ALPHA FLUITIN 1535 No Clean Cored Solder wire

Transcription

1 ALPHA FLUITIN 1535 No Clean Cored Solder wire Type: J-STD-004 ROL1 / IPC-SF-818-L2CN / ISO / DIN 8511 F SW26 DESCRIPTION Alpha Fluitin 1535 is an activated rosin cored solder wire developed for general hand soldering applications. The unique activator system offers good thermal stability at pre-soldering temperatures ensuring that Fluitin 1535 performs extremely well on parts and surfaces which present poor or difficult soldering conditions. Fluitin 1535 leaves post-soldering residues that are hard and which can be safely left without the need to remove them. If the removal of residues is required then semi-aqueous or aqueous systems can be used effectively. FEATURES & BENEFITS ROL1 Suitable for J-STD-001B Class III High performance electronic products. Minimal, non-corrosive, clear and safe residues. Very fast wetting. Good spread characteristics. Pleasant pine smell. Ease of solderability. Provides good joint appearance. APPLICATION Fluitin 1535 is suitable for use in any commercial no-clean hand soldering application that specifies compliance to J-STD-004 ROL1 standard. This applies to products where continued high performance or performance on demand is crucial and equipment downtime cannot be tolerates and / or the end use environment may be uncommonly harsh. This classification would typically include military weapons, and defence systems, aerospace, life support systems and under the hood automotive electronics. HINTS & TIPS ON SOLDERING IN GENERAL Always remember that a soldered joint is formed by heating the parts to be soldered to a temperature in excess of the melting point of the alloy to be used in hand soldering this is how a soldering iron is used. By feeding the cored wire onto the parts, the flux is able to flow and remove oxide films, whilst the solder creates a thin intermetallic bond which becomes the solder joint. Note the following tips: Use a soldering iron bit size and form to suit the operation: small bits for soldering large components may prevent the formation of a joint or slow the process down. Always select wire diameters to suit both soldering iron bit and the parts/components to be soldered. Soldering irons systems should provide sufficient heat to satisfy the requirements of the points above. Cored solder wires can be provided in different grades of alloy so always ensure you have selected the right grade for the Issue 4

2 application. Do not overheat as this causes an increase in the depth of the intermetallic layer, which in turn weakens the joint. All materials from Cookson Electronics Assembly Material are manufactured to meet the most stringent of standards and to ensure the best possible finish to every soldering application. The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated TECHNICAL SPECIFICATION Physical Properties Rosin Grade: Rosin Softening Point: Acid Value: Halide Content: Corrosiveness: Copper Mirror: Surface Insulation Resistance: (Not Cleaned) Classification: Typical Values Standard Alloy Designation Melting or Solidus / Liquidus Temp C WW per Fed Spec. ISO 9453 (2) S-Sn60Pb % LL-R C (160 F) ISO 9453 (5) S-Pb60Sn % (mg KOH/g) % (by weight) Classified to J-STD-004 as L type material Classified to J-STD-004 as <50% breakthrough Passes IPC-SF-818 Class III. Test results to J-STD C/85% RH / 7 days CD = 3.73E10 Ohms CU = 3.22E10 Ohms (Pass >1E08 Ohms) J-STD-004 ROL1 IPC-SF-818 L2CN ISO DIN 8511 F SW26 Flux Configuration HEALTH & SAFETY Observe standard precautions for handling and use. Use in well ventilated areas. DO NOT SMOKE. Alpha Fluitin 1535 wire is not considered toxic. However, its use in typical soldering applications will generate a small amount of decomposition and fumes. These fumes must adequately exhausted/vented for operator safety and comfort. In order to carry out your full COSHH assessment, consult the product Material Safety Data Sheet (MSDS) The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials Issue 4

3 European Headquarters: Worldwide Headquarters Regional Offices Cookson Electronics Assembly Materials Cookson Electronics Assembly Materials Belgium: Tel: +32 (0) Forsyth Road, Sheerwater 600 Route 440 France: Tel: +33 (0) Woking, Surrey Jersey City, New Jersey Germany: Tel: +49 (0) GU21 5RZ. United Kingdom USA Ireland: Tel: +353 (0) Tel: +44 (0) Tel: +1 (201) Italy: Tel: +39 (0) Fax: +44 (0) Fax: + 1 (201) Hungary: Tel: +36 (0) Netherlands: Tel: +31 (0) The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials Issue 4

4 SM989-1 ALPHA Vaculoy SACX PLUS 0307,0300 LEAD FREE WAVE SOLDER and REWORK ALLOY DESCRIPTION ALPHA Vaculoy SACX Plus 0307 is a next generation lead-free alloy suitable for use as a replacement for SnPb, SAC305 and other low silver SAC alloys including the original SACX 0307 in wave solder, lead tinning and rework processes. SACX Plus 0307 has been engineered for improved copper dissolution performance during the long hot exposure times associated with rework and lead tinning. The SACX Plus 0300 variant is used as a replenishment alloy in solder baths with elevated copper levels. As with all Alpha Metals bar solder, Alpha s proprietary Vaculoy manufacturing process is used to remove certain impurities, particularly oxides. The product is further enhanced with the addition of other materials designed to further reduce drossing, increase wetting speed and force and improve joint cosmetics. FEATURES & BENEFITS Features: RELIABILITY Comparable to higher Ag alloys (ie. SAC305) in thermal fatigue resistance, lap shear and pin pull performance. YIELD Comparable to SAC305, superior performance for hole fill and SMT related defects compared to Ag free alloys like Sn99.3/Cu0.7. COPPER EROSION Low erosion during long rework exposure times DROSS GENERATION lowest in class due to the Vaculoy process in conjunction with the addition of a dross reducing agent. Benefits: Lowers Total Cost of Ownership due to the lower material cost, high yields and low dross generation. Excellent mechanical reliability. Gives very good hole fill and drainage due to the lower surface tension attributed to Ag. Reduces erosion of copper plating during rework improving assembly reliability. Delivers good performance across a range of flux technologies. The proprietary Vaculoy process is a highly effective method for removing included oxides from solder. This is extremely important because included oxides generate excessive drossing and increase the viscosity of the solder. Solder with higher viscosity can result in increased soldering defects (i.e solder bridging) APPLICATION ALPHA Vaculoy SACX Plus 0307 is suitable for wave soldering, lead tinning and reworking both through hole and surface mount components in a lead-free process. It is suited to single side and relatively complex, dual sided mixed technology boards. A solder pot temperature of C ( F) is recommended with a contact time seconds. For suitable wave solder fluxes, please see our selector guide. Lead free Reclaim services including dedicated lead free containers is also available, please consult your local sales office. AVAILABILITY ALPHA Vaculoy SACX Plus 0307 is available in 1kg (2.2lb) Bar, chunks, Feeder Ingots and Autofeed Wire The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials

5 HEALTH & SAFETY Please refer to MSDS for advice on proper handling and safety instructions. TECHNICAL SPECIFICATION Complies with all requirements of RoHS Directive (Article 4.1 of the European Directive 2002/95/EC). Alloy specification for Maximum Lead (Pb) Content = 0.1% Material Property Units Vaculoy SACX Plus 0307 Solidus Celsius 217 Liquidus Celsius 228 Hardness HV 14.1 Density g/cc 7.33 Specific Heat Capacity J/kg C 0.17 Stress at MAX Load Mean 29.5 (N/mm 2 ) Std Dev 0.64 Elongation at failure (%) Mean 21.8 Std Dev 8.8 Thermal Expansion (30-100C)/C x Coefficient ( C)/C x Silver Content % /-0.05 Copper Content % /-0.1 Lead Content % Max 0.1% RECOMMENDED WAVE SOLDER PROCESS SETTINGS Wave Configuration Single Wave Dual Wave Process Parameter Suggested Process Settings Pot temperature Celsius ( F) Conveyor speed m/min (3.3-5 ft/min) Contact time seconds Wave Height 1/2 to 2/3 of board thickness Dross removal Once per 8 hour run time Copper Check Every 8,000 boards until 40,000 Pot temperature Celsius ( F) Conveyor speed m/min (3.3-5 ft/min) Contact time seconds Wave Height 1/2 to 2/3 of board thickness Dross removal Once per 8 hour run time The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials Issue 2

6 MANAGEMENT OF COPPER LEVELS IN THE SOLDER BATH Copper should be controlled in the solder bath between 0.7% and 1.0% Management of the copper level in the wave solder bath is critical to ensure low defects in the soldering process. There is a tendency for the copper levels within a high tin bearing alloy wave solder bath to increase due to copper dissolution from the PCB. This effect increases based on the level of exposed copper on the assembly, as in the case of boards using OSP pad finishes. Studies have shown a typical leaching rate of 0.01% Cu per 1000 boards. As each process is unique, this rate should be viewed as a guideline only. It is recommended that the copper is controlled at between 0.7% and max 1.0% for SACX Plus 0307 alloy. If the copper levels are higher than 1.0% then this will increase the liquidus temperature which in turn may mean that the solder bath temperature has to be increased to maintain the process yields. The copper levels in the bath can be controlled by means of adding SACX Plus 0300 to the wave solder pot. It may be the case that equilibrium can be attained by continuing with SACX Plus 0300 additions as the only means of solder top up, however each process is unique and we would recommend regular analysis of the solder bath so that good control of copper can be maintained. This analysis service is available from Cookson, contact your local sales office for details. RECOMMENDED ACTION LEVELS FOR WAVE SOLDER IMPURITES Please find below a list of recommended action levels for wave solder bath impurities. For information of specific action plans to bring your solder bath back to an acceptable condition please contact your local sales office. Element Sn ACTION Levels BAL Pb 0.10 As 0.03 Cu 1.00 Bi 0.20 Zn Fe 0.02 Ag 0.50 Sb 0.20 Ni Cd Al Au 0.1 No Action level. Notes RoHS Directive 2002/95/EC states a maximum Lead content of 0.1% Levels greater than 0.03% can cause de-wetting. SACX is tolerant to copper levels up to 1.0%, SACX0300 copper free should be added to maintain copper levels. Levels above 1.0% may cause more bridging. Lead Free alloys are tolerant to Bi up to 1.0%, however if levels above 0.20% are detected this indicates some contamination issues that should be investigated Levels greater than 0.003% may cause higher levels of bridging and icicling and a greater level of surface oxidation in the solder bath. Greater than 0.02% Iron can be an indicator of pot erosion and may cause gritty joint formation and the formation of FeSn 2 IMC needles that can cause bridging. Silver levels of 4% are used in some SAC alloys, however if the levels in SACX rise above 0.5% then some investigations should be held to establish the cause. Solderability should not be affected Lead Free alloys are tolerant to Sb up to 1.0%, however if levels above 0.20% are detected this indicates some contamination issues that should be investigated Levels greater than 0.025% may start to slow the wetting speed and could affect the hole fill performance. If process performance is OK then levels up to 0.05% are OK. RoHS Directive 2002/95/EC states a maximum Cadmium content of 0.01%. Levels of 0.003% may cause higher level of bridging and icicling. Levels greater than 0.002% may cause higher levels of bridging and icicling and a greater level of surface oxidation in the solder bath. At levels above 0.1% there may be some problems with joint strength. Headquarters Regional Sales Offices: Belgium Tel: +32 (0) Japan: Tel: Cookson Electronics Assembly Materials Brazil Tel: Korea: Tel: Corporate Blvd. France: Tel: +33 (0) Mexico: Tel: South Plainfield Germany: Tel: +49 (0) Netherlands: Tel: +31 (0) NJ 07080, U.S.A. Hong Kong: Tel: Singapore: Tel: Tel: Hungary Tel: +36 (0) Taiwan: Tel: +886 (3) Fax: India: Tel: UK: Tel: +44 (0) Ireland: Tel: +353 (0) USA - Elgin: Tel: Italy: Tel: +39 (0) The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials Issue 2