FILMS. Chang Sung Corporation
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1 FILMS
2 Divisions in CSC 7 Divisions, 1 R&D Center METAL POWDERS Cu & Cu-Alloys Ferrous Metals Tin, Ni, Al Alloys Ag, Ag Alloys Coated Powders POWDER CORES MPP Ces High Flux Ces Sendust Ces Mega Flux Ces HS Ces CONDUCTIVE PASTES Ag Pastes Ni Pastes Cu Pastes Ag/Cu Pastes POWDER METALLURGY Oil-Impregnated Bearings Balance Weights Counter Weights Heat Sinks FILMS EMI Absbers Magnetic Shielding Materials Thermal Interface Materials Thermal Bonding Sheets CLAD METALS Inlay Clads Overlay Clads Solder Clads Contact Bars INDUCTORS Small SMD Power Inducts Soft Magnet Materials R&D CENTER EMC Solutions Functional Fillers Magnetic Fillers Thick Film Materials Powder Metallurgy
3 1-1. TECHNOLOGY TIM (Adhesive) TIM Sheets EMI Absbers Dual Sheets (Heat+EMI) Thermal Grease Heat Dissipation Materials Heat Spreaders Bonding Film Coating Pressing Semi-Conduct Packaging Materials Organic& Inganic Hybrid Technology Powder Manufacturing Technology Polymer Technology
4 1-2. TECHNOLOGY 1) Power Manufacturing Technology Micro Fging 1~5mm Drying Heat Treatment
5 1-3. TECHNOLOGY 2) Complex Powder Manufacturing Technology High Temperature Synthesis Methods (Metal/Ceramic) Tundish Gas Atomizer Furnace Heat Treatment (Microstructure Control) N2 purging Chamber Metal Powders - Bon Nitride (BN) - Complex Powders (BN+MgO) - Magnetic Powders
6 1-4. TECHNOLOGY 3) Filler Dispersion & Coating Technology Solution Premixing Dispersion Filtering Resin Dissolution 1 st Mixing 2 nd Mixing & Dispersion Refine Defoarming Casting Cutting Removing foam Coating Drying Hardening Cutting
7 2. Products of Film Division EMI Absbers EMI Absber Sheets EMI Absber Films Magnetic sheets f WPC/NFC Thermal Interface Materials TIM Dual sheets Heat Spreading Films Functional Adhesives Preparation f MC PCB Resin Coated Cu MCCL f Metal PCBs
8 EMI Absbers
9 3-1. EMI Absbers Flexible Rubbers EMI Absber sheets absb electromagnetic waves by changing them into heat with a magnetic domain. Magnetic Fillers Adhesive Layers Release Papers Applications WPC/NFC Electromagnetic Waves
10 Permeability 3-2. EMI Absbers NS-G NS-S i( wt ) M 0e M 0 iwt e H0e H0 i i Perfmance μ x d μ d Magnetic Permeability Thickness NS-J 120 NS-K 80 NS-B 40 NS-L NS-H NS-HD Frequency (MHz) Higher μ Thinner EMI Absbers
11 Permeability ( ') 3-3. EMI Absbers Over 3GHz 20 New absber f >3GHz NS-K Frequency (Hz)
12 3-4. EMI Absber sheets
13 3-5. Roll type High Perfmance products NS-KxxxTHF NS-JxxxTHF μ = 100 μ = 130 Thickness: 0.02, 0.03, 0.05mm Width: 300mm Length: up to 200m Minimum Thickness : 20μm
14 3-6. RF Induction Sheets RF Induction Sheets Grade Permeability μ' μ" Thickness (mm) Standard size (mm) NFC Applications WPC RF-K x297 RF-M x297 RF-Y x297 RF-B x297 RF-L x297
15 Permeability 13.56MHz 3-7. RF Induction Sheets 100 RF-K 90 RF-M RF-Y RF-B RF-L Frequency[MHz]
16 Thermal Interface Materials
17 4-1. Thermal Interface Materials TIM Sheets are manufactured with high thermal conductive functional fillers (dispersed evenly in high temperature heat resisting resin). They are widely used in electronic products and to solve a variety of heat related problems in the electric industry. Principle Hot spot 73.0 Hot spot 45.0 Applications Befe After Computers Mobile Phones Displays, LCDs, LEDs Electronic Home Appliances Communication Devices Automobiles
18 4-2. Thermal Interface Materials
19 4-3. Soft Types Standard Size (mm x mm) Thickness (mm) Hardness (Asker C/She 00) Thermal Conductivity (W/mK) Tensile Strength (MPa) Breakdown Voltage (kv) Volume Resistivity (Ω cm) Flame Rating (UL94) TP-S10 Soft Types (TP-S Series) 0.2 ~ / > 0.2 > 5 > V-0 TP-S ~ / > 0.2 > 5 > V-0 TP-S ~ / > 0.2 > 5 > V-0 TP-S ~ / > 0.2 > 5 > V-0 TP-S ~ / > 0.2 > 5 > V-0
20 4-4. Super Soft Types Standard Size (mm x mm) Thickness (mm) Hardness (Asker C/She 00) Thermal Conductivity (W/mK) Tensile Strength (MPa) Breakdown Voltage (kv) Volume Resistivity (Ω cm) Flame Rating (UL94) TP-SS ~ / > 0.1 > 5 > V-0 TP-SS ~ / > 0.1 > 5 > V-0 TP-SS ~ / > 0.1 > 5 > V-0 TP-SS ~ / > 0.1 > 5 > V-0 TP-SS ~ / > 0.1 > 5 > V-0
21 4-5. Hard Types Standard Size (mm x mm) Thickness (mm) Hardness (She A) Thermal Conductivity (W/mK) Tensile Strength (MPa) Breakdown Voltage (kv) Volume Resistivity (Ω cm) Flame Rating (UL94) TP-H ~ > 1.0 > 5 > V-0 TP-H ~ > 2.0 > 5 > V-0 TP-H ~ > 1.5 > 5 > V-0 TP-H ~ >1.0 > 5 > V-0 TP-H ~ > 0.5 > 5 > V-0
22 4-6. Reinfced Types Standard Size (mm x mm) Thickness (mm) Hardness (Asker C) Thermal Conductivity (W/mK) Tensile Strength (MPa) Breakdown Voltage (kv) Volume Resistivity (Ω cm) Flame Rating (UL94) TP-HG ~ > 10 > 5 > V-0 TP-HG ~ > 5 > V-0 TP-SG ~ > 4.0 > 5 > V-0 TP-SG ~ >4.0 > 5 > V-0 TP-SG ~ > 4.0 > 5 > V-0
23 4-7. Dual Types Standard Size (mm x mm) Thickness (mm) Hardness Thermal Conductivity (W/mK) Tensile Strength (MPa) Breakdown Voltage (kv) Volume Resistivity (Ω cm) Flame Rating (UL94) TM-H ~ (She A) 2.0 > 0.2 > 0.25 > 10 9 V-0 TM-S ~ (Asker C) 1.5 > 0.2 > 0.25 > V-0 TM-S25HV 0.5 ~ (Asker C) 2.5 > 0.2 > 3.0 > V-0
24 4-8. High Conductive Types Standard Size (mm x mm) Thickness (mm) Hardness Thermal Conductivity (W/mK) Tensile Strength (MPa) Breakdown Voltage (kv) Volume Resistivity (Ω cm) Flame Rating (UL94) TP-H ~ (She A) 6.0 > 2.0 > 5 > (Urethane) TP-S ~ (Asker C) 5.0 > 0.2 > 5 > V-0 (Silicone) TP-S ~ (Asker C) 6.0 > 0.2 > 5 > V-0 (Silicone)
25 4-9. Molding Compound Types A/B Mixing Ratio (wt%) Viscosity (cp) Density (g/cm 3 ) Hardness (Asker C) Thermal Conductivity (W/mK) Breakdown Voltage (kv) Volume Resistivity (Ω cm) Flame Rating (UL94) Cure Condition ( /min) 1W/mK Type 100 : 100 9, > 5 > V / 30 (2-Component) 2W/mK Type 100 : 100 2, > 5 > V / 30 (2-Component)
26 4-10. Thermal Adhesive Tapes 4) Thermal Adhesive Tapes T-Gums (P Series) are insulating adhesive materials f MCCL, and are used in applications that require high heat dissipating characteristics such as LED lights. Thermal Adhesives Thermal Adhesives Item TA-2510 LED Lights Thermal Conductivity (W/mK) 2.5 Metal-PCB LED Bars Thickness ( μm ) 85 ± 5
27 4-11. Heat Spreading Sheets Ceramic Insulation Layer Metal Layer [30, 50μm] Thermal Adhesive Tape Hizontally Heat Spread= Ceramic Insulation layer + Metal Layer + Thermal Adhesive Tape EMI Shielding = Metal Layer + Thermal Adhesive Tape
28 4-12. Heat Spreading Sheets Standard Size (mm x mm) Thickness (mm) Adhesion Strength (gf/inch) Vertical Resistivity (Ω) Thermal Conductivity (W/mK) In-plane Through-plane Flame Rating (UL94) TS-C030A 200 x > 1,000 > V-0 TS-C050A 200 x > 1,000 > V-0 TS-G050A 200 x > 1,000 > V-0
29 5. R & D CENTER Established October 31, 2008 Personnel Patents R&D Field 25 (2 Ph.Ds, 15 Master s) Registered : 6 patents are on process, 5 domestic patents, 2 overseas patents Applications Magnetic Fillers Fillers f EMI Absbers Multi Functional Fillers EMI Absbers TIM Dual Sheets Electronic Noise Absbers Magnetic Shielding Sheets Absbers f RFID Thermal Conductive Sheets Thermal Adhesives Adhesive Insulating Films f PCB f LED EMI Absbers + Thermal Conductive Sheets Multi Layer Heat Spreaders EMI Shielding Materials Shielding Gaskets Shielding Tapes Shielding Fibers and Papers
30 R & D Equipment Metal Powders Laser Particle Size Analyzer FSSS Tap Denser Flow Meter Furnace Pearl Mills Attrition Mills Micro Sieve Vacuum Oven Polishing & Mounting Machine EMC Solutions B-H Analyzer VSM AC Loop Tracer Flux meter Gauss meter Impedance Analyzer Netwk Analyzer Electronic Load DC Bias Tester Ce Loss Tester LCR Meter Contact Resistance Tester Tubular Mixer Press Spectrum Analyzer TIM Thermal Conductivity Analyzer Constant Temp. Chamber Data Logger Withstand Voltage Tester Viscometer Rubber Hardness Tester Probe Tack Tester Ball Tack Tester Hot Press Tape Coater Fundamentals SEM Optical Microscope Universal Testing Machine(UTM) Atomic Absption Spectrophotometer Video Microscope IT System Kneader Constant Humid. & Temp. Chamber Thermal Shock Tester HAST Chamber Flame Retardant Tester
31 Thank You
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