Semiconductor Devices
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1 Semiconductor Devices Lecture Course Part of SS Module PY4P03 Dr. P. Stamenov School of Physics and CRANN, Trinity College, Dublin 2, Ireland Hilary Term, TCD 20 th of Jan 14
2 M-S and p-n Junctions Minor current components The Schottky effect Abrupt p-n junction Charge, potential, field and bands... Graded p-n junction Charge, potential, field and bands... Epitaxial diodes Current components and IV-characteristics
3 Focus on Minority Components a) Thermionic emission b) Tunnelling c) Recomb. in dep. region d) Deep recombination After: Rhoderick and Williams (1988) Metal-Semiconductor Contacts
4 Recombination in the Depleted Region Recombination time in the depleted region Intrinsic carrier concentration The product of the carrier concentrations is voltage activated. No bias reverts to equilibrium case Simple modelling only in complete activation approximation (barrier height must be high enough) Distorts very significantly the experimental activation scales (temperature dependencies). When the junction structure is bad, with many recombination centres this component can dominate the total current.
5 Hole Injection (Deep Recombination) Hole current Just a reminder Barrier for the holes Bias dependence (implicit via J) Corresponding Barriers Donor states offset Minority Injection Ratio Conventionally considered spurious (reverse gated JFET) Its analogue in p-n junctions is very important for the BJT principle of operation (will be discussed later in the course)
6 Schottky Effect Barrier Lowering + - Classical Image Charge Effect M Ground S Maximal depleted region E-field Actual Build-in Potential One should always measure lower barrier than expected (or otherwise suspect large recombination currents) Usually corrected for, based on calculations.
7 Abrupt pn-junction Diodes Contact Metal Oxide Insulation Semiconductor base Diffused counterdoped Region SMV14xx Skyworks Recipe... Diffuse from a constant source Clean-up Deposit metal Contact Features Building block Control of Capacitance Low forward drop Lower reverse bias leakage Minority carrier device
8 log N Abrupt Junction via Diffusion p-type n-type N a Surface Diffused N d Substrate Doping Distance from the top surface Can be manufactured by counter-diffusing a surface region In a constant source diffusion N a can be rather high while keeping the L d short an approximation of abrupt p + n junction
9 Charge, Field, Potential and Bands E qn d de/dx = / s x x d x qn a V bi c.b. qv bi x d x x v.b. E F d /dx = -E(x)
10 log N Graded Junction via Diffusion p-type n-type N a Diffused N d Substrate Doping Distance from the top surface Can be manufactured by counter-diffusing a surface region In a limited source diffusion N a can be distributed within a smoother profile with a longer diffusion length.
11 Charge, Field, Potential and Bands E de/dx = / s x x d x V bi c.b. qv bi x d x x v.b. E F d /dx = -E(x)
12 Epitaxial Growth Si-on-Si, CVD There are a number of different methods that can achieve epitaxial growth MBE CVD, LPE, PLD, however, the most popular for Si epilayers is the CVD (silane process). The main reactions are as follows: Si + 3 HCl SiHCl 3 + H 2 4 SiHCl 3 SiH SiCl 4 The decomposition of SiCl 4 carried by H 2 over the silicon wafers results in epilayer growth at temperatures > 1200 o C. Silane is rather pirophoric especially when mixed with nitrogen. It irritates the eyes and is rather toxic with lethal concentrations below 1 %. Doping is achieved by admixing gases such as PH 3 and AsH 3 also extremely toxic.
13 Epitaxial Diode Contact Metal Oxide Insulation Semiconductor base Epitaxial Layer Diffused counterdoped Region Avoids the necessity for a very thin base The epitaxial (greek: επιταξία) layer needs only be several micrometer thick The secondary junction formed (say nn + ) is normally perfectly ohmic Recipe... Grow an epilayer Oxidize Diffuse from a constant source... Features Building block Low series resistance Low forward drop Lower reverse bias leakage Minority carrier device
14 log N Abrupt Junction in an Epilayer p-type n-type epilayer n + -type substrate N d Substrate Doping N d Epilayer Doping N a Surface Diffused Distance from the top surface Can be readily manufactured, provided epitaxy is available Since the diffusion of the pn-junction is executed after the epitaxial growth the nn + transition is actually rather smooth
15 Static, Zero-bias Considerations Poisson s Equation Parabolic dependence Postulate of constant gradient Electric Field Profile Build-in Field Magnitude Note that the power law is not the same as in the case of Schottky diodes Associated Capacitance
16 Static, Biased Considerations Quasi-equilibrium potential Treat as definitions Remember!!! The potentials for electrons and holes pn-product under bias
17 Current Components Electrons Holes At the edge of the depleted region Applied Bias Continuity The same for holes
18 Thanks and Acknowledgements Thank You Very Much for Your Attention!
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