Low Pressure Molding Overview. Henkel Electronics

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1 Low Pressure Molding Overview Henkel Electronics

2 Agenda 1 Technology 2 Process 3 Solutions 2

3 Agenda Low Pressure Molding Overview of Technology Definition Value Proposition Applications Processing Equipment Mold sets Parameters Products overview General Specialty Products 3

4 Solution Brief Description Low Pressure Molding Hot melt polyamide material designed for electronic components Its low pressure and high speeds are suitable for sensitive electronic components in manufacturing environments The technology allows for unique design beyond the Form-Fit-Function of traditional materials. Benefits Complete watertight encapsulation Temperature and solvent resistant materials UL 94-V0 rated Short cycle time Green technology No VOC and minimal waste Significantly Lowers TCOO 4

5 What is Molding? Molding = Low Pressure Injection Molding of Adhesives An environmentally-friendly process positioned between potting and injection molding technologies A process to over or partially mold components pre-inserted in a mold set, like PCBs, sensors, switches, batteries, connectors, etc. To protect them from environmental issues like moisture, temperature, chemicals, etc. Pressure Injection Molding Molding Cycle time Potting 5

6 A Sustainable Solution ü High performance polyamide hotmelts ü Solvent free, no safety labels ü 80% of raw materials are based on renewables (vegetable oils) ü No harmful fumes from the molding process ü Long shelf life (2+ years) ü RoHS and REACH complaint 6

7 Low Pressure Molding Technology Value Proposition Electrical Insulation Contact Strain Relief Vibration Corrosion Waterproof Environmental Influences 7

8 LPM typical Applications Encapsulating, sealing & protecting electronic assembly Sealing connectors and providing strain relief Switches, automotive electronic and medical sensors LED Lighting 8

9 Agenda 1 Technology 2 Process 3 Solutions 9

10 Application Development Solution Equipment Mold Design Application Engineering Water proof Low Capital Less Weight Product Design Input Chemical Resistant Fast Cycle time Smaller Footprint Material Experience Impact & Vibration Minimal Footprint Design Flexibility Process Optimization Strain Relief Versatility Prototyping Versatile Sustainable Form, Fit & Function Reliable Partnerships with Equipment Vendors to Support Development 10

11 Low Pressure Molding Process Insert Electronics Over-mold sec Ready to handle & test 11

12 Equipment Partners Supply Molding Product Customer Supply System Hotmelt Adhesives Technical Support Molding Machines Mold Sets Melting Unit Supplier Supply Melting Unit 12

13 Examples of Automated Molding Machines Process Flow of Applications are Developed 13

14 Mold Tools Material Usually aluminum Lower mold-half Easy to mill, drill and etch Good release of the molded pieces Steel inserts recommended in contact areas with harder metal parts Upper mold-half Runner & Gate Cavity Lifetime Very long, as is not abrasive nor corrosive 14

15 Process Conditions Pressure & Temperature Injection temperature (Deg C) Injection Pressure (bar) Engineering PA: PA6, PA66, PA11 Low Pressure Molding Traditional Plastic Injection Molding 15

16 Process Conditions Temperature & Injection Time Temperature Profile during Injection, Typical Un-encapsulated Injection temperature: 425 F, mold-set temperature: 70 F Cylindrical overmold of PCB: 0.5 dia by 2.5 long C C C Degrees F C Encapsulated in C C Temperature on PCB Seconds Temperature 1mm from surface Workpiece Filled (size dependency ex. USB stick) Overmolding with shows no adverse affects in solder joint reliability 16

17 Process Overview & Comparisons Traditional Potting Process Flow Mold Plastic Housing Parts to Assembly Insert Electronics Parts Preheating Potting Dispense Vacuum or Settle Oven Cure Parts for Test Low Pressure Molding Process Insert Parts Over Mold (LPM) Parts ready for Test 17

18 Cost Savings Calculator Application Case History Potted Water Sensor: Cylinderical part with mounting tabs and exiting cables Dimensions ~ 35 mm, height ~ 15 mm Process Steps Material Consumption Throughput Cost Savings Potting PCB in housing Dispense Cure Lid attach Secure lid LPM Insert into mold set and mold Potting Density =1.06 g/cc 58 cc empty space 65 grams potting material required LPM 11 grams/shot Potting One shift capacity (5 days x 8 hours) = 300,000 pts/yr LPM One shift capacity = 405,000 pts/yr Potting Cost of potted part = $0.97/pt LPM Cost of molded part = $0.78/pt Total Savings > 25% material cost savings Per YEAR 18

19 Low Pressure Molding Benefits Cost Savings Molds Skylining No cure Time Savings Fast cycle times Simple and clean process Minimal maintenance Production Space Savings Decreased equipment footprint 19

20 Colors Henkel s standard colors are amber or black Via colored master batches you can achieve almost every color you need 20

21 Printing It s possible to print a marking directly onto the molded assembly Pad printing Laser printing 21

22 Agenda 1 Technology 2 Process 3 Solutions 22

23 Material Properties Molding Temperature resistance, short term exposure <= 185 C Flexibility, Elongation at rupture <= 800 % Cold flexibility >= -50 C Good chemical resistance related to automotive fluids, short term exposure. Good chemical resistance regarding non-polar liquids like oil, long term exposure. Water absorption 0.2 to 2.0 %, 24 h at 22 C Flame retardant properties UL-listing, mainly UL 94 V-0 and RTI certified 23

24 Technology Overview Molding Resins Thermoplastic materials, UL 94 V-0 Naturally occurring raw materials No toxic fumes due to cure Application viscosity from 1,000 10,000 cps Application Pressure from 20 to 500 psi Performance temperatures from -40 C to 170 C Excellent adhesive properties to variety of substrates Amber, Black, White and Transparent material solutions 24

25 Product Review Product PA 633/638 PA 641/646 PA 652/657 PA 673/678 PA 6208/6208 BLACK Key Property Generalist product High Strength & hardness High Adhesion & cold flexibility High working Temp Outdoor performance (f2) Working Temp. -40 to 130 o C -40 to 130 o C -40 to 100 o C -40 to 140 o C -40 to 100 o C Hardness A 90 A 92 A 77 A A Strength 5.2 N/mm2 11 N/mm2 2.7 N/mm2 5.7 N/mm2 3.4 N/mm2 Specialty products: PA 648: Improved UV resistance PA 341: Blaze orange color for Electric vehicles PA 658: Hydrolysis resistant for improved 85/85 performance PA 2384: Increased hardness and improved alcohol resistance PA 668: UV Stabilized White for LED applications. PA 2692: High Temperature, 150 C Subgroup into market areas. LED/light (PA 668, PA 648, AS 4226) Industrial Components UV exposure (PA 6208 BLACK, PA 648, PA 649, PA 6344) Automotive/Sensors (PA 341, PA 658, PA 2384, PA

26 Henkel Innovations White Polyamide PA 668 PA 668 white Properties UV stabilised Good mechanical properties Suitable for LED applications -40 up to 105 C UV resistance, does not yellow over time 26

27 Henkel Innovations Solvent/Chemical resistant PA 2384 PA 2384 is a solvent and chemically resistant material Polar solvent and hydrocarbon resistant High hardness High operating temperature PA 6208 vs PA 2384 mechanicals before and after IPA exposure 7 Day Submersion Test 8 Week Submersion Test IPA treated Treated Not treated Not treated 13.61g 27

28 Thermally Conductive Under Development Q3/2015 Project Goal: Develop higher Thermal Conductive Standard resin is insulating with ~ 0.2 W/mK TCTM to allow heat transfer through molded encapsulate Targeting formulas with > 0.5 W/mK, > 0.7 W/mK, and > 1 W/mK performance Allows for heat dissipation through the molded encapsulant layer 28

29 Thank you!

30 Products Low Pressure Molding for CBP Low Pressure Molding High Temperature Resistance Adhesion to Plastics Increased Hardness Solvent Resistant UV Resistant Amber Black Amber Black Blaze Orange Amber Black Amber White Black PA 673 PA 678 PA 633 PA 638 PA 341 PA 641 PA 646 PA 2384 PA 668 PA 6344 PA 682 PA 687 PA 652 PA 657 PA 2692 PA 6208 PA 6208 BLACK 30