Pretreatment for Innerlayers. V-Bond BO-7770V. R&D Center

Transcription

1 Pretreatment for Innerlayers V-Bond BO-7770V

2 PCB Manufacturing Process Innerlayer Patterning Multilayer Board Pretreatment for Innerlayer Laminate and Press Outer Layer Patterning Solder Mask Final Surface Finish Assembly Shipping 2

3 Multilayer Board & Pretreatment for Innerlayer Multilayer Board (8 layers) 3 pieces of Innerlayer Boards 4 pieces of Prepregs 2 pieces of Copper Foil Innerlayer Boards Pretreatment for Innerlayer To Enhance Adhesion Black Oxide Treatment, Black Oxide Reduction Treatment V-Bond Treatment 3

4 What is V-Bond? V-Bond, which is a alternative to chemicals for black oxide treatment or black oxide reduction treatment, is available for a pretreatment for innerlayer. Unique surface topography produced by V-Bond can enhance adhesion of copper to resin. 4

5 V-Bond BO-7770V Process 20-30ºC, S 1. CB times dilution Water Rinse 1.Removal of rust and dirt on a panel 40-50ºC, S 25ºC, S Dip 25ºC, S 2. Alkaline Cleaner 4%Caustic Soda Water Rinse 3. Predip (BO-7770VP) 4. BO-7770V 2. Removal of residues of dry film 3. Help to obtain good surface finish in BO-7770V process. Avoid dragging-in of rinse water into BO-7770V tank. Water Rinse Dry 4. Roughen copper surface and produce organic copper film simultaneously resulting in producing copper surface having superior adhesion 5

6 V-Bond BO-7770V Features 1 Sulfuric Acid - Hydrogen Peroxide Microetching Solution Black Oxide Treatment V-Bond Needle-shaped Copper Oxide = Physical Bonding Peaks and Valleys Physical Bonding Organic Copper Film Chemical Bonding Resin 30,000 Cu 6

7 V-Bond BO-7770V Features 2 Excellent Adhesion to High Tg Halogen Free Pb(lead)Free High Heat Resistance Halogen Free Environment High Density High-frequency Thinner&Lighter Model High Heat Resistance Application Digital Appliance PC Mobile Phone Digital Camera) Amusement PSP NDS Automobile Driving Stopping Turning High Heat Resistance High-Frequency Halogen Free Innerlayer Materials Prepreg High Tg Halogen Free Materials 7

8 V-Bond BO-7770V Features 3 Comparison with Oxide Treatment Peel Strength V-Bond vs. Black Oxide Treatment Peel N/mm Strength (N/mm) FR-4 High Tg Halogen Free Prepreg Black Oxide Treatment V-Bond V-Bond Contribution to to Enhance Reliability of of PCB PCB Copper Foil :35 m 8

9 V-Bond vs. Product M vs. Product B Comparison of Topography & Peel Strength

10 MEC Copper Foil : Mitsui Mining and Smelting 3EC- 3,500 Stage Angle m Etched 1.5 m Etched 2.0 m Etched 10

11 Product M Company Copper Foil : Mitsui Mining and Smelting 3EC- 3,500 Stage Angle m Etched 1.5 m Etched 2.0 m Etched 11

12 Product A Company Copper Foil : Mitsui Mining and Smelting 3EC- 3,500 Stage Angle m Etched 1.5 m Etched 2.0 m Etched 12

13 Topography and Roughness Etching Amount : 1.5 m V-Bond Product M Product B 3,500 10,000 Ra Rz Each product provides unique topography. Topography is roughen in order of Product M, V-Bond & Product B

14 Peel Strength GEA-67N (Hitachi Chemical) Peel Strength (N/mm) 14

15 Peel Strength GEA-679N (Hitachi Chemical) Peel Strength (N/mm) 15

16 Peel Strength GEA-679F (Hitachi Chemical) Peel Strength (N/mm) 16

17 Peel Strength GEA-67BE(G) (Hitachi Chemical) Peel Strength (N/mm) 17

18 V-Bond BO-7770V Features 4 With V-Bond Less Dirt Generated in the Treatment Tank Compared to Others. V-Bond Product M Dirt on the solution surface Less More Frequency of replacement of whole working solution Frequency of replacement of filter Once three to six months When whole working solution is replaced. At least Once a month Once a month 18

19 V-Bond BO-7770V Features 5 Simple Control According to Panel Counter Chemical Type Control Method CB-7612 Caustic Soda Solution level compensation + Panel counter replenishment BO-7770VP BO-7770V Copper concentration control can be automatic + Panel counter replenishment. All chemicals employed in MEIKO ELECTRONICS (Wuhan) are replenished by panel counter. 19

20 V-Bond BO-7770V Features 6 An automatic feed and bleed system accurately controls working solution Measured Time & Date Analysis result can be printed for records. Automatic Analysis Device Appearance Cu Concentration H 2 O 2 Concentration H 2 SO 4 Concentration Replenished amount of the fresh solution & Operated time Holding Cu concentration (45 1 g/l) constant makes it possible to use the solution under stable conditions, and consequently it leads to a reliable quality. Analysis Cell 20

21 V-Bond BO-7770V Features 7 Color of V-Bond treated copper surface can be qualified by L-values for process control. Daily Control Method of BO-7770V Concentrations of individual elements (Sulfuric Acid, Hydrogen Peroxide and Copper) in BO-7770V + Measurement of Etching Rate Measurement of L-value* Check a status of BO-7770V working solution. + Information from a board treated with the solution A degree of copper roughened topography and a status of organic copper film can be observed according to L-value*. Highly Reliable Control A balance of an effective element in BO-7770V can be seen according to L-value*. 21

22 Actual Achievement of V-Bond There are thirteen companies employing V-Bond as of Oct Production Volume : About 50,000 m2 / mon. in Japan, About 40,000m2 / mon. overseas The table shows customers whose production amount is 5,000 /M or larger Customers Date Throughput /mon. Application 22

23 Support System Observation of Cross-section View Analysis of Effective Element in Working Solution HPLC Observation of Surface Topography by SEM Observation Cross-section Surface by FE-SEM & Elemental Analysis 10,000 MEC Elemental Analysis of Copper Surface EPMA) 3.0 µm MEC will try the best to examine problems using all analytical techniques Cu when L troubles arise 3.0 µm C K 23