Conformal Coating over No Clean Flux
|
|
- Barnaby Kelley
- 6 years ago
- Views:
Transcription
1 Conformal Coating over No Clean Flux Karl Seelig & Timothy O Neill AIM Cranston, Rhode Island. USA. kseelig@aimsolder.com & toneill@aimsolder.com Introduction As the proliferation of modern day electronics continues to drive miniaturization and functionality, electronic designers/assemblers face the issue of environmental exposure and uncommon applications never previously contemplated. This reality, coupled with the goal of reducing the environmental and health implications of the production and disposal of these devices, has forced manufacturers to reconsider the materials used in production. Furthermore, the need to increase package density and reduce costs has led to the rapid deployment of leadless packages such as QFN, POP, LGA, and Micro-BGA. In many cases, the manufacturers of these devices will recommend the use of no clean fluxes due to concerns over the ability to consistently remove flux residues from under and around these devices. These concerns, along with the need to implement a tin whisker mitigation strategy and/or increase environmental tolerance, have led to the conundrum of applying conformal coating over no clean residues. The AIM Research & Development team has united with OEM electronics and conformal coating manufacturers in an attempt to characterize the different coating technologies currently available. In this study, various coating materials were tested with different chemistries of no clean fluxes. Results demonstrate possible combinations meeting the mission profile of the assembly with consideration for the assemblers capabilities and cost objectives. Conformal coating of PCB has garnered serious attention in all phases of PCB design and manufacturing. Manufacturers and Engineers industry wide are exploring the capabilities, costs, and limitations of this technique. The driving factor being the deployment of electronics into more diverse and harsh environments as the demand for functionality and interoperability grows. These systems are being introduced to conditions that would have been considered unsuitable for electronics a short time ago, including condensing environments and dust environments. Some of the known benefits of coating include; Reducing entrapped surface contamination to contact power or ground areas Tin whisker mitigation Having engaged multiple conformal coating manufacturers, there is a common recommendation for the application of conformal coating; that is that the substrate be cleaned prior to application, regardless of the type of coating to be applied. These same manufacturers will also admit that many of their customers are coating over no clean flux residues for a variety of reasons. The most common being; Cost of cleaning Through-put requirements Incomplete removal of ionic contamination under and around low-standoff devices Tin whisker mitigation Analyzing final working environment is crucial to a successful outcome and should be the first consideration in determining the appropriate assembly process. One should determine if applying coating will a) achieve the desired outcome b) be practical given the nature of the assembly and the assemblers capabilities. Assuming coating is appropriate the materials to be used needs to be vetted. In this study, we will address the findings of an in-depth analysis of various types of conformal coatings and how they perform in combination with a variety of no clean flux residues. The following industry test standards were applied: IPC J-Std-004 SIR Testing IPC CC Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies ASTM D Standard Test Methods for Measuring Adhesion by Tape Test
2 The three standards applied to this study will determine the SIR values and adhesion properties of each material in combination. These figures were compared with supplier provided data on the individual materials to determine if characteristics were measurably enhanced or degraded when combined. The classes of conformal coating materials tested are outlined below. Acrylics Thermoplastics dissolved in solvents no cross-linking Urethanes Cure through cross-linking Silicones Cure through moisture cross-linking Epoxies Usually two-part systems Acrylated Urethane UV Curable Urethane All of the samples tested passed IPC SIR testing without issue. An example of the data generated found below: PASS-FAIL CRITERIA IPC J-STD-004B All measurements on all test patterns shall be exceed the 100 MΩ No evidence electrochemical migration that reduces conductor spacing by more than 20%. No corrosion of the conductors. TEST RESULTS 1. Test data, chart attached, pass 2. Presence of dendrites: No 3. Maximum percent reduction of spacing: 0%. 4. Presence of discoloration between conductors: No 5. Presence of water spots. No 6. Presence of subsurface metal migration. No Original test data available upon request.
3 Result Charts (1-3) Chart 1. L UV Cure Coated, Paste 54 (Sn-Pb), Control --Control D1--Control C1 --Control C1 --Control A1 --Control D2--Control C2 --Control B2 --Control A2 --Paste 54/L UV D1 --Paste 54/L UV C1 --Paste 54/L UV B1 --Paste 54/ L UV A1 --Paste 54/L UV D2 --Paste 54/L UV C2 --Paste 54/L UV B2 --Paste 54/ L UV A2 --Paste 54/L UV D3 --Paste 54/L UV C3 --Paste 54/L UV B3 --Paste 54/ L UV A3 Chart 2. H UV Cure Coated, Paste 54 (SAC305), Control --Control D1 --Control C1 --Control C1 --Control A1 --Control D2 --Control C2 --Control B2 --Control A2 --Paste 54/H UV/ D1 --Paste 54/H UV/ C1 --Paste 54/H UV/ B1 --Paste 54/H UV/A1 --Paste 54/H UV/D2 --Paste 54/H UV/C2 --Paste 54/H UV/B2 --Paste 43/H UV/A2 --Paste 54/H UV/D3 --Paste 54/H UV/C3 --Paste 54/H UV/B3 --Paste54/H UV/A3 Chart 3. H UV Cure Coated, Paste 54 (Sn-Pb), Control
4 --Control D1 --Control C1 --Control C1 --Control A1 --Control D2--Control C2 --Control B2 --Control A2 --Paste 54/H UV/ D1 --Paste 54/H UV/ C1 --Paste 54/H UV/ B1 --Paste 54/H UV/A1 --Paste 54/H UV/D2 --Paste 54/H UV/C2 --Paste 54/H UV/B2 --Paste 43/H UV/A2 --Paste 54/H UV/D3 --Paste 54/H UV/C3 --Paste 54/H UV/B3 --Paste54/H UV/A3 Adhesion testing/thermal shock testing was originally conducted on Practical Component SABER Test Assemblies; however after multiple tests it was determined that the required data could be collected using standard B-24 test coupons. In addition to a considerable cost savings, it eliminated variables that could have clouded the results including the presence of ionics, mold release agents and coating thickness variability. The findings of the adhesion testing yielded some favorable and some unexpected results. The balance of this work focuses on solder paste. We did not test wire solder residues and all liquid fluxes where the conformal coating wet and adhered to the substrate at the time of coating/curing passed all subsequent tests. Initial testing of thermal shock at -60 C +125 C showed gross delamination. Initially, it was thought the failure was due to movement of the flux residue having softened at 125 C. Further examination revealed that there was a cohesive failure of the flux residue, wherein the flux remained firmly adhered to the PCB substrate and to the coating, but failed internally (photo 3). This phenomenon was present on all coatings in varying degrees (other than silicone). In general, UV materials performed the worst, with solvent-based acrylics better and silicones the best, with no delamination. A failure was considered any evidence of delamination. It was not determined if delaminated coating that remained contiguous was still effective in protecting the underlying substrate. Ultimately, we found the modulus of the coating is directly correlated to cold temperature failure. The CTE mismatch of the residue and a high modulus coating were enough to fracture the cold hardened flux residue. Flux medium used in solder paste is typically a resin-based material and after reflow, the residue is hard. The colder the environment is, the harder the residue. To test this theory, we varied the residue and the coatings using harder and softer materials. UV curable silicone having the lowest modulus of the materials tested and UV cure urethane the highest. We also tested a paste that is not resin based with residue that is waxy, rather than hard. As depicted below, reducing the modulus of either the coating or the residue eliminated the delamination failure. We also noted that solvent-based acrylic coatings out performed UV cured urethane materials although it was product specific. It is believed that the solvent would facilitate a more intimate bond between the residue and the coating lessening the adverse effect of the CTE. We went a step further to determine what the lowest temperature a resin based no clean paste and acrylic or acrylate/urethane coating can withstand before suffering delamination. The results of these tests were scattered, but none of the material sets were capable of withstanding more than -35 C for more than 10 cycles.
5 With this information, it would seem the simple solution to this problem would be to incorporate a softer residue solder paste to remedy the delamination issue. Unfortunately, there is a significant impact to the SIR characteristics as detailed below in Figure 1. Figure 1. Moisture Absorption after Conformal Coat Figure 2. Results: 1 to 5 (worst to best) The results indicated that the silicon did not delaminate. Delamination is easy to see in the test as shown below. The following profile was used. Figure 3. Profile
6 Figure 4. Pre Shock Figure 5. Paste 55 Post T Shock Delamination However if the solder paste is a low/no residue nitrogen reflow solder paste delamination does not occur. Figure 6. Paste 16 (low/no residue) Pre T Shock Figure 7. Paste 16 Post T Shock/No defects The following are a series of photographs that identify the hard flux issue with delamination of a harder urethane coating.
7 Photo 1 Delaminated after thermal shock testing Photo 2 Delamination lifting off board Photo 3 The crystal flux residue left on the board
8 Photo 4 Crystal flux residue stuck to the coating Photo 5 Close up of the above Photo 6 Close up of the above Conformal coatings are not hermetic with all the materials tested having varying degrees of moisture vapor transmission. In this case, whereas moisture enters the coating, the softer residue solder paste absorbs the moisture and creates a pressure cooker of corrosion and electrical failures (shown in figure. 9). Pictured below in figure 8 are SIR test results showing the beginnings of dendrites. These were run in 85 C/85Rh. SIR testing was also run at 40 C and 90 Rh. This test showed less failures compared to the 85 C/ 85Rh.
9 Figure 8. IPC SIR Test (paste material coated with conformal coating). The below picture is of a comb pattern that was run at 85 C/85Rh. The dendrites are starting to grow. Figure 9. Comb Pattern w/ Dendrites Adhesion to board and flux residues can also be determined by using a crosshatch cut and applying tape to check adhesion as shown in figure (s) 10 & 11. Figure 10. Black Light/Good Adhesion
10 Figure 11. White Light/Good Adhesion Conclusion This writing is a consolidation of hundreds of tests and material combinations. The matrix of residues and available coatings would be too large to contemplate. The data has been edited to present key findings of collected information and provide practical guidance for engineers considering deploying this technique for their assemblies. Based on our findings, we have concluded that conformal coatings can safely be used over no clean flux chemistry for many types of assemblies. It is imperative that compatibility testing be performed to ensure the coating provides the intended protection and meets the mission profile of the assembly. The incorporation of low standoff devices and the ability to completely remove water soluble organic residues is driving more assemblers to consider a no clean process. The risk assessment of water soluble versus no clean in these applications consistently favors no clean. The cost savings in decommissioning the wash process and equipment is another major reason for migrating to no clean chemistries. Finally, as conformal coating continues to be the only accepted practice for tin whisker mitigation, along with the looming expiration of the RoHS exemption, we predict no clean chemistries and the subsequent coating of the resulting residues will become increasingly prevalent over time.
IPC-AJ-820A Assembly and Joining Handbook. The How and Why of All Things PCB & PCA
IPC-AJ-820A Assembly and Joining Handbook The How and Why of All Things PCB & PCA 1 Scope To provide guidelines and supporting info for the mfg of electronic equipment To explain the HOW TO and WHY Discussions
More informationSample Preparation for Mitigating Tin Whiskers in alternative Lead-Free Alloys
As originally published in the IPC APEX EXPO Conference Proceedings. Sample Preparation for Mitigating Tin Whiskers in alternative Lead-Free Alloys Mehran Maalekian Karl Seelig, V.P. Technology Timothy
More informationPARYLENE ENGINEERING. For Longer Lasting Products
PARYLENE ENGINEERING For Longer Lasting Products PARYLENE ENGINEERING This presentation serves as a quick overview of the conformal coating material and processes currently used in the industry. The field
More informationSelection and Application of Board Level Underfill Materials
Selection and Application of Board Level Underfill Materials Developed by the Underfill Materials Design, Selection and Process Task Group (5-24f) of the Assembly and Joining Committee (5-20) of IPC Supersedes:
More informationNo-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability
No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability Eric Bastow Indium Corporation Utica, NY No-clean soldering processes dominate the commercial electronics manufacturing
More informationCleaning Before Coating. Presented by Jigar Patel, Senior Process Engineer
Cleaning Before Coating Presented by Jigar Patel, Senior Process Engineer Cleaning Before Coating Influencing factors Failure mechanisms Coating failures Cleaning before coating Analytics and test methods
More informationIBM Laminate Study Group
IBM Laminate Study Group Lead-Free Laminate Robustness Brett Krull, Dept FM2 Nov 18, 2009 Agenda Introductions Laminate Robustness Background Qualification Methods Contributing Factors Past Work on Laminate
More informationcontaminated, or if the location of the assembly house is well above sea level.
VAPOR PHASE REFLOW S EFFECT ON SOLDER PASTE RESIDUE SURFACE INSULATION RESISTANCE Karen Tellefsen. Mitch Holtzer, Corne Hoppenbrouwers Alpha Assembly Solutions South Plainfield, NJ, USA Roald Gontrum SmartTech
More informationSample Preparation for Mitigating Tin Whiskers in alternative Lead-Free Alloys
Sample Preparation for Mitigating Tin Whiskers in alternative Lead-Free Alloys Mehran Maalekian Karl Seelig, V.P. Technology Timothy O Neill, Technical Marketing Manager AIM Solder Cranston, RI Abstract
More informationTECHNICAL DATA SHEET 1 P a g e Revised August, 2014
1 P a g e Revised August, 2014 TAIYO PSR-4000 CC01SE (UL Name: PSR-4000JV / CA-40JV) LIQUID PHOTOIMAGEABLE CURTAIN COAT SOLDER MASK Curtain Coat Application Aqueous Developing Solder Mask RoHS Compliant
More informationAutomotive Electronic Material Challenges. Anitha Sinkfield, Delphi
Automotive Electronic Material Challenges Anitha Sinkfield, Delphi Automotive Electronic Material Challenges Project Update About inemi Project Participants Problem Statement Project Details Summary and
More informationTAIYO IJR-4000 MW300
TAIYO IJR-4000 MW300 INKJET LEGEND INK Photos Courtesy of ZOT Engineering Inkjet Application; Fast UV Curing High Cured Hardness Halogen-free; Bright White Color Excellent Adhesion to Semi- and Fully-Cured
More informationTECHNICAL DATA SHEET 1 P a g e Revised June, 2015
1 P a g e Revised June, 2015 TAIYO PSR-4000 CC01SE (UL Name: PSR-4000JV / CA-40JV) LIQUID PHOTOIMAGEABLE CURTAIN COAT SOLDER MASK Curtain Coat Application Aqueous Developing Solder Mask RoHS Compliant
More informationEffectiveness of Conformal Coat to Prevent Corrosion of Nickel-palladium-goldfinished
As originally published in the IPC APEX EXPO Conference Proceedings. Effectiveness of Conformal Coat to Prevent Corrosion of Nickel-palladium-goldfinished Terminals Michael Osterman Center for Advanced
More informationEffects of Solder Reflow Conditions on the Assembly of Electronics Packaging and Printed Circuit Boards
Effects of Solder Reflow Conditions on the Assembly of Electronics Packaging and Printed Circuit Boards Gregory K. Arslanian, Minfa Lin, Amy Wressell, Tom Mebrahtu, Victor Wang Air Products and Chemicals
More informationNo-Clean Flux Activity under Low Standoff Components
No-Clean Flux Activity under Low Standoff Components Bruno Tolla, Ph.D, Jennifer Allen, Kyle Loomis, Denis Jean ~ KESTER Corporation Mike Bixenman, DBA ~ KYZEN Corporation Electronic Devices More complex
More informationRecent Advances in Die Attach Film
Recent Advances in Die Attach Film Frederick Lo, Maurice Leblon, Richard Amigh, and Kevin Chung. AI Technology, Inc. 70 Washington Road, Princeton Junction, NJ 08550 www.aitechnology.com Abstract: The
More informationThe Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues Authored by: Eric Bastow, Indium Corporation Abstract An estimated 80% of all SMT assembly in the world
More informationTECHNICAL DATA SHEET 1 P a g e Revised January 9, 2014
1 P age Revised January 9, 2014 TAIYO PSR-4000 CC01SE (UL Name: PSR-4000JV / CA-40JV) LIQUID PHOTOIMAGEABLE CURTAIN COAT SOLDER MASK Curtain Coat Application Aqueous Developing Solder Mask RoHS Compliant
More informationLEAD FREE ALLOY DEVELOPMENT
LEAD FREE ALLOY DEVELOPMENT Karl F. Seelig, VP of Technology AIM Cranston, RI. USA. kseelig@aimsolder.com Abstract. When lead-free solders were first introduced to the electronics industry in the early
More informationHBLED packaging is becoming one of the new, high
Ag plating in HBLED packaging improves reflectivity and lowers costs JONATHAN HARRIS, President, CMC Laboratories, Inc., Tempe, AZ Various types of Ag plating technology along with the advantages and limitations
More informationFilm Defects vs Solutions
Technical Datasheets 技術資料 / TDS1504 PCA Conformal Coating Application Film Defects vs Solutions TOP5 / Common Errors in PCB Conformal Coatings TOP12 / Common Film Defects in General Coatings 티티앤에스주식회사
More informationHead-in-Pillow BGA Defects Karl Seelig AIM Cranston, Rhode Island, USA
Head-in-Pillow BGA Defects Karl Seelig AIM Cranston, Rhode Island, USA Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does
More informationNew Pb-Free Solder Alloy for Demanding Applications. Presented by Karl Seelig, VP Technology, AIM
New Pb-Free Solder Alloy for Demanding Applications Presented by Karl Seelig, VP Technology, AIM Why REL? The evolution and expansion of electronics into more harsh operating environments performing more
More informationOffshore Wind Turbines Power Electronics Design and Reliability Research
Offshore Wind Turbines Power Electronics Design and Reliability Research F. P. McCluskey CALCE/Dept. Of Mechanical Engineering University of Maryland, College Park, MD (301) 405-0279 mcclupa@umd.edu 1
More informationPremium Acrylic Conformal Coating 419D Technical Data Sheet 419D-Liquid
Description Premium Acrylic Conformal Coating Our 419D Premium Acrylic Conformal Coating is an IPC-CC-830B and UL 94-V0 certified, fast drying, xylene and toluene free product that provides an excellent
More informationPremium Acrylic Conformal Coating 419D Technical Data Sheet 419D-Liquid
Description Premium Acrylic Conformal Coating Our 419D Premium Acrylic Conformal Coating is a fast drying, xylene and toluene free product that provides an excellent finish. This one part coating is easy
More informationPulse White Paper Regarding RoHS Compliance
Pulse White Paper Regarding RoHS Compliance Table of Contents Executive Summary... 2 Background/History... 3 Materials Selection... 3 Testing/Validation... 4 Implementation/Conclusion... 5 References...
More informationOptimizing the Assembly Process with Cure-On-Demand UV/Visible Light-Curable Adhesives
Optimizing the Assembly Process with Cure-On-Demand UV/Visible Light-Curable Adhesives Virginia P. Read Industrial Market Segment Manager DYMAX Corporation Torrington, CT www.dymax.com Introduction Manufacturers
More informationVapor-Clear. The high-performance, low-cost, eco-friendly, aesthetically-pleasing alternative to high-build epoxy floors and boring
advanced moisture control, inc. The high-performance, low-cost, eco-friendly, aesthetically-pleasing alternative to high-build epoxy floors and boring 250 polished concrete slabs! Made in Southern California,
More informationCleaning Flux Residues Under Low Profile Components
Cleaning Flux Residues Under Low Profile Components Rich Brooks Kyzen Corporation March 4 th, 2010 How to clean under low profile components Improve the Fluid Flow BUT THAT IS NOT ALL THAT IS REQUIRED
More informationADVANCED PROTECTIVE COATING SYSTEM Breakthrough Protective Top Coat and High Performance Epoxy Primer
ADVANCED PROTECTIVE COATING SYSTEM Breakthrough Protective Top Coat and High Performance Epoxy Primer VSC 12 TOPCOAT VSC 11 PRIMER Traditional heavy-duty protective coating systems typically utilize a
More informationDRAFT DOCUMENT FOR INDUSTRY CONSENSUS REVIEW ONLY
To: the Reviewers of IPC-CC-830 From: 5-33a Leadership As you review the Final Draft for Industry Review (FDIR) for IPC-CC-830 Revision C, Qualification and Performance of Electrical Insulating Compound
More informationThe Dymax Edge. O l i gomers. Adhesive s. C o a t i n g s. E quipment. One priceless
The Dymax Edge O l i gomers. Adhesive s. C o a t i n g s. E quipment. One priceless r e s o u r c e. T h a t s t h e D ym a x E d ge. At Dymax, we re committed to providing our customers with the solutions
More informationSn60Pb40 No Clean Solder Wire Technical Data Sheet
Description The 487 4877 of Sn6Pb4 No Clean Solder Wire is an electronic grade solder wire. It uses a classical tin-to-lead alloy ratio, which is complemented with a no clean, synthetically refined, splatter-proof,
More informationWF6317. A superactive low-volatile/high heat-resistant water-soluble flux for ball soldering
WF637 A superactive low-volatile/high heat-resistant water-soluble flux for ball soldering Low viscosity and high tacking power stabilize ball holding force and ensures excellent solder wettability Easy
More informationPARTIALLY-ACTIVATED FLUX RESIDUE INFLUENCE ON SURFACE INSULATION RESISTANCE OF ELECTRONIC ASSEMBLY
As originally published in the SMTA Proceedings. PARTIALLY-ACTIVATED FLUX RESIDUE INFLUENCE ON SURFACE INSULATION RESISTANCE OF ELECTRONIC ASSEMBLY Xiang Wei, Ph.D., Kyle Loomis, Jennifer Allen, Bruno
More informationINTENSITY CODES TECHNICAL. INTENSITY CODES. Intensity Code for Standard LEDs (Ta=25 C Tolerance +/-15%)
INTENSITY CODES Intensity Code for Standard LEDs (Ta=25 C Tolerance +/-15%) Intensity Code for Displays (Ta=25 C Tolerance +/-15%) Bin Code Light intensity in mcd (IF
More informationLead-Free Connectors - An Overview
Lead-Free Connectors - An Overview Pete Elmgren Molex Inc. 15 August 2003 Introduction For more than 50 years, lead-bearing solders have been used almost exclusively throughout the electronics industry
More informationEPOXY FLUX MATERIAL AND PROCESS FOR ENHANCING ELECTRICAL INTERCONNECTIONS
As originally published in the SMTA Proceedings. EPOXY FLUX MATERIAL AND PROCESS FOR ENHANCING ELECTRICAL INTERCONNECTIONS Neil Poole, Ph.D., Elvira Vasquez, and Brian J. Toleno, Ph.D. Henkel Electronic
More informationSilicones for Air Conditioning Units
Silicones for Air Conditioning Units Overview Silicones for Air Conditioning Units: From potting and encapsulation products to adhesives, additives, hardcoats and packaging, Momentive has been leading
More informationTAIYO PSR-4000 LDI (US) (UL Name: PSR-4000 JA / CA-40 JA)
TAIYO PSR-4000 LDI (US) (UL Name: PSR-4000 JA / CA-40 JA) LASER DIRECT IMAGING SOLDER MASK For LDI Exposing Available in Green, Blue, Black and Red Satin Finish Halogen-Free RoHS Compliant Compatible with
More informationPb-free Challenges for High Complexity Products. inemi Jan 16 th 2008
Pb-free Challenges for High Complexity Products inemi Jan 16 th 2008 All Rights Reserved Alcatel-Lucent 2007 Agenda RoHS 101 Typical complex of telecom products (different from consumable) Pb-free Concerns
More informationResults of Mitigation Effectiveness Survey
Results of Mitigation Effectiveness Survey &Plans for GEIA-STD-0005-2 Revision Anduin E. Touw Task Team Lead for PERM GEIA-STD-0005-2 Associate Technical Fellow, The Boeing Company anduin.e.touw@boeing.com
More informationReference Only. 2.Part Numbering (ex) NF Z 5B BW 2R9 L N 1 0 L
SpecNo.JENF243J-0011A-01 P1/10 CHIP NOISE FILTER NFZ5BBW LN10 REFERENCE SPECIFICATION 1.Scope This reference specification applies to NFZ5BBW_LN10L Series, Chip Noise Filter. 2.Part Numbering (ex) NF Z
More informationLiquid Optically Clear Adhesive for Display Applications
Liquid Optically Clear Adhesive for Display Applications Daniel Lu, PhD Technical Director Henkel Corporation LOCTITE Liquid Optically Clear Adhesives (LOCA) Cover lens LOCA Touch sensor LOCA LCD 2 LOCA
More informationReference Only. Spec. No. JENF243D-0006K-01 P 1/ 8
Spec. No. JENF243D-0006K-01 P 1/ 8 Chip EMIFIL LC Combined Monolithic NFL21SP X1C Reference Specification 1. Scope This reference specification applies to Chip EMIFIL LC Combined Monolithic Type NFL21S
More informationThermally Conductive Epoxy Product No
PELCO T E C H N I C A L N O T E S DESCRIPTION Thermally Conductive Epoxy Product No. 16027 Product No. 16027 Thermally Conductive Epoxy, Encapsulating and Potting Compound, is an electric grade epoxy.
More informationLead-Free HASL: Balancing Benefits and Risks for IBM Server and Storage Hardware
Lead-Free HASL: Balancing Benefits and Risks for IBM Server and Storage Hardware November 19, 2009 M.Kelly, P.Eng, MBA Senior Engineer, ECAT Interconnect Technology Lead-Free Server Development Core Team
More informationWorkShop Audace. INSA ROUEN 8 juin 2012
WorkShop Audace INSA ROUEN 8 juin 2012 Global Standards for the Microelectronics Industry JEDEC standards for product level qualification Christian Gautier Content JEDEC overview Environmental reliability
More informationReference Only. This reference specification applies to Chip Ferrite Bead Array BLA31 Series used for electronic machinery. (8)Numbers of Circuit
Spec. No. JENF243A 0008N-01 P 1 / 9 1. Scope Chip Ferrite Bead Array BLA31SN4 Reference Specification This reference specification applies to Chip Ferrite Bead Array BLA31 Series used for electronic machinery.
More informationComponent Palladium Lead Finish - Specification Approved by Executive Board 1997-xx-xx August 22 Version
Component Palladium Lead Finish - Specification Approved by Executive Board 1997-xx-xx August 22 Version Appendices 1. User Commitment Form 2. Supplier Compliance Form Table of contents 1. Background 2.
More informationTopview 5630 Red SMD LED
Topview 5630 Red SMD LED 1. Features - Chip High-Luminosity SMD LED - 5.6 x 3.0 x 0.9 mm (L x W x H), 4-Pin, Small Size Surface Mount Type - Wide Viewing Angle - Long Operating Life - MSL 3 2. Applications
More informationFollowing this guideline enables proper treatment of the relays during the critical phase in the relay life.
Electromechanical relays are one of the most robust and most reliable electronic components. In order to achieve and guarantee the excellent performance of AXICOM relays, some precautions must be taken
More informationFailure Modes in Wire bonded and Flip Chip Packages
Failure Modes in Wire bonded and Flip Chip Packages Mumtaz Y. Bora Peregrine Semiconductor San Diego, Ca. 92121 mbora@psemi.com Abstract The growth of portable and wireless products is driving the miniaturization
More informationQualification and Performance Specification for Flexible Printed Boards
Qualification and Performance Specification for Flexible Printed Boards Developed by the Flexible Circuits Performance Specifications Subcommittee (D-12) of the Flexible Circuits Committee (D-10) of IPC
More informationLighting Marketing Team SAMSUNG Electronics LED Business
Lighting Marketing Team SAMSUNG Electronics LED Business Index 1. Chemical Guide Page 1.1 Sulfurization, Chloridization (or Tarnishing) in LED 1.1.1 Mechanism 3 1.1.2 Case study 5 1.1.3 Guide 7 1.2 Discoloration
More informationWhite Paper Quality and Reliability Challenges for Package on Package. By Craig Hillman and Randy Kong
White Paper Quality and Reliability Challenges for Package on Package By Craig Hillman and Randy Kong Background Semiconductor technology advances have been fulfilling Moore s law for many decades. However,
More informationEvaluating the CAF (conductive anodic filament)
Technology report Evaluating the CAF (conductive anodic filament) resistance of multi-layered PWBs Akiko Kobayashi, Yuichi Aoki, Keiko To Headquarters ESPEC Corp. Technical Development A dvances in the
More information3M Optically Clear Adhesives
Technical Data July, 2008 3M Optically Clear Adhesives 8180 8182 8185 8187 8188 8189 Product Description : 8180 10.0 mil (254 microns) optically clear laminating adhesive for bonding smooth or textured,
More informationConcrete Floor Coating Challenges
48 D+D MARCH 2015 True Grit Concrete Floor Coating Challenges Dave Lick, Paint Quality Assurance Inspector Peeling paint reveals a coating system failure in a commercial hallway. Planning and preparation
More informationLead-free soldering materials, some considerations. Presented at FHI conference, Gorinchem November 2005
Lead-free soldering materials, some considerations Presented at FHI conference, Gorinchem November 2005 Outline Present situation in Europe towards RoHS Industry status Lead-free soldering materials Getting
More informationFlorock Seamless Flooring Systems
Architectural Specification FloroCrete RT Rake/Trowel Urethane Mortar 3/16-1/4 (4.5-6.0 mm) Floor Resurfacing System Part 1: General 1.01 System Description A. System I Skid-Resistant Finish Resurfacing
More information3M XYZ / Isotropic Electrically Conductive Adhesive Transfer Tape 9709
Technical Data October, 2009 3M XYZ / Isotropic Electrically Conductive Adhesive Transfer Tape 9709 Product Description 3M XYZ/Isotropic Electrically Conductive Adhesive Transfer Tape 9709 is a pressure
More informationATS Document Cover Page
221-008 Item Rev Status: RELEASED printed 9/20/2017 2:27:42 PM by Les Deenin ATS: OPERATIN PROCEDURE ATS Document Cover Page Responsible Department: Supply Chain This copy is uncontrolled unless otherwise
More informationCures, Sealers Densifiers & Crystal Technology Ultimate / Proven Concrete Protection
Cures, Sealers Densifiers & Crystal Technology Ultimate / Proven Concrete Protection IF USED CORRECTELY AND IN THE RIGHT PLACES What is a Curing Membrane? Aids in the development of the designed strength
More informationPAYING ATTENTION TO DETAIL by Bob Cusumano
PAYING ATTENTION TO DETAIL by Bob Cusumano Painting contractors are often required to install caulk or sealant in exterior joints. Too often, the sealant is simply gunned into the joint until it s filled
More informationDie Attach Materials. Die Attach G, TECH. 2U. TECHNICAL R&D DIV.
Die Attach Materials Die Attach G, TECH. 2U. TECHNICAL R&D DIV. 2 Topics 3 What it is X 5,000 X 10,000 X 50,000 Si Chip Au Plating Substrate Ag Resin 4 Current Products Characteristics H9890-6A H9890-6S
More informationRobust Optimization of a Lead Free SMT Process
Presented at IPC SMEMA Council APEX 2003 www.goapex.org Robust Optimization of a Lead Free SMT Process Craig Jensen, Fred Kuhlman and Mike Pepples Delphi Delco Electronics Kokomo, Indiana Abstract This
More informationROHS Reliability Impact
ROHS Reliability Impact A Reality Check!!!! Presented by Larry Akre May 17, 2007 LAkre 2007 1 ROHS Reliability Impact RoHS Directive 2002/95/EC WEEE Directive 2002/96/EC Failure Mechanisms Tin Whiskers
More informationFrequently Asked Questions. 3M Liquid-Filled Transformer Insulation
Frequently Asked Questions 3M Liquid-Filled Transformer Insulation Frequently Asked Questions What configurations are available for 3M Liquid-Filled Transformer Insulation (LFT Insulation) layer insulation?
More informationLead Free Assembly: A Practical Tool For Laminate Materials Selection
Lead Free Assembly: A Practical Tool For Laminate Materials Selection Erik J. Bergum David Humby Isola Abstract: The impending European RoHS legislation, restricting the use of lead containing solders,
More informationFreescale Semiconductor Tape Ball Grid Array (TBGA) Overview
Freescale Semiconductor Tape Ball Grid Array (TBGA) Overview Revision 0 2006 Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the
More informationTHIN IMMERSION TIN USING ORGANIC METALS
THIN IMMERSION TIN USING ORGANIC METALS Jim Kenny, Nils Arendt, Bernhard Wessling, and Karl Wengenroth Enthone Inc., A Business of Cookson Electronics West Haven, CT, USA ABSTRACT With the international
More informationDow Corning Protection, Assembly and Optical Materials Solutions for Lighting. LED Lighting Product Selection Guide
Dow Corning Protection, Assembly and Optical Materials Solutions for Lighting LED Lighting Product Selection Guide your ideas WE MAKE LED Headlamp Assembly Adhesives Moldable Silicones Reflective Coatings
More informationSUPERIOR PRODUCTS INTERNATIONAL LEAD-BASED PAINT ABATEMENT ENCAPSULATION METHOD THAT ELIMINATES SANDBLASTING FOR STEEL STRUCTURES
SUPERIOR PRODUCTS INTERNATIONAL INTRODUCES A LEAD-BASED PAINT ABATEMENT ENCAPSULATION METHOD THAT ELIMINATES SANDBLASTING FOR STEEL STRUCTURES Superior Products RUST GRIP and ENAMO GRIP Before 1 LEAD-BASED
More informationReference Only. Spec. No. JENF243E-0002Q-01 P1 / 8
Spec. No. JENF243E-0002Q-01 P1 / 8 Chip EMIFIL LC Combined Type for Large Current NFE31PT 1E9 Reference Specification 1. Scope This reference specification applies to Chip EMIFIL LC Combined Type for Large
More informationSTYCAST 2850 FT. Technical Data. Two Component, Versatile Epoxy Encapsulant With High Thermal Conductivity
Two Component, Versatile Epoxy Encapsulant With High Thermal Conductivity Key Feature High thermal conductivity Wide variety of catalysts Low coefficient of thermal expansion Product Description : Benefit
More informationBasic PCB Level Assembly Process Methodology for 3D Package-on-Package
Basic PCB Level Assembly Process Methodology for 3D Package-on-Package Vern Solberg STC-Madison Madison, Wisconsin USA Abstract The motivation for developing higher density IC packaging continues to be
More informationIs there a Liquid applied EPDM roof
Coatings At Their Best As the coatings market grows, building owners will have improved selections of their arsenal of applications. By Pete E. Rowan, BS, C.P.M.R. Is there a Liquid applied EPDM roof coating?
More informationRecommended Land Pattern: [mm]
Dimensions: [mm] Recommended Land Pattern: [mm] Electrical Properties: Properties Test conditions Value Unit Tol. 1,7 Inductance 100 khz/ 250 mv L 47 µh ±20% Rated Current ΔT = 40 K I R 1.1 A max. 4,0
More informationTechnical Bulletin July, 2013
Extreme Sealing Tape Exterior Durability Report Technical Bulletin July, 213 Summary of Technical Data: This report provides outdoor weathering data, temperature and humidity resistance, and solvent immersion
More informationReliability of Interconnects in LED Lighting Assemblies Utilizing Metal Clad Printed Circuit Boards Stefano Sciolè BDM I.M.S.
Reliability of Interconnects in LED Lighting Assemblies Utilizing Metal Clad Printed Circuit Boards Stefano Sciolè BDM I.M.S. Henkel Electronic Materials Agenda 1. Introduction 2. Motivation 3. Interconnect
More informationReference Only. Marked three digits system.(ex. 270pF 271) 8 Lead Type
Spec No. JENF243F-0018K-01 P1/11 Disc-Type EMIFIL (A miniature three-terminal capacitor) DSS6N 1.Scope This reference specification applies to DSS6N series. 2.Part Numbering (Ex.) DS S 6 N B3 2A 271 Q93
More information3M Electrical, Electronic and EMI Shielding Tapes Selection Guide
3M Electrical, Electronic and EMI Shielding Tapes Selection Guide 3M Electrical Tapes Operating Temperature ( C) Dielectric Breakdown (Volts) Insulation Resistance (megohms) (lb/in)/(n/10 mm) Elongation
More informationELANTAS Zhuhai Co., Ltd. Zhuhai P.R. China. ELANTAS PDG, Inc. St. Louis U.S.A. ELANTAS Tongling Co., Ltd. Tongling P.R. China
Focus on innovation The more you demand, the more you get Worldwide locations BECTRON performance is convincing in a wide range of applications. So the coating for your product can be configured to your
More informationMVTR Barrier of Metallized PLA Films
MVTR Barrier of Metallized PLA Films Sigma Technologies Int l A. Yializis PhD Presented By: Steven Yializis 1 What Is PLA PLA is a Natural Product Based on Plant Photosynthesis H 2 O + CO 2 + Light CH
More informationDow Corning Protection, Assembly and Optical Materials Solutions for Lighting. LED Lighting Product Selection Guide
Dow Corning Protection, Assembly and Optical Materials Solutions for Lighting LED Lighting Product Selection Guide WE MAKE yourideas LED Headlamp Assembly Adhesives Moldable Silicones Reflective Coatings
More information3M Anisotropic Conductive Film 5363
Technical Data November 2013 Product Description 3M Anisotropic Conductive Film (ACF) 5363 is a heat-bondable, electrically conductive adhesive film. The unbonded film is non-tacky at room temperature
More informationReference Only. Spec. No. JENF243E-0003Q-01 P 1 / 8. Chip EMIFIL LC Combined Type for Large Current NFE61PT 1H9 Reference Specification
Spec. No. JENF243E-0003Q-01 P 1 / 8 Chip EMIFIL LC Combined Type for Large Current NFE61PT 1H9 Reference Specification 1. Scope This reference specification applies to Chip EMIFIL LC Combined Type for
More information3-Part Epoxy Grouting System for Pile Capping
Product Data Sheet Edition: 10/10/2012 Identification no. Version no: GCC Sikadur -42 PC Sikadur -42 PC 3-Part Epoxy Grouting System for Pile Capping Product Description Uses Characteristics / Advantages
More informationDimensions: [mm] Recommended Land Pattern: [mm] 3,5 pl 3,5 1,0 0,6. Pattern Properties: Article Properties:
Dimensions: [mm] Recommended Land Pattern: [mm] 3,5 pl 3,5 1,0 0,6 1 End 2,2 1 End 2,6 1,0 ±0,05 L ±0,15 L2 ±0,1 Pl ±0,1 h 0,13 0,35 ±0,05 3,00 ±0,15 1,7 General tolerance ±0,05 Pl Pl 1,7 1,7 ±0,25 7,1
More informationRust-Oleum Industrial Brands Specification
Rust-Oleum Industrial Brands Specification Coating Specification for Rust-Oleum Virtual Solutions Coating Solution 2 A solvent based coating system High Performance 9100/9800 System DTM Epoxy Mastic/DTM
More informationPower Electronics Packaging Solutions for Device Junction Temperature over 220 o C
EPRC 12 Project Proposal Power Electronics Packaging Solutions for Device Junction Temperature over 220 o C 15 th August 2012 Page 1 Motivation Increased requirements of high power semiconductor device
More informationReference Only. Chip Ferrite Bead BLM31 SZ1 Murata Standard Reference Specification [AEC-Q200]
P.1/9 Chip Ferrite Bead BLM31 SZ1 Murata Standard Reference Specification [AEC-Q200] 1. Scope This reference specification applies to Chip Ferrite Bead for Automotive Electronics BLM31_SZ Series based
More informationAuthor: M Shaw, Sika Limited. Construction. A Guide to the Concrete Repair European Standards BS EN 1504 Series
Author: M Shaw, Sika Limited A Guide to the Concrete Repair European Standards BS EN 1504 Series 1 Contents Section Heading Page Introduction 3 1.0 Overview of BS EN 1504 Documents 4 2.0 BS EN 1504 Principles
More information3M Electromagnetic Compatible Products
3M Electromagnetic Compatible Products Selection Guide Revision E 3 Innovation Faster, smaller, lighter, easier the skyrocketing development of today s electronics requires new solutions for significant
More informationPS-101 Preparing for Your Success
PS-101 Preparing for Your Success The Pressure-sensitive Label Construction Module 4: Adhesives Pressure-Sensitive Adhesive Features Coating Technology Adhesive Chemistry Adhesive Selection Criteria &
More information