Fabrication Technology, Part II

Size: px
Start display at page:

Download "Fabrication Technology, Part II"

Transcription

1 EEL5225: Principles of MEMS Transducers (Fall 2003) Fabrication Technology, Part II Agenda: Process Examples TI Micromirror fabrication process SCREAM CMOS-MEMS processes Wafer Bonding LIGA Reading: Senturia, pp Lecture 9 by H.K. Xie 9/15/2003

2 Process Examples Surface micromachining: TI Digital Micromirror Devices (DMDs) Invented by L.J. Hornbeck Ref. Maluf, Introduction to MEMS Engineering, p

3 Process Examples Bulk-Micromachined Pressure Sensor Thermal oxide Boron implantation Boron drive-in LPCVD Si 3 N 4 Backside KOH etch Electrochemical etch stop Metallization Detailed process steps refer to Senturia p.93 Ref. Senturia, Microsystem Design, p.97 3

4 Process Examples Single Crystal Reactive Etching and Metallization (SCREAM) Process First demonstrated by MacDonald s group at Cornell University Single crystal silicon (SCS) microstructures Large force Large displacement Post-CMOS process for electronics integration Ref. Maluf, Introduction to MEMS Engineering, p.82. 4

5 CMOS-MEMS Why CMOS-MEMS? Smart on-chip CMOS circuitry Multi-vendor accessibility Scalability Compact size More functions Low cost MEMS structures can be made Before CMOS processes ( pre-cmos ) In-between CMOS processes ( intermediate-cmos ) After CMOS processes ( post-cmos ) 5

6 Pre-CMOS MEMS Process Pre-etched trench to house MEMS structures CMP to planarize the wafer for regular CMOS processing Wet etch to release MEMS structures Need a dedicated production line 6

7 Intermediate-CMOS MEMS Form transistors on bare wafers first Then deposit and anneal MEMS structural materials No CMP needed Only one interconnect metal layer Wet etch to release MEMS structures Need a dedicated production line NPN NMOS Sensor Area Sensor Poly Passivations BPSG Met Thox Nwell Emitter Base NSD Courtesy of Mr. John Geen of Analog Devices, Inc. 7

8 Thin-Film Post CMOS-MEMS (a) After standard CMOS processes CMOS region microstructural region metallization layers (b) Pattern microstructure Metal as etching mask Anisotropic etch CHF3 + O2 (c) Release microstructure Metal as etching mask Undercut Si substrate Isotropic etch movable microstructure SF6 or XeF2 G. Fedder et al., Sensors & Actuators A, v.57, no.2, 1996 dielectric layers silicon substrate gate polysilicon metal-3 metal-2 metal-1 anchored stator Spring beams Sensing comb fingers Proof mass H. Xie et al., Thin-film z-axis accelerometer 8

9 DRIE CMOS-MEMS Process (a) Backside etch STS: 12-sec etching, 130-sccm SF 6, 13-sccm O 2, 23 mt, 600 W coil power, 12 W platen power; 8-sec passivation 85-sccm C 4 F 8, 12 mt, 600 W coil power, 0 platen power. CMOS-region Single-crystal Si (SCS) membrane metal-3 metal-2 metal-1 oxide poly-si (b) Oxide etch PlasmaTherm-790: 22.5-sccm CHF 3, 16-sccm O 2, 100 W, 125 mt for 125 minutes and then 100 mt for 10 minutes. (c) Deep Si etch CMOS layer STS: same as Step (a). 9 H. Xie et al, Journal of Microelectromechanical Systems, April 2002

10 Flat structure Thin-film structure (d) Si undercut STS: 130-sccm SF 6, 13-sccm O 2, 23 mt, 600 W coil power, and 0 platen power. SCS layer (20~100µm) bimorph actuator Spring beams mirror Sensing comb fingers Proof mass Xie et al, 1-D Scanning Micromirror Xie et al, DRIE z-axis accelerometer 10

11 Wafer Bonding Wafer bonding Addresses need to obtain greater vertical dimensions and vacuum packaging, and to seal channels Methods Epoxy bonding (low temperature 100 C) Metal eutectic bonding (low-moderate temperature C) Glass frit bonding (low-moderate temperature 450 C) Anodic bonding (moderate temperature C) Silicon fusion bonding (high temperature C) Ref. Kovacs, Micromachined Transducers Sourcebook, p

12 Wafer Bonding Anodic bonding Moderate temperature C Sodium-rich glass plate (7740 Pyrex) V at 500 C to diffuse ions and to form electrostatic bond Bond chamber Ref. Kovacs, Micromachined Transducers Sourcebook, p EVG501 Wafer Bonding System 12

13 LIGA LIGA LIGA: German acronym for X-ray Lithographie, electrodeposition (Galvanoformung), and molding (Abformung) Ref. Maluf, Introduction to MEMS Engineering, p.76. Issues High energy radiation source Alternatives Assembly Thick UV sensitive resist ( poor man s LIGA ) Enables fabrication of microsize metal parts 13

14 Project Issues Teams Schedule 14

Lecture 7 CMOS MEMS. CMOS MEMS Processes. CMOS MEMS Processes. Why CMOS-MEMS? Agenda: CMOS MEMS: Fabrication. MEMS structures can be made

Lecture 7 CMOS MEMS. CMOS MEMS Processes. CMOS MEMS Processes. Why CMOS-MEMS? Agenda: CMOS MEMS: Fabrication. MEMS structures can be made EEL6935 Advanced MEMS (Spring 2005) Instructor: Dr. Huikai Xie CMOS MEMS Agenda: Lecture 7 CMOS MEMS: Fabrication Pre-CMOS Intra-CMOS Post-CMOS Deposition Etching Why CMOS-MEMS? Smart on-chip CMOS circuitry

More information

Dr. Lynn Fuller Webpage:

Dr. Lynn Fuller Webpage: ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING Microelectromechanical Systems (MEMs) Process Integration Dr. Lynn Fuller Webpage: http://people.rit.edu/lffeee 82 Lomb Memorial Drive Rochester,

More information

MEMS Fabrication. Beyond Integrated Circuits. MEMS Basic Concepts

MEMS Fabrication. Beyond Integrated Circuits. MEMS Basic Concepts MEMS Fabrication Beyond Integrated Circuits MEMS Basic Concepts Uses integrated circuit fabrication techniques to make mechanical as well as electrical components on a single chip. Small size 1µm 1mm Typically

More information

Lecture 3: Integrated Processes

Lecture 3: Integrated Processes Lecture 3: Integrated Processes Single-Crystal Silicon Process Integration Polysilicon Micromachining Process Integrated CMOS Micromachining Process ENE 5400, Spring 2004 1 Single Crystal Silicon ENE 5400,

More information

Lecture 5. SOI Micromachining. SOI MUMPs. SOI Micromachining. Silicon-on-Insulator Microstructures. Agenda:

Lecture 5. SOI Micromachining. SOI MUMPs. SOI Micromachining. Silicon-on-Insulator Microstructures. Agenda: EEL6935 Advanced MEMS (Spring 2005) Instructor: Dr. Huikai Xie SOI Micromachining Agenda: SOI Micromachining SOI MUMPs Multi-level structures Lecture 5 Silicon-on-Insulator Microstructures Single-crystal

More information

Integrated Processes. Lecture Outline

Integrated Processes. Lecture Outline Integrated Processes Thara Srinivasan Lecture 14 Picture credit: Lemkin et al. Lecture Outline From reader Bustillo, J. et al., Surface micromachining of MEMS, pp. 1556-9. A.E. Franke et al., Polycrystalline

More information

Lecture 10: MultiUser MEMS Process (MUMPS)

Lecture 10: MultiUser MEMS Process (MUMPS) MEMS: Fabrication Lecture 10: MultiUser MEMS Process (MUMPS) Prasanna S. Gandhi Assistant Professor, Department of Mechanical Engineering, Indian Institute of Technology, Bombay, 1 Recap Various VLSI based

More information

6.777J/2.732J Design and Fabrication of Microelectromechanical Devices Spring Term Solution to Problem Set 2 (16 pts)

6.777J/2.732J Design and Fabrication of Microelectromechanical Devices Spring Term Solution to Problem Set 2 (16 pts) 6.777J/2.732J Design and Fabrication of Microelectromechanical Devices Spring Term 2007 By Brian Taff (Adapted from work by Feras Eid) Solution to Problem Set 2 (16 pts) Issued: Lecture 4 Due: Lecture

More information

Chapter 3 Silicon Device Fabrication Technology

Chapter 3 Silicon Device Fabrication Technology Chapter 3 Silicon Device Fabrication Technology Over 10 15 transistors (or 100,000 for every person in the world) are manufactured every year. VLSI (Very Large Scale Integration) ULSI (Ultra Large Scale

More information

ME 189 Microsystems Design and Manufacture. Chapter 9. Micromanufacturing

ME 189 Microsystems Design and Manufacture. Chapter 9. Micromanufacturing ME 189 Microsystems Design and Manufacture Chapter 9 Micromanufacturing This chapter will offer an overview of the application of the various fabrication techniques described in Chapter 8 in the manufacturing

More information

ASIM-X MEMS-Specific Design Rules

ASIM-X MEMS-Specific Design Rules ASIM-X MEMS-Specific Design Rules Version 2 Revised April 5, 2006. This is a beta version, subject to change. Revised by G. K. Fedder, Carnegie Mellon University. 1 Process Overview ASIM-X, an acronym

More information

Manufacturing Technologies for MEMS and SMART SENSORS

Manufacturing Technologies for MEMS and SMART SENSORS 4 Manufacturing Technologies for MEMS and SMART SENSORS Dr. H. K. Verma Distinguished Professor (EEE) Sharda University, Greater Noida (Formerly: Deputy Director and Professor of Instrumentation Indian

More information

CMOS Technology. Flow varies with process types & company. Start with substrate selection. N-Well CMOS Twin-Well CMOS STI

CMOS Technology. Flow varies with process types & company. Start with substrate selection. N-Well CMOS Twin-Well CMOS STI CMOS Technology Flow varies with process types & company N-Well CMOS Twin-Well CMOS STI Start with substrate selection Type: n or p Doping level, resistivity Orientation, 100, or 101, etc Other parameters

More information

Surface Micromachining and Inertial Sensors

Surface Micromachining and Inertial Sensors Surface Micromachining and Inertial Sensors Tutorial 2A Bob Sulouff Analog Devices Inc. Cambridge, MA. 02139 Bob.Sulouff@Analog.com 617-761- Presentation Outline Technology of MEMS Surface Micromachined

More information

INF5490 RF MEMS. LN02: MEMS Fabrication. Spring 2012, Oddvar Søråsen Department of Informatics, UoO

INF5490 RF MEMS. LN02: MEMS Fabrication. Spring 2012, Oddvar Søråsen Department of Informatics, UoO INF5490 RF MEMS LN02: MEMS Fabrication Spring 2012, Oddvar Søråsen Department of Informatics, UoO 1 Micromachining Today s lecture Important process steps General Summary: MEMS-specific steps Examples

More information

Micro-Electro-Mechanical Systems (MEMS) Fabrication. Special Process Modules for MEMS. Principle of Sensing and Actuation

Micro-Electro-Mechanical Systems (MEMS) Fabrication. Special Process Modules for MEMS. Principle of Sensing and Actuation Micro-Electro-Mechanical Systems (MEMS) Fabrication Fabrication Considerations Stress-Strain, Thin-film Stress, Stiction Special Process Modules for MEMS Bonding, Cavity Sealing, Deep RIE, Spatial forming

More information

Preface Preface to First Edition

Preface Preface to First Edition Contents Foreword Preface Preface to First Edition xiii xv xix CHAPTER 1 MEMS: A Technology from Lilliput 1 The Promise of Technology 1 What Are MEMS or MST? 2 What Is Micromachining? 3 Applications and

More information

Micro-Scale Engineering I Microelectromechanical Systems (MEMS) Y. C. Lee

Micro-Scale Engineering I Microelectromechanical Systems (MEMS) Y. C. Lee Micro-Scale Engineering I Microelectromechanical Systems (MEMS) Y. C. Lee Department of Mechanical Engineering University of Colorado Boulder, CO 80309-0427 leeyc@colorado.edu September 2, 2008 1 Three

More information

Today s Class. Materials for MEMS

Today s Class. Materials for MEMS Lecture 2: VLSI-based Fabrication for MEMS: Fundamentals Prasanna S. Gandhi Assistant Professor, Department of Mechanical Engineering, Indian Institute of Technology, Bombay, Recap: Last Class What is

More information

EE C245 ME C218 Introduction to MEMS Design Fall 2011

EE C245 ME C218 Introduction to MEMS Design Fall 2011 Lecture Outline EE C245 ME C218 Introduction to MEMS Design Fall 2011 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720

More information

General Introduction to Microstructure Technology p. 1 What is Microstructure Technology? p. 1 From Microstructure Technology to Microsystems

General Introduction to Microstructure Technology p. 1 What is Microstructure Technology? p. 1 From Microstructure Technology to Microsystems General Introduction to Microstructure Technology p. 1 What is Microstructure Technology? p. 1 From Microstructure Technology to Microsystems Technology p. 9 The Parallels to Microelectronics p. 15 The

More information

Lect. 2: Basics of Si Technology

Lect. 2: Basics of Si Technology Unit processes Thin Film Deposition Etching Ion Implantation Photolithography Chemical Mechanical Polishing 1. Thin Film Deposition Layer of materials ranging from fractions of nanometer to several micro-meters

More information

Introduction to Microeletromechanical Systems (MEMS) Lecture 5 Topics. JDS Uniphase MUMPs

Introduction to Microeletromechanical Systems (MEMS) Lecture 5 Topics. JDS Uniphase MUMPs Introduction to Microeletromechanical Systems (MEMS) Lecture 5 Topics JDS Uniphase MUMPS Foundry Process and Devices Foundry Process Sequence Design Rules and Process Interactions Examples CMOS for MEMS

More information

PHYS 534 (Fall 2008) Process Integration OUTLINE. Examples of PROCESS FLOW SEQUENCES. >Surface-Micromachined Beam

PHYS 534 (Fall 2008) Process Integration OUTLINE. Examples of PROCESS FLOW SEQUENCES. >Surface-Micromachined Beam PHYS 534 (Fall 2008) Process Integration Srikar Vengallatore, McGill University 1 OUTLINE Examples of PROCESS FLOW SEQUENCES >Semiconductor diode >Surface-Micromachined Beam Critical Issues in Process

More information

We are IntechOpen, the world s leading publisher of Open Access books Built by scientists, for scientists. International authors and editors

We are IntechOpen, the world s leading publisher of Open Access books Built by scientists, for scientists. International authors and editors We are IntechOpen, the world s leading publisher of Open Access books Built by scientists, for scientists 3,900 116,000 120M Open access books available International authors and editors Downloads Our

More information

L5: Micromachining processes 1/7 01/22/02

L5: Micromachining processes 1/7 01/22/02 97.577 L5: Micromachining processes 1/7 01/22/02 5: Micromachining technology Top-down approaches to building large (relative to an atom or even a transistor) structures. 5.1 Bulk Micromachining A bulk

More information

EECS130 Integrated Circuit Devices

EECS130 Integrated Circuit Devices EECS130 Integrated Circuit Devices Professor Ali Javey 9/13/2007 Fabrication Technology Lecture 1 Silicon Device Fabrication Technology Over 10 15 transistors (or 100,000 for every person in the world)

More information

Fabrication technique for microelectromechanical systems vertical comb-drive actuators on a monolithic silicon substrate

Fabrication technique for microelectromechanical systems vertical comb-drive actuators on a monolithic silicon substrate Fabrication technique for microelectromechanical systems vertical comb-drive actuators on a monolithic silicon substrate Q. X. Zhang Institute of Microelectronics, 11 Science Park Road, Singapore Science

More information

This Appendix discusses the main IC fabrication processes.

This Appendix discusses the main IC fabrication processes. IC Fabrication B B.1 Introduction This Appendix discusses the main IC fabrication processes. B.2 NMOS fabrication NMOS transistors are formed in a p-type substrate. The NMOS fabrication process requires

More information

Review of CMOS Processing Technology

Review of CMOS Processing Technology - Scaling and Integration Moore s Law Unit processes Thin Film Deposition Etching Ion Implantation Photolithography Chemical Mechanical Polishing 1. Thin Film Deposition Layer of materials ranging from

More information

3. Overview of Microfabrication Techniques

3. Overview of Microfabrication Techniques 3. Overview of Microfabrication Techniques The Si revolution First Transistor Bell Labs (1947) Si integrated circuits Texas Instruments (~1960) Modern ICs More? Check out: http://www.pbs.org/transistor/background1/events/miraclemo.html

More information

Solid State Sensors. Microfabrication 8/22/08 and 8/25/08

Solid State Sensors. Microfabrication 8/22/08 and 8/25/08 Solid State Sensors Microfabrication 8/22/08 and 8/25/08 Purpose of This Material To introduce the student to microfabrication techniques as used to fabricate MEMS Sensors Understand concepts not specifics

More information

Lecture 030 Integrated Circuit Technology - I (5/8/03) Page 030-1

Lecture 030 Integrated Circuit Technology - I (5/8/03) Page 030-1 Lecture 030 Integrated Circuit Technology - I (5/8/03) Page 030-1 LECTURE 030 INTEGRATED CIRCUIT TECHNOLOGY - I (References [7,8]) Objective The objective of this presentation is: 1.) Illustrate integrated

More information

Interconnect Issues for Integrated MEMS Technology

Interconnect Issues for Integrated MEMS Technology Interconnect Issues for Integrated MEMS Technology Tsu-Jae King, Roger T. Howe *, Marie-Ange Eyoum and Sunil A. Bhave * Dept. of Electrical Engineering and Computer Sciences, * Berkeley Sensor and Actuator

More information

UT Austin, ECE Department VLSI Design 2. CMOS Fabrication, Layout Rules

UT Austin, ECE Department VLSI Design 2. CMOS Fabrication, Layout Rules 2. CMOS Fabrication, Layout, Design Rules Last module: Introduction to the course How a transistor works CMOS transistors This module: CMOS Fabrication Design Rules CMOS Fabrication CMOS transistors are

More information

Figure 2.3 (cont., p. 60) (e) Block diagram of Pentium 4 processor with 42 million transistors (2000). [Courtesy Intel Corporation.

Figure 2.3 (cont., p. 60) (e) Block diagram of Pentium 4 processor with 42 million transistors (2000). [Courtesy Intel Corporation. Figure 2.1 (p. 58) Basic fabrication steps in the silicon planar process: (a) oxide formation, (b) selective oxide removal, (c) deposition of dopant atoms on wafer, (d) diffusion of dopant atoms into exposed

More information

4. Process Integration: Case Studies

4. Process Integration: Case Studies Case Study #2: FCantilevered Microgripper Surface Machined MEMS Case Study #2: FCantilevered Microgripper Sandia Lucent Sandia Integrated Accelerometers Optomechanical Systems Integrated Sensors 1 Bulk

More information

EE 330 Lecture 9. IC Fabrication Technology Part II. -Oxidation -Epitaxy -Polysilicon -Planarization -Resistance and Capacitance in Interconnects

EE 330 Lecture 9. IC Fabrication Technology Part II. -Oxidation -Epitaxy -Polysilicon -Planarization -Resistance and Capacitance in Interconnects EE 330 Lecture 9 IC Fabrication Technology Part II -Oxidation -Epitaxy -Polysilicon -Planarization -Resistance and Capacitance in Interconnects Review from Last Time IC Fabrication Technology Crystal Preparation

More information

Process Integration. NMOS Generic NMOS Process Flow. CMOS - The MOSIS Process Flow

Process Integration. NMOS Generic NMOS Process Flow. CMOS - The MOSIS Process Flow Process Integration Self-aligned Techniques LOCOS- self-aligned channel stop Self-aligned Source/Drain Lightly Doped Drain (LDD) Self-aligned silicide (SALICIDE) Self-aligned oxide gap MEMS Release Techniques

More information

Surface micromachining and Process flow part 1

Surface micromachining and Process flow part 1 Surface micromachining and Process flow part 1 Identify the basic steps of a generic surface micromachining process Identify the critical requirements needed to create a MEMS using surface micromachining

More information

Mechanical Engineering and Applied Mechanics University of Pennsylvania. A glimpse of MEMS. Presented to MEAM 550 (Fall 2001) students

Mechanical Engineering and Applied Mechanics University of Pennsylvania. A glimpse of MEMS. Presented to MEAM 550 (Fall 2001) students Mechanical Engineering and Applied Mechanics University of Pennsylvania A glimpse of MEMS Presented to MEAM 550 (Fall 2001) students G. K. Ananthasuresh September 17, 2001 What s in a name? Micro-Electro-Mechanical

More information

SURFACE MICROMACHINING

SURFACE MICROMACHINING SURFACE MICROMACHINING Features are built up, layer by layer on the surface of a substrate. Surface micromachined devices are much smaller than bulk micromachined components. Nature of deposition process

More information

Wafer-to-Wafer Bonding and Packaging

Wafer-to-Wafer Bonding and Packaging Wafer-to-Wafer Bonding and Packaging Dr. Thara Srinivasan Lecture 25 Picture credit: Radant MEMS Reading Lecture Outline Senturia, S., Chapter 17, Packaging. Schmidt, M. A. Wafer-to-Wafer Bonding for Microstructure

More information

Lecture 6. Through-Wafer Interconnect. Agenda: Through-wafer Interconnect Polymer MEMS. Through-Wafer Interconnect -1. Through-Wafer Interconnect -2

Lecture 6. Through-Wafer Interconnect. Agenda: Through-wafer Interconnect Polymer MEMS. Through-Wafer Interconnect -1. Through-Wafer Interconnect -2 Agenda: EEL6935 Advanced MEMS (Spring 2005) Instructor: Dr. Huikai Xie Lecture 6 Through-wafer Interconnect EEL6935 Advanced MEMS 2005 H. Xie 1/21/2005 1 Motivations: Wafer-level packaging CMOS 3D Integration

More information

Process Integration. MEMS Release Techniques Sacrificial Layer Removal Substrate Undercut

Process Integration. MEMS Release Techniques Sacrificial Layer Removal Substrate Undercut Process Integration Self-aligned Techniques LOCOS- self-aligned channel stop Self-aligned Source/Drain Lightly Doped Drain (LDD) Self-aligned silicide (SALICIDE) Self-aligned oxide gap MEMS Release Techniques

More information

5.8 Diaphragm Uniaxial Optical Accelerometer

5.8 Diaphragm Uniaxial Optical Accelerometer 5.8 Diaphragm Uniaxial Optical Accelerometer Optical accelerometers are based on the BESOI (Bond and Etch back Silicon On Insulator) wafers, supplied by Shin-Etsu with (100) orientation, 4 diameter and

More information

Micro-Electro-Mechanical Systems (MEMS) Fabrication. Special Process Modules for MEMS. Principle of Sensing and Actuation

Micro-Electro-Mechanical Systems (MEMS) Fabrication. Special Process Modules for MEMS. Principle of Sensing and Actuation Micro-Electro-Mechanical Systems (MEMS) Fabrication Fabrication Considerations Stress-Strain, Thin-film Stress, Stiction Special Process Modules for MEMS Bonding, Cavity Sealing, Deep RIE, Spatial forming

More information

FABRICATION ENGINEERING MICRO- NANOSCALE ATTHE AND. Fourth Edition STEPHEN A. CAMPBELL. of Minnesota. University OXFORD UNIVERSITY PRESS

FABRICATION ENGINEERING MICRO- NANOSCALE ATTHE AND. Fourth Edition STEPHEN A. CAMPBELL. of Minnesota. University OXFORD UNIVERSITY PRESS AND FABRICATION ENGINEERING ATTHE MICRO- NANOSCALE Fourth Edition STEPHEN A. CAMPBELL University of Minnesota New York Oxford OXFORD UNIVERSITY PRESS CONTENTS Preface xiii prrt i OVERVIEW AND MATERIALS

More information

EE 330 Lecture 8. IC Fabrication Technology Part II. - Oxidation - Epitaxy - Polysilicon - Interconnects

EE 330 Lecture 8. IC Fabrication Technology Part II. - Oxidation - Epitaxy - Polysilicon - Interconnects EE 330 Lecture 8 IC Fabrication Technology Part II - Oxidation - Epitaxy - Polysilicon - Interconnects Review from Last Time MOS Transistor Bulk Source Gate Drain p-channel MOSFET Lightly-doped n-type

More information

IC/MEMS Fabrication - Outline. Fabrication

IC/MEMS Fabrication - Outline. Fabrication IC/MEMS Fabrication - Outline Fabrication overview Materials Wafer fabrication The Cycle: Deposition Lithography Etching Fabrication IC Fabrication Deposition Spin Casting PVD physical vapor deposition

More information

Micro-Electro-Mechanical Systems (MEMS) Fabrication. Special Process Modules for MEMS. Principle of Sensing and Actuation

Micro-Electro-Mechanical Systems (MEMS) Fabrication. Special Process Modules for MEMS. Principle of Sensing and Actuation Micro-Electro-Mechanical Systems (MEMS) Fabrication Fabrication Considerations Stress-Strain, Thin-film Stress, Stiction Special Process Modules for MEMS Bonding, Cavity Sealing, Deep RIE, Spatial forming

More information

VLSI Systems and Computer Architecture Lab

VLSI Systems and Computer Architecture Lab ΚΥΚΛΩΜΑΤΑ VLSI Πανεπιστήμιο Ιωαννίνων CMOS Technology Τμήμα Μηχανικών Η/Υ και Πληροφορικής 1 From the book: An Introduction ti to VLSI Process By: W. Maly ΚΥΚΛΩΜΑΤΑ VLSI Διάρθρωση 1. N well CMOS 2. Active

More information

Applications of High-Performance MEMS Pressure Sensors Based on Dissolved Wafer Process

Applications of High-Performance MEMS Pressure Sensors Based on Dissolved Wafer Process Applications of High-Performance MEMS Pressure Sensors Based on Dissolved Wafer Process Srinivas Tadigadapa and Sonbol Massoud-Ansari Integrated Sensing Systems (ISSYS) Inc., 387 Airport Industrial Drive,

More information

Chapter 2 Manufacturing Process

Chapter 2 Manufacturing Process Digital Integrated Circuits A Design Perspective Chapter 2 Manufacturing Process 1 CMOS Process 2 CMOS Process (n-well) Both NMOS and PMOS must be built in the same silicon material. PMOS in n-well NMOS

More information

Micromachining AMT 2505

Micromachining AMT 2505 Micromachining AMT 2505 Shanmuga Raja.B (BVB0912004) Module leader : Mr. Raja Hussain Introduction Micromachining are inherently connected to the evolution of Micro Electro Mechanical Systems (MEMS). Decades

More information

Multiple-height Microstructures Fabricated by ICP-RIE and Embedded Masking Layers

Multiple-height Microstructures Fabricated by ICP-RIE and Embedded Masking Layers Paper Multiple-height Microstructures Fabricated by ICP-RIE and Embedded Masking Layers Student Member Makoto Mita (IIS., Univ. of Tokyo & CREST/JST ) Student Member Yoshio Mita (IIS., Univ. of Tokyo)

More information

EE 330 Lecture 9. IC Fabrication Technology Part II. -Oxidation -Epitaxy -Polysilicon -Planarization -Resistance and Capacitance in Interconnects

EE 330 Lecture 9. IC Fabrication Technology Part II. -Oxidation -Epitaxy -Polysilicon -Planarization -Resistance and Capacitance in Interconnects EE 330 Lecture 9 IC Fabrication Technology Part II -Oxidation -Epitaxy -Polysilicon -Planarization -Resistance and Capacitance in Interconnects Review from Last Time Etching Dry etch (anisotropic) SiO

More information

Introduction to CMOS VLSI Design. Layout, Fabrication, and Elementary Logic Design

Introduction to CMOS VLSI Design. Layout, Fabrication, and Elementary Logic Design Introduction to CMOS VLSI Design Layout, Fabrication, and Elementary Logic Design CMOS Fabrication CMOS transistors are fabricated on silicon wafer Lithography process similar to printing press On each

More information

Czochralski Crystal Growth

Czochralski Crystal Growth Czochralski Crystal Growth Crystal Pulling Crystal Ingots Shaping and Polishing 300 mm wafer 1 2 Advantage of larger diameter wafers Wafer area larger Chip area larger 3 4 Large-Diameter Wafer Handling

More information

CMOS-MEMS integration

CMOS-MEMS integration CMOS-MEMS integration Jan Erik Ramstad Institute for Informatics University of Oslo janera@fys.uio.no 27th March 2006 Contents 1 Essay background 1 2 Processes 1 2.1 CMOS-MEMS process steps.............

More information

Chapter 2 OVERVIEW OF MEMS

Chapter 2 OVERVIEW OF MEMS 6 Chapter 2 OVERVIEW OF MEMS 2.1 MEMS and Microsystems The term MEMS is an abbreviation of microelectromechanical system. MEMS contains components ofsizes in 1 micrometer to 1 millimeter. The core element

More information

Single crystal silicon supported thin film micromirrors for optical applications

Single crystal silicon supported thin film micromirrors for optical applications Single crystal silicon supported thin film micromirrors for optical applications Zhimin J. Yao* Noel C. MacDonald Cornell University School of Electrical Engineering and Cornell Nanofabrication Facility

More information

EE C245 ME C218 Introduction to MEMS Design Fall 2010

EE C245 ME C218 Introduction to MEMS Design Fall 2010 EE C245 ME C218 Introduction to MEMS Design Fall 2010 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture EE C245:

More information

Chapter 4 Fabrication Process of Silicon Carrier and. Gold-Gold Thermocompression Bonding

Chapter 4 Fabrication Process of Silicon Carrier and. Gold-Gold Thermocompression Bonding Chapter 4 Fabrication Process of Silicon Carrier and Gold-Gold Thermocompression Bonding 4.1 Introduction As mentioned in chapter 2, the MEMs carrier is designed to integrate the micro-machined inductor

More information

An SOI Process for Fabrication. of Solar Cells, Transistors and Electrostatic Actuators. Berkeley Sensor and Actuator Center

An SOI Process for Fabrication. of Solar Cells, Transistors and Electrostatic Actuators. Berkeley Sensor and Actuator Center An SOI Process for Fabrication of Solar Cells, Transistors and Electrostatic Actuators Colby L Bellew, Seth Hollar and K.S.J. Pister University of California at Berkeley Berkeley Sensor and Actuator Center

More information

Lecture #18 Fabrication OUTLINE

Lecture #18 Fabrication OUTLINE Transistors on a Chip Lecture #18 Fabrication OUTLINE IC Fabrication Technology Introduction the task at hand Doping Oxidation Thin-film deposition Lithography Etch Lithography trends Plasma processing

More information

Mikrosensorer. Microfabrication 1

Mikrosensorer. Microfabrication 1 Mikrosensorer Microfabrication 1 Literature Introductory MEMS Fabrication and Applications Thomas M. Adams and Richard A. Layton Available as ebook on http://www.lub.lu.se/en/search/lubsearch.html This

More information

INTEGRATED-CIRCUIT TECHNOLOGY

INTEGRATED-CIRCUIT TECHNOLOGY INTEGRATED-CIRCUIT TECHNOLOGY 0. Silicon crystal growth and wafer preparation 1. Processing Steps 1.1. Photolitography 1.2. Oxidation 1.3. Layer Deposition 1.4. Etching 1.5. Diffusion 1.6 Backend: assembly,

More information

Lecture 22: Integrated circuit fabrication

Lecture 22: Integrated circuit fabrication Lecture 22: Integrated circuit fabrication Contents 1 Introduction 1 2 Layering 4 3 Patterning 7 4 Doping 8 4.1 Thermal diffusion......................... 10 4.2 Ion implantation.........................

More information

EE 143 FINAL EXAM NAME C. Nguyen May 10, Signature:

EE 143 FINAL EXAM NAME C. Nguyen May 10, Signature: INSTRUCTIONS Read all of the instructions and all of the questions before beginning the exam. There are 5 problems on this Final Exam, totaling 143 points. The tentative credit for each part is given to

More information

A discussion of crystal growth, lithography, etching, doping, and device structures is presented in

A discussion of crystal growth, lithography, etching, doping, and device structures is presented in Chapter 5 PROCESSING OF DEVICES A discussion of crystal growth, lithography, etching, doping, and device structures is presented in the following overview gures. SEMICONDUCTOR DEVICE PROCESSING: AN OVERVIEW

More information

EE C245 ME C218 Introduction to MEMS Design Fall 2007

EE C245 ME C218 Introduction to MEMS Design Fall 2007 EE C245 ME C218 Introduction to MEMS Design Fall 2007 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture 10: Bulk

More information

Atomic Layer Deposition(ALD)

Atomic Layer Deposition(ALD) Atomic Layer Deposition(ALD) AlO x for diffusion barriers OLED displays http://en.wikipedia.org/wiki/atomic_layer_deposition#/media/file:ald_schematics.jpg Lam s market-leading ALTUS systems combine CVD

More information

Lecture 1A: Manufacturing& Layout

Lecture 1A: Manufacturing& Layout Introduction to CMOS VLSI Design Lecture 1A: Manufacturing& Layout David Harris Harvey Mudd College Spring 2004 Steven Levitan Fall 2008 1 The Manufacturing Process For a great tour through the IC manufacturing

More information

Lecture 200 BiCMOS Technology (12/12/01) Page 200-1

Lecture 200 BiCMOS Technology (12/12/01) Page 200-1 Lecture 200 BiCMOS Technology (12/12/01) Page 200-1 LECTURE 200 BICMOS TECHNOLOGY (READING: Text-Sec. 2.11) INTRODUCTION Objective Illustrate BiCMOS technology Outline Introduction Physical process illustration

More information

CMOS Fabrication. Dr. Bassam Jamil. Adopted from slides of the textbook

CMOS Fabrication. Dr. Bassam Jamil. Adopted from slides of the textbook CMOS Fabrication Dr. Bassam Jamil Adopted from slides of the textbook CMOS Fabrication CMOS transistors are fabricated on silicon wafer Lithography process similar to printing press On each step, different

More information

Outline. Introduction to the LIGA Microfabrication Process. What is LIGA? The LIGA Process. Dr. Bruce K. Gale Fundamentals of Microfabrication

Outline. Introduction to the LIGA Microfabrication Process. What is LIGA? The LIGA Process. Dr. Bruce K. Gale Fundamentals of Microfabrication Outline Introduction to the LIGA Microfabrication Process Dr. Bruce K. Gale Fundamentals of Microfabrication What is LIGA? The LIGA Process Lithography Techniques Electroforming Mold Fabrication Analyzing

More information

Lecture 2: CMOS Fabrication Mark McDermott Electrical and Computer Engineering The University of Texas at Austin

Lecture 2: CMOS Fabrication Mark McDermott Electrical and Computer Engineering The University of Texas at Austin Lecture 2: CMOS Fabrication Mark McDermott Electrical and Computer Engineering The University of Texas at Austin Agenda Last module: Introduction to the course How a transistor works CMOS transistors This

More information

Welcome MNT Conference 1 Albuquerque, NM - May 2010

Welcome MNT Conference 1 Albuquerque, NM - May 2010 Welcome MNT Conference 1 Albuquerque, NM - May 2010 Introduction to Design Outline What is MEMs Design General Considerations Application Packaging Process Flow What s available Sandia SUMMiT Overview

More information

PROCESS FLOW AN INSIGHT INTO CMOS FABRICATION PROCESS

PROCESS FLOW AN INSIGHT INTO CMOS FABRICATION PROCESS Contents: VI Sem ECE 06EC63: Analog and Mixed Mode VLSI Design PROCESS FLOW AN INSIGHT INTO CMOS FABRICATION PROCESS 1. Introduction 2. CMOS Fabrication 3. Simplified View of Fabrication Process 3.1 Alternative

More information

EE 434 Lecture 9. IC Fabrication Technology

EE 434 Lecture 9. IC Fabrication Technology EE 434 Lecture 9 IC Fabrication Technology Quiz 7 The layout of a film resistor with electrodes A and B is shown. If the sheet resistance of the film is 40 /, determine the resistance between nodes A and

More information

MEMS Surface Fabrication

MEMS Surface Fabrication ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING MEMS Surface Fabrication Dr. Lynn Fuller webpage: http://people.rit.edu/lffeee Electrical and Microelectronic Engineering Rochester Institute

More information

Lecture 19 Microfabrication 4/1/03 Prof. Andy Neureuther

Lecture 19 Microfabrication 4/1/03 Prof. Andy Neureuther EECS 40 Spring 2003 Lecture 19 Microfabrication 4/1/03 Prof. ndy Neureuther How are Integrated Circuits made? Silicon wafers Oxide formation by growth or deposition Other films Pattern transfer by lithography

More information

Evolution of MEMS Technology

Evolution of MEMS Technology Evolution of MEMS Technology 1 Raksha Sahadev Hukkeri, 2 Shreya Madapurmath, 3 Shreelekha Navale 1,2,3 UG Student, Department of ECE, SDMCET Dharwad Abstract Micro-Electro-Mechanical Systems (MEMS) is

More information

EE40 Lec 22. IC Fabrication Technology. Prof. Nathan Cheung 11/19/2009

EE40 Lec 22. IC Fabrication Technology. Prof. Nathan Cheung 11/19/2009 Suggested Reading EE40 Lec 22 IC Fabrication Technology Prof. Nathan Cheung 11/19/2009 300mm Fab Tour http://www-03.ibm.com/technology/manufacturing/technology_tour_300mm_foundry.html Overview of IC Technology

More information

EE C245 ME C218 Introduction to MEMS Design

EE C245 ME C218 Introduction to MEMS Design EE C245 ME C218 Introduction to MEMS Design Fall 2007 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture 10: Surface

More information

CMOS Manufacturing process. Design rule set

CMOS Manufacturing process. Design rule set CMOS Manufacturing process Circuit design Set of optical masks Fabrication process Circuit designer Design rule set Process engineer All material: Chap. 2 of J. Rabaey, A. Chandrakasan, B. Nikolic, Digital

More information

The Active Dissolved Wafer Process (ADWP) for Integrating single Crystal Si MEMS with CMOS Circuits

The Active Dissolved Wafer Process (ADWP) for Integrating single Crystal Si MEMS with CMOS Circuits JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, VOL.2, NO. 4, DECEMBER, 2002 273 The Active Dissolved Wafer Process (ADWP) for Integrating single Crystal Si MEMS with CMOS Circuits Karl J. Ma, Yogesh

More information

EE 330 Lecture 9. IC Fabrication Technology Part 2

EE 330 Lecture 9. IC Fabrication Technology Part 2 EE 330 Lecture 9 IC Fabrication Technology Part 2 Quiz 8 A 2m silicon crystal is cut into wafers using a wire saw. If the wire diameter is 220um and the wafer thickness is 350um, how many wafers will this

More information

Cambridge University Press A Guide to Hands-on MEMS Design and Prototyping Joel A. Kubby Excerpt More information.

Cambridge University Press A Guide to Hands-on MEMS Design and Prototyping Joel A. Kubby Excerpt More information. 1 Introduction 1.1 Overview of MEMS fabrication Microelectromechanical systems (MEMS) fabrication developed out of the thin-film processes first used for semiconductor fabrication. To understand the unique

More information

Bulk Silicon Micromachining

Bulk Silicon Micromachining Bulk Silicon Micromachining Micro Actuators, Sensors, Systems Group University of Illinois at Urbana-Champaign Outline Types of bulk micromachining silicon anisotropic etching crystal orientation isotropic

More information

Mostafa Soliman, Ph.D. May 5 th 2014

Mostafa Soliman, Ph.D. May 5 th 2014 Mostafa Soliman, Ph.D. May 5 th 2014 Mostafa Soliman, Ph.D. 1 Basic MEMS Processes Front-End Processes Back-End Processes 2 Mostafa Soliman, Ph.D. Wafers Deposition Lithography Etch Chips 1- Si Substrate

More information

Lecture 5: Micromachining

Lecture 5: Micromachining MEMS: Fabrication Lecture 5: Micromachining Prasanna S. Gandhi Assistant Professor, Department of Mechanical Engineering, Indian Institute of Technology, Bombay, Recap: Last Class E-beam lithography X-ray

More information

Lecture 0: Introduction

Lecture 0: Introduction Lecture 0: Introduction Introduction Integrated circuits: many transistors on one chip. Very Large Scale Integration (VLSI): bucketloads! Complementary Metal Oxide Semiconductor Fast, cheap, low power

More information

Silicon Wafer Processing PAKAGING AND TEST

Silicon Wafer Processing PAKAGING AND TEST Silicon Wafer Processing PAKAGING AND TEST Parametrical test using test structures regularly distributed in the wafer Wafer die test marking defective dies dies separation die fixing (not marked as defective)

More information

FABRICATION PROCESSES FOR MAGNETIC MICROACTUATORS WITH POLYSILICON FLEXURES. Jack W. Judy and Richard S. Muller

FABRICATION PROCESSES FOR MAGNETIC MICROACTUATORS WITH POLYSILICON FLEXURES. Jack W. Judy and Richard S. Muller FABRICATION PROCESSES FOR MAGNETIC MICROACTUATORS WITH POLYSILICON FLEXURES Jack W. Judy and Richard S. Muller Berkeley Sensor & Actuator Center (BSAC) Department of EECS, University of California, Berkeley,

More information

Fabrication Technology, Part I

Fabrication Technology, Part I EEL5225: Principles of MEMS Transducers (Fall 2003) Fabrication Technology, Part I Agenda: Oxidation, layer deposition (last lecture) Lithography Pattern Transfer (etching) Impurity Doping Reading: Senturia,

More information

Chapter 3 CMOS processing technology

Chapter 3 CMOS processing technology Chapter 3 CMOS processing technology (How to make a CMOS?) Si + impurity acceptors(p-type) donors (n-type) p-type + n-type => pn junction (I-V) 3.1.1 (Wafer) Wafer = A disk of silicon (0.25 mm - 1 mm thick),

More information

Complexity of IC Metallization. Early 21 st Century IC Technology

Complexity of IC Metallization. Early 21 st Century IC Technology EECS 42 Introduction to Digital Electronics Lecture # 25 Microfabrication Handout of This Lecture. Today: how are Integrated Circuits made? Silicon wafers Oxide formation by growth or deposition Other

More information