality and Reliability Report
Quality and Reliability Report Product Qualification MASW-007921 2mm 8-Lead Plastic Package QTR-0148 M/A-COM Technology Solutions Inc. 100 Chelmsford Street Lowell, MA 01851 Tel: (978) 656-2500 Fax: (978)
More information3M MetPak 2-FB Socket 2 mm 4/5-Row, Solder Tail or Press-Fit With Tail Cover, Right Angle MP2 Series
M MetPak 2-FB Socket End-to-end stackable Offset dual-beam contact minimizes insertion force Expanded pin counts Protective Push-Cap Monoblockable Press or heat stake peg 12 mm modular units Meets global
More informationQuality and Reliability Report
Quality and Reliability Report Product Qualification MAAM-008819 2mm 8-Lead PDFN Plastic Package QTR-0147 M/A-COM Technology Solutions Inc. 100 Chelmsford Street Lowell, MA 01851 Tel: (978) 656-2500 Fax:
More informationSnPb BGA Availability for High Rel Applications Supplier Perspective. Edgar R. Zuniga Texas Instruments September 28 th, 2006
SnPb BGA Availability for High Rel Applications Supplier Perspective Edgar R. Zuniga Texas Instruments September 28 th, 2006 33 Background On January 27, 2003, European Union passed "Restriction on Use
More informationCypress Semiconductor Mold Compound Qualification Report
Cypress Semiconductor Mold Compound Qualification Report QTP# 010601 VERSION 2.0 (G3) October 2004 28-44 Lead SOJ/20-32 Lead SOIC/28 Lead SNC s Sumitomo EME 6600HR Mold Compound, MSL3 Assembly CYPRESS
More informationSolder Alloy Evolution and Development
Solder Alloy Evolution and Development SMTA Boston November 4, 2018 Presented by Timothy O Neill, Technical Marketing Manager, AIM A Brief Review of Electronic Solders 1960 s to 2006 Tin/Lead (Sn/Pb) Solder
More informationLead Free Solder for Flip Chip
Lead Free Solder for Flip Chip Zhenwei Hou & R. Wayne Johnson Laboratory for Electronics Assembly & Packaging Auburn University 162 Broun Hall, ECE Dept. Auburn, AL 36489 USA 334-844-1880 johnson@eng.auburn.edu
More informationMQEC. Metal Alloy Low Resistance Resistor Specifications. 1. Scope: 2. Product Features: 3. Product Applications: a. LR1206 series. b. LR2010 series.
1. Scope: 1.1 This specification is covered following products: a. LR1206 series. b. LR2010 series. c. LR2512 series. d. LR2725 series. e. LR2728 series. 2. Product Features: 2.1 Ideal for all types of
More informationNew Pb-Free Solder Alloy for Demanding Applications. Presented by Karl Seelig, VP Technology, AIM
New Pb-Free Solder Alloy for Demanding Applications Presented by Karl Seelig, VP Technology, AIM Why REL? The evolution and expansion of electronics into more harsh operating environments performing more
More informationT/C stress resistant high reliability solder alloy SB6NX / SB6N. Patented by Panasonic
T/C stress resistant high reliability solder alloy X / Patented by Panasonic Sn 3.5Ag 0.5Bi 6.0In 0.8Cu Sn 3.5Ag 0.5Bi 6.0In X & solder alloy X alloy is Panasonic patented Conventional (Sn3.5Ag0.5Bi6In)
More informationNEMI Sn Whisker Project
NEMI Sn Whisker Project JISSO/PROTEC Forum Irina Boguslavsky, NEMI Consultant Japan May 15-16, 2003 Tin Whisker Committees Tin Whisker Test Standards Committee (Test Group) First committee formed Objective
More informationLead Free Component Qualification
EU Directive Comparison Lead Free Component Qualification TURI Lead Free Meeting Taunton, MA December 3, 2003 Dr. Robert D. Hilty, Tyco Electronics bob.hilty@tycoelectronics.com (+0) 77 986-3949 MS 40-09,
More informationXBSC/UBDC/UBSC/BBSC/ULSC 100 µm & 400 µm - Assembly by soldering
Assembly by soldering General description This document describes the attachment techniques recommended by Murata* for their pre-bumped and un-bumped silicon capacitors on the customer substrates. This
More informationFuture Electronic Devices Technology in Cosmic Space and Electroless Ni/Pd/Au Plating for High Density Semiconductor Package Substrate
JAXA 25 rd Microelectronics Workshop Future Electronic Devices Technology in Cosmic Space and Electroless Ni/Pd/Au Plating for High Density Semiconductor Package Substrate November 2, 2012 Yoshinori Ejiri
More informationPhysical. Electrical. Environmental
M MetPak 2-FB Inverse Header 2 mm 5-Row, Right Angle, Solder MP2 Series Three levels of early mate, late break (EMLB) sequencing or selective loading options Footprint compatible with standard Futurebus+
More informationResults from Whisker investigations and the corresponding conclusions
Lead free: Whisker Results from Whisker investigations and the Dr. Werner A. Hügel, Dr. Verena Kirchner, Moheb Nayeri, Dr. Lothar Henneken, and Rolf Keller Robert Bosch GmbH, Stuttgart, Germany 1 Motivation
More informationMurata Silicon Capacitors - LPSC 100µm NiAu finishing Assembly by Soldering. Table of Contents
Table of Contents Table of Contents...1 Introduction...2 Handling precautions and storage...2 Pad opening...3 Process Flow...5 Solder print material and stencil printing recommendations...6 Pick and Place...7
More informationAn Investigation of Whisker Growth on Tin Coated Wire and Braid
An Investigation of Whisker Growth on Tin Coated Wire and Braid Dave Hillman and Tim Pearson Rockwell Collins Cedar Rapids IA USA ddhillma@rockwellcollins.com Thomas Lesniewski Northrop Grumman Corporation
More informationThe objective of this document is to specify the chemicals characteristics and properties of the material Steel AISI Carbon Steel.
STEEL AISI - 2 Steel AISI 2. Carbon Steel. Carbon C.8.23 Manganese Mn.3.6 Phosphorus P -.4 Max Sulfur S -.5 Max FM-DO-CO-2 3/3/27 STEEL AISI - 862 Steel AISI 862. Carbon Steel. Carbon C.7.23 Silicon Si
More informationCopper & Copper Alloys CuZn31Si1 (OF 2270)
Copper and Copper Alloys Page 1 of 5 no responsibility is taken for the correctness of this information 02/2014 Cu Zn Pb Sn Fe Mn Ni Al Si As Co Cr Others min. 66.0 Rem. 0.1 - - - - - 0.7 - - - - max.
More informationALPHA OM-5100 FINE PITCH SOLDER PASTE
SM 797-7 ALPHA OM-5100 FINE PITCH SOLDER PASTE DESCRIPTION Cookson Electronics Assembly Material s ALPHA OM-5100, is a low residue, no-clean solder paste designed to maximize SMT line yields. The flux
More informationLead Free Tin Whiskering Study. Grayhill DIP Switches
Lead Free Tin Whiskering Study Grayhill DIP es May 11, 2004 Revision A TABLE OF CONTENTS 1. Introduction...3 2. Test Specification...4 2.1. Intent...4 2.2. Preconditioning...4 2.2.1. Wave Temperature Processing...4
More informationMaterials Declaration Form
Materials Declaration Form IPC 1752 Form Type * Distribute Version Sectionals * Material Info Subsectionals * Manufacturing Info * : Required Field 2 A-D Supplier Information Company Name * STMicroelectronics
More informationProduct Specification JUL 14 Rev. A1
Industrial SCSI Connector 1. Scope 1.1 Contents This specification covers the requirements for product performance, test methods and quality assurance provisions of SCSI Connector. 2. Applicable Documents
More informationA Component Supplier s Green Approach Texas Instruments
A Component Supplier s Green Approach Texas Instruments IPC/JEDEC Pb-free Conference Dallas, TX Dec 9, 2008 Mark Frimann 1 Texas Instruments & RoHS Nickel-Palladium-Gold RoHS Compliant Solutions (no Tin
More informationSnAg3.5 (CLF5013) Halide Free No Clean Core Wire
Pb SnAg3.5 (CLF5013) Halide Free No Clean Core Wire INTRODUCTION With implementation of stringent manufacturing process, Asahi has developed a wide range of wires with diverse alloys and flux types to
More informationEEE COMPONENTS LONG TERM STORAGE Long Term Storage Workshop ESA / ESTEC (7 th June 2016)
EEE COMPONENTS LONG TERM STORAGE Long Term Storage Workshop ESA / ESTEC (7 th June 2016) Gonzalo Fernandez Romero TÜV NORD GROUP June 2016 AEROSPACE & ELECTRONIC BUSINESS UNIT ALTER TECHNOLOGY GROUP: with
More informationAccelerated Tin Whisker Test Committee Update Phase 5 Evaluation
Accelerated Tin Whisker Test Committee Update Phase 5 Evaluation Heidi L. Reynolds, Ph.D. Project Chair ECTC Tin Whisker Workshop Reno, NV May 29, 2007 Tin whisker test committee is a microcosm of the
More informationAmphenol Amphenol Taiwan Corporation Sheet 1 of 7
Amphenol Amphenol Taiwan Corporation Sheet 1 of 7 Title: Part Number: Description: Micro SD Card Connectors Product Specification GTFP08 SERIES Micro SD Card Connectors push-push type Revisions Control
More information3M MetPak 2-FB Socket
M MetPak 2-FB Socket End-to-end stackable Offset dual-beam contact minimizes insertion force Molded guide fingers provide integrated alignment Alignment wafer for true position Mates with MP2-P inverse
More informationEnvironmentally Preferred Products
Environmentally Preferred Products Lead (Pb)-Free, RoHS Compliant Solution May 2006 Customer Communication Let s get clear about RoHS RoHS (EU Directive 2002/95/EC) The official Directive name is Restriction
More informationGlobal Supplier. of Soldering. and Brazing. Preforms
Global Supplier of Soldering and Brazing Preforms www.ametekmetals.c Responding quickly, precisely and efficiently to our customers needs Yes, we do. Our primary business at Coining is the fabrication
More informationSnAg3.0 (CLF5013) Halide Free No Clean Core Wire
Pb SnAg3.0 (CLF5013) Halide Free No Clean Core Wire INTRODUCTION With implementation of stringent manufacturing process, Asahi has developed a wide range of wires with diverse alloys and flux types to
More informationHTSC SiCap 400µm - NiAu finishing - Assembly by soldering
General description This document describes the attachment techniques recommended by Murata* for their HTSC silicon capacitors on the customer substrates. This document is non-exhaustive. Customers with
More informationTHE EFFECTS OF INTERNAL STRESSRS IN BGA Ni LAYER ON THE STRENGTH OF Sn/Ag/Cu SOLDER JOINT
THE EFFECTS OF INTERNAL STRESSRS IN BGA Ni LAYER ON THE STRENGTH OF Sn/Ag/Cu SOLDER JOINT C.H. Chien 1, * C.J. Tseng 1,2 T.P. Chen 1,3 1 Department of Mechanical and Electro-Mechanical Engineering, National
More informationNARROW PITCH (0.4mm) CONNECTORS P4S SERIES
FOR BOARD-TO-BOARD AND BOARD-TO-FPC CONNECTION AXT3, 4 NARROW PITCH (0.4mm) CONNECTORS P4S SERIES NEW 2. Strong resistance to adverse environments! Utilizes construction for high contact reliability. 1)
More informationProduct Documentation MS1V-T1K
Product Documentation Quartz Crystal Unit 32.768 khz February 2017 1/12 Rev. 1.0 2. Product Description The is a low frequency surface mount technology Quartz Crystal Unit that incorporates a tuning fork
More informationMaterials Declaration Form
Materials Declaration Form IPC 1752 Version 2 Form Type * Distribute Sectionals * Material Info Subsectionals * A-D Manufacturing Info * : Required Field Supplier Information Company Name * STMicroelectronics
More informationIBM Platform Symposium September 14-15, Artesyn s Approach to RoHS Compliance
IBM Platform Symposium September 14-15, 2004 Artesyn s Approach to RoHS Compliance RoHS summary Project implementation strategy Process development status Reliability test plan Reliability test status
More informationon the Sn Whisker Growth Propensity of Quattro/Dos Ball Grid Array (BGA) Platform Tin-plated Leadframes Solder-dipped Leads
Pulse White Paper on the Sn Whisker Growth Propensity of Pulse Electronic Component Terminals: Quattro/Dos Ball Grid Array (BGA) Platform Tin-plated Leadframes Solder-dipped Leads Colin Zhang, Reliability
More informationManufacturing Notes for RFFM8504
Manufacturing Notes for RFFM8504 The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ( RFMD ) for its use, nor for
More informationCertificate of non-use of The Controlled Substances
Certificate of non-use of The Controlled Substances Company name Product Covered Thyristor SOT-89 Package Issue Date It is hereby certified by, that there is neither RoHS (EU Directive 2011/65/EU)-restricted
More informationC27000 CuZn36 Industrial Rolled
C27 Alloy Designation EN DIN CEN/TS 13388 (2.335) CW57L JIS C 27 BS CZ 18 UNS Chemical Composition Weight percentage C27 Cu 63.5.. 65.5 % Zn Rest % Ni.3 % Sn.1 % Fe.5 % This alloy is in accordance with
More information3M HDC Header. Physical. Electrical. Environmental Vertical Mount, PCB/Backplane, Solder Tail or Press-Fit HDC Series
M HDC Header High density, up to 240 contacts single bay Early Mate Late Break (EMLB) grounding contacts for hot swapping Mates with three-row and four-row sockets RoHS* compliant. See the Regulatory Information
More informationCopper & Copper Alloys
Copper and Copper Alloys Page 1 of 6 No responsibility is taken for the correctness of this information 12/2016 Cu Zn Pb Sn Fe Mn Ni Al Si As Co Cr Others min. 58 Rem. - 0.1 0.35 1.8-1.4 0.6 - - - - max.
More informationUnique Failure Modes from use of Sn-Pb and Lead-Free (mixed metallurgies) in PCB Assembly: CASE STUDY
Unique Failure Modes from use of Sn-Pb and Lead-Free (mixed metallurgies) in PCB Assembly: CASE STUDY Frank Toth, and Gary F. Shade; Intel Corporation, Hillsboro, OR, USA {francis.toth.jr@intel.com, (503)-696-1546}
More informationSpecification ALLOYED STEEL FOR QUENCHING AND TEMPERING, HIGH STRENGTH All.steel f.quen.a.temp, h.str.
Class: Heat-treatable steel Specification 16-09 ALLOYED STEEL FOR QUENCHING AND TEMPERING, HIGH STRENGTH Class No.:11 JED 723 Previous Edition Abbreviated Title 15-07 All.steel f.quen.a.temp, h.str. 8
More informationEFFECT OF ANNEALING AND NICKEL UNDERPLATE ON SUPPRESSION OF TIN WHISKERS
The 5 th PSU-UNS International Conference on Engineering and 679 Technology (ICET-2011), Phuket, May 2-3, 2011 Prince of Songkla University, Faculty of Engineering Hat Yai, Songkhla, Thailand 90112 EFFECT
More informationHigh Performance STOL Alloys. Characteristics. Current Carrying Capacity. Density 8.9 g/cm³. Specific heat capacity J/(g K)
Alloy Designation High Performance STO Alloys EN - DIN CEN/TS 13388 - UNS Chemical Composition percentage Cu Rest % Ni 1.4.. 1.7 % Si 0.2.. 0.35 % Sn 0.02.. 0.3 % Zn 0.20.. 0.7 % Others 0.50 % This alloy
More informationC26800 CuZn33 Industrial Rolled
C268 Alloy Designation EN DIN CEN/TS 13388 CW56L JIS C 268 BS CZ 13 UNS Chemical Composition Weight percentage C268 Cu 66.. 68 % Zn Rest % Ni.3 % Sn.1 % Fe.5 % This alloy is in accordance with RoHS 22/96/CE
More informationHigh Performance Alloys. Characteristics. Stamped parts connectors Relay springs Semiconductor components. Density 8.8 g/cm³
Alloy Designation High Performance Alloys EN CuNi3Si DIN CEN/TS 13388 UNS Chemical Composition percentage Cu Rest % Ni 3 % Si.65 % Mg.15 % This alloy is in accordance with RoHS 22/96/CE for electric &
More informationCypress Semiconductor Qualification Report QTP# 97092VERSION 1.0 June, 1997
Cypress Semiconductor Qualification Report QTP# 97092VERSION 1.0 June, 1997 SST SONET/SDH Serial Transceiver CY7B952 SST is a trademark of Cypress Semiconductor Corporation SST SONET/SDH Serial Transceiver
More informationMaterials Declaration Form
Materials Declaration Form IPC 1752 Version 2 Form Type * Distribute Sectionals * Material Info Subsectionals * A-D Manufacturing Info * : Required Field Supplier Information Company Name * STMicroelectronics
More informationCDC Division FCI USA, Inc.
CDC Division FCI USA, Inc. Report EL-2005-07-046 CR Evaluation of Tin Whisker Growth, FCI Lead Free AIRMAX VS Header Connectors 2006 May 16 PURPOSE: Lead free AIRMAX VS header connectors were tested to
More informationSample Preparation for Mitigating Tin Whiskers in alternative Lead-Free Alloys
As originally published in the IPC APEX EXPO Conference Proceedings. Sample Preparation for Mitigating Tin Whiskers in alternative Lead-Free Alloys Mehran Maalekian Karl Seelig, V.P. Technology Timothy
More informationProduct Change Notification - GBNG-28HRUQ041
Product Change Notification - GBNG-28HRUQ041-12 Apr 2017 - CCB 2840 Initial No... http://www.microchip.com/mymicrochip/notificationdetails.aspx?pcn=gbng-28hruq0... Page 1 of 2 4/13/2017 Product Change
More information