Inductors. 1 Rev

Transcription

1 Inductors Content Multi-Layer Power Inductors (IP Series)... 2 Ordering Code... 2 Standard External Dimensions... 3 Multi-Layer Ferrite Inductor for General Use (F Type)... 4 Multi-Layer Power Inductor for Choke (L Type)... 5 Multi-Layer Power Inductor for DC/DC converter (S Type)... 6 Testing Condition & Requirements (IP Series)... 9 Packaging Specification Cautions Rev

2 Inductors-MLCI (IP Series) Multi-Layer Power Inductors (IP Series) Ordering Code IP R0 M P S 9 PRODUCT CODE IP : Multilayer Power Inductor (Lead Free) DIMENSION (L X W) Code Dimension EIA x 0.80 mm X 1.25 mm X 1.6 mm X 2.0 mm 1008 INDUCTANCE CODE Code (uh) R47 1R0 1R5 2R2 3R3 4R TOLERANCE CODE M: ±20% PACKAGING CODE T: Paper tape reel P: Embossed reel SPECIFICATION CODE S: Standard for DC/DC converter L: Light loading current for choke F: for General Use THICKNESS CODE Code B (mm) Rev

3 Inductors-MLCI (IP Series) Standard External Dimensions Unit: mm/(inch) Series L W T A (Min/Max) IP1608 (0603) 1.6±0.15 (0.063±0.006) 0.8±0.15 (0.031±0.006) 0.95 max (0.037max) 0.1/0.5 (0.008/0.032) IP2012 (0805) 2.0±0.2 (0.079±0.008) 1.25±0.2 (0.049±0.008) 0.55 max (0.021max) 0.20/0.80 (0.008/0.032) IP2012 (0805) 2.0±0.2 (0.079±0.008) 1.25±0.2 (0.049±0.008) 1.0 max (0.039max) 0.20/0.80 (0.008/0.032) IP2016 (0806) 2.0±0.2 (0.079±0.008) 1.6±0.2 (0.063±0.008) 1.0 max (0.039max) 0.20/0.80 (0.008/0.032) IP2520 (1008) 2.5±0.2 (0.098±0.008) 2.0±0.2 (0.079±0.008) 1.0 max (0.039max) 0.20/0.80 (0.008/0.032) Recommended Pad Dimensions Soldering resist Land Pattern SMD Inductor c b a Size mm (EIA) L x W (mm) a (mm) b (mm) c (mm) 1608 (0603) 1.6 x to to to (0805) 2.0 x to to to (0806) 2.0 x to to to (1008) 2.5 x to to to 2.2 Unit: mm/(inch) 3 Rev

4 Inductors-MLCI (IP Series) Multi-Layer Ferrite Inductor for General Use (F Type) Feature 1. Ferrite core and magnetic shielding enables the design of compact circuits with higher mounting density 2. Multilayer block structure yields higher reliability. 3. RoHS complaint Application Any general circuit of portable equipment in which compact size and high mounting densities are required. Part Numbers & Characteristic IP1608_F Series (0603) Ordering Code [uh] Tolerance Measuring frequency [MHz] DC Resistance [Ω] Max. Typ. Idc (ma) Q (min) SRF [mm] Packing IP16084R7 TF ±10%, ±20% IP TF ±10%, ±20% ± Paper 4kpcs IP2012_F Series (EIA 0805) Ordering Code [uh] Tolerance Measuring frequency [MHz] DC Resistance [Ω] Max. Typ. Idc (ma) Q (min) SRF [mm] Packing IP20122R2 TF ±10%, ±20% ±0.10 IP20124R7 TF ±10%, ±20% IP PFB 10.0 ±10%, ±20% ± Paper 4kpcs 7 Embossed 3kpcs 4 Rev

5 Feature Inductors-MLCI (IP Series) Multi-Layer Power Inductor for Choke (L Type) 1. Ferrite core and magnetic shielding enables the design of compact circuits with higher mounting density 2. Multilayer block structure yields higher reliability. 3. Low DC resistance 4. RoHS complaint Application 1.Separation of analog and digital circuits 2.Prevents interference between PLL and the other digital circuits Part Numbers & Characteristic IP2012_L Series (EIA 0805) Ordering Code [uh] Tolerance Measuring frequency [MHz] DC Resistance [Ω] Rated [mm] Packing IP20124R7MPL ±25% 0.80 ±20% IP MPL ±25% ± Embossed 3 kpcs 5 Rev

6 Feature 1. Small and light weight 2. Low DC resistance 3. RoHS complaint Inductors-MLCI (IP Series) Multi-Layer Power Inductor for DC/DC converter (S Type) Application DC/DC converter for the Mobile equipment; Mobile Phone, DSC, WLAN Part Numbers & Characteristic IP1608 (0603) Ordering Code [uh] Tolerance Measuring frequency [MHz] DC Resistance [Ω] Rated Saturation [mm] Packing IP1608R33MTS ±25% IP1608R50MTS ±25% ±20% 1 IP16081R0MTS ±25% IP16082R2MTS ±25% ± Paper 4kpcs IP2012 (EIA 0805) Ordering Code [uh] Tolerance Measuring frequency [MHz] DC Resistance [Ω] Rated Saturation [mm] Packing IP2012R47MTS ±25% IP20121R0MTS ±20% ±25% IP20122R2MTS ±25% IP20122R2MPS ±25% ±20% 1 IP20124R7MPS ±25% ± ± Paper 4kpcs 7 Embossed 3 kpcs IP2012R47MPS ±25% IP20121R0MPS ±25% IP20121R5MPS ±25% ±20% 1 IP20122R2MPS ±25% IP20123R3MPS ±25% IP20124R7MPS ±25% ± Embossed 3 kpcs IP2016 (EIA 0806) Ordering Code [uh] Tolerance Measuring frequency [MHz] DC Resistance [Ω] Rated Saturation [mm] Packing IP2016R47MPS ±25% IP20161R0MPS ±25% IP20161R5MPS ±25% ±20% 1 IP20162R2MPS ±25% IP20163R3MPS ±25% IP20164R7MPS ±25% ± Embossed 3 kpcs 6 Rev

7 IP2520 (EIA 1008) Inductors-MLCI (IP Series) Ordering Code [uh] Tolerance Measuring frequency [MHz] DC Resistance [Ω] Rated Saturation [mm] Packing IP25201R0MPS ±25% ±20% 1 IP25202R2MPS ±25% ± Embossed 3 kpcs IP25201R0MPS ±25% IP25201R5MPS ±25% ±20% 1 IP25202R2MPS ±25% IP25204R7MPS ±25% ±10 7 Embossed 3 kpcs Rated current specifies that self-heat generation is below 40 during DC loaded (at 20 ) Saturated current specifies that inductance drop is below 30% during DC loaded (at 20 ) Operating temperature range from -55 to Rev

8 Inductors-MLCI (IP Series) Electric Properties DC Bias characteristics vs Frequency 8 Rev

9 Inductors-MLCI (IP Series) Testing Condition & Requirements (IP Series) No. Item Test Condition Requirements 1 Appearance Inductors shall be visually inspected for visible evidence of defect. No harmful defect for piratical use. 2 a. Temperature: 25+/- 3 b. Relative Humidity: 45 to 75%RH c. Measuring equipment:hp4286a HP4287A Measuring Jig: HP Within specified tolerance. 3 DC Resistance Measuring instrument: HP4338B HIOKI IM Dimension Dimension shall be measured with caliper or micrometer In accordance with electrical specification. In accordance with dimension specification. 5 Solder-ability Immerse a test sample into a methanol solution containing rosin and immerse into SAC305(Sn96.5Ag3.0Cu0.5) solder of 245±5 for 3±1 seconds. 90% of the termination is to be soldered evenly and continuously. 6 Resistance to Soldering Heat Immerse a test sample into a methanol solution containing resin, preheat it at 150 to 180 for 2~3 minutes and immerse into molten solder of 260+/-5 for 10+/-1 second so that both terminal electrodes are completely submerged. After this test samples shall be taken out and measured after kept at room temperature for 2 to 3 hours. Solder the chip to test jig then apply a force in the direction shown in below. The soldering shall be done with the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock. No visible damage Remained terminal electrode : 70% min. variation within 30% 7 Bending Strength Pressurizing speed : 1.0mm/sec. Pressurize R230 Flexure : 1mm Capacitance Meter No mechanical damage shall be observed. 8 Thermal Shock Solder a test sample to printed circuit board, and conduct 5 cycles of test under the conditions shown as below. Condition for 1 cycle Step1:-55+0 / -2 30±3 min. Step2: Room temperature within 2 to 3 min. Step3: / -0 30±3 min. Measured at room temperature after placing for 2 to 3 hrs. No visible damage variation within 30% 9 Rev

10 Inductors-MLCI (IP Series) No. Item Test Condition Requirements 9 High Humidity State Life Test Keep a test sample in an atmosphere with a temperature of 40±2, 90~95%RH for /-0 hours. After the removal from test chamber, 2 to 3 hours of recovery under standard condition, and measurement shall be made after 24±2 hrs of recovery under standard condition. No visible damage. variation within 30%. 10 High Humidity Load Life Test Solder a test sample to printed circuit board then keep the test sample in an atmosphere with a temperature of 40±2, 90~95%RH for /-0 hours while supplying the rated current. After the removal from test chamber, 2 to 3 hours of recovery under standard condition, and measurement shall be made after 24±2 hrs of recovery under standard condition. No visible damage. variation within 30% High Temperature State Life Test High Temperature Load Keep a test sample in an atmosphere with a temperature of 85±2 for /-0 hours. After the removal from test chamber, 2 to 3 hours of recovery under standard condition, and measurement shall be made after 24±2 hrs of recovery under standard condition. Solder a test sample to printed circuit board then keep the test sample in an atmosphere with a temperature of 85±2 for /-0 hours while supplying the rated current. After the removal from test chamber, 2 to 3 hours of recovery under standard condition, and measurement shall be made after 24±2 hrs of recovery under standard condition. No visible damage. variation within 30%. No visible damage. variation within 30%. 10 Rev

11 Inductors-MLCI Reflow Profile Chart (Reference) Soldering Profile for SMT Process with Lead Free Solder Paste. The rate of preheat should not exceed 4 /sec and a target of 2 /sec is preferred. Ceramic chip components should be preheated to within 100 to 130 of the soldering. Temperature ( ) Soldering 240 to ~ 10 sec. Gradual Natural Cooling Preheating 0 over 1 min over 1 min Over 200,within 90sec Time (sec.) Soldering Profile for SMT Process with SnPb Solder Paste. The rate of preheat should not exceed 4 /sec and a target of 2 / sec is preferred. Ceramic chip components should be preheated to within 100 to 130 of the soldering Soldering 220 to ~ 10 sec. Temperature ( ) 200 Gradual Natural Cooling Preheating 0 over 1 min over 1 min Over 200,within 40sec Time (sec.) 11 Rev

12 Inductors-MLCI Packaging Specification Paper Tape Product Size Code Symbol 0603(0201) 1005(0402) 1608(0603) 2012(0805) (mm) (mm) (mm) (mm) Chip cavity A 0.38± ± ± ±0.2 B 0.68± ± ± ±0.2 Insertion Pitch F 2±0.1 2± ± ±0.1 Tape T 1.1 max 1.1 max 1.1 max 0.8 max 12 Rev

13 Inductors-MLCI Embossed Tape 4mm pitch tape P 0 P 1 D 0 P 2 E K 0 T A 0 F W B 0 D 1 Direction of feed Top tape T Symbol 2012 (0805) 2016 (0806) 2520 (1008) P 1 4±0.1 4±0.1 4±0.1 P O 4±0.1 4±0.1 4±0.1 P 2 2±0.05 2±0.05 2±0.05 A ± ± ±0.1 B 0 2.3± ± ±0.1 K 0 1.3± ± ±0.1 W 8±0.3 8±0.3 8±0.3 E 1.75± ± ±0.1 F 3.5± ± ±0.05 D (+0.1/-0.0) (+0.1/-0.0) (+0.1/-0.0) T 0.3 max 0.3 max 0.3 max Unit: mm/(inch) Reel Specifications Tape Width (mm) G (mm) T max.(mm) D (mm) ± ± Rev

14 Inductors-Cautions Peel Strength of Top Cover Tape The peel speed shall be about 300 mm/min. The peel strength of top cover tape shall be between 0.1 to 1.0N. Cautions Storage 1. The inductor shall be packaged in carrier tapes. 2. To keep storage place temperature from +5 to 35, humidity from 45 to 70% RH. 3. The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid exposing the product to saline moisture. If the product is exposed to such atmospheres, the terminals will oxidize and solderability will be affected. 4. The solder ability is assured for 12 months from our final inspection date if the above storage condition is followed. Handling Inductor should be handled with care to avoid contamination or damage. The use of vacuum pick-up or plastic tweezers is recommended for manual placement. Tape and reeled packages are suitable for automatic pick and placement machine. 14 Rev