FrelTec GmbH. Shielded SMD Power Inductors

Transcription

1 GmbH Mathildenstr. 10A Starnberg Germany 1/23/2014 1/11 GmbH

2 SPECIFICATION Part Number * 101 * M E0A ** Type Size Value Tolerance Packing 171 : Shielded SMD Power Inductor The value is given in µh and u indicates the decimal point. N: ±30% When higher than 100µH then l the last digit is the multiplier which denotes the number of Q: ±25% zero following Example: M: ±20% L01 : Embossed tape and reel for 1k pcs (13 reel) 3U3 : 3,3 µh 220 : 22 µh 151 : 150 µh * not all combination is possible 1/23/2014 2/11

3 Dimensions and land pattern: B PAD LAYOUT J A C H TYPE A (mm) B (mm) C (mm) H (Ref.) I (Ref.) J (Ref.) Quantity per reel Reel size ,3±0,2 7,8±0,5 3,2±0,2 2,8 1,5 5, " ,3±0,2 7,8±0,5 4,5±0,3 2,8 1,5 5, " Electrical Characteristics Part Number Inductance (H) Test Freq. (Hz) Series Specification DCR (mω) Saturation Current (A) Temp. Rise current (A) U2 2,2 u 100 K 18 4,50 4, U3 3,3 u 100 K 28 3,70 3, U7 4,7 u 100 K 35 3,30 3, U8 6,8 u 100 K 49 2,40 2, u 100 K 60 2,10 1, u 100 K 87 1,70 1, u 100 K 124,8 1,35 1, u 100 K 200 1,10 1, u 100 K 290 1,00 0, u 100 K 370 0,80 0, u 100 K 510 0,63 0, u 100 K 900 0,50 0, u 100 K ,43 0, u 100 K ,37 0, u 100 K ,30 0, u 100 K ,26 0, u 100 K ,22 0,20 1/23/2014 3/11

4 Part Number Inductance (H) Test Freq. (Hz) Series Specification DCR (mω) Saturation Current (A) Temp. Rise current (A) U3 3,3 u 100 K 22 4,00 3, U7 4,7 u 100 K 25 3,50 3, U8 6,8 u 100 K 34 2,80 2, u 100 K 39 2,60 2, u 100 K 54 2,10 2, u 100 K 95 1,50 1, u 100 K 120 1,35 1, u 100 K 213 1,10 1, u 100 K 288 0,95 0, u 100 K 398 0,72 0, u 100 K 554 0,63 0, u 100 K 838 0,50 0, u 100 K ,40 0, u 100 K ,35 0, u 100 K ,28 0, u 100 K ,24 0,23 NOTE:The operating temperature range is -40 C to +125 C Tolerance M:±20%,N:±25%,Y:±30% Irms:The value of D.C current when the temperature rise is T 40 C.(Ta=25 C) 1/23/2014 4/11

5 Material list NO. ITEM MATREIAL 1 Drum core Ni-Zn Ferrite 2 Ring core Ni-Zn Ferrite 3 Wire Copper Wire 4 Electrode Electrode (top surface solder coating) Cu-Ni-Sn Sn-Cu 5 Adhesive Epoxy resin 1/23/2014 5/11

6 SPECIFICATION Tape And Reel Package E P 2 P 0 D W F B P 1 A In Accordance with EIA Size A B W F E P 1 P 2 P 0 D T 1 T ,70±0,1 8,10±0,1 16,0±0,3 7,5±0,1 1,75±0,10 12,0±0,1 2,0±0,1 4,0±0,1 1,50+0,1/-0 3,30±0,1 0,35±0, ,70±0,1 8,10±0,1 16,0±0,3 7,5±0,1 1,75±0,10 12,0±0,1 2,0±0,1 4,0±0,1 1,50+0,1/-0 4,70±0,1 0,35±0,05 Lead Dimensions: Unfilled Area(Front) 200mm;Unfilled Area (Back) 300mm Cover Tape Peel off Strength Specifications: 0,01N~1,3 N Angle of between 165 and 180 degrees with the top of the carries tape. The cover tape, shall be pulled with a velocity of 300 mm ± 10 mm/ minute, relative to the carrier tape, during peeling, which results in the cover/carrier tape seal beling separated at a rate of 150 mm/minute. 1/23/2014 6/11

7 Symbol Dimension Reel Type / Tape A N C D B G T 330±2,0 90 Min 13,0±0,5 21,0±1,0 2,0±0,5 16,4 +0,1-0 20,4±0,4 in mm 1/23/2014 7/11

8 Stock period The performance of these products, including the solderability, is guaranteed for one year after production date code, provided that they remain packed as they were when delivered and stored at a temperature of 25 C ± 3 C and a relative humidity less than 80%RH Lead Free Reflow Soldering Profile by using lead-free solder paste The reflow condition recommended above is according to the machine used by our company. Big differences will arise as a result of the type of machine, reflow conditions, method, etc used. Hence, before setting up your reflow conditions, please confirm with the above. Head endurance test The test should be made under the conditions according to the chart, after the test it is kept for 2 hours under the normal temperature and humidity. The reflow test can be done twice, but the interval should be more than one hour under the normal conditions. 1/23/2014 8/11

9 Reliability Test Test Items Test Conditions Criteria Low temperature storage High temperature storage Thermal shock Humidity resistance Drop Vibration Terminal strength Soldering heat resistance Placed at -40 C for 500 hours, then measured at room ambient temperature after placing 24 hours. Placed at +125 C for 500 hours, then measured at room ambient temperature after placing 24 hours. Condition for 1 cycle: -40 C, 30min. ~ +125 C,30min. Number of cycles:5 Placed at 90 to 95%RH,+50 C for 500 hours, then measured at room ambient temperature after placing 24 hours. Drop specimen three times on concrete floor from a height of 1 meter which mounted on test board. Frequency: 10~55~10Hz Amplitude: 1.5mm or 10G Sweep time: 1oct/min Test Directions: X,Y,Z Test Time: 2 hours each direction Add static load 4,9N (500gf) to inductor through hole of test board for 10±2 sec. Dip inductor's terminal in solder bath of following conditions: 1) 260±5 C, 10±1sec, 2) 350±10 C, 3.5±0,5sec Insulation resistance>100mohm at DC No detachment of terminal pin and no breakage of wire. Appearance: No damage 1/23/2014 9/11

10 For this part: It does not use the materials that include the substances specified in RoHS, the detail refer to the part of prohibition or exclusion items in RoHS (2011/65/EC), Cadmium and cadmium compounds (permissive content<100 ppm) Lead and lead compounds (permissive content<1000 ppm) Exceptions specified: Lead contained in the glass of cathode ray tubes, electronic components and fluorescent tubes. The glass material used in the electronic components, which includes resistor elements, conductive pastes (silver or copper ones), adhesives, glass frit and sealing materials. Mercury and its mercury compounds (permissive content<1000 ppm) Hexavalent chromium compounds (permissive content<1000 ppm) Polybrominated biphenyls (PBB) (permissive content<1000 ppm) Polybrominated diphenylethers (PBDE) (permissive content<1000 ppm) 1/23/ /11

11 Published by GmbH Mathildenstr. 10A; Starnberg; Germany 2014 GmbH. All Rights Reserved. The following applies to all products named in this publication: 1. The information describes the type of component and shall not be considered as assured characteristics. 2. Terms of delivery and rights to change design reserved. 3. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. Nevertheless, we explicitly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether a product with the properties described in the product specification is suitable for use in a particular customer application. 4. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 5. The warnings, cautions and product-specific notes must be observed. 6. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous ). Useful information on this will be found in our Material Data Sheets. Should you have any more detailed questions, please contact our sales offices. 7. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true for the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. 8. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the General conditions for the supply of products and services of the electrical and electronics industry published by the German Electrical and Electronics Industry Association (ZVEI), available at 9. As far as patents or other rights of third parties are concerned, liability is only assumed for components per se, not for applications, processes and circuits implemented within components or assemblies. 10. The trade name is a trademark registered or pending in Europe and in other countries. 1/23/ /11