ACI BASIC DESIGN RULES
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1 ACI BASIC DESIGN RULES All these rules are basic rules. For any specialty please do not hesitate to contact us so we can discuss and find a solution to fulfill your needs. ACI available products Material Layers Material thickness (in mm) Copper thickness (in µm) FR FR FR FR FR FR FR FR FR FR FR FR FR FR FR FR FR FR FR FR FR FR FR FR FR FR Kapton Upon request we may process other types of material (Rogers, etc.) or different thicknesses. Material will be provided by the customer.
2 Standard Dimensions (in mm) Description PCB size max. Panel size max. Small 148 x x 250 Medium 228 x x 300 Large 228 x x 380 Hole Diameter (in mm) Material Thickness Min. Hole Diameter Max. Hole Diameter (c) (c) Available drills: From 0.25 up to 3.25 mm, by steps of 0.05 From 3.30 up to 6.2 mm, by steps of 0.1 Drill diameters above 6.2 mm must be placed in the Outline file, GERBER RS-274X format
3 Files needed: 1 file showing the layout of one side of the PCB, scale 1:1 (with dimensions if bigger then A4), PDF format (PDF 1:1 du circuit) 1 file TOP GERBER RS-274X format (Face dessus) 1 file BOT GERBER RS-274X format (Face dessous) 1 file Solder Mask TOP GERBER RS-274X format (Masque anti-soudure face dessus) 1 file Solder Mask BOT GERBER RS-274X format (Masque anti-soudure face dessous) 1 file Outline GERBER RS-274X format (Fichier de découpe mécanique) 1 Excellon 2 drill file with header (Fichier de perçage) We do not provide silk-screen (for component legend) Important: do not forget to add the EPFL logo in the design. If not present, ACI will add it, unless it is specified in the order that it should not. EPFL logos can be found under: For Altium a True Type editor can be found here: Gerber Files Format Extensions Description Protel Orcad Eagle Other Top Copper gtl top cmp gbr, gbx Bottom Copper gbl bot sol gbr, gbx Top Soldermask gts smt stc gbr, gbx Bottom Soldermask gbs smb sts gbr, gbx Top Silkscreen gto sst plc Bottom Silkscreen gbo ssb pls NC Drill drl thruhole.tap drd nc, txt, g01 Outline gm1 gbr, gbx, gm1
4 Finishing: ACI offers the following finishing: Copper (Cuivre) Chemical tin (Etain) Gold (Nickel-Or) o ENEPIG - Electroless Nickel Electroless Palladium Immersion Gold. This finish has many advantages like excellent flatness for fine pitch components, very good oxidation properties, etc. It should also be the perfect choice for wire bonding. It is made of: microns of Nickel, microns of palladium and microns of gold. o ENIG (Chemical gold) Electroless Nickel Immersion Gold. This finish is also absolutely flat, as very good oxidation properties and should be used in case of edge card connection and press fit connectors because the gold is harder and more resistant. It is made of: microns of Nickel and microns of gold. Gold (without Nickel) o EPIG - Electroless Palladium Immersion Gold. Due to the absence of Nickel this finish is really useful in case of medical or high- frequency applications. The type of gold finish requested, ENEPIG, Chem-Gold or EPIG, must me mentioned in the "Remarques" window of the order form. Gold finish is done externally and therefore an extra 5 working days delivery should be added. To order ACI services aci-commandes.epfl.ch
5 Copper design rules (in µm) Copper thickness Min. Trace width Min. Space width Min. Annulus width Min. space between copper and PCB outline (a) (b) (e) (d)
6 Solder Mask (in µm) Clearance Bridge Cover (f) (g) (h)
7
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Dimensions: [mm] Recommended Land Pattern: [mm] 3,5 pl 3,5 1,0 0,6. Pattern Properties: Article Properties:
![Dimensions: [mm] Recommended Land Pattern: [mm] 3,5 pl 3,5 1,0 0,6. Pattern Properties: Article Properties:](/thumbs/74/71304573.jpg "Dimensions: [mm] Recommended Land Pattern: [mm] 3,5 pl 3,5 1,0 0,6. Pattern Properties: Article Properties:")
Dimensions: [mm] Recommended Land Pattern: [mm] 3,5 pl 3,5 1,0 0,6 1 End 2,2 1 End 2,6 1,0 ±0,05 L ±0,15 L2 ±0,1 Pl ±0,1 h 0,13 0,35 ±0,05 3,00 ±0,15 1,7 General tolerance ±0,05 Pl Pl 1,7 1,7 ±0,25 7,1