SEMI Networking Day 2013 Rudolph Corporate Introduction

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1 SEMI Networking Day 2013 Rudolph Corporate Introduction

2 Rudolph Technologies: Corporate Profile Business: Semiconductor capital equipment company dedicated exclusively to inspection, advanced packaging lithography, and process control solutions Customers: High-volume semiconductor, FPD, LED manufacturing fabs Company: Public, NASDAQ (RTEC) Revenue (2012): $218.5 million Cash Bal (Mar 2013): $166 million Europe 13% North America 19% Employees: >650 Asia 68% Headquarters: Flanders, New Jersey

3 Rudolph Surrounds Advanced Packaging MetaPULSE G NSX 320 RDL/UBM/µbump/pillar 2D Metal + Transparent Film For Advanced WLP and TSV AWX / AMX Bare Wafer/Mask Advanced Packaging Applications S3000S Resists, Dielectrics, Stress/Bow JetStep Panel Lithography System WS D Bump Height ProcessWORKS Run-to-Run Control Discover Yield Management ARTIST Fault Detection & Classification TrueADC Automatic Defect Classification JetStep Lithography System

4 ,, Lithography & Solutions for Bumping Lithography Process Fab BEOL Sputter Expose RDL/ Cu Pillar/ Solder Bump/ Solder Cap Plating Etch Bump/ RDL height Post-saw / Chamber clean quals, monitor wafer Post-develop RDL CD, plating defect,, CD and width, height with respect overlay to PR/PI Reside defects Height, co-planarity, size, location, missing, RDL CD Post-saw, chipping, laser scribe Solution AWX NSX Wafer Scanner Xport/FF Electroplated Cu, ILD Modulus, Cu CMP, Barrier (Ta/TaN/Ti/TiN) Film stack thickness Thick PR, Dielectrics, Hardmasks, Stress/Bow RDL layer/stack T UBM layer/stack T, RDL height Solution MetaPULSE MetaPULSE S3000 MetaPULSE MetaPULSE FDC R2R Predict process tool failures, optimize consumables, and gather trace for yield learning Adjust energy and X/Y offsets to control CD and alignment for Litho Adjust Etch time Predict Saw failures causing chipping YMS Track Overlay/CD trend Trend and track data / Reduce Review for 2D Reduce Review JetStep

5 ,, Lithography & Solutions for WLCSP Lithography Process Fab BEOL Re-constituion (Fan-out only) Sputter Expose RDL/ Cu Pillar/ Solder Bump/ Solder Cap Plating Etch Bump/ RDL height Post-saw / Die location and feedback for litho Chamber clean quals, monitor wafer Post-develop RDL CD, plating defect,, CD and width, height with respect overlay to PR/PI Residue defects Height, co-planarity, size, location, missing, RDL CD Post-saw, chipping, laser scribe Solution NSX AWX NSX Wafer Scanner Xport/FF Electroplated Cu, ILD Modulus, Cu CMP, Barrier (Ta/TaN/Ti/TiN) Metal film stack thickness Thick PR, Dielectrics, Hardmasks, Stress/Bow RDL layer/stack T UBM layer/stack T, RDL height Solution MetaPULSE MetaPULSE S3000 MetaPULSE MetaPULSE FDC R2R YMS Discover to store offsets for Pick and place tools Predict process tool failures, optimize consumables, and gather trace for yield learning Adjust energy and X/Y offsets to control CD and alignment for Litho Track Overlay/CD trend Adjust Etch time Trend and track data / Reduce Review for 2D Predict Saw failures causing chipping Reduce Review JetStep

6 ,, Lithography & Solutions for TSV Lithography Process Fab BEOL / Via etch / Via Fill Nail Reveal / protrusion Micro-bump/ Pillar bump Back-side UBM/ RDL Plating Post-bond De-bond Post-saw / Via depth, Via CD, sidewall defect, void detection TSV post height, RDL plating thickness, RDL CD Height, coplanarity, size, location, missing, RDL CD RDL CD, plating defect, backside surface defect Edge chipping, Edge trimming Residue, notch, edge trim defects Post-saw, mold defects, chip to wafer alignment Solution F30 with Wafer Scanner,, Via barrier T, fill, and RDL layer/stack T solutions for TSV overburden, void UBM layer/stack T, detection RDL height Process Steps NSX Solution Acoustics R&D MetaPULSE MetaPULSE MetaPULSE FDC R2R NSX E30/B30 Predict process tool failures, optimize consumables, and gather trace for yield learning Adjust settings to control CD, alignment, thickness and uniformity F30 Xport/FF Predict saw failures causing chipping YMS Collecting all, FDC, and test data to provide reports and alarms and better yield. Reduced Review JetStep JetStep JetStep JetStep

7 Thank You!

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