Stevenage Circuits Group

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1 Stevenage Circuits Group Incorporating: Stevenage Circuits Tru-Lon Printed Circuits March 2011

2 The Organisation Stevenage Circuits formed 1971 Tru-Lon integrated into the Stevenage site March 2011 Group privately owned 11m turnover, potential 15m turnover 150 staff / 70,000 square feet 24 / 7 working hours since November 2010 ~ 20m worth equipment Dedication to investment Full range of products including PTFE processing

3 Key Staff Stuart Spink Mark Brown Rob Brown David Brown Jeremy Rygate Rosemary Burt Tim Gee Jonathan Calver Beverley Cording Lee Naylor David Wyllie David FitzGerald John Wood Alaistar Waddell CEO HR Director Sales and Marketing Director Operations Director Engineering Director Company Secretary Operations Manager Process Engineering Manager Quality Management Systems Manager CAM Supervisor Sales Manager Area Sales Manager Area Sales Manager Area Sales Manager

4 Key Staff Continued... Phil Firth Paul Estwick Neil Butler Marc Holloway Engineering Manager Quality Control Manager Internal Sales IT Manager

5 Qualifications currently held Underwriters Laboratories - UL94V0 (Rigid FR4, Flexi- Rigid, Flexible, Rigid Polyimide) BS EN ISO 9001:2008 (Quality System Approval) ISO14001 (Environmental) IPC Class 3 manufacture and test (Int. standard) COSHH (System of controlling hazardous substances) CECC/IECQ (BS123000) D/S, M/L, Flexis, Flexi Rigid FR4, Reinforced Polyimide, Flex Polyimide Blind, buried, laser or mechanically drilled Variety of finishes

6 Certificates: CECC

7 Capability CECC (cont)

8 Qualifications currently sought IPC Class 3 formal release May 2011 AS9100 (Aerospace Approval) March 2011

9 Investment in 2010 / 2011 Thin core cut sheet laminator Loaders / unloaders (LDI, DES, pre-treat lines) Orbotech Discovery AOI 5 x Orbotech InCAM Front End systems New Class 10,000 clean room ESI Laser drill upgrade Effluent plant Visper Automatic Final Inspection machine Total cost ~ 1.5m

10 Product sectors Military Aerospace Medical Telecoms Security Entertainment Sport Domestic Automotive UK, Europe and further

11 Product mix Rigid Layer Miscellaneous PTH Flexible Flexi-Rigid Rigid 4-10 Layer

12 Examples Military 49,500 holes 10 levels blind / buried Reinforced polyimide Tg 260 deg C 4 oz copper Controlled depth rout

13 Examples (cont) Aerospace D/S Flexi 50 micron blind laser drilled vias in 125 micron pads Super finish (Ni / Pd / Au) Flexible solder resist 90 micron track / gap

14 Examples (cont) Medical Implant - 2mm x 1mm laser routed 4 layer F/R Flexible O/L Track height 18 microns 100 micron track / gap to +/- 6 microns Adhesiveless flexi Track pitch to +/- 12 microns 4 layer rigid, 2 x blind vias Inserted into capsule, then swallowed

15 All laser drilled and LDI 4 layer, 1-2, 2-3, 3-4, 1-4 drilling Examples (cont) Telecoms Microwave - PTFE alternatives All laser drilled and LDI.6 layer. 1-2, 2-3, 3-4, 4-5, 5-6, 1-6 drilling Edge plated fingers

16 Examples (cont) Security 25 micron PTHs in 50 micron tracks with 50 micron gaps

17 Examples (cont) Entertainment Photogragh reproduced kind permission of Active Silicon who specialise in the design, manufacture and supply of specialist digital imaging products and technologies 6 layer Flexi - Rigid

18 Examples (cont) Research 6 layer stepped flexible with 1-2, 2-3, 3-4, 4-5, 5-6, 1-6 drilling

19 Others Stepped boards Metal backed PTFE Flying leads

20 Special Equipment 4 x Laser drill - UV YAG 2 x Laser Direct Image (LDI) 2 mil Track / Gap and Solder Resist Auto-align outer layer & solder resist printers Vacuum and High Temp bonding presses for PTFE Specialist routers (Tru-Lon) for thick metal backing (Brass, Copper, Aluminium) Post etch punches and X-ray drill Permanganate and Plasma desmear / clean Vacuum laminator Multi-seat Perfectest for layer registration data Ink jet printer for serialisation / legend Resin fill machine Polar TDR Impedance measurement Struers microesectioning system (auto-profiling and sectioning)

21 Special Software Genesis 2000 CAM stations (10 licences) InCAM (5 licences) latest State of the Art CAM software Softwires PCP 2000 CIM system dedicated to PCB manufacture Lab Wizard for chemical analysis Track Pro for calibration Pirana for maintenance In-house software for Capacity Planning Polar SI 8000 (Impedance modelling) InStack (Simultaneous Impedance and Build-up modelling) Q-Pulse for document control

22 Genesis 2000 CAM

23 Controlled Impedance

24 ESI 5200 UV YAG Laser drill

25 Laser drill microsections All laser drilled into reinforced polyimide Buried via Blind vias PTH

26 Laser drill techniques Illustrations (c) 2004 Electro Scientific Industries, used with permission. Blind holes Stage 1 Through holes Stage 2

27 Laser drill SEMs Photos (c) 2004 Electro Scientific Industries, used with permission.

28 Laser direct imaging (LDI) Orbotech

29 Outer Layer and Solder Resist exposure Bacher - auto registration

30 Visper Automatic Final Inspection machine

31 Class 10,000 clean room (Feb 2011)

32 Materials Woven Glass Reinforced (Rigid) Standard FR4 (Tg 135 C) incl. Halogen free FR4 suitable for lead-free assembly High Tg FR4 Withstands higher temperatures (Tg 175 C and 210ºC) Stablcor Low CTE in X/Y, low weight, high stiffness, high thermal conductivity Polyimide High Tg of 260 C, low TCE (z), low Df

33 Materials Suitable for lead-free assembly could be: >Tg 150 C (Standard FR4 is 135 C) >Td 330 C (Standard FR4 is 300 C) >T260 15minutes (Standard FR4 is 4 mins) IPC define as IPC 4101B/99, 101, 121, 124, 126, 129

34 Materials (IPC defined for lead-free) IPC-4101B ANSI FR4 FR4 FR4 FR4 FR4 FR4 Fillers > 5% Yes Yes N/A N/A Yes N/A Tg >150 C >110 C >110 C >150 C >170 C >170 C Td >325 C >310 C >310 C >325 C >340 C >340 C CTE C <3,5% <4% <4% <3,5% <3,0% <3,0% T260 >30min >30min >30min >30min >30min >30min T288 >10min >5min >5min >10min >15min >15min

35 Materials (cont) Random Aramid Reinforcment (Rigid) Epoxy or polyimide based Easily laser ablatable Improved, repeatable dimensional stability Ideal for sequential build up (SBU) Resin only e.g. RCC (Resin Coated Copper) ideal for laser drilling outer layers must be attached to a rigid core

36 Materials (cont) High frequency applications PTFE Optimum frequency range 1-90 GHz Low Dk ~ 2.3 Low Df ~ Metal backed PTFE alternatives Optimum frequency range 100MHz - 15GHz Dk ~ 3.38 / 3.48 Df ~ / 0.004

37 Materials (cont) Flexible Polyimide (Kapton ) base and coverlays Epoxy, acryllic, pure polyimide adhesives Single, double sided and multilayer structures Thin and low weight

38 Materials (cont) Copper 2µm - 140µm copper thickness Can be used for electrical and thermal conductivity Thick copper can be used for rigidity if placed near outer layers Copper / Invar / Copper (used for restraining purposes for TCE matching)

39 Materials (cont) New generation laminates Hole filling pre-preg with High Tg Enhanced Epoxy for Tg > 210 deg C SI glass for optimum signal integrity and precise impedance We are constantly examining new materials with our suppliers, who are always prepared to discuss further requirements with our customers

40 Board types / technologies M/L up to 24 layers (releasable to BS series) Sequentially built and Stepped boards Flexi and flexi rigid Exotic materials e.g. metal backed PTFE (Copper, Aluminium, Brass) Buried Resistors using Ohmega-Ply(+/- 15% std, +/-10% special) Buried Capacitors using 3M s licence free material Buried vias (mechanically or laser drilled) Blind vias (mechanically or laser drilled) Copper filled blind microvias Microvias (< 0.15mm diameter) Resin filled through vias Laser profiling Controlled Impedance (+/- 10% std, +/- 5% special) Edge plated fingers and plated 1/2 holes Variety of finishes Embedded fibre optics

41 Research and Development Dedicated Process Engineering Dept. Optical Waveguides Stretchable PCBs Embedded components

42 Processes available Metalisation by Direct Plate (Shadow) or Electroless Electrolytic copper plate by Pulse or DC plating Finishes: Ni / Au Immersion Tin HASL (leaded and unleaded subcontract) Ni / Pd / Au (sub-contract) Tin / Lead Silver Electroplated Hard and Soft Gold

43 Processes available (cont) Spray coat green, red and blue solder resist plus other colours available by screen printing Flexible coverlay Laser routed sheet polyimide (or post ablate) Photoimageable flexible solder resist (brown, black, white) Photoimageable dry film Extensive conveyorised lines and auto load / unload machines to de-skill processes Laser structuring (copper pattern and solder resist) Complete Engineering back-up from product conception to post delivery

44 Resin filled vias

45 Copper filled vias

46 Copper filled vias Example with stacked vias

47 Design Rules and Structures 3 mil track / gap if plated (2 mil track and gap as special) 2 mil track / gap if unplated 2 mil registration solder resist to copper pattern 3 mil minimum webbing solder resist 6 mil PTH to copper track / plane 16:1 aspect ratio for PTHs (Thickness : Finished Hole Size) 1:1 aspect ratio for blind holes (Thickness : FHS) Buried resistors (+/- 15% std, +/-10% special or in parallel) Controlled Impedance (+/- 10% std, +/- 5% special)

48 Standard PTH technology Layer Copper feature to be at least 0.175mm away from drilled hole 1 Track (75 micron) Pad size at least 0.20mm bigger than drilled hole Drilled hole diameter 0.15mm minimum. Finished Hole Size (FHS) 0.1mm less. Aspect ratio (thickness : FHS) 16:1 maximum.

49 Laser drilled blind vias PTH Laser drilled blind vias 1-2, 7-8 Layer Capture pad size to be at least 0.20mm more than drilled hole Target pads can be 0.2mm diameter 1 for 0.1mm hole Target pad size to be at least 0.1mm more than drilled hole Laser vias can exit to surface mount pads on outer layers, with very little solder loss. Drill diameter 0.025mm - 0.2mm (0.1mm mm typical) Aspect ratio 1:1 max after plating

50 Buried vias PTH Buried vias 2-3, 6-7 Layer 1 Pad size to be at least 0.25mm more than drilled hole Drilled hole diameter mm Can be laser drilled Aspect ratio 16:1 maximum

51 Laser blind sequential bond Layer Layer 1 L a s e r b l in d s e q u e n t ia l b o n d Buried PTH Laser drilled blind hole 1-2, 7-8 (resin Buried filled) PTH Laser as drilled described blind hole earlier 1-2, 7-8 (resin filled) as described earlier PTHs from 1-8 are optional. If not required, outer layers can contain only surface mount pads PTHs from 1-8 are optional. All vias must exit to pads, so 2-7 holes must have pads on 2 and 7 If not required, outer layers can contain only surface mount pads All vias must exit to pads, so 2-7 holes must have pads on 2 and 7

52 Blind sequential bond Layer PTH Blind vias 1-4, "Double multilayer" with blind holes filling and plating over All vias must exit to pads, so 1-4 and 5-8 holes must have pads on 4 and 5

53 Double laser blind sequential (2 bonds): Buried PTH Laser drilled blind holes 1-2, 2-3, 6-7, 7-8 Layer

54 Double laser blind sequential (3 bonds) Buried D o u bpth l e l a s e r Laser b l in drilled d sblind e q uholes e n t1-2, ia 2-3, l 6-7, 7-8 Layer Buried PTH Laser drilled blind holes 1-2, 2-3, 6-7, 7-8 Layer Etc Etc

55 How a PCB is made.. Copper FR4 Copper 1 ) L a min a t e a s s u p p l ie d b y ma n u f a c t u r e r Photoresist Copper FR4 Copper Photoresist 2 ) C o a t l a min a t e w it h p h o t o r e s is t

56 3 ) Pin t o o l e d n e g a t iv e in n e r l a y e r f il m Film Photoresist Copper FR4 Copper Photoresist Film What is clear will end up copper e.g. pads and tracks 4 ) Ex p o s e w it h U V l ig h t Film Photoresist Copper FR4 Copper Photoresist Film

57 5 ) R e mo v e f il m a n d d e v e l o p o f f u n e x p o s e d r e s is t Photoresist Copper FR4 Copper Photoresist 6 ) Et c h o f f c o p p e r n o t p r o t e c t e d b y r e s is t Photoresist Copper FR4 Copper Photoresist

58 7 ) St r ip o f f p h o t o r e s is t Copper FR4 Copper.. to get an etched inner layer pair e.g. layers 2/3 8 ) B o n d l a y e r s t o f o r m 6 l a y e r b o a r d Copper foil 1 Copper 2 Laminate Copper 3 Copper 4 Laminate Copper 5 Copper foil 6 Full copper foil on outer layers

59 9) Drill and Permanganate Desmear Copper foil 1 Copper 2 Laminate Copper 3 Copper 4 Laminate Copper 5 Copper foil ) D ir e c t me t a l is a t io n p r o c e s s Copper foil 1 Copper 2 Laminate Copper 3 Copper 4 Laminate Copper 5 Copper foil 6 Conductive graphite added (only remains on non copper)

60 1 1 ) C o a t w it h p h o t o r e s is t Photoresist Copper foil 1 Copper 2 Laminate Copper 3 Copper 4 Laminate Copper 5 Copper foil 6 Photoresist 1 2 ) Pin t o o l e d p o s it iv e o u t e r l a y e r f il m Film Photoresist Copper foil 1 Copper 2 Laminate Copper 3 Copper 4 Laminate Copper 5 Copper foil 6 Photoresist Film What is black will end up copper e.g. pads and tracks

61 1 3 ) Ex p o s e w it h U V l ig h t Film Photoresist Copper foil 1 Copper 2 Laminate Copper 3 Copper 4 Laminate Copper 5 Copper foil 6 Photoresist Film 1 4 ) R e mo v e f il m a n d d e v e l o p o f f u n e x p o s e d r e s is t Photoresist Copper foil 1 Copper 2 Laminate Copper 3 Copper 4 Laminate Copper 5 Copper foil 6 Photoresist

62 Plated tin 1 5 ) E l e c t r o p l a t e c o p p e r a n d t in Plated copper Copper foil 1 Copper 2 Laminate Copper 3 Copper 4 Laminate Copper 5 Copper foil 6 Plated copper Plated tin 1 6 ) S t r ip o f f p h o t o r e s is t Plated copper Copper foil 1 Copper 2 Laminate Copper 3 Copper 4 Laminate Copper 5 Copper foil 6 Plated copper

63 1 7 ) E t c h a w a y c o p p e r n o t p r o t e c t e d b y t in Plated copper Copper foil 1 Copper 2 Laminate Copper 3 Copper 4 Laminate Copper 5 Copper foil 6 Plated copper 1 8 ) S t r ip t in Plated copper Copper foil 1 Copper 2 Laminate Copper 3 Copper 4 Laminate Copper 5 Copper foil 6 Plated copper.. and we have a working PCB!

64 1 9 ) C o a t w it h s o l d e r r e s is t Solder resist Copper 1 Copper 2 Laminate Copper 3 Copper 4 Laminate Copper 5 Copper 6 Solder resist Film 2 0 ) Pin t o o l e d p o s it iv e s o l d e r r e s is t f il m Solder resist Copper 1 Copper 2 Laminate Copper 3 Copper 4 Laminate Copper 5 Copper 6 Solder resist Film

65 2 1 ) E x p o s e w it h U V l ig h t Film Solder resist Copper 1 Copper 2 Laminate Copper 3 Copper 4 Laminate Copper 5 Copper 6 Solder resist Film 2 2 ) R e mo v e f il m a n d d e v e l o p o f f u n e x p o s e d r e s is t Solder resist Copper 1 Copper 2 Laminate Copper 3 Copper 4 Laminate Copper 5 Copper 6 Solder resist

66 2 3 ) A d d f in is h (e.g. N i / A u ) t o e x p o s e d c o p p e r Surface mount pad Nickel / Gold Solder resist Copper 1 Copper 2 Laminate Copper 3 Copper 4 Laminate Copper 5 Copper 6 Solder resist Leaded component pad / via

67 Thank you for the interest shown For further information please: Visit our website Phone: (Stevenage Circuits) (Tru-Lon)

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