4.5x3.2x x2.5x x1.6x1.6

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1 hip ead ores Type: M Features ffective noise suppression for power lines and high speed signal lines asy pattern layout on P oard For fl ow soldering and refl ow soldering Type:, M ow D esistance to 8 m typical: ated current ( and 4 mperes) (type: M) ow impedance ecommended pplications Digital equipment such as Ps, word processors, print ers, HDD, P, D-OMs, DVD-OMs. Digital audio and video equipment such as Vs, DV, D Players, DVD Players. adapters, and switching power supplies. lectronic musical instruments, and other digital equipment. Type: High impedance for high speed signal line noise Increased attenuation 6 -, -.5 are achieved by using 68 size (type: P) Type: xplanation of Part Numbers U Product ode Type Part kind Size Form Suffix Noise Filter hip type ead core ode x.x.8.x.5x.6.x.6x.6 ode Packing U mbossed arrier Taping Feb. 6

2 onstruction Dimensions in mm (not to scale) W Ferrite core lectrode Type (inches) 45 (8) 5 () 6 (6) W H Mass (Weight) [mg/pc.] 4.5±.4.±..8±..5±. 5.8.±..5±..6±..5±. 6.5.±..6±..6±..5±. 7 Type: M xplanation of Part Numbers M 9 U Product ode Type Part kind Size Material Nominal Impedance Form Noise Filter Multilayer hip type ead core ode x.6 x..x.6 x.9.x.5x.9.6x.8 x.8 The first two digits are significant figure of impedance value and the third one denotes the number of zeros following ode U H Packing mbossed arrier Taping (M6 to ) mbossed arrier Taping (M45) onstruction Dimensions in mm (not to scale) e T Ferrite core W onductor lectrode Type (inches) M6 (6) M (85) M (6) M45 (86) W T e Mass (Weight) [mg/pc.].6±..8±..8±. (.4) 4.5.±..5±..9±. (.5).5.±..6±..9±. (.6).5 4.5±..6±..±. (.6) 6. Feb. 6

3 Type: xplanation of Part Numbers H Product ode Size Type haracteristics Nominal Impedance Form Suffix Noise Filter ode.6x.8x.8 Multilayer hip type ead ore P High frequency High attenuation for signal ines High frequency High attenuation for Power ines The first two digits are significant figure of impedance value and the third one denotes the number of zeros following ode Packing H mbossed arrier Taping onstruction Dimensions in mm (not to scale) Ferrite core e T W Inner onductor lectrode Type (inches) (6) P (6) W T e Mass (Weight) [mg/pc.].6±..8±..8±..± ±..8±..8±..± atings Type Part Number Impedance ated urrent D esistance ( ) at MHz tol.(%) (m D) ( ) max U U U M459H M68U 68. M9U ±5 68 M67U P6H 6.7 PH 5. H. 6H 6.8 H 5 Feb. 6

4 Impedance haracteristics (eference Data) Measured by HP49 : Impedance : esistance : eactance 45U (45),,( ) U (5),,( ) U (6) M67U (68),,( ) M9U (),,( ) M68U (6),,( ) ,,( ) M459H (456),,( ) Feb. 6

5 Impedance haracteristics (eference Data) Measured by HP49 : Impedance : esistance : eactance H (68) PH (68),,( ) ,,( ) 5 5 6H (68) P6H (68),,( ) ,,( ) 5 5 H (68),,( ) Feb. 6

6 Packaging Methods (Taping) Standard Quantity Part Number Kind of Taping Pitch (P ) Quantity 45U 5U 6U M459H M68U M9U M67U H mbossed arrier Taping 8 mm pcs./reel pcs./reel pcs./reel 4 mm 4 pcs./reel mbossed arrier Taping Taping eel T t Sprocket hole fd ompartment f F W f D f t P P P hip component Tape running direction f W t mbossed arrier Part Number W F P P P fd t t 45U.6±. 4.9±..±. 5.5±. 8.±..4 max. 5U.9±..6±. 8.±..5±. 6U.±..6±.. max. M459H.9±. 4.8±..±. 5.5±..75±. 4.±..±. 4.±..5±..±.5.8 max. M68U.9±..5±. M9U.5±..±. M67U.±..±. 8.±..5±..6 max. H.±..8±..5±.5 Standard eel Part Number f f f fd W T t 45U max. 5U 6U max. M459H ±..±.5.±.8.± max. M68U M9U M67U max. H.±.5 Feb. 6

7 ecommended Soldering onditions ecommendations and precautions are described below. Please contact us for additional information when used in conditions other than those specifi ed. Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use. The limit of resistance <ecommended reflow soldering temperature> to reflow soldering heat 7 Temperature of terminals ( ) ising temperature I Preheating ising temperature II Time (min.) Main heating Gradual cooling Temperature ( ) Time (s) 7 <epair with hand soldering> Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 5 or less. Solder each electrode for seconds or less. Never touch this product with the tip of a soldering iron. Safety Precautions Solder ising temperature I Preheating ising temperature II Main heating Gradual cooling For soldering (Sn-7Pb) For lead-free soldering (Sn-g-.5u) The normal time for preheating s to 6 s The normal time for preheating s to 6 s ecommended and Pattern Dimensions in mm (not to scale) (mm) Part Number 45U to 6 6 s to s 5 to 7 6 s to s efl ow soldering shall be performed a maximum of two times. Preheating to s to 4 s Preheating to s to 4 s 5± Peak Peak to to 4 /s to to 4 /s 5U U M459H.6 to 5.5 to 6.5. to.6 M68U.6 to 4 to 5. to.6 M9U.8 to. to 4 to. M67U.6 to to.8 to H.8 to to.6.8 to The following are precautions for individual products. Please also refer to the precautions common to MI Filters, Fuses, and Sensors(M lements) shown on page of this catalog.. With regard to fl ow soldering, consult with our sales person in advance.. Use rosin-based fl ux or halogen-free fl ux.. For cleaning, use an alcohol-based cleaning agent. efore using any other type, consult with our sales per son in advance. 4. Do not apply shock to hip ead ores (hereafter called the bead cores) or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, their bodies may be chipped, affecting their per for mance. xcessive mechanical stress may damage the bead cores. Handle with care. 5. Store the bead cores in a location with a temperature ranging from -5 to +4 and a rel a tive humidity of 4 % to 6 %, where there are no rapid changes in temperature or humidity. 6. Use the bead cores within a year ( Type: within half a year) after the date of the out go ing in spec tion indicated on the packages. Feb. 6

8 Safety Precautions (ommon precautions for MI Filters, Fuses, and Sensors[M lements]) When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject to change without prior notice. Do not use the products beyond the specifi cations described in this catalog. This catalog explains the quality and performance of the products as individual components. efore use, check and evaluate their operations when installed in your products. Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause the loss of human life or other signifi cant dam age, such as damage to vehicles (automobile, train, vessel), traffi c lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. Systems equipped with a protection circuit and a protection device Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a sin gle fault () Precautions for use These products are designed and manufactured for general and standard use in general elec tron ic equipment (e.g. V equipment, home electric appliances, offi ce equipment, information and communication equipment) These products are not intended for use in the following special conditions. efore using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used.. In liquid, such as water, oil, chemicals, or organic solvent. In direct sunlight, outdoors, or in dust. In salty air or air with a high concentration of corrosive gas, such as l, HS, NH, SO, or NO 4. lectric Static Discharge (SD) nvironment These components are sensitive to static electricity and can be damaged under static shock (SD). Please take measures to avoid any of these environments. Smaller components are more sensitive to SD environment. 5. lectromagnetic nvironment void any environment where strong electromagnetic waves exist. 6. In an environment where these products cause dew condensation 7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials These products generate Joule heat when energized. arefully position these products so that their heat will not affect the other components. arefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or infl ammables, such as vinyl-coated wires, near these products (except Thermal utoffs). Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the performance or reliability of the products. arefully select a fl ux cleaning agent for use after soldering. n unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. () Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of ar riv al at your company, provided that they remain packed as they were when delivered and stored at a tem per a ture of 5 to 5 and a relative humidity of 45 % to 85 %. (Micro hip Fuses: Guaranteed for 6 months from the date of arrival at your company) The performance of MI Filters is guaranteed for 6 months or a year from the out go ing inspection date indicated on the packages, provided that they are stored at a temperature of -5 to +4 and a relative humidity of 4 % to 6 %. heck the guarantee period in the specifi cations. The performance of Thermal ut offs is guaranteed for a year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of - to +4 and a relative humidity of % to 75 %. ven within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures.. In salty air or in air with a high concentration of corrosive gas, such as l, HS, NH, SO, or NO. In direct sunlight <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in nglish. Feb. 6