Challenges in Material Applications for SiP

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1 Challenges in Material Applications for SiP Sze PeiLim Regional Product Manager for Semiconductor Products Indium Corporation

2 Indium Corporation Materials Supplier: SMT solder pastes and fluxes Power semiconductor die-attach Semiconductor fluxes SiP solder pastes TIMs Engineered solders Specialty compounds NanoFoil Customer Recognition: Intel (Preferred Quality Supplier Award) Celestica (Total Cost of Ownership Award) Samsung (Superior Vendor Award) Shinwa (Best Supplier Awards) 9/25/2017

3 Outline/Agenda Introduction Challenges Solder Paste Flip-Chip Flux Acknowledgements Q & A

4 Introduction of SiP Heterogeneous integration in SiP Increased functionality in a single package, higher performance Faster time to market Lower cost Miniaturization for SiP passives Current (ASE: 2017/2018) (2019/2020)

5 Challenges in Material Solder Paste Smaller stencil aperture, tighter gap between pads More critical solder paste printing requirements Jetting paste? Flip-Chip Flux Cross contamination of flip-chip flux with solder paste Cleaning Solder paste and flux cleanability Water wash vs. solvent wash How clean is clean? CUF/MUF Flowability Compatibility with no-clean flux 9/25/2017

6 Solder Paste: Powder Size Type Powder Size (IPC J-STD-005) vs. Minimum Stencil Aperture Less than 0.5% larger than 10% Max. between 80% Min. Between 10% Max. Less than Minimum of 5-6 solder particles across the aperture Minimum Stencil Aperture (um) Approximate Powder Surface Area (times) NA NA NA NA Increase in powder surface area will require more flux or flux with a better oxidation barrier to protect the powder from surface oxidation

7 High Volume Powder (SAC305) Type 5 Type 6 Type 6-SG Type 6-SG Solder Paste Printing Water-soluble Indium3.2HF 0.1mm aperture 50µm-thick stencil 9/25/2017

8 Solder Paste: Flux Types Standard No-Clean SMT Paste Ultralow Residue No- Clean Typical Flux Residue (%w/w of flux) 40-60% 4-10% Not needed for standard SMT, but can be solventcleaned Cleaning Process Not needed MUF/CUF compatibility Poor if not cleaned (delamination and solder bridging) Usually good if all solvent removed during reflow or postprocessing Water-wash Zero after cleaning / drying DI water clean or aqueous solvent Excellent if residue completely cleaned and dried

9 Solder Paste Paste rheology Slump behavior Stencil life

10 Printing Performance Minimum slump or bridging down to 50µm gap 125µm x 150µm pad and 50µm gap distance X (µm) Y (µm) Stencil Thickness (µm) Area Ratio /25/2017

11 Printing Performance Print down to 0.42 area ratio 1 80 Box Boxplot Plot of Different of Different Aspect Ratio Aspect using Ratios Paste C Data Cpk Cp 0.45AR AR AR AR AR AR AR 0.42AR 0.45AR 0.57AR 0.62AR 0.64AR 9/25/2017

12 Printing Performance Powder size comparison T6-SG vs. T7-SG T7-SG has smaller standard deviation 1 80 Boxplot of Volume T6SG vs T7SG Data AR T6SG 0.45AR T7SG 0.42AR T6SG 0.42AR T7SG 0.40AR T6SG 0.40AR T7SG

13 Printing Performance Substrate support system: pallet vs. vacuum Vacuum support shows better consistency Support Aspect Ratio Cpk Ppk Cp Pallet Pallet Pallet Vacuum Vacuum Vacuum

14 Next Generation Water-Soluble Indium3.2HFA SiP Printing Paste Voiding Performance A A

15 Solder Paste for Jetting Jetting can dispense dots close to pad and high above the pad Faster than dispensing; higher frequency Ability to achieve smaller deposits Ability to dispense additional paste to increase volume Ability to dispense paste in cavity on a substrate

16 9/25/2017 Jetting Performance

17 MEMS Lid-Attach Consistent rectangles for MEMS lid-attach with no gaps

18 Flip-Chip Flux Application Processes

19 Emerging Flip-Chip Challenges Package Design Changes Pitch: Shrinking to 100 microns and below Die-substrate clearances: Down to 60 microns and below Substrates thin (coreless): Subject to warping Logic die: Down to 50 microns thick and memory (DRAM) down to <20 microns thick Flux Cleaning Challenges Pitch reduction limits ability to completely remove water soluble flux residues: Corrosive residues left behind Block flow of CUF and MUF leading to underfill voiding Interfere with CUF and MUF adhesion causing delamination Cleaning process: Increases substrate warpage after reflow and before underfill Die damage Cracked solder joints Adds costs Answer: Move to no-clean flux

20 TGA Comparison: ULR and Standard Residue Fluxes Standard reflow peak maximum

21 Low-Residue Flux for Mass Reflow Flip-Chip Flux NC-26S Flip-Chip Flux NC-26-A Flip-Chip Flux NC-699 Different rheology or viscosity is required based on process and product type Flip-Chip Flux NC-26S Flip-Chip Flux NC-26-A Flip-Chip Flux NC-699 Viscosity (kcsp) Residue Level* 7~8% ~4% <1% * Residue level was measured by gravimetric method before and after reflow using typical lead-free SAC profile with convection oven.

22 ULR Flux: Importance of Rheology High viscosity Bridging Inability to remove die from tray Low viscosity Flux wicking and die-surface contamination Inability to hold die in place Poor joint strength

23 Printing Comparison: TACFlux 10 and Flip-Chip Flux NC-26S Parameter setting: Kneading: 100 strokes Separation: 1mm/sec Pressure: 2kg per 8-inch squeegee Two stencils with different aperture openings: Both are 40µm thick Flip-Chip Flux NC-26S TACFlux 10 40µm-thick stencil 95mil (diameter) 175mil (pitch) Fluxes were printed on a smooth copper surface, which makes slump easier than on a PCB. 12mil diameter (largest circle) 4mil width (smallest square) Fluxes were printed on an ENIG surface with a solder mask on a PCB TACFlux 10 slumped while Flip-Chip Flux NC-26S did not. Flip-Chip Flux NC-26S provided better printing compared to TACFlux 10

24 Compatibility with Underfill

25 Flux and Underfill Materials Low-Residue Flux Reference Fluxes and Reference Flip-Chip Flux NC-026S (NC-26S) Flip-Chip Flux NC-026-A (NC- 26-A) B (Compatibility Improved Flux) TACFlux 7 (Regular Residue Flux) Blank (No Flux Applied) Underfill G355 U C

26 Share Strength (psi) Molded Underfill (G355) Shear Strength G G355 G355 with HT G355 with G355 with G355 with N-26A NC-26-A and B HT G355 with B and HT G355 with NC-26S G355 with G355 with G355 with NC-26S and TACFlux 7 TACFlux 7 and HT HT G355 Blank gives best shear strength; next best is B NC-26-A and NC-26S provide similar and proper compatibility TACFlux 7 is worse than others After humidity and high temperature (HT) treatment, shear strength became lower as expected

27 Shear Strength (psi) Capillary Underfill (U C) Shear Strength U C U C U C U C U C U C U C U C U C U C Blank Blank with HT with NC-26-A with NC-26-A with with with NC-26S with NC-26S with and HT B B and HT and HT TACFlux 7 U C with TACFlux 7 and HT B, NC-26-A, and NC-26S gives similar or even higher shear strength in some cases than U Blank (no flux residue) U C provides good compatibility with no-clean low-residue flux TACFlux 7 is worse than others No-clean low-residue fluxes provide good compatibility.

28

29 9/25/2017

30 Equipment and Materials Partners* Flip-chip, MR, and TCB Flip-chip MR, and TCB Flip-chip, TCB Wafer-bumping Wafer-bumping Reflow and sintering Solder paste jetting Solder paste jetting Flux jetting Reflow Vacuum reflow and sintering Cleaning flux and die-attach paste Cleaning flux and die-attach paste

31 Thank you!

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