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2 ANNEALSYS designs and manufactures Rapid Thermal Processing (RTA, RTCVD) Direct Liquid Injection (DLI-CVD, DLI-ALD) systems for research laboratories and companies for semiconductor, MEMS, nanotechnologies, photovoltaic and other applications. 2
3 We address the following processes : RTA: Rapid Thermal Annealing RTCVD: Rapid Thermal Chemical Vapor Deposition DLI-CVD: Direct Liquid Injection Chemical Vapor Deposition DLI-ALD: Direct Liquid Injection Atomic Layer Deposition 3
4 More than 240 customers more than 40 countries Worldwide sales and service support 4
5 Research cooperation SPEED SPEED (Silicon carbide power electronics technology for energy efficient devices) INAEL, ABB SCRC, CSIC-CNM, ENEL, Univ. Bremen, Univ. Oviedo, Norstelab, Ascatron, Univ. Nottingham, Infineon Technologies, Infineon Technologies Austria, TU München, Fraunhofer IISb, CVUT Praze, LU Hannover, Ingeteam and Annealsys DESPATCH Development of atmospheric plasma Enhanced SPatial ATomiC layer deposition (SALD) for application to silicon Heterojunction solar cells. LMGP, LTM, GREMI, INES and Annealsys 5
6 RTP and RTCVD Rapid Thermal Processing Rapid Thermal Chemical Vapor Deposition 6
7 RTP Processes Implant annealing Contact annealing Rapid Thermal Oxidation (RTO) Rapid Thermal Nitridation (RTN) Diffusion of dopants Densification and crystallization Selenization, sulfurization Etc. 7
8 RTCVD Processes CVD of graphene CVD of hbn Carbon nanotubes RTCVD of Si poly, SiO 2, SiN x 8
9 Substrate types Silicon wafers Compound semiconductor wafers GaN/Sapphire wafers for LEDs Silicon carbide wafers Poly silicon wafers for solar cells Glass substrates Metals Polymers Graphite and silicon carbide susceptors Etc 9
10 RTP / RTCVD systems AS-Micro: 3-inch RTP system for R&D AS-One: 4 and 6-inch RTP systems up to 1450 C AS-Premium: 156x156 mm² RTP system AS-Master: 200-mm RTP and RTCVD system Zenith 100: High temperature RTP / RTCVD system 10
11 Main features of Annealsys RTP and RTCVD systems Stainless steel cold wall chamber Low Temperature measurement system Proprietary fast digital PID temperature controller Multi zone cross lamp furnace (AS-Premium & AS-Master) Vacuum and gas mixing capability Same software for all systems Optional turbo pump and automatic pressure control 11
12 RTP and RTCVD systems Technology advantages Cold wall chamber: Reactor design: Furnace design: Less memory effects of the chamber Better process reproducibility Higher cooling rates Accurate temperature measurement (no lamp signal) No metallic contamination RTCVD capability Uniform gas distribution High vacuum capability High temperature capability Multi-zone control (AS-Premium and AS-Master) 12
13 3-inch RTP system for laboratories Features: Infrared halogen tubular lamp furnace with silent fan cooling Quartz tube chamber with water-cooled stainless steel flanges Room temperature up to 1250 C, up to 250 C/s Thermocouple control (optional pyrometer) Atmospheric and vacuum process capability Purge gas line with needle valve Up to 4 process gas lines with digital MFC PC control with Ethernet communication for fast data logging Optional turbo pump and automatic pressure control 13
14 Versatile 4 & 6-inch RTP system for R&D and low volume production Features : Floor standing system (reduced foot print) Infrared halogen tubular lamp furnace with silent fan cooling Stainless steel cold wall chamber technology Room temperature up to 1450 C Thermocouple and pyrometer control Atmospheric and vacuum process capability Up to 5 process gas lines with digital MFC, purge gas line PC control with Ethernet communication for fast data logging Optional turbo pump and automatic pressure control More than 150 units installed worldwide 14
15 156x156 mm² RTP system Multiple configurations Features: Heating from top, bottom or both sides Stainless steel square cold wall chamber Manual loading or cluster interface Room temperature up to 1300 C Thermocouple and pyrometer control Atmospheric and vacuum process capability Up to 8 process gas lines with digital MFC PC control with Ethernet communication for fast data logging Optional turbo pump and automatic pressure control 15
16 200-mm RTP and RTCVD system Up to 1450 C - R&D to production Features: Infrared multi zone lamp furnace with fan cooling Stainless steel cold wall chamber technology From room temperature to 1450 C, up to 200 C/s Thermocouple and pyrometer control Atmospheric and vacuum process capability Purge gas line and up to 6 process gas lines with digital MFC PC control with Ethernet communication for fast data logging Optional turbo pump and automatic pressure control Manual loading, cassette to cassette and cluster tool versions 16
17 RTP system from R&D to production Cassette to cassette loading Automatic loading of susceptor Batch processing capability up to 4 Compatible with many substrate types Manual or multi cassette loading configuration for single wafer or batch wafer annealing with susceptors 17
18 100 mm High Temperature RTP system Up to 2000 C process capability RTP and RTCVD processes Features: Low inertia tungsten heating elements Stainless steel cold wall chamber technology From 400 C up to 2000 C Pyrometer temperature control with fast PID controller Atmospheric and vacuum process capability Purge gas line and up to 8 process gas lines with digital MFC PC control with Ethernet communication for fast data logging Standard turbo pump and optional pressure control 18
19 DLI-CVD & DLI-ALD Direct Liquid Injection Chemical Vapor Deposition Direct Liquid Injection Atomic Layer Deposition 19
20 DLI-CVD / DLI-ALD Processes Simple and multi-metallic oxides Metals, nitrides and alloys III-V, wide band gap semiconductors 2D and 3D materials Etc. 20
21 Direct liquid injection vaporizers The machines are provided with Kemstream vaporizer Perfect vaporizer integration for unique process capabilities Advantages Perfect control of precursor flow (control of the liquid flow) Precursor tanks remains at room temperature Utilization of thermally unstable chemical precursors Utilization of low vapor pressure chemical precursors (solids) Utilization of diluted chemical precursors (safer utilization) Accurate control of stoichiometry and doping level Fast vapor switch on/off Coriolis liquid flow meters (no need for calibration) 21
22 DLI-CVD / DLI-ALD systems Technology advantages Reactors designed for R&D applications Low cost of ownership, low maintenance requirements Thermalized walls technology, deposition only on substrate No complicated shower heads Optimized integration of vaporizers Embedded Kemstream direct liquid injection vaporizers State of the art liquid panel for easy precursor management Reactor by-pass Multi process capability: CVD, ALD, pulse pressure CVD 22
23 DLI systems MC050: 2-inch DLI system with RTP capability MC100: 4-inch DLI system for R&D MC200: 200 mm DLI system with plasma capability 23
24 Laboratory 2-inch DLI system Multi-process capability : DLI-CVD, DLI-ALD, MOCVD, RTP, RTCVD Features: Lamp furnace for process up to 1100 C Thermocouple control with PID temperature controller Up to 6 direct liquid injection vaporizers Automatic downstream pressure control Process chamber vapor by-pass Up to 6 process gas lines with digital MFC and purge line PC control with Ethernet communication Optional glove box and turbo pump 24
25 100 mm (4-inch) DLI reactor for R&D DLI-CVD, DLI-ALD, Pulse Pressure CVD Features: Stainless steel thermally controlled chamber Rotating and heating substrate holder up to 800 C Substrate holder with vertical motion Up to 4 direct liquid injection vaporizers Process chamber vapor by-pass Thermocouple control with PID controllers Vacuum and pressure control Up to 6 process gas lines with digital MFC and purge line PC control with Ethernet communication 25
26 200 mm DLI reactor DLI-CVD, DLI-ALD, Pulse Pressure CVD Features: Stainless steel thermally controlled chamber Rotating and heating substrate holder up to 800 C Optional capacitive plasma Substrate holder with vertical motion Up to 4 direct liquid injection vaporizers Process chamber vapor by-pass Vacuum and pressure control Up to 8 process gas lines with digital MFC PC control with Ethernet communication Optional motorized loadlock 26
27 Customer support 27
28 Customer support Outstanding customer support Fast response time Remote ( and phone) rapid thermal process support Remote chemistry and process support included with DLI systems Efficient technical support thanks to software diagnostic features 28
29 Thank you for your attention 139 rue des Walkyries MONTPELLIER FRANCE Tel: +33 (0)
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