Circuit Board Protection: Encapsulants for high reliability electronics. Hilde Goossens March 2015

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1 Circuit Board Protection: Encapsulants for high reliability electronics Hilde Goossens March 2015

2 Agenda 1. Company Introduction 2. Project Introduction 3. Temperature stability project 4. Chemical resistance project 5. Summary 6. Product High lights 2

based on natural oils & fats Preferred stocks traded

3 Who we are Family Company with more than 130 Years of History Founded 1876 Historical basis: Chemicals based on natural oils & fats Preferred stocks traded since 1985 Family owns > 59 % of ordinary stocks Image 3

4 Who we are Henkel at a glance 2014 Almost 50,000 employees worldwide 2.6 bn adjusted 1 operating profit (EBIT) Around 16.4 bn sales, 3.4% organic sales growth 59% of our sales generated by our top 10 brands 44% of our sales generated in emerging markets 138 years of brand success 1 Adjusted for one-time charges/gains and restructuring charges. 4

5 Who we are Global leading positions in consumer and industrial businesses Consumer Businesses Industrial Business Laundry & Home Care Beauty Care Adhesive Technologies 5

6 Adhesive Technologies Five Business Segments Packaging and Consumer Goods Transport and Metal General Industry Electronics Consumer, Craftsmen and Building 6

7 Adhesive Technologies Electronics Target markets: Semiconductor and Electronic Assembly Global business Focus on high growth or high margin segments Partner of choice for innovation leaders Accounts for 7% of sales 7

8 Who We Are Our Brands 1997 PCB Assembly Solder Material Our Manufacturer Brand 2000 PCB Assembly Solder Material Semiconductor & PCB Assembly 2005 Semiconductor Mold Compound Printed Circuit Board (PCB) Printed Electronics Semiconductor Assembly Thermal Management Materials Our Technology Brands 8

9 Markets We Serve Semiconductor Packaging Consumer Electronics Industrial Electronics Thermal (NEW) Memory 3D Packaging Flip Chip Packaging Wafer Level Packaging Camera Module & Image Sensor TSV IC Leadframe/laminates Discretes/passives HB LED Handheld Digital Printing Computing Appliance Lens Bonding ITO Overcoat (Displays) OLED Displays Touch sensors ITO overcoat Automotive WDI Electronic Components Defense & Aerospace RFID Medical Opto-electronics Power Electronics Solar Automotive Handheld Displays Solar Power Electronics Defense & Aerospace Computing Fans and Blowers Membrane Switches Thermal Substrates RFID = Radio Frequency Identification WDI = Wireless Device Infrastructure HB = High Brightness TSV = Through Silicon Via OLED = Organic Light Emitting Diode ITO = Indium Tin Oxide 9

Henkel Electronic Materials Product Lines Die Attach Adhesives Molding Compounds Assembly Adhesives Liquids Inks & Coatings Solder Materials Thermal Materials Die Attach Paste Die Attach Film Dicing

10 Henkel Electronic Materials Product Lines Die Attach Adhesives Molding Compounds Assembly Adhesives Liquids Inks & Coatings Solder Materials Thermal Materials Die Attach Paste Die Attach Film Dicing Die Attach Film Conductive Die Attach Film WBC Mold Compound Powders ECA NCA SMA ABP Underfills Sealants CBP Encapsulants Light cure adhesives LPM (Macromelt) LCM NCP Conductive Inks Non-Conductive Inks Blendable Resistors Shielding Coatings Solder Paste Liquid Flux Solder Wire Solder Bar Assembly Film Thermal (Interface) Material Thermally Conductive Adhesive Liquid Gap Filler Gap Pads Insulated Metal Substrate (IMS) Electrically Insulating Film Abbreviations: ABP = Assembly Bench Products CBP = Circuit Board Protection ECA = Electrically Conductive Adh LCM = Liquid Compression Molding LPM = Low Pressure Molding NCA = Non Conductive Adhesive NCP = Non Conductive Paste SMA = Surface Mount Adhesive WBC = Wafer Backside Coating 10

Electronics Assembly Materials Market-Tailored Product Solutions Henkel Solutions Die Attach Adhesives Molding Compounds Assembly Adhesives Liquids Inks & Coatings Solder Materials Thermal Materials

11 Electronics Assembly Materials Market-Tailored Product Solutions Henkel Solutions Die Attach Adhesives Molding Compounds Assembly Adhesives Liquids Inks & Coatings Solder Materials Thermal Materials Customer Mfg. Efficiency Low Pressure Molding Potting Compound Non-Conductive Pastes Liquid Gap Filler Conformal Coatings Market Needs Sustainability High Reliability Miniaturization Sealants Electrically Insulating Film Printed Inks CSP Underfills (Cornerbond) Encapsulants (Glob Top) Insulated Metal Substrate (IMS) Gap Pads Electrically Conductive Pastes Gasketing Solder Materials Assembly Film Adhesives Surface Mount Adhesives 11

Encapsulants for high reliability electronics High temperature and chemical resistant potting materials Definition potting material: Method which consists of pouring a catalysed or hard-enable liquid

12 Encapsulants for high reliability electronics High temperature and chemical resistant potting materials Definition potting material: Method which consists of pouring a catalysed or hard-enable liquid into a shell or housing which remains as an integral part of the unit. Customer Benefit: To isolate devices from generally degrading environmental and operational effects such as oxygen, moisture, heat and cold, dust, current leakage, corrosion, mechanical shock and vibration. PCB Resin Housing or Case 12

13 Encapsulants for high reliability electronics Industry Trends For todays electronic devices, reliability is critical. Higher temperature operating materials (up to C) required Chemical resistant materials (at elevated temperatures) Automatic transmission fluids Oils Different fuels (biodiesel, methanol fuels) Additives (AD Blue) Better heat dissipation = improved thermal conductivity 13

14 Encapsulants for high reliability electronics High temperature and chemical resistant potting materials Scope To create and evaluate a standard test protocol to be used globally by PD and TCS to determine the fit for use of potting materials for automotive applications. Temperature stability performance at temperatures up to 250 C of commercial products. Chemical resistance evaluation against automotive fluids Temperature stability performance Performance at 150 C Adhesion strength on Al and PBT Performance at 200 C/225 C/250 C Adhesion strength on Al Chemical resistance performance Weight absorption Hardness Appearance 14

15 Encapsulants for high reliability electronics Selection of products Two component products LOCTITE 2850 FT / LOCTITE cat 27-1 (epoxy) LOCTITE 2850 FT / LOCTITE cat 23LV (epoxy) LOCTITE W1 / LOCTITE cat 27-1 (epoxy) LOCTITE E 2534 FR / LOCTITE cat 9 (epoxy) One component products LOCTITE EO 1058 (epoxy) LOCTITE E 2517 (epoxy) LOCTITE ECCOBOND A (epoxy) XE70202 (epoxy) LOCTITE ES 4322 (epoxy) LOCTITE ES 4512 (epoxy) LOCTITE 2762 FT / LOCTITE cat 17 (epoxy) LOCTITE ES 0515 (epoxy) LOCTITE ABLESTIK 104 (epoxy) LOCTITE U 2500 HTR (polyurethane) LOCTITE S 5225 (silicone) 15

16 Encapsulants for high reliability electronics High temperature and chemical resistant potting materials Scope To create and evaluate a standard test protocol to be used globally by PD and TCS to determine the fit for use of potting materials for automotive applications. Temperature stability performance at temperatures up to 250 C of commercial products. Chemical resistance evaluation against automotive fluids Temperature stability performance Performance at 150 C Adhesion strength on Al and PBT Performance at 200 C/225 C/250 C Adhesion strength on Al Chemical resistance performance Weight absorption Hardness Appearance 16

17 Encapsulants for high reliability electronics Temperature stability evaluation at 150 C Test description TLSS: according to TP-21W PBT strips: BASF Ultradur B4300 (30%GF) molded by Rocholl, Germany into 25mm x 100mm x 13mm strips roughened by using sandpaper P320 Aluminum strips: 25mm x 100mm x 1.6mm sheared strips of 6061 T6 aluminium acid pre-etched per ASTM D2651and supplied by Dalco Engineering, Carlisle, MA, USA Controlled bond line thickness 80 micron stainless wire Overlap size: 1.3 ± 0.2 cm Report maximum load at room temperature in Mpa [for conversion reference 1 MPa 145 psi 10,1971 kg/cm2] 5 bonded assemblies per test condition Test panels Heat storage Al/Al Initial adhesion + after 6 weeks storage at 150 C PBT/PBT Initial adhesion + after 6 weeks storage at 150 C 17

Heat storage results 150 C Adhesion strength Two component materials 20 18 16 14 12 10 Heat storage 150 C TLSS AI test panels (MPa) 8 6 4 2 20 18 16 14 12

ES4512 U2500HTR S5225 0 2850FT cat 23LV 2850FT cat 27-1 2651-40W1 cat 27-1 E2534FR cat 9 Initial None of the products show degradation high adhesion

18 Heat storage results 150 C Adhesion strength Two component materials Heat storage 150 C TLSS AI test panels (MPa) Heat storage 150 C TLSS PBT test panels (MPa) FT cat 23LV 2850FT cat W1 cat 27-1 E2534FR cat 9 Initial ES4322 after 6 weeks ES4512 U2500HTR S FT cat 23LV 2850FT cat W1 cat 27-1 E2534FR cat 9 Initial None of the products show degradation high adhesion values are obtained Highest adhesion is obtained with epoxy systems In general adhesion to PBT is lower than to Al ES4322 after 6 weeks ES4512 U2500HTR S

EO1058 0 XE 70202 E2517 A316-48 EO1058 Initial after 6 weeks None of the products show degradation high

19 Heat storage results 150 C Adhesion strength One component materials Heat storage 150 C TLSS AI test panels (MPa) 25 Heat storage 150 C TLSS PBT test panels (MPa) XE E2517 A EO XE E2517 A EO1058 Initial after 6 weeks None of the products show degradation high adhesion values are obtained XE70202 shows highest adhesion with substrate failure of PBT Initial after 6 weeks 19

20 Encapsulants for high reliability electronics Temperature stability evaluation at 200 C/225 C/250 C Test description TLSS: according to TP-21W Aluminum strips 25mm x 100mm x 1.6mm sheared strips of 6061 T6 aluminium acid pre-etched per ASTM D2651and supplied by Dalco Engineering, Carlisle, MA, USA Controlled bond line thickness 80 micron stainless wire Overlap size: 1.3 ± 0.2 cm Report maximum load at room temperature in MPa [for conversion reference 1 MPa 145 psi 10,1971 kg/cm 2 ] 4 bonded assemblies per test condition Test condition Heat storage at 200 C / 225 C / 250 C 200 C Initial + after 2 and 6 weeks storage 225 C Initial + after 2 and 6 weeks storage 250 C Initial + after 2 and 6 weeks storage 20

Heat storage results 200 C/225 C/250 C Adhesion strength Heat storage 200 C TLSS AL test panels 20 Heat storage 225 C TLSS AI test panels 20 TLSS (Mpa) 15 10 5 TLSS (Mpa) 15 10 5 TLSS (Mpa) 0 2762FT

21 Heat storage results 200 C/225 C/250 C Adhesion strength Heat storage 200 C TLSS AL test panels 20 Heat storage 225 C TLSS AI test panels 20 TLSS (Mpa) TLSS (Mpa) TLSS (Mpa) FT Cat 17 ECCOBOND 104 ES0515 ES4322 EO1058 Heat storage 250 C TLSS AI test panels FT Cat 17 ECCOBOND 104 ES0515 ES4322 EO1058 E2517 E FT Cat 17 ECCOBOND 104 ES0515 ES4322 EO1058 E2517 All products can be used up to 200 C, no degradation is observed. E 2517 fails at temperatures above 200 C 2762 FT and ECCOBOND 104 can be used up to 250 C Initial After 6weeks 21

22 Summary heat storage test Heat storage 150 C XE70202 performs best in class up to 150 C High adhesion and adhesion retention obtained on both Al and PBT substrates U 2500 HTR (urethane system), no adhesion degradation at 150 C. Heat storage 200 C All tested products can be used up to 200 C, no degradation is observed. E 2517 fails at temperatures above 200 C EO 1058 and ES 4322 can be used up to 200 C -225 C 2762 FT and ECCOBOND 104 can be used up to 250 C 22

23 Encapsulants for high reliability electronics High temperature and chemical resistant potting materials Scope To create and evaluate a standard test protocol to be used globally by PD and TCS to determine the fit for use of potting materials for automotive applications. Temperature stability performance at temperatures up to 250 C of commercial products. Chemical resistance evaluation against automotive fluids Temperature stability performance Performance at 150 C Adhesion strength on Al and PBT Performance at 200 C/225 C/250 C Adhesion strength on Al Chemical resistance performance Weight absorption Hardness Appearance 23

24 Encapsulants for high reliability electronics Chemical resistance evaluation Selection of automotive fluids: Synthetic oil Kroon Emperol 10W-40 Brake fluid Kroon Drauliquid-S dot 4 Automatic transmission fluid Pennzoil Dexron III/Mercon Euro diesel III Cert Fuel (Chevron Phillips Chemical) Salt water 5 % NaCl by weight in DI water 24

25 Encapsulants for high reliability electronics Chemical resistance evaluation Test description Absorption measurements : according to TP-428 For Euro diesel : weight change is measured in a closed jar 3 test pieces (total surface area = 30 cm2) per condition Weight absorption was determined after 168, 500 and 1000 hours Fluids Test Condition Synthetic oil RT and 140 C Brake Fluid RT Automatic transmission Fluid RT and 140 C Euro Diesel RT and 65 C 5% NaCl in DI water RT and 85 C 25

26 Encapsulants for high reliability electronics Chemical resistance evaluation Colour code explanation less than 0.5% weight increase between 0.5 and 3% weight increase more than 3% weight increase Not tested 26

27 Chemical resistance results Two component potting materials Synthetic Oil Brake fluid ATF Euro Diesel 5% NaCl/water RT T RT T RT T RT T RT T 2850FT/cat FT/cat 23LV W1/cat 27-1 E 2534FR/cat 9 ES4322 ES4512 U2500HTR S

28 Chemical resistance results One component potting materials Synthetic Oil Brake fluid ATF Euro Diesel 5% NaCl/water RT T RT T RT T RT T RT T E2517 XE70202 EO1058 A

29 Summary chemical resistance test All tested epoxy based systems (two and one component systems) show very good resistance against the automotive fluids The silicone and urethane based materials are not recommended when resistance against immersion in these fluids is required 29

30 Summary Looking at the combination of high temp adhesion strength and resistance against automotive fluids, following products can be recommended: LOCTITE 2850 FT LOCTITE E 2534 FR LOCTITE W1 LOCTITE EO 1058 XE

31 Product High light 1 LOCTITE 2850 FT Technology Operating temperature Product benefits Applications High voltage application Epoxy Two component RT or heat cure (wide variety of catalysts available) -40 C / +200 C Thermally conductive (good heat dissipation) Low CTE Excellent chemical resistance Electrically insulating Alternators, temperature control sensors, bonding of heat sinks LOCTITE 2850 FT BLUE 31

32 Product High light 2 LOCTITE E 2534 FR / LOCTITE cat 9 Technology Operating temperature Product benefits Applications Epoxy Two component RT or Heat cure (65 C) -40 C / +150 C Thermally conductive (good heat dissipation) Flame retardant (UL 94V-0 rating in 6mm thickness) Excellent chemical resistance Halogen Free NTC temperature sensors 32

33 Product High light 3 LOCTITE W1 Technology Operating temperature Product benefits Applications UL approved version Epoxy Two component RT or Heat cure (wide variety of catalysts available) -40 C / +175 C Low viscosity Ease of use Good adhesion to variety of substrate Capacitive sensors, general purpose PCB protection LOCTITE ES

34 Product High light 4 LOCTITE EO 1058 Technology Operating temperature Product benefits Applications Epoxy One component Heat cure -40 C / +200 C Excellent chemical resistance High temperature stability Good thermal shock/cycle performance Low CTE Sensors, gear box sensors, clutch position sensors 34

35 Product High light 5 XE70202 Technology Operating temperature Product benefits Applications Epoxy One component Heat cure -40 C / +150 C Good chemical resistance Moderate viscosity Good thermal shock/cycle performance Excellent adhesion to Al and PBT HAL sensors, position sensors, temperature sensors 35

36 Product High light 6 LOCTITE U 2500 HTR Technology Operating temperature Product benefits Applications Polyurethane Two component RT or heat cure -40 C / +150 C Low viscosity Low Tg (-40 C) Low modulus Operating temperature up to 150 C Transformers, ignition systems, ultrasonic sensors 36

37 Questions? 37

38 Thank you! Contact: This material has been visually improved with the help of our team at the Graphic Design Center in SSC Manila. To know more about this service, please visit in the Henkel portal.

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