1.6 (.063) 0.2 (.008) 0.8 (.031) ±0.2 (.008) 0.8 (.031) ±0.2 (.008) 0.2 (.008) min 0.2 (.008) min

Transcription

1 NC SMD hermistors With Nickel Barrier ermination NB 21 - NB 23 Chip thermistors are high quality and low cost devices especially developed for surface mounting applications. hey are widely used for temperature compensation but can also achieve temperature control of printed circuits. A nickel barrier metallization provides outstanding qualities of solderability and enables this chip to meet the requirements of the most severe soldering processes. ypes NB 21 NB 23 IEC SIZE : 63 IEC SIZE : 42 DIMENSIONS: millimeters (inches) 1.6 (.63).2 (.8).8 (.31).8 (.31).2 (.8) min.2 (.8) min.4 ±.1 (.2 ±.4).6 (.24) max 1. ±.1 (.4 ±.4).25 (.1) min.25 (.1) min erminations Nickel Barrier Marking On packaging only Climatic category 4/125/56 Operating temperature -55 C to + C olerance on Rn (25 C) ±5%, ±1%, ±2% imum dissipation at 25 C.7 W.6 W hermal dissipation factor 1 mw/ C.8 mw/ C hermal time constant 4 s 3 s Resistance - emperature characteristics: pages 36 to 4. APPLICAIONS LCD compensation Battery packs Mobile phones CD players Heating systems Air-conditioning systems emperature control of Switch Mode Power Supplies Compensation of pressure sensors Protection of power transistors in various electronic circuits HOW O ORDER NB 21 K 13 M BB ype Material Code K (See tables page 15) Resistance 1, Ω olerance M (±2%) J (±5%) K (±1%) Suffix: Packaging : Bulk BB: Cardboard tape (18mm diam. reel) BF: Cardboard tape (1/2 reel) BD: Cardboard tape (33mm diam. reel) 14

2 NC SMD hermistors With Nickel Barrier ermination NB 21 - NB 23 ABLE OF VALUES ypes NB 21 IEC SIZE : 63 Rn at 25 C Material B (K) at 25 C (1) ± 5% (Ω) Code ( B/B (2) ± 3% ) (%/ C) NB 21 KC NB 21 KC 11 KC 347 ± 5% 3.9 NB 21 KC NB 21 MC 12 1, MC 391 ± 3% 4.4 NB 21 J 472 4,7 J 348 ± 3% 3.9 NB 21 J ,8 348 ± 3% 3.9 NB 21 J , J5 348 ± 3% 3.9 NB 21 K 13 1, NB 21 K , K 363 ± 3% 4. NB 21 L , L 379 ± 3% 4.2 NB 21 M , M 39 ± 3% 4.4 NB 21 M , NB 21 L , L2 385 ± 3% 4.1 NB 21 N , N 48 ± 3% 4.6 NB 21 N 5 14, N5 416 ± 3% 4.7 NB 21 P 154, P 422 ± 3% 4.7 NB 21 Q , Q 4 ± 3% 4.7 NB 21 Q , ypes NB 23 IEC SIZE : 42 Rn at 25 C Material B (K) at 25 C (1) ± 5% (Ω) Code ( B/B (2) ± 3% ) (%/ C) NB 23 NC 13 1, NC 48 ± 3% 4.6 NB 23 RC 13 1, RC 434 ± 3% 4.7 NB 23 NC , NB 23 NC , NC 48 ± 3% 4.6 NB 23 RC , NB 23 RC , RC 434 ± 3% 4.7 NB 23 NE , NE 4 ± 3% 4.6 NB 23 RC , NB 23 RC , RC 434 ± 3% 4.7 NB 23 RC 14, 15

3 Packaging for Automatic Insertion NC Chip hermistors / NC/NB Series AUOMAIC INSERION Super 8 Plastic ape Packaging: he mechanical and dimensional reel characteristics are in accordance with the IEC publication (.217) Cover ape B B1 3µ ± 5µ K R =.3 (.12). D A1 Hole P2 A +.2 (.8) 1 (.39) - P F E Direction of unreeling W Designation Symbol Value olerance ape width W 8 ±.2 ape thickness.4 max. Pitch of the sprocket holes P 4 ±.1 Diameter of the sprocket holes D 1.5 ±.1 - Distance E 1.75 ±.1 Distance (center to center) F 3.5 ±.5 Distance (center to center) P2 2 ±.1 Sizes of the NC 12 (85) A 1.5 ±.1 cavities B 2.4 ±.1 K 1.4 max. K ±.1 (size is adjustable) (K = t1 +.2) NC 2 (126) A 1.95 ±.1 B 3.55 ±.1 K 1.5 max. K ±.1 (size is adjustable) (K = t1 +.2) ø18 (7.9) (.79) ø 62 (2.44) ± 1.5 (.59) 14.4 (.567) max. 8.4 (.331) +.15 (.6) +.5 (.2) ø 2.5 (.87) +.15 (.6) ø (.2) according to ISO/DIS Direction of unreeling Bottom side Upper side QUANIY PER REEL ype Suffix Qty Per NC - NB 12 BA 4 BE NC 2 - NB 2 BA BE 16

4 Packaging for Automatic Insertion NC Chip hermistors / NC/NB Series AUOMAIC INSERION 8mm Paper ape Packaging: he mechanical and dimensional reel characteristics are in accordance with the IEC publication D P 2 P 1 PICHES CUMULAIVE OLERANCE ON APE.2mm (.8) E 1 BOOM COVER APE OP COVER APE B F E 2 W G 1 1 CAVIY SIZE SEE NOE 1 A CENER LINES OF CAVIY P 1 User Direction of Feed Designation Symbol Value olerance ape width W /+.3 ape thickness 1.1 max. Pitch of the sprocket holes P 4 ±.1 Diameter of the sprocket holes 1.5 D -/+.1 ±.1 Distance E ±.1 Distance (center to center) F 3.5 ±.5 Distance (center to center) P2 2 ±.5 Cover tape thickness 1.1 max. Distance E min. Distance G.75 min. Component pitch 85/63 4 ±.1 P ±.1 ø18 (7.9) (.79) ø 62 (2.44) ± 1.5 (.59) 14.4 (.567) max. 8.4 (.331) +.15 (.6) +.5 (.2) ø 2.5 (.87) +.15 (.6) ø (.2) according to ISO/DIS Direction of unreeling Bottom side Upper side QUANIY PER REEL ype Suffix Qty Per NB - NC 12 BB 4 NB 21 BF NB 23 BB BF 17

5 Surface Mounting Guide Chip hermistor Application Notes SORAGE Wave Good solderability is maintained for at least twelve months, provided the components are stored in their as received packaging at less than 4 C and 7% RH. Preheat Natural Cooling SOLDERABILIY / LEACHING erminations to be well soldered after immersion in a 6/4 tin/lead solder bath at 235 ± 5 C for 2 ± 1 seconds. erminations will resist leaching for at least the immersion times and conditions recommendations shown below. Solder emp. 23ºC to ºC P/N ermination Solder Solder Immersion ype in/lead emp ºC ime Seconds NC AgPdPt 6/4 26 ± 5 15 max NB Nickel Barrier 6/4 26 ± 5 3 ± 1 NB products are compatible with a wide range of soldering conditions consistent with good manufacturing practice for surface mount components. his includes Pb free reflow processes with peak temperatures up to 27ºC. Recommended profiles for reflow and wave soldering are shown below for reference. NC products are recommended for lead soldering application or gluing techniques. 1 to 2 min 3 sec. max (Preheat chips before soldering) /maximum C a) he visual standards used for evaluation of solder joints will need to be modified as lead free joints are not as bright as with tin-lead pastes and the fillet may not be as large. b) Resin color may darken slightly due to the increase in temperature required for the new pastes. c) Lead-free solder pastes do not allow the same self alignment as lead containing systems. Standard mounting pads are acceptable, but machine set up may need to be modified. Reflow D2 Solder emp. Preheat 22ºC to ºC Natural Cooling RECOMMENDED SOLDERING PAD LAYOU Dimensions in mm (inches) REFLOW SOLDERING D1 D3 D4 D5 emperature C 1min 1min (Minimize soldering time) 1 sec. max Pre-heating: C ±15 C / 6-9s. Peak Gradient: 2.5 C/s Peak emperature: 245 C ±5 C ime at >23 C: 4s. ime (s) Case Size P/N D1 D2 D3 D4 D5 42 NB (.67) (.24) (.2) (.24) (.2) 63 NB (.91) (.31) (.28) (.31) (.3) 85 NB (.118) (.39) (.39) (.39) (.49) 126 NB (.157) (.39) (.79) (.39) (.98) WAVE SOLDERING Case Size P/N D1 D2 D3 D4 D5 63 NB (.122) (.47) (.28) (.47) (.3) 85 NB (.157) (.59) (.39) (.59) (.49) 126 NB (.197) (.59) (.79) (.59) (.63) 18