Surface tension and density of liquid Ag-Cu alloys

Transcription

1 Foundry Research Insttute Surface tenson and densty of lqud Ag-Cu alloys Przemyslaw Fma 1,2 and Natala Sobczak Center for Hgh Temperature Studes, Foundry Research Insttute, Krakow 2 - Insttute of Metallurgy and Materals Scence PAS, Krakow E-mal: nmfma@mm-pan.krakow.pl

2 Presentaton plan Introducton Results for pure Ag Results for Ag-Cu alloys Densty and molar volume Surface tenson Modellng of the surface tenson Summary

3 Introducton Ag-Cu system: A subsystem of ternary and multcomponent solders Ag-Cu-Sn Ag-Cu-Sn-In A braze alloy for jonng of metals and ceramcs Ag-Cu Ag-Cu-T

4 Introducton Investgated by a few groups: relatvely good agreement of densty data some dfferences n surface tenson data Author (Year) Densty Surface tenson Krause et al. (1929) + + Brcard et al. (1973) + Sebo et al. (1977) + + Lee et al. (2004) + Novakovc et al. (2005) + Kucharsk et al. (2006) + + Brllo et al. (2006) +

5 Expermental procedure Materals: Ag (5N), X(Cu): 0.3; 0.4; 0.5 Sessle drop method Ar (6N) protectve gas K, temperature decreasng stepwse Hold tme 10 mn Surface tenson calculated wth AstraVew, developed by CNR-IENI, Genoa, Italy N. Sobczak et al. Mater Sc Eng A495 (2008) 43

6 Surface tenson measurement capture the mage 2. change the mage nto a set of coordnates 3. ft the soluton of Laplace equaton to coordnates Rotenberg et al., J Collod Interf Sc 93 (1983) 169

7 Ag (pure) - densty ρ L ρ T Temperature (g cm -3 ) (g cm -3 K -1 Method Atmosphere ) (K) Year A A A N MBP H A MBP Ar MBP Ar SD Ar A N % H A SD Ar, H MBP Ar + 10% H SD Ar EML He + 8% H SD Ar A Archmedean prncple, EML electromagnetc levtaton, MBP maxmum bubble pressure, SD sessle drop method

8 Ag (pure) - densty 9,4 9,3 Densty y, g cm -3 9,2 9,1 9,0 8,9 Brllo et al. (EML) Gasor et al. (MBP) Kucharsk et al. (SD) Ths work (SD) 8, Temperature, K

9 Ag (pure) surface tenson ρ L σ T Temperature (mn m -1 ) (mn m -1 K -1 Method Atmosphere ) (K) Year SD Vac MBP MBP MBP H MBP H MBP SD Vac SD Ar SD He SD He SD Ar, H EML Ar, H MBP Ar + 10% H SD Ar + 10% H SD Ar SD Ar EML Ar + 5% H SD Ar

10 Ag (pure) surface tenson Surface tens son, mn m Mlls and Su (revew) 850 Ths work (SD) Temperature, K

11 Ag-Cu alloys - densty Densty y, g cm Ag (pure) X(Cu) = 0.3 X(Cu) = 0.4 X(Cu) = Temperature, K

12 Ag-Cu alloys molar volume Molar volum me, cm 3 mol K Krause and Sauerwald (A) Sebo et al. (SD) Brllo et al. (EML) Kucharsk et al. (SD) Ths work (SD) X(Cu)

13 Ag-Cu alloys surface tenson Surface tens son, mn m Ag (pure) X(Cu) = 0.3 X(Cu) = 0.4 X(Cu) = Tempeature, K

14 Modellng of the surface tenson The Butler equaton σ = σ + RT A ln x x ( s) 1 A ( Ex( s) Ex G G ) The partal Gbbs free energy of the component G Ex ( ) 2[ ( ) ( ) ( ) ( 3 ) ( )( 5 )...] x L + L x x + L x x x x + = j j j j j j j G Ex( s) = β G Ex Parameters L from COST 531 thermodynamc database

15 Modellng of the surface tenson 1500 Surface tenson, mn m K Sebo et al. (SD) Kucharsk et al. (SD) Krause et al. (MBP) Brcard et al. (SD) Lee et al. (SD) Novakovc et al. (SD) Ths work (SD) X(Cu)

16 Modellng of the surface tenson X(Ag) n the surface layer X(Ag) n the bulk 1373 K 1573 K

17 Summary Our data for pure Ag agree well wth lterature data Densty of Ag-Cu alloys decreases wth ncreasng temperature and wth ncreasng concentraton of Cu Molar volume shows addtve behavor n the whole range of Ag-Cu compostons Surface tenson decreases wth temperature and ncreases wth Cu content, a small change of slope s observed There s a good agreement of expermental data wth surface tenson calculated wth the Butler equaton Surface layer of Ag-Cu soluton s enrched wth slver P. Fma, N. Sobczak (2010) Int J Thermophys, do: /s

18 Ths work was fnancally supported by the Mnstry of Scence and Hgher Educaton of Poland under the project no. PBZ/MNSW/07/2006/56, n the years Thank you for your attenton!

19 Ag-Cu alloys surface tenson 0 X(Cu) dσ/dt Ths work Kucharsk et al. Novakovc et al. -0.3

20 Modellng of the surface tenson 1400 Surface tens son, mn m K beta = 1 beta = X(Cu)

21 . 1 σ r1 1 + = g r ρ 2 ( h z) + C