Electrically Conductive Compounds Selector Guide. Chomerics. Coatings, Adhesives, Sealants, Gap Fillers, and Greases ENGINEERING YOUR SUCCESS.

Transcription

1 aerospace climate control electromechanical filtration fluid & gas handling hydraulics pneumatics process control sealing & shielding Electrically Conductive Compounds Selector Guide Coatings, Adhesives, Sealants, Gap Fillers, and Greases

2 CHO-SHIELD Conductive Coatings - Typical Properties Filler Resin Type (Parts) Mix Ratio by Max. Surface Resistance (Rec. Thickness 2 ) ohm/sq. (mils) C ( F) Elevated Cure C ( F) RT Cure Time Working Hours Shelf Months 3 Theoretical (Rec. Thickness 2 ) ft 2 /gram m 2 /gram VOC 4 g/l 2044* Ni Acrylic (1) (2) -40/ (-40/1) C (150 F) 24 hr. unlimited ft 2 /gram m 2 /gram 755 Durable coating. Nickel filler provides some H-field shielding 2056* /Cu & Acrylic (1) (1) -40/ (-40/1) C (150 F) 24 hr. unlimited ft 2 /gram m 2 /gram 718 Most cost effective EMI shielding solution for electronic enclosures 2040* Acrylic (1) (1) -40/ (-40/1) C (150 F) 24 hr. unlimited ft 2 /gram m 2 /gram 741 Silver filler provides antimicrobial resistance and excellent EMI shielding 610* /Cu A:B 100: (2) -65/125 (-/257) 1 66 C (150 F) C ( F) 1 week ft 2 /gram m 2 /gram 591 Man portable electronics, radar systems, missile cannisters Maintains electrical and mechanical stability in harsh environments 571* A:B 100: (1) -40/125 (-40/257) C (70 F) C ( F) none ft 2 /gram m 2 /gram 308 Component level EMI shielding of semiconductor devices Good adhesion to semiconductor packages. Withstands wave solder temperatures 576* A:B 100: (1) -40/150 (-40/302) 1 21 C (70 F) C ( F) 1 week ft 2 /gram 0.00 m 2 /gram 560 Electroplating over plastics and graphite composites Provides a conductive seed layer for electroplating 596* A:B 100: (1) -40/150 (-40/302) 1 21 C (70 F) C ( F) 1 week ft 2 /gram m 2 /gram 5 Man portable electronics, radar systems, missile cannisters Meets military specification MIL-C-22750, CHO-SHIELD 579 is a low VOC version of CHO-SHIELD * Polyester (1) (0.5) -40/125 (-40/257) C ( F) none unlimited ft 2 /gram m 2 /gram 711 Flexible coating, great for covering parts with difficult geometries 604* Polyurethane (1) (1) 4994* 2001* Cu 2002* Cu 2003* Cu Polyurethane (4) A:B:C:D 100:18.3: 1.4:20.9 Polyurethane (3) A:B:C 100:10.1:42.0 Polyurethane (3) A:B:C 100:10.3:42.2 Polyurethane (3) A:B:C 100:10.1: (3) (3) (3) (3) -40/125 (-40/257) -40/ (-40/1) -65/ (-/1) -65/ (-/1) -65/ (-/1) C (302 F) 2 hr. RT & 40-60% RH C (130 F) C ( F) C ( F) C ( F) * Hazardous shipping required. All compounds such as these should be packed and shipped by trained professionals. Regulations vary by material type and by quantity. The information provided here is to be used as a general guideline only. none unlimited 9 1 week week week week ft 2 /gram m 2 /gram ft 2 /gram m 2 /gram ft 2 /gram m 2 /gram ft 2 /gram m 2 /gram ft 2 /gram m 2 /gram 767 Component level EMI shielding of semiconductor devices 596 Airframes Corrosion protection for airframes Corrosion protection for airframes Corrosion protection for airframes Advanced coating developed for high volume, precise spray application on semiconductor packages Very smooth and very coinductive; long pot life, excellent sprayability Requires use of CHO-SHIELD 1091 primer Chromate free. Requires use of CHO-SHIELD 1091 primer Requires use of CHO-SHIELD 1091 primer te: Primers are applied to the substrate prior to application of the conductive material. In no instance is the primer to be mixed into the conductive material. For additional information consult Technical Data Sheet.

3 Sealants/Gap Fillers - Typical Properties Filler Resin Type (Parts) Mix Ratio by Max. Vol. Resistivity 1 ohm-cm C ( F) Min. Lap Shear 1 psi (kpa) Elevated Cure C ( F) RT Cure Time Working Hours Shelf Months 3 VOC 4 g/l 4660* /Cu Polyisobutylene (1) 2.0** /100 (-67/212) n/a ne 1 week Sealing enclosure seams Superior performance in vibration or shear. For vertical seams or longer (120 minutes) working life, use CHO-BOND 4669 VOC = 340. Tecknit 0005* / glass Polyolefin (1) /94 (-65/200) 4 (28) ne 24 hr. 5 min Bonding enclosures Flexible thixotropic cream system 2165* Cu Polyurethane (2) A:B 100: / (-/1) 120 (827) 2 21 o C (70 o F) C (235 F) 1 week Airframe form-in-place sealing Corrosion resistant; paintable Tecknit 0002 CHO-BOND 1016* 1038* 1075* 1035* Silicone (1) Ni/C Silicone (1) /Cu Silicone (1) /Al Silicone (1) / glass Silicone (1) /204 (-75/400) -55/200 (-67/392) -55/200 (-67/392) 150 (1034) 150 (1034) 150 (1034) 100 (689) 100 (689) * Hazardous shipping required. All compounds such as these should be packed and shipped by trained professionals. Regulations vary by material type and by quantity. The information provided here is to be used as a general guideline only. ** Wet density ne 72 hr. 5 min Bonding elastomer gaskets ne 1 week ne 1 week Ideal in outdoor applications for EMI shielding and low corrosion Sealing enclosure seams; airframe gap sealing; connector shielding ne 1 week Sealing enclosure seams ne 1 week Sealing enclosure seams Rec. bond line thickness: ( mm mm); flexible paste; Handling time 24 hours. Rec. bond line thickness: > (0.18 mm); Primer promotes adhesion. Rec. bond line thickness: > (0.18 mm); Primer promotes adhesion. CHO-BOND 1121 is a solvent free version with a 12 month shelf life Rec. bond line thickness: > (0.25 mm) Primer promotes adhesion Rec. bond line thickness: > (0.18 mm) Primer promotes adhesion te: Primers are applied to the substrate prior to application of the conductive material. In no instance is the primer to be mixed into the conductive material. For additional information consult Technical Data Sheet.

4 Adhesives - Typical Properties CHO-BOND Tecknit 8116* * 1029* Filler /Cu Resin Type (Parts) Mix Ratio by 584:29 100: :208 1:1 580:208 1:1 A:B 1:1 360:20 1:1 Max. Vol. Resistivity 2 ohm-cm /Cu Silicone (1) /Cu Silicone (2) A:B 1: C ( F) -55/200 (-67/392) Min. Lap Shear 1 psi (kpa) 1200 (8274) 1000 (6895) (4826) 1400 (9653) 1600 (11032) 200 (1379) 450 (3103) Elevated Cure C ( F)** C (235 F) C (212 F) C (212 F) C (212 F) C (239 F) RT Cure Time Working Hours Shelf VOC 4 Months 3 g/l 24 hr Bonding enclosures; connnector shielding 24 hr Bonding enclosures 24 hr Bus bar grounding for shielded windows 24 hr Bonding enclosures Epoxy solder 24 hr EMI gasket attachment; bonding enclosures ne 1 week EMI gasket attachment C ( F) * Hazardous shipping required. All compounds such as these should be packed and shipped by trained professionals. Regulations vary by material type and by quantity. The information provided here is to be used as a general guideline only. ** For alternate cure schedules csee Technical Bulletin. 1 week EMI gasket attachment General purpose; light paste; fast heat or RT cure; available in easy mix CHO-PAKs & SYRINGE-PAKs May be sprayed by thinning with toluene. CHO-BOND /toluene weight mix ratio is 100:150 General purpose; medium paste; fast heat or RT cure; Easy 1:1 mix ratio (wt.) May be sprayed by thinning with solvent. Solvent weight mix ratio is 50:30:20, toluene:butanol:propanol, CHO-BOND /solvent weight mix ratio is 100:38 General purpose; very thick paste; fast heat or RT cure; Minimum bond line is (0.25 mm) Recommended bond line thickness: < (0.25 mm); Primer promotes adhesion. Recommended bond line thickness: < (0.20 mm); Primer promotes adhesion. Recommended primer is 10 te: Primers are applied to the substrate prior to application of the conductive material. In no instance is the primer to be mixed into the conductive material. For additional information consult Technical Data Sheet. Conductive Grease - Typical Properties Filler Resin Type (Parts) Max. Vol. Resistivity 1 ohm-cm C( F) Shelf VOC 4 Months 3 g/l Cho-LUBE 4220 Silicone (1) 3.1** 0.100*** -40/204 (-40/400) 12 0 Surface-to-surface particularly metal-to-metal sliding contact areas requiring continuous electrically conductive paths, such as a switch. Can also be used for grounding of enclosures, equipment or components which require lubrication to overcome friction as well as EMI control. It may be supplied by standard caulking or grease guns. ** Wet density *** Per CHO-MAT 1002

5 Conductive Coatings - Ordering Information Adhesives - Ordering Information Part. Primer Included Part. Primer Included CHO-SHIELD gallon aluminum can component, premeasured CHO-PAK CHO-SHIELD gallon aluminum can component, premeasured CHO-PAK CHO-SHIELD gallon aluminum can x 3 2 component, premeasured, 10x 3 gram syringe kits CHO-SHIELD fluid ounce aluminum aerosol can component, premeasured CHO-PAK CHO-SHIELD component, 1/2 pint aluminum can kit component, 4 fluid ounce polypropylene kit CHO-SHIELD component, 8 fluid ounce polypropylene kit component, 1/2 pint aluminum can kit component, 4 fluid ounce polypropylene kit component, 16 fluid ounce polypropylene kit CHO-SHIELD component, 8 fluid ounce polypropylene kit CHO-SHIELD component, 1 gallon aluminum can component, 16 fluid ounce polypropylene kit CHO-SHIELD quart aluminum can component, 2 fluid ounce polypropylene kit component, 1 quart aluminum can kit component, 1/2 pint aluminum can kit component, 1 gallon aluminum can kit fluid ounce aluminum bottle fluid ounce aluminum foil tube component, 1/2 pint aluminum can kit fluid ounce aluminum foil tube component, 1/2 pint aluminum can "touch-up" kit CHO-SHIELD 596 CHO-SHIELD 4994 CHO-SHIELD 604 CHO-SHIELD 2001* CHO-SHIELD 2002* CHO-SHIELD 2003* CHO-BOND CHO-BOND CHO-BOND TECKNIT 8116 CHO-BOND CHO-BOND fluid ounce SEMCO cartridge component, 1 pint aluminum can kit component, 4 ounce polypropylene kit component, 1 quart aluminum can kit component, 8 ounce polypropylene kit component, 1/2 pint aluminum can kit component, 1/2 pint aluminum can "touch-up" kit component, 1 pint aluminum can kit component, 1 quart aluminum can kit component, 1/2 pint aluminum can kit component, 1/2 pint aluminum can "touch-up" kit CHO-BOND 1029 te: See Technical Data Sheet for packaging details component, 1 pint aluminum can kit component, 1 quart aluminum can kit te: See Technical Data Sheet for packaging details * Requires the use of 1091 Primer. continued on next page...

6 Sealants/Gap Fillers - Ordering Information Primer - Ordering Information CHO-BOND 4660 CHO-BOND 4669 Part. Primer Included fluid ounce aluminum foil tube gallon fiber cartridge fluid ounce aluminum foil tube gallon fiber cartridge TECKNIT fluid ounce aluminum foil tube TECKNIT pint aluminum can CHO-BOND 2165* CHO-BOND 1016 CHO-BOND component,.5 pint aluminum can kit component, 1 quart aluminum can kit fluid ounce aluminum foil tube fluid ounce SEMCO cartridge fluid ounce aluminum foil tube fluid ounce aluminum foil tube fluid ounce SEMCO cartridge fluid ounce SEMCO cartridge fluid ounce SEMCO cartridge CHO-BOND fluid ounce SEMCO cartridge CHO-BOND 1075 CHO-BOND 1035 te: See Technical Data Sheet for packaging details * Requires the use of 1091 Primer fluid ounce aluminum foil tube fluid ounce aluminum foil tube fluid ounce SEMCO cartridge fluid ounce aluminum foil tube fluid ounce aluminum foil tube fluid ounce SEMCO cartridge Part. CHO-BOND pint can CHO-BOND 1086 CHO-SHIELD dram glass vial fluid ounce glass bottle pint can fluid ounce glass bottle fluid ounce plastic bottle te: Primers are applied to the substrate prior to application of the conductive material. In no instance is the primer to be mixed into the conductive material. Conductive Grease - Ordering Information CHO-LUBE 4220 Part fluid ounce foil tube fluid ounce SEMCO cartridge te: See Technical Data Sheet for packaging details

7 NOTES: 1. Properties listed are for products prepared at the elevated cure schedule. Test Methods: Gravity, , , QAP-1101F; Volume Resistivity, , , , ; Surface Resistance, ; Lap Shear, These specifications are available from. Copies are available upon request. 2. The recommended thickness may vary from application to application. Please use the published data a preliminary guideline. Contact Application Engineering for assistance. 3. Compound shelf life is established at storage conditions from date of manufacture. All compounds are shipped from Parker with a minimum 80% shelf life. 4. Volatile Organic Content (VOC) values are theoretical approximations calculated from the characteristics of the individual components of the product formulation. 5. Material is sufficiently cured after 24 hours for handling purposes. Full specification properties are developed after time given. Worldwide Corporate Facilities To Place an Order Please Contact a Customer Service Representative at the Following Locations rth America Division Headquarters Woburn, MA Phone Fax chomailbox@parker.com Europe High Wycombe, UK Phone Fax chomerics_europe@parker.com Saint Ouen l Aumône, France Phone Fax Asia Pacific Shanghai PRC Phone Fax Shenzhen Phone Fax Shah Alam, Selangor, Malaysia Phone Fax Chennai India Phone Manufacturing Facilities Woburn, MA; Hudson, NH; Cranford, NJ ; Millville, NJ; Fairport, NY; Monterrey, Mexico; Grantham, UK; Shanghai; Sadska, Czech Republic; Shenzhen; PRC; Chennai, India. CHOMERICS, TECKNIT, CHO-BOND, CHO-LUBE, and CHO-SHIELD are registered trademarks of Parker Hannifin Corporation Parker Hannifin Corporation. All rights reserved. SG 1003 EN February 2016