Solder paste for transfer soldering NT2 Series

Transcription

1 #49002E Solder paste for transfer soldering Product information This product information has been prepared with the cooperation of Fuji Machine Mfg. Co., Ltd. This product information contains product performance assessed strictly according to our own test procedure and may not be compatible with results at end-users.

2 2 Product features Solder alloy composition is Sn3.0Ag0.5Cu. Specially designed for applications of PoP process. Enables CONSISTENT transfer of solder paste onto the component solder bumps Designed for nitrogen reflow process (below 200ppm O₂O density) Halogen FREE(Cl + Br:0ppm 0ppm) BS EN14582

3 3 Product features Comparison: solder paste vs. soldering flux The biggest advantage of using solder paste in transfer soldering is the capability to prevent the occurrence of incomplete merger. Reflow simulation showed that soldering flux is not a perfect solution as it gave in easily to joint failure due to component warpage. In contrast, inherent viscosity and cohesive properties of solder paste work to fill the gap between the component and the board while being heated, and bind them together when processed in the reflow oven. 25ºC 180ºC 219ºC 230ºC Solder paste Soldering flux Incomplete merger * Red line: level of the board / Blue line: initial height of the component

4 4 Application Transfer soldering Product S3X70-NT2 S3X811-NT2 S3X812-NT2 Composition (%) Sn96.5Ag3.0Cu0.5 Alloy Flux Product Melting point (ºC) Particle size (µm) * 3 ( ppm) 0 Flux type* 4 ROL0 Flux content (%) 20.2± ± ±1.0 Viscosity* 1 ( Pa.S) 25±10 Copper plate corrosion* 2 Passed Tack time >72hours Shelf life (below 10ºC) Jar Syringe : 3 months : 1 month 1. Viscosity: Malcom spiral viscometer, PCU-205 at 25ºC 10rpm 2. Copper plate corrosion: In accordance with IPC J-STD-004A 3. :: According to IPC J-STD-004A / BS EN Flux type: According to IPC J-STD-004A

5 5 Alloy selections S3X812 NT 2 Alloy composition Particle size Flux type Flux number Alloy composition (%) Particle size (µm) Flux type S3X: Sn96.5-Ag3.0-Cu0.5 70: : : 1-20 NT:N₂ use / Stamping application Flux number Solids and solvent used

6 6 Test condition Solder paste : S3X812-NT2 Stamping module : Fuji Machine Mfg. Co., Ltd. NXTⅡ Squeegee speed : 80rpm time : 6 hours continuously Rotary tray Time 0 hour 4 hours 6 hours State Ensures consistent rheology and state even after 6 hours of smoothening.

7 7 Test condition Solder paste : S3X812-NT2 BGA : 0.20mm pitch, bump diameter 0.135mm, height of bump 0.10mm Stamping module : Fuji Machine Mfg. Co., Ltd. NXTⅡ Squeegee speed : 80rpm time : 6 hours continuously Stamping depth : 50 µm Conventional product Particle size 5-20µm Time 0 hour 4 hours 6 hours State Finer particle size resulted in quality transfer state. It retained consistent transfer properties even after continual 6-hour smoothening.

8 8 - Height Test condition Solder paste : S3X812-NT2 BGA : 0.20mm pitch, bump diameter 0.135mm, height of bump 0.10mm Stamping module : Fuji Machine Mfg. Co., Ltd. NXTⅡ Squeegee speed : 80rpm time : 6 hours continuously Stamping depth : 50µm Height of solder 転写高さ paste (μm) transferred (mm) Squeegee ローリング時間 time (hr) Height Transfer height remained stable and consistent even after continual 6-hour smoothening.

9 9 Test condition Solder paste : S3X812-NT2 BGA : 0.20mm pitch, bump diameter.135mm, height of bump 0.10mm Stamping module : Fuji Machine Mfg. Co., Ltd. NXTⅡ Squeegee speed : 80rpm Stamping depth : 50µm 250 Reflow machine : 5 pre-heat zones + 2 peak zones 200 Reflow profile : As shown 150 Atmosphere : N 2 (O 2 density below 200ppm) 100 Temp. 温度 ( ( ) C) Time 時間 (Sec.) (sec) Appearance Cross section Intermetallic compound Solder joint 4.08um Quality solder joint was formed.

10 10 Test method : A: IPC-TM B: BS EN14582 Measurement instrument : ICS-1500 (DIONEX) AQF-100 (MITSUBISHI CHEMICAL ANALYTECH) (wt%) Method A B Cl ND ND Br ND ND None of the above halide substances were detected.

11 11 Test condition : 85±2ºC 85±2%RH for 1008 hours Stencil thickness : 100 µm Comb type electrode : JIS type-ii Measurement voltage : DC100V Voltage applied : DC50V Test method : JIS Z 3197 Insulation resistance (Ω) 1.00E E E E E E E E E E+07 SIR GRAPH Time (hour)

12 12 Recommended reflow profile (ºC) Pre-heat temp. 160~180ºC 120sec. Pre-heat temp. 110~160ºC 60sec. Peak temp. 230~250ºC Over 220ºC > 30 sec. 50 Ramp-up temp. 1.0~3.0ºC/sec. O 2 density: < 200ppm(S3X812-NT2) (sec.) Lower limit: 140~180ºC 60sec Upper limit: 190~200ºC-120sec This product is designed exclusively for reflow processing in N 2 environment, with O 2 density of below 200ppm. Excessive pre-heating (time & temp.) may cause too much oxidation. Perform sufficient test-runs to obtain optimal parameters before volume production.

13 13 1. Soaking depth : 40 ~ 60% of BGA bump 2. Minimum bump height : S3X70-NT2 > 450µm : S3X811-NT2 >300µm : S3X812-NT2 >100µm 3. Rolling Temperature Humidity : 22~25ºC : 40~60%RH 4. : 250g /Jar 100g / syringe 5. Shelf life 1) 0~10ºC (jar) : 3 months from manufacturing date 2) 0~10ºC (syringe) : 1 month from manufacturing date * Continual usage of 6 hours or shorter is recommended. Clean the dip tray every 6 hours. Caution: We are unable to ensure the shelf life of the solder paste when it is transferred from jar to other types containers such as syringes. In some cases, the constituents of the product might separate from each other during its shelf life, but product quality itself shall remain intact. When this happens, mix it well before use. * Manufacturing date can be obtained from the lot number (jar) ex. Lot No No. of lot : 2nd Date : 22nd Month : January Year : 2011 * Date of filling is indicated on the syringe. This product information contains product performance assessed strictly according to our own test procedures and may not be compatible with results at end-users.