Technology by MOS. printed circuit board technology for the future

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1 Technology by MOS printed circuit board technology for the future

2 Technology by MOS 7th edition, Date of issue: November 2013

3 Table of contents Table of contents About MOS 8-9 Via filling The MOS Group Copper hole filling 34 SBU core Filled internal pltd borehole Express Service 13 Press-fit technology Stacked b PoolPlus Designs Flexible or elastic press-fit technology - Solid press-fit technology Service and advice 15 Thick copper & backplanes 41 Formats 15 IMS Base materials Layer structures Impedance test Materials - Versions - The single-layer IMS board - Multiple-layer IMS versions Impedance models Flex-rigid technology Layer structure with impedance-controlled conductors Design rules - External layers - Internal layers - Boreholes and microvias - HDI / SBU design - Coatings and screen printing - Mechanical Applications - Base materials - Design information - Procedure (example of a 2-layer flex-rigid with ZIF-connector) - Error patterns - Description of drilling geometry Environmental protection Contact Soldermask 28 Agents 87 Lacquers / Printing / Coatings 29 Notes i Final surfaces / Coatings 30-31

4 About MOS Quality by MOS MOS Electronic has almost three decades of experience in the production of printed circuits. Cooperation with our partners in the Far East enables us to supply all types of printed circuit boards in any quantity. From prototypes to mass production - All from a single source The process of developing prototypes often results in requirements which do not actually apply until mass production starts a long time later. Our claim that we are "always one step ahead" ensures that your projects today feature the technology of tomorrow. After all, our slogan is: Printed circuit board technology for the future ISO 9001: The quality standards of our products are an integral part of our corporate philosophy. Ever since the company was founded it has been our aim to maintain production at the highest possible technological standard. Continuous new investments and product improvements are one of the main reasons behind our success. Our express service was first launched at MOS in Express production jobs for prototypes but also for emergency production of large quantities and deliveries straight to the assembly belt have long been part of our everyday work - all in standard quality of course. Our wide range of references, for example from the motor industry, document our absolute reliability and professionalism, supported by our extremely flexible team composed of around sixty employees, most of whom have been with us for years. As a result of our experience and competence as a printed circuit board specialist we are also able to manufacture even complex products at our contract partners in the Far East. Our familiarity with their production systems and process enable us to create solutions for the cost-optimised mass production of critical products as early as the sample phase, working close with our partners. printed circuit board technology for the future 9

5 The MOS Group The MOS Group Take advantage of our long term experience with mass manufacturers from the Far East. We will take care of all the organisation for you: Inquiry Production selection Quotation Precision Quality High tech Order Data preparation Technical clarification Flexibility Speed MOS is on site in China MOS retains responsibility for quality Production in China Full final inspection by MOS Transport & Logistics Organisation by MOS Rework facility / Facility for emergency production Delivery / Warehousing We have been working with specific Asian mass manufacturers since 2005 which now enables us to supply printed circuit boards in all standard sizes. As a result of our experience and competence as a printed circuit board specialist we are also able to manufacture even complex products at our contract partners in the Far East. Our familiarity with their production systems and process enable us to create solutions for the cost-optimised mass production of critical products as early as the sample phase, working close with our partners. Before we deliver any products to our customers all the consignments from our partners are subjected to extensive receiving inspection and testing procedures. These cover at least the following points: Verification and validation of the products and the requisite documents against customer specifications Random testing: - Testing the quality of the through-contacts - Checking the mechanical dimensions - Layer thickness measurements (layer structure, copper, Ni/Au, tin, etc.) Archiving all documents including reserve samples and test documentation Special action if requested by customers 10 11

6 Surfaces Printing Internal layers 105 µm (min. conductor width 210 µm / min. spacing 340 µm) 50 IMS material (aluminium) Mechanics printed circuit board technology for the future NEW The products from the PoolPlus service are supplied by MOS Electronic GmbH. The offer is only valid after the data have undergone a final review. We reserve the right to refuse unsuitable projects for this offer. Our terms of sale and delivery available at are applicable. Prices are quoted exclusive of VAT. Terms of payment: 10 days 2%, 30 days net. Delivery ex-works. If you are interested or have any questions, please contact our Mr Jens Rosen (Sales, phone , jr@mos-electronic.de) or Mr Holdermann (CAM / Data, phone , cam@mos-electronic.de). Please send purchase orders / data to: poolplus@mos-electronic.de. We will also be delighted to provide you with a tailored quotation. Is your specification not listed? We will be delighted to provide you with a tailored quotation. Inquiries to: anfrage@mos-electronic.de Valid until 30 June 2013 The MOS Group Express Service Our manufacturers are at least certified to ISO 9001, TS and ISO We also have manufacturers for aerospace projects with AS9100 and Nadcap certification. In addition to products which are fully RoHS-compliant and lead-free processes, generally all products are also UL-licensed. Outsourcing In addition we have also been able to supply UL-licensed products for the Canadian market. We use an extremely professional procedure for selecting our partners. In addition to their classification by technology and batch size, the following factors also play a vital role: "Express services starts with a quotation." Production within just one working day - Lead time for HDI and flex-rigid by agreement Production in standard quality - Identical processes and machines - Identical IT and archiving - Transferability to mass production No restriction to PCB design Our major strength: Emergency production even for large batches Flexibility is a matter of course to us - for important orders even at weekends... Regular on site audits Constant quality monitoring Pool Plus Long term relationships Economical circumstances Contract assurance Do you require low cost samples in standard quality as quickly as possible? Try our PoolPlus service. We have at least one "second source" for every technology. During our regular site audits, in addition to qualification we also pay increased attention to the company's environmental policy. OPTIONS printed circuit board Layout and final thickness Conductor width / Spacing 70 µm min. 90 Final thickness > 1.00 mm to 2.00 mm +/- 10% No supplement Final thickness > 2.00 mm to 3.00 mm +/- 10% 60 Final copper thicknesses External layers 70 µm (conductor width / spacing 150 µm min.) No supplement External layers 105 µm (min. conductor width 140 µm / min. spacing 210 µm) 35 Internal layers 70 µm (min. conductor width 140 µm / min. spacing 210 µm) 35 MOS ELECTRONIC GMBH Thickness 1.00 mm, 1.60 mm or 2.00 mm No supplement Final copper thickness 35 µm or 70 µm No supplement DESIGN Thermal conductivity > 1.6 W/m*K (VT4A1) or 2.2 W/m*K (VT4A2) No supplement IMS material (aluminium) Basic price: 288 Pool Plus by MOS Please note for IMS materials: min. milling diameter: 2.00 mm. Min. hole diameter 1.00 mm. Supplements may apply if you require complex milling programs or lots of parts on the pool panel. Multiple-up (panel), v-cut 40 Multiple-up (panel), milled 60 Multiple-up (panel), v-cut + milled 80 Please note: our standard mills are 2.0 and 2.4 mm in diameter. Supplements may apply to thinner mills and complex milling programs. Entek (OSP) / chem. tin (1.0 µm min.) / chem. Ag 40 Chem. Ni/Au (3-5 µm Ni / µm Au) 80 2 layers 222» 4 working days 4 layers 444» 6 working days Lead time: 6 working days (Subject to material availability) 2-layer base material FR 4 TG 140 / (TG 150: supplement 15 ) Multilayer base material Isola IS400 (TG 150) IMS material (aluminium) Ventec VT4A1 or VT4A2 Final thickness 1.55 mm +/- 10% Final copper thickness on external layers 35 µm Our express service was first launched at MOS Description 6 layers 666» 8 working days 8 layers 888» 10 working days Legend ink (silkscreen) on each side (white) 60 Legend ink (silkscreen) on each side (not white) 90 Peelable mask, per side 90 Via-filler 90 Carbon printing 120 Colour change for solder stop (all colours possible, type: Carapace EMP110) 120 * Miscellaneous Final copper thickness on internal layers 18 µm or 35 µm Surface HAL lead-free Solder stop-off Peters Elpemer 2467 (green matt) Standard prepegs 1080 / 2116 / 7628 Standard cores (mm) 0.36 / 0.41 / 0.46 / 0.51 / 0.61 / 0.71 / 0.9 / 0.96 (bespoke structure by agreement) LAyouT in Express production jobs for prototypes but also for emergency production of large quantities and deliveries straight to the assembly belt have long been part of our everyday work - all in standard quality of course. Our wide range of references, for example from the motor industry, document our absolute reliability and professionalism, supported As a result of our experience and competence as a printed circuit board specialist we are also able to manufacture even complex products at our contract partners in the Far East. Our familiarity with our offer is for a pool panel measuring 417 x 570 mm. For smaller layouts the printed circuit board is reproduced with the best possible capacity of the available panel. The reproduction is subject to Impedance test 280 * Initial sample inspection report 180 * Production to IPC Class 3 (min. hole copper 25 µm) plus 10% on the total price Electrical testing Please note: a symmetrical structure is required. Conductor width/spacing 0.10 mm Min. residual root solder stop-off 0.10 mm Final diameter tolerance Plated drills < 6.00 mm +/ mm Non-plated drills < 6.00 mm +/ mm by our extremely flexible team composed of around sixty employees, most of whom have been with us for years. their production systems and process enable us to create solutions for the cost-optimised mass production of Number of pool panels Our offer relates to the size of a pool panel. However, we can also offer two or three pool panels within our critical products as early as the sample phase, working close with our partners. After all, our slogan is: printed circuit board technology for the future technical restrictions (spacing from PCB to PCB generally 8 mm). We guarantee an error-free output volume of at least 60%. If only one PCB will fit on the pool panel, at least two pool panels must be ordered (see optional price list). Different layouts per pool panel are not permitted as part of this offer. All products will be produced to ul standards and are RoHS-compliant. The production standard is IPC Class 2 (min. perforated copper 20 µm). Please see our supplement Electrical testing for 2 layers and IMS 60 Electrical testing for 4 or more layers included PoolPlus range. The supplements on the total price for one pool panel which we charge for this are as follows: For 2 pool panels 30% Routing (inner/outer) +/ mm Fast - low cost - Standard quality system for multiple uses and complex milling programs. For 3 pool panels 50% Pool panel 417 x 570 mm LegaL InfOrMaTIOn * The above supplement for multiple pool panels does not apply to these items We would be delighted to take you order if you wish to take advantage of our offer. Boreholes over 6.00 mm will be milled Not fast enough? Ask about our express service options. 12 i Have we caught your interest? Why not request our PoolPlus flyer today. poolplus@mos-electronic.de or by phone from Mr Jens Rosen on phone +49 (0)

7 Designs Service and advice One-sided with up to 50 layers (max. thickness 6 mm, when joined, up to 10 mm, max. 72 layers) HDI and SBU multilayers (4 + core + 4 max.) Blind, buried and microvias Stacked vias High frequency and impedance-controlled printed circuit boards Halogen-free printed circuit boards Backplanes Thick copper up to 400 µm Press-fit technology IMS / Metal core PCB Flex / Flex-rigid (also HDI) Via hole plugging and copper hole filling Soldermask in various colours RoHS compliance and UL listing Special materials (for example Rogers, Nelco, glass-reinforced polyimide, etc.) Special applications if requested by customers Technological advice Impedance calculations and layer structure suggestions Support with the development of new products Creation of alternative solutions and development to achieve product stability Use of synergy effects DFM (design for manufacturing) Workshops and technology days with bespoke contents Our products are manufactured to IPC A600G Class 2 (alternatively Class 3). Formats Standard format for one-sided and double-sided printed circuit boards: 580 x 427 mm² (useful area) Standard format for multilayer boards: 577 x 419 mm² (useful area) Standard format for SBU multilayer boards: 577 x 419 mm² (useful area) Max. size in MOS Group: 1200 x 700 mm² (useful area) Special sizes available on request 14 15

8 16 Base materials Different applications require different base materials. The following material types are used at MOS: Low, mid and high TG FR4 Materials for high frequency applications (for example Rogers, Nelco, etc.) Halogen-free materials Polyimide / Glass-reinforced polyimide Teflon Ceramic-filled materials IMS (aluminium, copper, brass, etc.) Special materials if requested by customers Base materials are classified by their thermal, electrical and mechanical properties. Thermal properties Glass transition temperature (TG) Delamination time (at 260 C and 288 C) Expansion properties (CTE in x, y, and z) Resistance in cycle tests Heat conductivity in W/mK Mechanical properties Elasticity Bending strength On the following pages we would like to give you more details about the standard materials we use. All the standard materials we use are suitable for lead-free soldering processes. Thermally conductive materials are listed in the special IMS section starting on page 42. i Electrical properties Dielectric constant (εr) Comparative tracking index (CTI) CAF resistance Surface resistance Loss angle Voltage strength Do you have any questions about base materials? Our Technology Team will be delighted to help (see page 86). Isola PCL-370HR Isola IS400 Ventec VT-481 Ventec VT-47 Nan Ya FR-4-86 UV BLOCK Base material (FR4) Grace MTC-97 Yes Yes Yes Yes Yes Yes Used for single and double-sided PCBs Used for multilayer boards: No No Yes Yes Yes Yes /21 /21 /97 /99 /126 /126 Typical IPC class IPC-4101C Inorganic Filler Inorganic Filler Inorganic Filler Inorganic Filler Not filled Not filled Filler Glass transition temperature (TG) 140 C 140 C 150 C 150 C 180 C 180 C Delamination time at 260 C 10 min min. > 60 min. > 60 min. > 60 min. > 60 min. Delamination time at 288 C 30 sec. 2-5 min. > 5 min. Approx. 25 min. > 30 min. > 30 min. Thermal decomposition (TD) Approx. 305 C. Approx. 320 C. Approx. 330 C. Approx. 345 C. Approx. 355 C. Approx. 340 C. Expansion in Z direction (before TG) 55 ppm/k ppm/k ppm/k 45 ppm/k 45 ppm/k ppm/k STII >215 No No No Yes Yes Yes Dielectric constant (εr) at 1MHz Loss factor at 1MHz CAF resistance No Yes Yes Yes Yes Yes RoHS-compliant Yes Yes Yes Yes Yes Yes UL listing Yes Yes Yes Yes Yes Yes 2 weeks Short lead time Short lead time From stock Available From stock Available From stock Available Availability (not guaranteed) 17

9 Layer structures Impedance models The properties of a printed circuit board are determined not least by its layer structure. The layer structure influences the impedances, for example. The following contains a list of standard prepreg types used by MOS: In practice a range of impedance calculation models are used depending on the specific requirements. The following provides details of four commonly used models Other types possible on request. The min. core thickness is 50 µm. Total thicknesses from 0.2 mm to 6.0 mm are possible (10.0 mm when joined). We recommend that symmetrical layer structures are used to prevent possible torsion and curvature. Coated microstrip Individual impedance-controlled conductors on the external layers. Main factors: - Distance from reference surface (H1) - Printed conductor width (W1) - Dielectric constant (εr) of the materials used Impedance test The impedances on the printed circuit board are primarily determined by the PCB layout, the layer structure and the dielectric constant of the materials used. The customer's impedance definitions are generally checked in terms of their feasibility depending on the other outline conditions using a calculation system (POLAR) and solutions are suggested if necessary. The tolerances are generally checked with a tolerance of +/-10%. However, tolerances of up to +/-5% are also possible to order. Edge coupled coated microstrip Impedance-controlled conductors in pairs on the external layers. Main factors: - Distance from reference surface (H1) - Printed conductor width (W1) - Printed conductor spacing (C3) - Dielectric constant (εr) of the materials used Offset stripline Individual Impedance-controlled conductors on the internal layers with two reference surfaces. 18 One factor which may result in undesirable differences in impedances is metallised copper layers (for example on the external layers) since they may feature irregularities in terms of their layer thickness. We recommend that impedance-controlled conductors are used on non-metallising internal layers. Main factors: - Distance from reference surfaces (H1 and H2) - Printed conductor widths (W1 and W2) - Dielectric constant (εr) of the materials used 19

10 Impedance models Layer structure with impedance-controlled conductors Edge coupled offset stripline Impedance-controlled conductors in pairs on the internal layers with two reference surfaces. Example Main factors: - Distance from reference surfaces (H1 and H2) - Printed conductor widths (W1 and W2) - Printed conductor spacing (S1) - Dielectric constant (εr) of the materials used Measuring an impedance signal 20 i Do you have any questions about layer structures or impedance testing? Our Technology Team will be delighted to help (see page 86). We will be delighted to provide you with a tailored layer structure suggestion. 21

11 Design rules Design rules 22 External layers Min. copper thickness (base + galv. copper) 32 μm Max. copper thickness (base + galv. copper) 400 μm Conductor width tolerance +/-10% Min. hole copper 20 μm / 25 μm Printed conductor: npltd borehole a b c pltd borehole BGA pad n k i f m e l h d Comments Others available on request BGA pad (diameter) 0.3 mm BGA pad pitch (one conductor between pad/pad) 0.5 mm BGA pad pitch (two conductors between pad/pad) 0.65 mm a Min. conductor width 70 μm Sample up to 50 µm b Min. conductor spacing 70 μm Sample up to 50 µm c Conductor pitch 140 μm Sample up to 100 µm d Conductor / Conductor spacing 70 μm Sample up to 50 µm e Conductor / Via pad spacing 70 μm Sample up to 50 µm f Conductor / Earth area spacing 70 μm Sample up to 50 µm g Conductor / BGA pad spacing 70 μm Sample up to 50 µm h Via pad / Via pad spacing 70 μm Sample up to 50 µm i Via pad / Earth area spacing 70 μm Sample up to 50 µm j Via pad / BGA pad spacing 70 μm Sample up to 50 µm k Earth area / Earth area spacing 70 μm l Distance between printed conductor and 200 μm Special technology up to 50 µm PCB edge m Distance between pad and PCB edge 200 μm Special technology up to 50 µm n Distance between earth area and PCB edge 200 μm Special technology up to 50 µm Special parameters available on request g j Internal layers Comments Min. core thickness 50 μm Min. copper lamination 9 μm Max. copper lamination 400 μm Conductor width tolerance +/-10% a Min. conductor width 70 μm Sample up to 50 µm b Min. conductor spacing 70 μm Sample up to 50 µm c Conductor pitch 140 μm Sample up to 100 µm d Conductor / Conductor spacing 70 μm Sample up to 50 µm e Conductor / Via pad spacing 70 μm Sample up to 50 µm f Conductor / Earth area spacing 70 μm Sample up to 50 µm g Via pad / Via pad spacing 70 μm Sample up to 50 µm h Via pad / Earth area spacing 70 μm Sample up to 50 µm i Earth area / Earth area spacing 70 μm Sample up to 50 µm j Distance between printed conductor and 200 μm Special technology up to 50 µm PCB edge k Distance between pad and PCB edge 200 μm Special technology up to 50 µm l Distance between earth area and PCB edge 200 μm Special technology up to 50 µm Special parameters available on request Printed conductor: npltd borehole a b c pltd borehole l i Please note: These design rules are our standard min/max values (for 18 µm base copper). If the copper thickness is increased or special materials are used the feasibility of the specified values becomes restricted. A review of the production documents is required for a final feasibility assessment. h f k e j g d 23

12 Design rules Design rules Boreholes and microvias Boreholes (Laser and mechanical) Feasibility a Min. hole diameter (pltd) Drilling Ø 0.2 mm / Final Ø 0.15 mm b Min. Via pad (pltd) Final Ø mm c Min. hole diameter buried via (pltd) Drilling Ø 0.2 mm / Final Ø 0.15 mm d Min. Via pad for buried vias (pltd) Final Ø mm e Min. via / via spacing (pltd) 0.30 mm f Min. hole / hole spacing (npltd) 0.15 mm g Min. via spacing (pltd) / conductor pattern 0.20 mm h Min. via spacing (pltd) / PCB edge 0.30 mm h Min. hole spacing (npltd) / PCB edge 0.30 mm i Min. diameter microvia (layer 1-2) Drilling Ø 0.1 mm / Final Ø 0.05 mm j Min. via-pad microvia (layer 1-2) Final Ø +0.2 mm HDI / SBU Design HDI / SBU Design Feasibility Max. sequential structures 4 + core + 4 Min. prepreg thickness for sequential structure PP106 (approx. 50 μm) Min. diameter microvia Drilling Ø 0.1 mm / Final Ø 0.05 mm Max. aspect ratio microvia 1:1 a Internal microvias Yes b Stacked via on through borehole Yes c Stacked via on microvia Yes d Copper hole filling for microvias Yes d Via hole plugging for microvias Yes e PID Yes f Microvia layer 1-2 (PP2116 / ~100 μm max.) Yes g Microvia layer 1-3 (PP1080 / ~ max.) Yes b g i f c e g d c b h a e d j f a 24 View of a section Please note: These design rules are our standard min/max values (for 18 µm base copper). If the copper thickness is increased or special materials are used the feasibility of the specified values becomes restricted. A review of the production documents is required for a final feasibility assessment. View of a section Do you have any questions about our design rules? i Our CAM Team will be delighted to help (see page 86). 25

13 Design rules Design rules Coatings and screen printing Soldermask / Layout printing Feasibility Soldermask thickness 16 μm Min. Edge coverage soldermask 6 μm a Min. opening soldermask / BGA pad 50 μm b Min. opening soldermask / SMD pad 50 μm c Min. residual root soldermask d Min. opening soldermask Pad μm e Min. line thickness for text in soldermask 100 μm g Min. line thickness for layout printing 100 μm h Min. registration tolerance for layout printing / conductor pattern 100 μm i Min. registration tolerance for layout printing / NDK borehole 3.0 mm 100 μm Min. registration tolerance for layout printing / NDK borehole 3.0 mm 150 μm Mechanics Mechanical machining Feasibility Min. tolerance borehole diameter +/-25 μm Min. tolerance end hole diameter +/-50 μm Min. tolerance milling +/-50 μm a Notch angle (V-cut) 30 V-cut / Conductor pattern registration tolerance +/-100 μm b Max. pos. tolerance top / bottom notch +/-50 μm c Min. tol. residual root for PCB thickness up to 1.2 mm / mm c Min. tol. residual root for PCB thickness over 1.2 mm / mm d Min. spacing skip notches (with chisel) 0.3 mm d Min. spacing skip notches (with notch cutter) 15 mm Notch cutter outlet (depending on notch depth) ~7 mm e Tolerance PCB thickness Generally +/-10% Pad Spacing d a Soldermask Registration Text style in soldermask e BSoldermask a c b Soldermask Residual root soldermask Layout printing NDK borehole i g R100 h Soldermask b c e Notch / V-cut Registration tolerances Standard Limit values Pltd borehole to conductor pattern +/-100 μm +/-50 μm Npltd borehole to conductor pattern +/-150 μm +/-100 μm Milling for conductor pattern +/-150 μm +/-100 μm Soldermask to conductor pattern +/-100 μm +/-50 μm Layout printing to conductor pattern +/-100 μm +/-100 μm Screen printing to conductor pattern +/-200 μm +/-150 μm d V-Cut Skip notches 26 Please note: These design rules are our standard min/max values (for 18 µm base copper). If the copper thickness is increased or special materials are used the feasibility of the specified values becomes restricted. A review of the production documents is required for a final feasibility assessment. Do you have any questions about our design rules? i Our CAM Team will be delighted to help (see page 86). 27

14 Soldermask Lacquers / Printing / Coatings We use Peters Elpemer 2467 and Carapace EMP110 soldermask from Electra as standard. These coatings are applied by spray. Photodefinable Maximum resolution (up to 50 µm) Aqueous-alkaline developable TWT cycle resistance (temperature cycle test) Very good resistance in galvanic and chemical baths Compatible with lead-free soldering processes Excellent edge coverage RoHS compliance and UL listing Complies with IPC-SM-840 C, Classes H and T Various colours are possible and it is also possible to produce multicoloured PCBs. The coatings can be characterised as follows: Soldermask in various colours (Standard: Peters Elpemer 2467 / Electra Carapace EMP110) Component printing Service printing Soldermask Carbon printing Via filler printing Flux stop coating Silver conductive coating Heatsink coating Soldermask Elpemer 2467 EMP110 Temperature shock Classes H and T Class H Disruptive strength kv/mm 134 kv/mm Dielectric constant (εr) at 1MHz The "Pink Circuit Board" MOS Electronic has been supplying soldermask in every conceivable colour for many years. ELPEMER SD 2431 HG (magenta colours) supplied by Peters is new at MOS. The initial colour samples caused a great deal of discussion when Peters appeared at the Productronica 2011 exhibition in Munich. "Like our other colours, this product features high colour stability. The special magenta colour was developed at the request of MOS Electronic. The aim of MOS is to highlight its corporate design to an even great extent in its product portfolio. Magenta - a colour than stands for quality. (Source: LPinfos 3/2011, customer journal published by the PETERS Group) 28 Do you have any questions about soldermask? i Our Technology Team will be delighted to help (see page 86). 29

15 Final surfaces / Finishes Final surfaces / Finishes 30 HAL lead-free (hot air tinning) Solder bath: HAL-Sn99Ag+ Coating thickness 1-30 µm Good soldering properties Lengthy storage life (>12 months) Not suitable for very fine textures No bonding capacity Poor planarity Storage life: 12 months Chemical Sn Process: Atotech (standard) and Ormecon possible Min. coating thickness 1.0 µm Good soldering properties Planar surface Narrow process window for soldering processes Restricted storage life Storage life: 6 months Chemical Ag Coating thickness µm Good soldering properties Bondable Planar surface Low processing temperature (approx. 50 C) Airtight storage required Storage life: 6 months Chemical Ni/Au Coating thickness 3-5 μm Ni, μm Au (soldering and US Al wire bonding) Coating thickness 3-5 μm Ni, μm Au (soldering and US Au gold wire bonding) Good soldering and bonding properties Good storage properties High process temperatures Storage life: 12 months Chemical Ni/Pd/Au Palladium coating thickness µm Can be soldered and bonded TS / US wire bonding possible Wide process window Good storage properties Planar surface High cost Storage life: 12 months Organic copper passivation (OSP / Entek) High planarity Good storage properties Low cost High process temperatures Non-bondable Storage life: 6 months HAL leaded Coating thickness 1-30 µm Good soldering properties Low process temperatures Good storage properties Not suitable for very fine textures Non-bondable No RoHS compliance Poor planarity Storage life: 12 months Other surfaces Galvanic gold (for example plug gold) Galvanic nickel Soldering paints Reductive gold Other surfaces to order Do you have any questions about surfaces or finishes? i Our Technology Team will be delighted to help (see page 86). 31

16 Via filling Via filling Via filling to IPC 4761 If there is noting in the PCB specification, the residual rings of the vias, as long as they are not exposed for data purposes, are covered with soldermask without filling the vias, MOS Electronic can provide several via filler types to comply with IPC Please note: Types III, V and VI are not used as standard by MOS. Depending on the manufacturer, however, other via filler types may be preferred by other companies in the MOS Group. Applications Plugging and metallising external through-contacts (Via in pad technology) This applications allows vias to be placed directly on a pad. The plugging process prevents air inclusions, for example. Can also be used for blind boreholes. Copper thickness in the sleeve: 15 μm min. (standard). Copper cover: 10μm min. (standard, the base copper thickness may have to be reduced). IPC 4761 Type IV: Plugged and covered via Filled pltd borehole Non-filled pltd borehole Base material The via is sealed on one side (Type IV a) or on both sides (Type IV b) with a via filler print using the screen printing method before the soldermask process. The via filler print consists Single-sided via filler print of the same contents (predominantly resin) as the soldermask. Vias filled using Type IV are gas-tight, their surfaces are not 100% planar. Double-sided via filler print Plugging internal boreholes (buried vias) Unfilled internal vias can cause sinks on the external layers of air inclusions, for example. This can be prevented by plugging the buried vias. Prepreg Base material Base material Prepreg Filled internal pltd borehole SBU core Filled internal pltd borehole IPC 4761 Type VII: Filled and capped via As a result of the ever increasing density of connections, so-called via hole plugging has become a key process in SBU technology. Both blind boreholes and through boreholes can be sealed with no air bubbles (also sequentially / partially). The sealed boreholes can be metallised as an option. Hole diameters of mm with an aspect ratio of max. 1:8 are possible (special sizes to order). Plugging and metallising internal boreholes (buried vias) The metallising process enables blind vias to be stacked (stacked vias). Prepreg Stacked blind via Filled internal pltd borehole SBU core Filled internal pltd borehole Prepreg Stacked blind via 32 33

17 Via filling Press-fit technology A white plugging paste is used for the via hole plugging process. Its properties are as follows: Good adhesion between copper and paste even when affected by temperature Good adhesion of copper, dielectrics and photoresist No air inclusions in the paste TG > 140 C CTE < 50 ppm (below TG) No shrinkage during curing Solder bath resistance to IPC-SM-840 C UL listing, RoHS compliance 34 Copper hole filling We can provide copper-filled blind vias in addition to via filling to IPC Copper hole filling is possible for hole diameters from 70 μm to 150 μm (microvias, aspect ratio 1:1 max.). The benefits over to via hole plugging are as follows: Greater stability No mechanical stress on the surface (no grinding process) Copper layer in the sleeve > 25 μm since only one metallising process is required Higher TG (TG depends on the base material used) i Do you have any questions about via filling or copper hole filling? Our Technology Team will be delighted to help (see page 86). Press-fit technology is a technology for solder-free electrical connections between components and printed circuit boards. The press-fit pin is pressed into an interlayer connection borehole. There are two types of press-fit technology which differ by the way in which the press-fit forces are absorbed. Parameters for the printed circuit board Drilling or milling tolerances Tolerance of the final hole diameter Copper sleeve Final surface Thickness of the PCB and copper thickness In flexible or elastic press-fit technology the forces are absorbed by the pressfit pin. If solid press-fit pins are used, the retaining force is created by the deformation of the copper sleeve. Both methods produce a gas-tight, electrical connection. Benefits of press-fit technology No thermal stress on the printed circuit board or modules which have already been fitted Gas-tight connection Can be repaired No solder bridges No flux residues and therefore no cleaning required No additional fastening of the components required 35

18 Press-fit technology Press-fit technology Flexible or elastic press-fit technology Solid press-fit technology Pins with a recess in the press-in zone are used for flexible press-fit technology. The pin has a larger diameter at this point than the interlayer connection borehole. The recess creates a spring effect which in turn produces the retaining force of the press-in connection. The main criterion for a good press contact for the printed circuit board is primarily the tolerance of the final hole diameter (typically / depending on manufacturer). The copper sleeve should have a thickness of at least 25 µm (possibly plus the final surface, see data sheet from the component manufacturer). Chemical Sn is recommended as the final surface. Applications For example plug connectors for signal distribution, not for high current applications. Diameter of the metallised hole Ø /-0.06 mm min. 25 μm Cu In contrast to flexible press-fit technology the pin is solid (generally with a rectangular or square design). The press-fit pin has a larger circumferential diameter than the interlayer connection borehole. During the pressing in process the copper sleeve in the PCB is deformed which creates the press contact and the gas-tight electrical connection. Example of solid press-fit technology Würth Elektronik power elements The main criterion for a good press contact for the printed circuit board is primarily the tolerance of the borehole diameter before plating and compliance with the specified copper thickness in the sleeve. Chemical Sn is recommended as the final surface. A single press-fit pin typically has a retaining force of > 100 N. Ø ,03 min Ø ±0.05 min. 30µm copper max. 60µm Würth Elektronik power elements Requirements for the printed circuit board (hole parameters) Section 36 Properties High requirements on the PCB in terms of drilling diameter ( / mm) and hole copper (min. 30 µm / max. 60 µm) High current capacity (>300 A) High resistance to vibrations and dirt Mechanically more stable compared to solder connections, high mechanical stresses possible (torques, etc.) 37

19 Press-fit technology Press-fit technology Specific requirements for the printed circuit boards Printed circuit boards must satisfy the following specifications for processing power elements from Würth Elektronik: The current capacity of the power elements must always be regarded in the context of the system as a whole since it depends on the design and pin layout of the power elements and the layout of the printed circuit board. The tests conducted on them showed that, for example, the combination of "2-layer 70 µm final copper PCB" and "Power One, 20 pins, all-round" can withstand currents of up to 300 A. Würth Elektronik is an all-round specialist in press-fit technology. This is backed by more than 25 years of expertise, lots of in-house developments, patents and experience in processing all conventional press-in zones from flexible and knurled to square or rectangular. Würth Elektronik supplies a wide range of power elements with press-fit technology. They are used for the supply and distribution of high currents in systems based on printed circuit boards. They are also ideal for use as connection elements for fuses, IGBTs, switches and cables on the printed circuit board or as connection elements from PCB to PCB or PCB to housing. Power elements are available in various designs whose design and dimensions can be configured to suit specific needs. The solid power elements are available in the form of single-piece (PowerOne), two-piece (PowerTwo) or plug-in (PowerRadsok, PowerLamella or PowerBasket) power elements. The punches PowerPlus and Power- Plus SMD power elements and the flexible PowerFlex power elements round off the range. Würth Elektronik ICS GmbH & Co. KG Intelligent connecting systems MOS Electronic GmbH printed circuit boards have been successfully qualified by Würth Elektronik for processing Würth Elektronik power elements. The satisfy the required printed circuit board specifications and have passed the current capacity tests

20 Press-fit technology Thick copper & backplanes Example of solid press-fit technology - Broxing power clamps Application and capabilities The press-fit pins have a round, serrated shape so that the entire contact surface area of the copper sleeve is available for contacting purposes. Broxing power clamps for press-fit technology are available in a range of versions. The press-fit boreholes for the B, N and L series can be fully drilled. However, the H and D series require pressfit boreholes with a diameter of up to mm which means that they cannot be drilled any further. MOS Electronic has developed a special, reliable process for these requirements which allows compliance with the tolerance and coating thickness requirements to be guaranteed. Chemical Sn (recommended), HAL or chemical Ni/Au may be used as the final surface. Press-fit elements are often used for applications relating to signal distribution, power consumption and high current applications. MOS Electronic has a wide range of productions and massive experienced in the production of high compatibility printed circuit boards. The MOS Group (Far East) can also provide all technologies. Product features Printed circuit board thickness up to 6 mm, up to 10 m within the MOS Group Copper thicknesses of up to 400 µm are possible Max. PCB size: 580 x 427 mm (1 and 2 layers) or 577 x 419 mm (multilayer), 1200 x 700 mm within the MOS Group, special sizes available on request. Design rules for thick copper Properties Durable, breakable connection using high current contact elements High current applications for 100 to 600 A using connection plates allows current of well over 1000 A to be transferred to the printed circuit board. High requirements on the PCB in terms of drilling and milling diameter (+/ mm) and hole copper (min. 25 µm / max. 45 µm) Lamination Base copper Min. conductor width Min. distance 70 µm 140 µm 210 µm 105 µm 210 µm 340 µm 140 µm 280 µm 400 µm 210 µm 420 µm 500 µm 400 µm 800 µm 700 µm Special parameters available on request The layer structure and copper distribution play a major role in thick copper applications in terms of dimension stability and preventing delamination. We will be delighted to advise you personally on the subject of product design. 40 i Do you have any questions about press-fit technology? Our Technology Team will be delighted to help (see page 86). i Do you have any questions about thick copper and backplanes? Our Technology Team will be delighted to help (see page 86). 41

21 IMS IMS A solid aluminium or copper plate is generally used as the metal substrate. The surface and hole walls (if necessary) of the metal are coated with a layer of insulation. Thermally conductive prepregs (which contain ceramic) are generally used as the dielectric. This gives the product high thermal conductivity (or fast temperature spread) combined with good electrical insulation. The classic version is a single-sided base material with a metal substrate on the underside. However, 2 or multiplelayer versions with interlayer connections are also possible (metal substrate on the inside or outside. Properties High thermal conductivity Low z-axis expansion High mechanical strength Low moisture absorption Benefits of copper over aluminium The physical properties of copper are better suited to mixed structures in terms of its coefficient of expansion and elasticity. Higher thermal and electrical conductivity Higher voltage strength Surfaces suitable for soldering can be applied Printed circuit boards with a metal core are enjoying increasing popularity wherever high temperatures must be dissipated through the PCB, for example for LED and high power applications. The following rule of thumb applies for LED applications: A rise in operating temperature by 10 C means 50% shorter service life. However a metal core can also be extremely beneficial for high mechanical stresses or high requirements relating to dimensional stability

22 IMS IMS Materials All IMS materials are pressed in-house by MOS, no prefinished materials are used as standard. This ensure maximum flexibility in the material configuration. The dielectrics used have heat conductivity values between 1.6 and 4.2 W/mK (for comparison: W/mK on the standard FR 4). Aluminium or copper in thicknesses between 0.4 mm and 3.0 mm (> 3.0 mm on request) is generally used as the metal substrate, but other substrates such as brass as also possible. Copper is recommended for multiple-layer applications as a result of the "proximity" of the physical properties to the PCB. As a result of high raw material prices and high weight, however, aluminium is typically used. Consideration of possible bending radii using the VT-4B3 as an example The dielectrics without glass fabric (VT-4B3 and VT-4B5) are suitable for bending applications. Possible bending parameters for the VT-4B3 dielectric are shown in the following: Bending angle 30 Bending angle 60 Dielectric Ventec VT-4A1 Ventec VT-4A2 Bending angle 90 Bending angle 180 Thickness of the dieletric in μm Therm. conductivity 1.6 W/mK 2.2 W/mK Therm. impedance (in C*in²/W) Glass fabric Yes Yes Bending tool Bending diameter Error pattern Dielectric Ventec VT-4B3 Ventec VT-4B5 Thickness of the dieletric in μm Therm. conductivity 3.0 W/mK 4.2 W/mK Therm. impedance (in C*in²/W) Glass fabric No No The bending process must always be carried out in controlled conditions using a bending tool so that the copper is not damaged (layout side)

23 IMS IMS Bending diameter (mm) 9 30 Bending diameter (mm) Aluminium Dielectric Copper 1.0 mm 1.0 mm 100 μm 1.5 mm 1.5 mm 100 μm HTE 0.4 mm 0.5 mm 1.0 mm 1.5 mm 1.0 mm Super HTE Aluminium Dielectric Copper 1.0 mm 1.0 mm 100 μm 1.5 mm 1.5 mm 100 μm HTE 0.4 mm 0.5 mm 1.0 mm 1.5 mm 1.0 mm Super HTE Bending diameter (mm) Bending diameter (mm) Aluminium Dielectric Copper 1.0 mm 1.0 mm 100 μm 1.5 mm 1.5 mm 100 μm HTE 0.4 mm 0.5 mm 1.0 mm 1.5 mm 1.0 mm Super HTE Aluminium Dielectric Copper 1.0 mm 1.0 mm 100 μm 1.5 mm 1.5 mm 100 μm HTE 0.4 mm 0.5 mm 1.0 mm 1.5 mm 1.0 mm Super HTE

24 IMS IMS Designs In general all technologies which are familiar from conventional printed circuit boards can be used. However, you should know that the metal substrate must initially be insulated for interlayer connections, for example, so as not to short circuit the entire system. There are restrictions for the mechanical machining. Possible special techniques for IMS boards include blind and buried vias, for example. To achieve even better heat dissipation, partial cavities (cleared or copper and prepreg) may be inserted to connect components which develop high temperature direct to the metal substrate. The component may be connected to the higher copper for this technology, for example, using a bonding process. In the event of space problems, deep cuts into the metal substrate may be made and then insulated. Combination with flexible materials is also possible. The single-layer IMS board With single-layer IMS boards it should be ensured that the hole walls of boreholes through the metal substrate are exposed, or in other words are not insulated. Although insulation is feasible, it is also very expensive. Cavity Final surfaces OSP / Entek (recommended) HAL lead-free / leaded (do not use HAL for multiple-layer structures) Chem. Sn Chem. Ag Chem. Ni/Au Copper Prepreg / Insulation layer Metal substrate The single-sided IMS board is the classic version on which the metal substrate on the underside is exposed. A tool with 1.0 mm should be selected as the minimum borehole diameter. The smallest cutter which can be used as standard should not be smaller than 2.0 mm. Special parameters are possible subject to certain conditions on request. Other surfaces available on request 48 1-layer IMS board with cavity 49

25 IMS IMS Multiple-layer IMS versions To enable multiple-layer IMS versions to have interlayer connections without connecting the metal substrate, a layer of insulation should be applied to the hole walls after the preceding drilling process. The actual interlayer connection can be made after the layer of insulation has been applied. The following parameters must be used for the printed circuit board design: Examples of multiple-layer structures 2-layer structure with metal core 4-layer structure with metal core a b c d 2-layer structure with external metal substrate acting as heat conduction plate 1-layer flexible printed circuit board with metal reinforcement Copper Prepreg / Insulation layer Metal substrate Parameter Recommended Limit value a 1.20 mm 1.00 mm Aspect Ratio a Max. 1:1 Max. 1:1 b 0.40 mm 0.30 mm c 0.50 mm 0.30 mm d 1.40 mm 1.20 mm Min. Ø NDK borehole 1.00 mm 1.00 mm Smallest cutter 2.00 mm 2.00 mm Special parameters available on request Insulation layer Cu sleeve Section of a metallised borehole with an insulation layer Prepreg Aluminium Legend Copper Prepreg / Insulation layer Metal substrate Polyimid FR4 Adhesive 50 51

26 IMS Flex-rigid technology Copper and aluminium cores can also be placed in direct contact for excellent heat dissipation or an electrical connection to the metal substrate. Applications Dielectric Aluminium Copper Cu sleeve Copper Aluminium 52 Other heat dissipation methods In addition to using IMS materials, there are other methods of dissipating heat. Radiation Convection Heat conduction (external coolers, heatsinks, copper inlays, heat dissipation through thick copper or thermal vias) The range of versions can also be combined. i Do you have any questions about IMS boards? Our Technology Team will be delighted to help (see page 86). Flex-rigid Flexibility for all applications Flexible printed circuit boards are now widely regarded as established. The main customers for flexible circuits are industries such as automotive, telecommunications, computer & peripherals, sensor technology, mechanical engineering, medical electronics and aerospace. Benefits over cable solutions - Great long term reliability - Lower weight and less space - High flexibility - Lower costs for assembly work and handling - Quality improvements and integration of special electrical properties (for example controlled impedance) 53

27 Flex-rigid technology Flex-rigid technology Base materials Selection criteria Quality criteria for flex-rigid printed circuit boards To ensure that a flex-rigid PCB can become a high quality product, attention must be given to the main quality criteria as early as the design phase (for example selection of base materials, information about layout. etc.). Selection of materials relative to: - Flexible material - Adhesion - Type of adhesion (no-flow prepreg, epoxy or acrylic adhesive) - Temperature stress - Cleaning before interlayer connection (plasma) - Chemicals for the interlayer connection process - Design of the layer structure Technical data / Differences of flexible materials Comparison of selected properties of the main flexible base foils - Standard foil thicknesses - Copper thicknesses and types - Adhesives and coatings Properties of the main flexible base foils Base foil Dielectric constant Disruptive strength in V/μm Max. operating temperature in C TG in C water absorption in % Expansion in ppm PET < PEN PI > The following materials are mainly used as base foils: PET (polyethylene teraphthalate) PEN (polyethylene naphtalate) PI (polyimide)* Differences between rigid and flexible materials PET: PEN: PI: Low price, very restricted soldering capacity, operating temperature approx. -70 C to +70 C Low price, very restricted soldering capacity, operating temperature approx. -70 C to +90 C High temperature stability, unrestricted soldering capacity, operating temperature approx. -70 C to +110 C, up to 200 C briefly Base foil Adhesion in N/cm 2 Shrinkage after etching in % Water absorption in % Flexible base material (PI) > < 3 Rigid base material (FR4) * preferred 54 55

28 Flex-rigid technology Flex-rigid technology Standard foils Sections Copper on one side Material Thickness in mm Copper Adhesive Polyimide Flexible base material without adhesive* - AP 9121 (DuPont) - A2010RD (Thinflex) - preferred Copper on two sides Material Thickness in mm Copper Adhesive Polyimide Adhesive Copper * preferred Flexible base material with adhesive - LF 9121 (DuPont) Copper on two sides, no adhesive AP material Material Thickness in mm Copper Polyimide Copper Copper ED: Elongation at rupture 8 10% (HTE Cu approx. 16%) RA: Elongation at rupture > 10% (IPC-CF-150 approx. 16%) Adhesive Epoxy, acrylic Polyimide with acrylic adhesive is ideal for dynamic stresses for up to 40 million bending cycles with the appropriate layout and bending radius. Polyimide with flame-inhibiting adhesive (FR4) is UL 94 VTM -0 listed and certified to IPC Class 2 but only has limited dynamic flexibility. Polyimide without adhesive is also UL 94 VTM -0 listed and certified to IPC Class 3. Its temperature resistance is specified at 1,000 hours at 150 C and it also has good chemical resistance and low gassing

29 Flex-rigid technology Flex-rigid technology Cover foil Material Thickness in mm Polyimide Adhesive from µm Backing foil Removed after mechanical machining Processing instructions (tempering process) As a result of the high moisture absorption of polyimide the PCBs must be dried (using a tempering process) before the soldering process.?! What does this mean for processing flexible circuits? 58 MOS prefers Coverlay from DuPont Flexible coating So-called flexible coatings (flexible soldermask, for example Peters type 2463) are also used. Low cost PET material can be used in cases where a flexible PCB is used as a pure connecting element between two connectors and not soldered with normal standard soldering systems. PEN or polyimide must be used as soon as SMD components must be fitted and soldered automatically. The decisive criterion in this respect is the machine equipment and the solder you plan to use. PEN can be used with suitable machines and automatic soldering. Polyimide has a clear advantage in this case. This material is suitable for all standard leaded and unleaded soldering processes (wave soldering, manual soldering and vapour phase soldering). It is often the adhesive system in the flexible base materials which determines with flexible PCBs (made of PEN or polyimide) are suitable for use in the field in high temperatures. The stresses to which flexible PCBs are exposed in the field and during processing determine the choice of the base material. Drying flexible PCBs made of polyimide As the diagram shows, polyimide absorbs up to 3% water from the surrounding atmosphere. Insulation voltages Polyester foil 3 x 10 2 V/cm Polyimide foil 1,5-2,5 x 10 2 V/cm Glass fibre epoxy foil 2,5 x 10 2 V/cm Polyimide foil 2 x 10 2 V/cm At max. water content Coating thickness (µm) Since this property has been known for at least 20 years, all processing business have adjusted to it. Polyimide is hydroscopic and therefore absorbs moisture (water). When this water is heated to over 100 C it turns to water vapour and therefore requires a considerably large volume. If it is heated very quickly (soldering process) this may result in the vapour pressure destroying the adhesion between the various layers (polyimide, adhesive and copper) - in other words delamination. This means that the product must be dried (tempering process) before the soldering process. After drying the PCBs must be processed within 2-6 hours or placed in temporary storage in a dry place. Selection of materials relative to: - Temperature stress Parameters - Requirement for UL listing - Temper for 2 hours at 120 C in a convection furnace - Bending stress (store printed circuit boards with gaps between them) - Puncture resistance - The max. holding time between tempering and the soldering process is 8 hours. If the holding time exceeds 8 hours a fresh tempering processing is required before the soldering process. - For reflow soldering processes the max. temperature Do you have any questions about flexible coatings? is 270 C i Our Technology Team will be delighted to help (see page 86). 59 Puncture voltage (kv) ,0 2,0 1,0 0,5 0,2 10

30 Flex-rigid technology Flex-rigid technology Design information Layout design (conductive pattern) Flexible PCBs are used for a wide range of purposes and in many applications they are stressed dynamically with up to several million bending cycles. In many other cases flexible PCBs are installed in miniature housings with minimal bending radii. The conductor layout is expected to be able to withstand all these stresses without suffering damage. Examples If certain basic rules are observed during the creation of a layout, this sets in place an important foundation for the successful use of flexible PCBs. If the layout is designed correctly the soldering eye areas should be as large as possible to ensure that the cover foil or coating covers the soldering eye. This is particularly necessary on 1-layer flexible PCBs. On 2-layer interlayer connectors PCBs the soldering eyes are connected from the top to the bottom by the interlayer connection sleeve like a rivet and thus well secured. Soft transitions from narrow to wide conductors are the best way of ensuring conductor structures which are no sensitive to fracturing. Conductor connectors at soldering eyes should always be droplet shaped and rounded. As large a soldering eye area as possible will help to anchor the soldering eyes on the flexible base materials better. Sharp corners in the etched conductor act like a notch in metal. If a component of this type is bent, the should in the conductor could become an obvious place to fracture. 60 Soldering eyes which are too small have a poor connection to the flexible base material. This may result in the soldering eyes peeling off the base material. A conductor fracture at the transition between the soldering eye and conductor is possible if the conductor connection is very narrow and subjected to stress. The transition from narrow to wider conductors at a 90 angle should always be achieved using adequately large radii. 61

31 Flex-rigid technology Flex-rigid technology Layout parameters Parameters for flexible soldermask Soldermask gap Coating web width 0.08 mm Soldermask gap Here, too, the sharp edges in the 90 angle act like notches in metal. There is a risk of fractures at these point if the component is bent. If SMD components are fitted to flexible PCBs it is advisable to reinforce these zones with mm polyimide foil or 0.5 mm FR4. This prevents the component zone being bent which may damage the soldering points. x Pad Borehole x Soldermask to conductor pattern: 0.15 mm Minimum web width between the gaps: 0.08 mm Pad Borehole Parameters for cover foils (Coverlay) Borehole Soldering eye Conductor connections to SMD pads must be as far removed from the bending zone as possible. SMD pads are extended under the cover foil to provide better anchoring. 90 conductor kinks are allowed in this zone since they are reinforced with polyimide or FR4. SMD pads are only designed in nominal form in this layout which means that no additional anchoring is achieved. The bending zone (yellow) is too close to the SMD pads which means that there is a very great risk of fractures at the conductor connection to the two right-hand SMD pads. 62 If flexible PCBs are slit, for example to bend two flexible arms in different directions, an additional copper track must be fitted both for a zero cut (left picture) and for a slit (right picture) to prevent tearing. The zero cut should also end in a borehole. The internal corners of the slit must be as large as possible in the form of a radius. These precautions prevent the flexible PCBs tearing at the points described when subjected to mechanical stresses. Flow up to 25 µm at 50 µm adhesive thickness (Standard) Cover foil gap (borehole) Adhesive flow after lamination Cover foil 63

32 Flex-rigid technology Flex-rigid technology Cover foil An adhesive flow occurs during the lamination of cover foils. The adhesive flow is transparent and therefore not always visible. It is not possible to provide a cover with a final surface in this zone and it must therefore be included in the residual ring design. See diagram entitled "Parameters for cover foils (Coverlay)" Partial cover foil When tacking the cover foil on to flexible materials marks for registration are placed outside the PCB contour. This must also be given due consideration in the usage design. Cover foil web width, borehole to borehole Cover foil web min. 0.2 mm Recess Cover foil Soldering eye {Flexible zone Cover foil Borehole in the circuit The cover foil has a backing foil towards the adhesive side. When this backing foil is removed and during lamination, this web may break and settled on the soldering eye. We recommend a web width of at least 0.2 mm to prevent this. If this is not possible the entire zone must be left open (alternatively a flexible soldermask may be used). { Rigid zone { Rigid zone Cover foil overlap in the rigid zone Partial cover foil and partial soldermask 0.8 mm min. overlap Cover foil Adhesive Partial cover foil 0.8 mm 0.8 mm Offset for tacking the cover foil Tolerance ± 0.25 mm { Flexible zone Polyimide No-flow Prepreg FR 4 Soldermask Soldermask 64 Tolerance ± 0.25 mm There must be no interlayer connected boreholes or soldering eyes in the overlap zone. Overcoating or coverage is not permitted. Flexible zone 0.4 mm 0.4 mm Rigid zone{ { Rigid zone{ The partial cover foil overlaps the soldermask applied previously. Set back the soldermask by at least 0.4 mm from the transition edge. 65

33 Flex-rigid technology Flex-rigid technology Levelling internal cover foil Example of a layer structure with internal flexible layer The cover foil is only partially applied to internal flexibly layers. The other area must be filled with a partial no-flow prepreg to prevent delamination. No-flow prepreg to level partial cover foil 0.8 mm min. overlap { { Rigid zone Cover foil to customer s drawing Flexible zone{ { { Rigid zone Partial cover foil No-flow prepreg { 1st pressing (flexible layer) 25 µm cover foil 50 µm adhesive Zero cut Flexible zone with{ partial cover foil No-flow prepreg type 1080 (~ 65 μm after pressing) { Pressing (flexible layer) { Flexible zone Flexibility in every layer FR

34 Flex-rigid technology Flex-rigid technology Forward / Counter grooves?! Why forward and counter grooves? Adhesive, no-flow prepreg or transparent adhesive such as LF0100 / LF0200 or composite adhesive LF0111 / LF0212 only have one flow which can only be stopped by the forward groove. Max. flow of the no-flow prepreg max. 0.3 mm ZIF-connector ZIF-connector zone Thickness 0.3 ± 0.03 mm (overall) Surface (gold) Cu base (possibly galv. Cu) Polyimide Stiffener flow flow Polyimide No-flow Prepreg FR4 Consideration in terms of: - Surface - Reinforcement Max. undercut (withdrawal of the no-flow prepregs) max. 0.2 mm undercut undercut Polyimide No-flow Prepreg FR4 68 Do you have any questions about forward and counter grooves? i Our Technology Team will be delighted to help (see page 86). 69

35 Flex-rigid technology Flex-rigid technology Warm adhesion Cold adhesion Design of the connector zone when using flexible soldermask or cover foil No-flow Prepreg Scotch 467 / 3M foil FR4 FR4 min. 0.1 mm Mechanical dimensions Pins Danger of fracture Dimension X is the main criterion for contact registration between the connector and connector housing. Incorrect layouts result in a loss of contact or even a short-circuit. It must be noted in the design of the external contour and layout that additional fiducials are required for the production process to allow compliance with the required tolerances. The copper must be set back since burr can be created during mechanical machining process. Not like this! Dimension to customer s drawing or layout Flexible zone Pins min. 0,35 mm Y X X Y Pin + + X X Fiducials Z Dimensions X and Y are taken from the customer's drawing or customer's layout. Conductors should exit the pins in a droplet shape. Cover foil or flexible soldermask The pins must be covered with soldermask or cover foil to avoid the risk of fracture. At least 0.35 mm of the pins should be covered as a result of possible offset when tacking the cover foil or positioning the flexible soldermask. 70 Do you have any questions about ZIF-connectors? i Our Technology Team will be delighted to help (see page 86). 71

36 Flex-rigid technology Flex-rigid technology Procedure Example of a 2-layer flex-rigid PCB with a ZIF-connector Snap-out technology With snap-out technology the rigid material under the flexible zone initially remains connected to the rigid section of the PCB and is not removed until the customer receives it. This achieves greater stability during the fitting process. The forward grooves are inserted as standard. Retaining webs are left when the counter grooves are cut. These must not be positioned in the conductor zone. OK Snap-out zone Not OK 75 µm Cover foil 30 µm Soldermask 33 µm galv. Cu 18 µm Basis-Cu (Flexible material) 50 µm Polyimide Polyimid (Stiffener) No-flow Prepreg 1080 FR4 (Core) 18 µm Basis-Cu (Core) 33 µm galv. Cu 30 µm Soldermask Receiving documents Check that the input data are complete Production data creation Approval of the production data Production start 72 Do you have any questions about snap-out technology? Material provision i Our Technology Team will be delighted to help (see page 86). 73

37 Flex-rigid technology Flex-rigid technology FR4 / Prepreg / Flexible / Cover foil Record material charge Drill catch holes Forward groove Expose the Cu separating layer 75 µm Cover foil 30 µm Soldermask 33 µm galv. Cu 18 µm Basis-Cu (Flexible Material) 50 µm Polyimide Polyimid (Stiffener) No-flow Prepreg 1080 FR4 (Core) 18 µm Basis-Cu (Core) 33 µm galv. Cu 30 µm Soldermask FR4 No-flow prepreg Flexible material Cover foil Stiffener Expose the Drill the catch holes Cut the Mill the Cu separating foil and mill the partial initial contour recesses for Cover foil the flexible zone Clean 75 µm Cover foil 30 µm Soldermask 33 µm galv. Cu 18 µm Basis-Cu (Flexible material) 50 µm Polyimide Polyimid (Stiffener) No-flow Prepreg 1080 FR4 (Core) 18 µm Basis-Cu (Core) 33 µm galv. Cu 30 µm Soldermask Initial pressing Measure the thickness 75 µm Cover foil 30 µm Soldermask 33 µm galv. Cu 18 µm Basis-Cu (Flexible material) 50 µm Polyimide Polyimid (Stiffener) No-flow Prepreg 1080 FR4 (Core) 18 µm Basis-Cu (Core) 33 µm galv. Cu 30 µm Soldermask Drill Interlayer connection Section production Clean Cu Photo print layer 1 and 2 Etch Flexible material 74 75

38 Flex-rigid technology Flex-rigid technology 75 µm Cover foil 30 µm Soldermask 33 µm galv. Cu 18 µm Basis-Cu (Flexible material) 50 µm Polyimide Polyimid (Stiffener) No-flow Prepreg 1080 FR4 (Core) 18 µm Basis-Cu (Core) 33 µm galv. Cu 30 µm Soldermask Develop Galv. copper and tin Section production to measure layer thickness of copper and tin AOI for breaks and short circuits Clean Apply soldermask on both side - except in flexible zone 75 µm Cover foil 30 µm Soldermask 33 µm galv. Cu 18 µm Basis-Cu (Flexible material) 50 µm Polyimide Polyimid (Stiffener) No-flow Prepreg 1080 FR4 (Core) 18 µm Basis-Cu (Core) 33 µm galv. Cu 30 µm Soldermask Etch layers 1 and 2 Clean 75 µm Cover foil 30 µm Soldermask 33 µm galv. Cu 18 µm Basis-Cu (Flexible material) 50 µm Polyimide Polyimid (Stiffener) No-flow Prepreg 1080 FR4 (Core) 18 µm Basis-Cu (Core) 33 µm galv. Cu 30 µm Soldermask Laminate partial cover foil (2nd "pressing") Galv. Au surface on ZIF-connector Premill in the ZIF-connector zone Insert and fix the V strip Check conductor width and insulation distances Press the V strip 76 77

39 Flex-rigid technology Flex-rigid technology 75 µm Cover foil 30 µm Soldermask 33 µm galv. Cu 18 µm Basis-Cu (Flexible material) 50 µm Polyimide Polyimid (Stiffener) No-flow Prepreg 1080 FR4 (Core) 18 µm Basis-Cu (Core) 33 µm galv. Cu 30 µm Soldermask Shipment inspection Delivery Initial contour - counter groove outline and remove the cover Laser cut the total contour Electrical test for breaks and short circuit (40 V) 75 µm Cover foil 30 µm Soldermask 33 µm galv. Cu 18 µm Basis-Cu (Flexible Material) 50 µm Polyimide Polyimid (Stiffener) No-flow Prepreg 1080 FR4 (Core) 18 µm Basis-Cu (Core) 33 µm galv. Cu 30 µm Soldermask Production of a section to measure the coating thickness of copper / soldermask / surface and thickness Inspection / Visual Test 257 C Test report 78 79

40 Flex-rigid technology Flex-rigid technology Error patterns Borehole with standard geometry Microvia to contact FR4 to flex The copper surface for contacting is coated with a cover foil (50 µm acrylic sticker, 25 µm polyimide). A borehole can only be cleaned by plasma in such a case. The two images show the result of cleaning a borehole with chemicals. They are not compatible with the acrylic adhesive. Borehole with flexible drill geometry Examples of poor interlayer connections Examples of poor interlayer connections 80 This image shows a strong undercut around the adhesion. This can result in a break if the copper does not 100% cover the undercut. In this case it is completely covered. Various defects can be seen here. - Nail head in the polyimide - Nail head in the copper - Undercut The interlayer connection is imperfect due to the bundling of the defects and results in a failure in the electrical test or later in the field. Interlayer connection flaws in the polyimide zone of a 2-sided flex-rigid PCB Epoxy adhesive Polyimide 50 μm Flaw in the epoxy adhesive zone. This error occurs if the circuit is left in the chemicals for too long. 81

41 Flex-rigid technology Flex-rigid technology Structure with adhesive Description of drilling geometry Adhesive in a structure creates problems for drilling, cleaning with plasma, interlayer connection and with galvanising the copper. Nominal diameter Tip angle Twist length Chamfer length Overall length View Y enlarged section Nominal diameter Twist angle Chamfer Chamfer width Web angle Z Chip groove Cross cutter Main cutter Z Second free area Chip groove Core increase Alternative structure 2nd free angle 1st free angle Core thickness There are no problems visible here. This is what the structure should look like! Deflection of drill bit Stability of drill bit Drill bit route Fracture properties Adhesive is replaced by no-flow prepreg Other criteria include: Adhesive discharge at the intervals between the "rigid" to "flexible" zones Package height F1 = F2 Productivity Frequent problem when drilling flexible printed circuit boards F2 If too much adhesive is discharged the following risks are possible during bending: - Overtwisting the copper - Compliance with the bending radius F1 X = 80 µm ø 0.3 mm x 6.5 mm Y = 45 µm ø 0.3 mm x 5.5 mm (Knot) chip formation by excessive heat formation or inadequate chip space 82 Do you have any questions about drilling geometry? i Our Technology Team will be delighted to help (see page 86). 83

42 Environmental protection The subject of protecting the environment and preserving resources has been an integral part of our thoughts and actions since the company was founded. Located at the edge of a conservation area in the Northern Black Forest nature reserve, we pay very close attention to saving material, water and energy and to improving our consumption levels. These factors also play a major role when we are selecting new production equipment. The recycling of materials and media has long been a matter of course for us. The subject of the environment is also a significant criterion when we select our group partners. Our partners are certified to ISO without exception

43 Contact Agents Management Mr Horst Schmalstieg Managing Director +49 (0) Mrs Margrit Schmalstieg Managing Director +49 (0) Technology & Production Mr Michael Klingler +49 (0) Mr Matthias Klingler +49 (0) Staub Industrievertretungen GmbH Mr Rainer Staub Obere Torstrasse 6 D Rottenburg phone: +49 (0) fax: +49 (0) mobile: +49 (0) mail: rainer@staub-gmbh.de Karl-Friedrich Kempf Industry Agents Waldstrasse 56 D Lahr phone: +49 (0) fax: +49 (0) mobile: +49 (0) mail: info@kempf-industrie.de Mr Reinhard Rosen Managing Director +49 (0) reinhard.rosen@mos-electronic.de Mr Jürgen Bauer Authorised Signatory +49 (0) juergen.bauer@mos-electronic.de Sales Mr Jens Rosen Sales Manager +49 (0) jens.rosen@mos-electronic.de Mr Roland Drexler Sales +49 (0) roland.drexler@mos-electronic.de Mrs Sabrina Hammann Support & Logistics +49 (0) sabrina.hammann@mos-electronic.de Accounts, Purchasing Mrs Elke Lörcher +49 (0) elke.loercher@mos-electronic.de Product Manager Flex-Rigid Technology CAM, Data Mr Ernst Winkler +49 (0) ernst.winkler@mos-electronic.de Mr Klaus Holdermann +49 (0) cam@mos-electronic.de Work Preparation Mrs Gabi Walz +49 (0) gabi.walz@mos-electronic.de Quality Assurance Mrs Sibylle Klingler +49 (0) sibylle.klingler@mos-electronic.de Mr Andreas Klittich +49 (0) andreas.klittich@mos-electronic.de Mr Edin Sisic edin.sisic@mos-electronic.de HVB Handelsvertretung Beitinger Mr Hartmut Beitinger Mörikestrasse 5 D Offenau phone: +49 (0) mobile: +49 (0) mail: hartmut@beitinger.biz Willuweit Industrievertretungen Mr Jürgen Willuweit Kesselbergweg 30 D Nideggen phone: +49 (0) fax: +49 (0) mobile: +49 (0) mail: willuweitiv@t-online.de CEE SA SC C.E.E.S.R.L. B-dul Industriei nr Timisoara (ROMANIA) mail: cee@mail.rdstm.ro (Contact through MOS) A/M/T Industry Partners Industry Agents Mr Achim Trampenau Ackerstrasse 29 D Zirndorf phone: +49 (0) fax: +49 (0) mobile: +49 (0) mail: Achim.Trampenau@amt-tp.de A. Arnold Electronic Vertretungs- und Vertriebs GmbH Am Kesseborn 10 D Unna phone: +49 (0) fax: +49 (0) mail: arnold-electronic-gmbh@t-online.de Head office: +49 (0) info@mos-electronic.de We look forward to receiving your inquiries either by phone or to anfrage@mos-electronic.de 86 87

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