TEST REPORT "INTEGRITY, HONESTY AND KNOWLEDGE" TEST RESULTS:

Transcription

1 TEST REPORT CLIENT: IPC Validation Services REFERENCE: IPC-4101D/130, IPC-TM , , 2.4.4, 2.4.8, , , , , , , , 2.5.1, , 2.5.6, , , , , UL94, Customer Technical Requirement TEST ITEM: SAMPLE: Peel Strength, Volume Resistivity, Surface Resistivity, Moisture Absorption, Dielectric Breakdown, Permittivity at 1 MHz, Loss Tangent at 1 MHz, Flexural Strength, Arc Resistance, Thermal Stress, Electric Strength, Flammability, Glass Transition Temperature and Cure Factor, Decomposition Temperature (Td), Glass Transition Temperature and Z- CTE (TMA), Time to Delamination (T260,T288,T300), Dimensional Stability, Solderability, Chemical Resistance, Metal Surfaces Cleanability, Pressure Cooker Test CCL/TU-862HF REPORT : 14749EG(Instead of 14749E) TEST RESULTS: The samples were tested by the indicated test methods within this report. Actual detailed test results are enclosed. (1 of 54) "INTEGRITY, HONESTY AND KNOWLEDGE" MICROTEK(CHANGZHOU)PRODUCT SERVICES CO., LTD NO.19 XINKE ROAD ELECTRONIC-TECHNOLOGY CHANGZHOU, JIANGSU, CHINA Tel: Fax: MCQD530-02(2014)

2 Test Results Test Item Thin Thick Peel Strength Pass Pass Volume Resistivity Pass Pass Surface Resistivity Pass Pass Moisture Absorption / Pass Dielectric Breakdown / Pass Permittivity at 1 MHz Pass Pass Loss Tangent at 1 MHz Pass Pass Flexural Strength / Pass Arc Resistance Pass Pass Thermal Stress Pass Pass Electric Strength Pass / Flammability Pass Pass Glass Transition Temperature and Cure Factor / Pass Decomposition Temperature (Td) / Pass Glass Transition Temperature and Z-CTE (TMA) / Pass Time to Delamination (T260,T288,T300) / Pass Dimensional Stability Pass Pass Solderability Pass Pass Chemical Resistance See test page See test page Metal Surfaces Cleanability / See test page Pressure Cooker Test / See test page MCQD530-02(2014) (Page 2 of 54)

3 SUBMISSION IDENTIFICATION The following sample(s) were submitted and confirmed by customer: Test s Submitted: , Designation Identification D/C Quantity CCL TU-862HF / Total 158 PCS CCL TU-862HF / 2 PCS Client: IPC Validation Services Address: 3000 Lakeside Drive Suite 105N Bannockburn, IL Attention: Mr. Randy Cherry Phone: MCQD530-02(2014) (Page 3 of 54)

4 s as received: Picture 1 TU-862HF (Thin) Peel Strength Picture 2 TU-862HF (Thick) Peel Strength Picture 3 TU-862HF (Thick) Moisture Absorption Picture 4 TU-862HF (Thick) Dielectric Breakdown Picture 5 TU-862HF (Thick) Flexural Strength Picture 6 TU-862HF (Thin) Electric Strength MCQD530-02(2014) (Page 4 of 54)

5 Picture7 TU-862HF (Thin) Permittivity and Loss Tangent Picture 9 TU-862HF (Thin) Thermal Stress Etched Picture 11 TU-862HF (Thin) Thermal Stress Unetched MCQD530-02(2014) Picture 8 TU-862HF (Thick) Permittivity and Loss Tangent Picture 10 TU-862HF (Thick) Thermal Stress Etched Picture 12 TU-862HF (Thick) Thermal Stress Unetched (Page 5 of 54)

6 Picture 13 TU-862HF (Thin) Flammability Picture 14 TU-862HF (Thick) Flammability Picture 15 TU-862HF (Thin) Solderability Picture 16 TU-862HF (Thick) Solderability Picture 17 TU-862HF (Thick) Metal Surfaces Cleanability MCQD530-02(2014) Picture 18 TU-862HF (Thick) Pressure Cooker Test (Page 6 of 54)

7 Picture 19 TU-862HF (Thick) Glass Transition Temperature and Cure Factor, Decomposition Temperature (Td) Glass Transition Temperature and Z-CTE (TMA), Time to Delamination (T260) Picture 20 TU-862HF (Thin) Dimensional Stability Picture 21 TU-862HF (Thick) Dimensional Stability Picture 22 TU-862HF (Thin) Other tests Picture 23 TU-862HF (Thick) Other tests MCQD530-02(2014) (Page 7 of 54)

8 Picture 24 TU-862HF (Thin) Peel Strength(As Received) Picture 25 TU-862HF (Thick) Peel Strength(As Received) MCQD530-02(2014) (Page 8 of 54)

9 Peel Strength SPECIMENS A minimum of two 0.79 mm and two 3.18mm test strips per specimen shall be peeled. REFERENCE IPC-TM-650 Method Peel Strength of Matallic Clad Laminates IPC-TM-650 Method Peel Strength of Matallic Clad Laminates at Elevated IPC-4101D Specification for Base Materials for Rigid and Multilayer Printed Boards Customer Technical Requirement METHOD/ REQUIREMENT Before testing the specimens need to be baked at 135 for 4h. As Rcecived Specimens have performing the peel test at room temperature. After Thermal Stress Apply a thin coating of silicon grease to specimens and float on solder maintained at 288 ± 5.5 for s. At Elevated Temperature Specimens shall be preconditioned by baking at 125 for 4h ± 0.5h, and then place the specimens to remain in the heated chamber for min before performing the peel test at 125. After Process Solution Immerse the samples in organic stripper as specified in Methylene Chloride for 75s ± 5s at 23 ± 2. Dry the samples 15min ± 5min at 125 ± 5. Immerse in a solution of 10 g/l sodium hydroxide at 90 ± 5 for 5min ± 1min. Rinse in hot tap water at 50 ~55 for 5min ± 1min. Immerse for 30min ± 5min in a solution of 10g/L sulfuric acid and 30g/L boric acid solutions at 60 ± 5. Rinse in hot water at 55 ± 5 for 5min ± 1min. Dry for 30min ± 5min at 125 ± 5. Immerse in a hot oil bath maintained at 220 ± 5 for 40s ± 5s. Immerse in degreaser as specified in isopropyl alcohol, at 23 ± 2 for 75s ± 5s to remove hot oil. MCQD530-02(2014) (9 of 54 )

10 Air dries the specimens. Examine the specimens using normal or corrected 20/20 vision. Record and report the presence of any base laminate degradation, including loss of surface resin, discoloration, resin softening, delamination, blistering, propagation of imperfections, measling, crazing, or voids. Peel the test strip back at the tab end (if present) no more than 12.7 mm. Attach the clamp to the peeled back end of the test strip. Start tester and apply force in the vertical direction at the rate of 50.8 mm/min, until at least a 25.4 mm peel is completed. Calculate the peel strength as per the formula: N/mm= L M /W S Where: L M = Minimum Load in N W S = Measured width of peel strip in mm RESULTS The samples were tested by the methods given above, the test results meet the requirements of IPC-4101D/130 standards. See attached test data sheets for actually test result. Table 1 Peel Strength(After Thermal Stress) Designation CCL Identification TU-862HF (Thin) Test Date Ambient 22, 51%RH Peel Strength (N/mm). A Crosswise A Lengthwise B Crosswise B Lengthwise Average Requirement MCQD530-02(2014) (10 of 54 )

11 Table 2 Peel Strength(After Thermal Stress) Designation CCL Identification TU-862HF (Thick) Test Date Ambient 22, 51%RH Peel Strength (N/mm). A Crosswise A Lengthwise B Crosswise B Lengthwise Average Requirement Table 3 Peel Strength(At Elevated Temperature) Designation CCL Identification TU-862HF (Thin) Test Date Ambient 21, 50%RH Peel Strength (N/mm). A Crosswise A Lengthwise B Crosswise B Lengthwise Average Requirement MCQD530-02(2014) (11 of 54 )

12 Table 4 Peel Strength(At Elevated Temperature) Designation CCL Identification TU-862HF (Thick) Test Date Ambient 21, 50%RH Peel Strength (N/mm). A Crosswise A Lengthwise B Crosswise B Lengthwise Average Requirement 0.70 Table 5 Peel Strength( After Process Solution ) Designation CCL Identification TU-862HF (Thin) Test Date Ambient 22, 51%RH Peel Strength (N/mm). A Crosswise A Lengthwise B Crosswise B Lengthwise Average Requirement MCQD530-02(2014) (12 of 54 )

13 Table 6 Peel Strength( After Process Solution ) Designation CCL Identification TU-862HF (Thick) Test Date Ambient 22, 51%RH Peel Strength (N/mm). A Crosswise A Lengthwise B Crosswise B Lengthwise Average Requirement 0.80 Table 7 Peel Strength( As Received Low Profile Copper Foil) Designation CCL Identification TU-862HF (Thin) Test Date Ambient 23, 52%RH Peel Strength (N/mm). A Crosswise A Lengthwise B Crosswise B Lengthwise Average Requirement MCQD530-02(2014) (13 of 54 )

14 Table 8 Peel Strength( As Received Low Profile Copper Foil) Designation CCL Identification TU-862HF (Thick) Test Date Ambient 23, 52%RH Peel Strength (N/mm). A Crosswise A Lengthwise B Crosswise B Lengthwise Average Requirement MCQD530-02(2014) (14 of 54 )

15 Volume and Surface Resistivity TEST SPECIMEN Laminate thickness of 0.50 mm or greater, three specimens of dimensions (101.6±3.2) mm x (101.6±3.2) mm by thickness shall be prepared for each test condition, unless otherwise specified. Laminate thickness of less than 0.50 mm, three specimens of dimensions (50.8±1.6) mm x (50.8±1.6) mm by thickness shall be prepared for each test condition, unless otherwise specified. REFERENCE IPC-4101D Specification for Base Materials for Rigid and Multilayer Printed Boards IPC-TM Volume and Surface Resistivity of Dielectric Materials Customer Technical Requirement METHOD/ REQUIREMENT Before testing the specimens need to be baked at 135 for 4h. Humidity Conditioning Specimens of a thickness less than 0.50 mm shall be subjected to % relative humidity and 35 ±2 for a period of hours prior to electrical measurement. Specimens of a thickness greater than, or equal to 0.50 mm shall be subjected to 20 cycles of temperature ranging from to (65±2), 85% to 93% relative humidity, 160 hours total. Electrical measurements taken shall be made after achieving 1.5 hours steady state of (25±2) and % relative humidity. All measurements shall be completed within 2 hours. At Elevated Temperature Conditioning Specimens shall be subjected to the specified temperature for a period of hours. Unless otherwise specified, the temperature shall be (125±2). Electrical measurements taken shall be completed within the 2 hours tolerance of the conditioning. All electrical measurements shall be made using 500 volts direct current. The voltage shall be applied to the specimen for seconds prior to taking the actual reading. The volume resistivity shall be calculated as follows: r =RA/T Where: r = Volume resistivity in megohm-centimeters R = Measured volume resistance in megohms A = Effective area of the guarded electrode in square centimeters MCQD530-02(2014) (15 of 54 )

16 T = Average thickness of specimen in centimeters The surface resistivity shall be calculated as follows: r =R P/D4 Where: r = Surface resistivity in megohms R = Measured surface resistance in megohms P = Effective perimeter of the guarded electrode in centimeters D4 = Width of the test gap in centimeters RESULTS The samples were tested by the methods given above. The test results meet the requirements of IPC-4101D/130 standards. See attached test data sheets for actually test result. MCQD530-02(2014) (16 of 54 )

17 Table 9 Volume and Surface resistivity (Humidity Conditioning) Designation CCL Identification TU-862 HF (Thin) Test Date ~ Ambient 22, 50%RH. Average Thickness T Volume Resistance R Surface Resistance R ' Surface Resistivity r ' =R ' P/D 4 Volume Resistivity r=ra/t (cm) (MΩ) (MΩ) (MΩ) (MΩ-cm) E E E E E E E E E E E E+08 Average 1.2E E+08 Requirement Table 10 Volume and Surface resistivity (At Elevated Temperature) Designation CCL Identification TU-862 HF (Thin) Test Date ~ Ambient 23, 50%RH. Average Thickness T Volume Resistance R Surface Resistance R ' Surface Resistivity r ' =R ' P/D 4 Volume Resistivity r=ra/t (cm) (MΩ) (MΩ) (MΩ) (MΩ-cm) E E E E E E E E E E E E+10 Average 2.8E E+10 Requirement MCQD530-02(2014) (17 of 54 )

18 Table 11 Volume and Surface resistivity (Humidity Conditioning) Designation CCL Identification TU-862 HF (Thick) Test Date ~ Ambient 23, 51%RH. Average Thickness T Volume Resistance R Surface Resistance R ' Surface Resistivity r ' =R ' P/D 4 Volume Resistivity r=ra/t (cm) (MΩ) (MΩ) (MΩ) (MΩ-cm) E E E E E E E E E E E E+08 Average 2.9E E+08 Requirement Table 12 Volume and Surface resistivity (At Elevated Temperature) Designation CCL Identification TU-862 HF (Thick) Test Date ~ Ambient 23, 50%RH. Average Thickness T Volume Resistance R Surface Resistance R ' Surface Resistivity r ' =R ' P/D 4 Volume Resistivity r=ra/t (cm) (MΩ) (MΩ) (MΩ) (MΩ-cm) E E E E E E E E E E E E+10 Average 1.9E E+10 Requirement MCQD530-02(2014) (18 of 54 )

19 Moisture Absorption TEST SPECIMEN The specimens shall be (50.8±0.5) mm (50.8±0.5) mm by the thickness of the material. Edges shall be smooth. REFERENCE IPC-TM-650 Method Water Absorption, Metal Clad Plastic Laminates IPC-4101D Specification for Base Materials for Rigid and Multilayer Printed Boards Customer Technical Requirement METHOD/ REQUIREMENT Dry the specimens in oven for 4h at 135. Remove the specimens from the oven and immediately place in the desiccator to cool. The specimens shall be cleaned by at least three repeated wipings with a clean damp cloth. The specimens were preconditioned by baking for 1 hour, at 105 to 110, cooled to room temperature in a desiccator and weighed immediately upon removal from the desiccator. Record the weight m 1. Place the samples in the distilled water maintained at (23±1.1) for 24 hours minus 0 plus 30 minutes. The specimens shall be removed from the water one at a time, all surface water removed with a dry cloth and weighed immediately. Record the wet weight m 2. m2 m1 Increase in weight, percent= 100 m 1 RESULTS The sample was tested by the methods given above, the test results meet the requirement of IPC-4101D/130 standards. See attached test data sheet for actually test result. MCQD530-02(2014) (19 of 54 )

20 Designation Table13 Moisture Absorption CCL Identification TU-862 HF Test Date ~ Ambient 19,51%RH Sanple Nunber mass(g) m 1 m 2 increasing weight percent of mass(%) Average 0.11 Requirement 0.80 MCQD530-02(2014) (20 of 54 )

21 Dielectric Breakdown SPECIMENS 4 pcs specimens, prepared by the customer,uncharted lengthwise and crosswise.the dimensions is 76mm 50mm. REFERENCE IPC-4101D Specification for Base Materials for Rigid and Multilayer Printed Boards IPC-TM-650 Method Dielectric Breakdown Customer Technical Requirement METHOD/ REQUIREMENT Place the samples at 135 for 4h. Unless otherwise specified the specimen shall be conditioned for hours in distilled water maintained at 50 ± 2. Following this step the specimen shall be immersed in ambient temperature distilled water for 30 minutes minimum, 4 hours maximum, to allow the specimens to achieve temperature equilibrium without a substantial change in moisture content. Remove a preconditioned specimen from the ambient temperature water and wipe dry with a lint free paper towel. Insert the first specimen into the fixture (inserting the tapered pins from opposite sides) and immerse in the oil bath. The leakage current is 5mA. Operate the tester such that the voltage is applied with 500 volts per second rate of rise and observe the specimen until an electrical breakdown occurs. RESULTS The samples were tested by the methods given above, the test results meet the requirement of IPC-4101D/130 standards. See attached test data sheet for actually test result. MCQD530-02(2014) (21 of 54 )

22 Table 14 Dielectric Breakdown Designation CCL Test Date ~ Identification TU-862HF Ambient 22, 49%RH. Thickness Voltage (mm) (kv) ,NB ,NB ,NB ,NB Minimum Voltage 45 Requirement 40 MCQD530-02(2014) (22 of 54 )

23 Permittivity and Loss Tangent (1MHz) TEST SPECIMEN Three specimens shall be 50 mm 50mm by the thickness of the material. REFERENCE IPC-TM-650 Method Permittivity and Loss Tangent, Parallel Plate,1MHz to 1.5 GHz IPC-4101D Specification for Base Materials for Rigid and Multilayer Printed Boards Customer Technical Requirement METHOD/ REQUIREMENT Dry the specimens in oven for 4h at 135. Remove the specimens from the oven and immediately place in the desiccator to cool. The specimens were preconditioned by baking for 2 h, at 105, cooled to room temperature. All samples shall be conditioned at 23 ±2 and 50% RH±5%RH for a minimum of 24h prior to testing. Measure the sample thickness. The samples were tested by impedance material analyzer. The samples were tested at 1MHz. RESULTS The sample was tested by the methods given above, the test results meet the requirement of IPC 4101D/130. See attached test data sheet for actually test result. MCQD530-02(2014) (23 of 54 )

24 Designation Table15 Permittivity and loss tangent CCL Identification TU-862HF Test Date ~ Ambient 21,48%RH Sanple Nunber test frequency thickness(mm) permittivity loss tangent MHz Average Requirement MHz Average Requirement MCQD530-02(2014) (24 of 54 )

25 Flexural Strength TEST SPECIMEN Dimensions of the specimens shall be 76.2mm 25.4mm.Two specimens shall be taken for each direction for lengthwise and crosswise direction of the sample tested. REFERENCE IPC-TM Flexural Strength of Laminates (at Ambient Temperature) IPC-4101D Specification for Base Materials for Rigid and Multilayer Printed Boards Customer Technical Requirement METHOD/ REQUIREMENT Before testing the specimens need to be baked at 135 for 4h. At Ambient Temperature Test the specimens at ambient temperature. Center the specimen on the supports with the long axis of the specimen perpendicular to the loading nose and supports and stabilize at elevated temperature, then apply the load at the speed of testing until the specimen breaks. Test speed is 0.76mm/min. Calculate the flexural strength for each specimen: 3PL S 2 2bd S = Flexural strength, N/mm 2 ; P = Load at breakage, N; L = Span, mm; b= Width of specimen, mm; d= Thickness, mm RESULTS The samples were tested by the methods given above, the test results meet the requirement of IPC-4101D/130 standards. See attached test data sheet for actually test result. MCQD530-02(2014) (25 of 54 )

26 Table 16 Flexural Strength Test (At Ambient Temperature) Designation Test Date CCL Identification TU-862HF Ambient 22, 50%RH. Span Load Width Thickness L P b d Flexural Strength Average Requirement S=3PL/2bd 2 (mm) (N) (mm) (mm) (N/mm 2 ) (N/mm 2 ) (N/mm 2 ) (Length Direction) (Length Direction) (Cross Direction) (Cross Direction) MCQD530-02(2014) (26 of 54 )

27 Arc Resistance SPECIMENS Three specimens shall be 76mm 50mm. Material under 1.5mm in thickness shall be built up to provide a specimen at least 1.5mm,but not exceeding 3.2mm. REFERENCE IPC-4101D Specification for Base Materials for Rigid and Multilayer Printed Boards IPC-TM-650 Method Arc Resistance of Printed Wiring Material Customer Technical Requirement METHOD/ REQUIREMENT Place the samples at 135 for 4h. Unless otherwise specified the specimens shall be conditioned for hours in distilled water maintained at 50 ± 2. Following this step the specimens shall be immersed in ambient temperature distilled water for 30 minutes minimum, 4 hours maximum, to allow them to reach temperature equilibrium without loss of moisture.the test shall be run at ambient temperature 23 ± 5 and ambient humidity.remove a preconditioned specimen from the ambient temperature distilled water and wipe dry with a lint free paper towel. Place a specimen (individual or built up) in the electrode fixture. Operate the tester in accordance with the manufacturer s instructions such that an arc is generated and automatically switched as indicated below. Observe the arc carefully and, at the point which the arc disappears and tracking occurs, stop the timer and record the time for the specimen to the nearest second.remove the specimen, remove and clean the electrodes thoroughly using a solvent and if necessary the crocus cloth.replace the electrode and check the electrode gap. RESULTS The samples were tested by the methods given above, the test results meet the requirement of IPC-4101D/130 standards.see attached test data sheet for actually test result. Table 17 Arc Resistance Designation CCL Test Date ~ Identification TU-862 HF Ambient 22, 49%RH. Thickness Times Average Requirement (mm) (s) (s) (s) > >180 > > > >180 > >180 MCQD530-02(2014) (27 of 54 )

28 Thermal Stress TEST SPECIMENS Specimens shall be (50.8±0.75) mm (50.8±0.75) mm by the thickness of the laminate. Metallic clad laminate shall include specimens which are completely clad and fully etched. REFERENCE IPC-4101D Specification for Base Materials for Rigid and Multilayer Printed Boards IPC-TM-650 Method Thermal Stress of Laminates Customer Technical Requirement METHOD/ REQUIREMENT Before testing the specimens need to be baked at 135 for 4h. Place the sample in a 125 ±2 aircirculation oven for (4~6) h then take samples out from oven in to a dryer and cool to ambient temperature. Take sample into a 288 solder bath to perform a solder float for 10s within 10min. This is for check whether there is any blistering, delamination or other damage. RESULTS The samples were tested by the methods given above. obvious blister, delamination or other damage. The test results meet the requirements of IPC-4101D/130 standards. See attached test data sheets for actually test result. MCQD530-02(2014) (28 of 54 )

29 Table18 Thermal Stress Designation Identification CCL Test Date TU-862 HF Ambient 22, 49%RH. Test result obvious blister, delamination or other damage A surface obvious blister, delamination or other damage Thin obvious blister, delamination or other damage obvious blister, delamination or other damage B surface obvious blister, delamination or other damage Etched obvious blister, delamination or other damage obvious blister, delamination or other damage A surface obvious blister, delamination or other damage Thick obvious blister, delamination or other damage obvious blister, delamination or other damage B surface obvious blister, delamination or other damage obvious blister, delamination or other damage obvious blister, delamination or other damage A surface obvious blister, delamination or other damage Thin obvious blister, delamination or other damage obvious blister, delamination or other damage B surface obvious blister, delamination or other damage Unetched obvious blister, delamination or other damage obvious blister, delamination or other damage A surface obvious blister, delamination or other damage Thick obvious blister, delamination or other damage obvious blister, delamination or other damage B surface obvious blister, delamination or other damage obvious blister, delamination or other damage MCQD530-02(2014) (29 of 54 )

30 Picture Thin Picture Thick After the test (Etched) Picture Thin Picture Thick After the test (Unetched) MCQD530-02(2014) (30 of 54 )

31 Electric Strength SPECIMENS Three specimens should be (100 ±25)mm (100 ±25)mm. REFERENCE IPC-4101D Specification for Base Materials for Rigid and Multilayer Printed Boards IPC-TM-650 Method Electric Strength Customer Technical Requirement METHOD/ REQUIREMENT Place the samples at 135 for 4h. Unless otherwise specified, the specimen shall be conditioned for hours in distilled water maintained at 50 ± 2. Following this the specimen shall be immersed in the ambient temperature distilled water for 30 minutes minimum, 4 hours maximum, to achieve temperature equilibrium without significant changes in moisture content. The test should be performed at ambient temperature, 23 ± 5. Remove a reconditioned specimen from the ambient temperature water and wipe dry with a lint free paper towel. The leakage current is 5mA.Operate the tester such that the voltage is applied with 500 volts per second increase and observe the point at which the tester indicates a breakdown. RESULTS The samples were tested by the methods given above, the test results meet the requirement of IPC-4101D/130 standards. See attached test data sheet for actually test result. Table 19 Electric Strength Designation CCL Test Date ~ Identification TU-862 HF Ambient 22, 49%RH. Average Thickness (mm) Voltage (kv) Electric Strength (kv/mm) Average Requirement MCQD530-02(2014) (31 of 54 )

32 Vertical Burning Test; V-0, V-1 or V-2 TEST SPECIMEN Bar specimens measuring (125±5) mm long by (13±0.5) mm wide with the edges sanded smooth and the corners having a radius not exceeding 1.3 mm REFERENCE IPC-4101D Specification for Base Materials for Rigid and Multilayer Printed Boards UL94, Section 8 50W (20 mm) Vertical Burning Test; V-0, V-1, or V-2 Customer Technical Requirement METHOD/ REQUIREMENT Flammability V-0 V-1 Flaming combustion time after each application of the flame for each test specimen 10s 30s Total flaming combustion time for the 10 flame applications for each set of five specimens 50s 250s Glowing combustion time after the second removal of the test flame 30s 60s Afterflame or afterglow of any specimen up to the holding clamp ne ne Dripping flaming particles that ignite the tissue paper ne ne Before testing the specimens need to be baked at 135 for 4h. Five bar samples of condition B are conditioned at 125 for 24h and cooled in a desiccator for at least 4h. Five bar samples of condition A are conditioned at 23 ±2 and 50% ±5% relative humidity for a minimum of 48h. After conditioning, clamp the specimen from the upper 6 mm of the specimen with the longitudinal axis vertical. Apply the 20 mm ±1 mm high flame centrally to the middle point of the bottom edge of the specimen so that the top of the burner is (10 ±1) mm below that point of the lower end of the specimen. Maintain the flame at that distance for (10.0 ±0.5) seconds, immediately withdraw the burner and simultaneously commence measurement of the afterflame time. Record the after flame time (t1). Immediately place the burner again centrally under the specimen at a distance of (10 ±1) mm for an additional (10.0 ±0.5) seconds. After this second application of the flame to the specimen, immediately remove the burner and simultaneously commence the measurement of the after flame time (t 2 ) and the afterglow time (t 3 ) and record t 2 and t 3 in seconds. MCQD530-02(2014) (32 of 54 )

33 RESULTS The samples were tested by the methods given above. The flammability classification is V-0, the test results meet the requirements of IPC-4101D/130 standards. See attached test data sheet for actually test result. Table20 VERTICAL BURNING TEST SAMPLE DESIGNATION: CCL AMBIENT: 22,50%RH SAMPLE IDENTIFICATION: TU-862 HF (Thin) TEST DATE: ~ Solder Limits Temperature N/A Time. Thk: (mm) Afterflames (s) Afterglo w (t 3 ) Sum of after flames (s) N/A (t 1 ) (t 2 ) (t 3 ) (t 1 + t 2 ) (t 2 + t 3 ) CONDITION A: Hours (23 ± 2) C Sum of afterflame and afterglow (s) (50 ± 5)% RH Avg: Max: 4 Sum: 19 Max: Did samples burn to the clamp? Pass Did the cotton ignite? Pass CONDITION B: Hours C RESULTS V-0 Avg: Max: 4 Sum: 17 Max: 4 Pass Pass MCQD530-02(2014) (33 of 54 )

34 SAMPLE IDENTIFICATION: TU-862 HF (Thick) TEST DATE: ~ Solder Limits Temperature N/A Time CONDITION A:. Thk: (mm) Hours Table21 VERTICAL BURNING TEST SAMPLE DESIGNATION: CCL AMBIENT: 22,50%RH Afterflames (s) Afterglo w (t 3 ) (23 ± 2) C Sum of after flames (s) 0 0 (50 ± 5)% RH Sum of afterflame and afterglow (s) N/A (t 1 ) (t 2 ) (t 3 ) (t 1 + t 2 ) (t 2 + t 3 ) Avg: Max: 0 Sum: 0 Max: 0 Pass Did samples burn to the clamp? Did the cotton ignite? Pass CONDITION B: Hours (70±1) C RESULTS V-0 Avg: Max: 0 Sum: 0 Max: 0 Pass Pass MCQD530-02(2014) (34 of 54 )

35 Glass Transition Temperature and Cure Factor TEST SPECIMEN CCL 1pcs REFERENCE IPC-TM-650 Method Glass Transition Temperature and Cure Factor by DSC IPC-4101D Specification for Base Materials for Rigid and Multilayer Printed Boards Customer Technical Requirement METHOD/ REQUIREMENT Dry the specimens in oven for 4h at 135. Remove the specimens from the oven and immediately place in the desiccator to cool.rout out a disk from the metal clad sample 6.25 mm in diameter. Sand any rough edges of the specimen. Precondition the sample in an aircirculating oven by baking for 2 h ±0.25 h, at 105 ±2. Cool the sample to room temperature for at least one-half hour in a desiccators maintained at less than 30% RH before testing. Mount the specimen in a standard aluminum sample pan with an aluminum lid. If the specimen is a powder, crimp the aluminum lid shut. For referee purposes, prepare a suitable reference by adding an equivalent weight of aluminum lids to the reference pan to match the weight of the specimen. Run the scan from 25 at a rate of 20 per minute. When the transition has been observed, scan at least 30 beyond the transition region. If the cure factor is applicable and required, perform the following steps: Continue the scan to 190. Hold the specimen at the isothermal temperature for 15 min. Immediately cool the specimen to the initial conditions and run a second scan with the same parameters as the first scan. Determine the Tg and the delta Tg as required. RESULTS The samples were tested as given by the methods above, the test results meet the requirement of IPC-4101D/130 standards. See attached test data sheet and test picture for actually test result. MCQD530-02(2014) (35 of 54 )

36 Table22 Glass Transition Temperature And Cure Factor Designation CCL Identification TU-862HF Test Date ~ Ambient 22,52 %RH Number Element Tg1 Tg2 Cure Factor Tg Measurement ( ) Requirement 170 / Picture TU-862HF MCQD530-02(2014) (36 of 54 )

37 Decomposition Temperature (T d ) TEST SPECIMEN The specimen may be an unclad laminate material or laminate material with copper completely removed and that has been cut approximately square to fit into the TGA sample pan. Typical sample mass is 10 mg to 30 mg. REFERENCE IPC-TM-650 method Decomposition Temperature (Td) of Laminate Material Using TGA IPC-4101D Specification for Base Materials for Rigid and Multilayer Printed Boards Customer Technical Requirement METHOD/ REQUIREMENT Dry the specimens in oven for 4h at 135. Remove the specimens from the oven and immediately place in the desiccator to cool. The test samples should be baked at 110 ± 2 for 24 h and placed in a desiccator for cooling to room temperature prior to testing. In standard lab conditions, the TGA test should be started within 15 minutes of removing test sample from the dessicator. Place the sample in the TGA and measure its mass. Heat the sample at a rate of 10 /min from ambient (not to exceed 50 ) to 550. Report the temperature at which the mass of the sample is 2% less than its mass measured at 50 (Td 2%) and the temperature at which the mass of the sample is 5% less than its mass measured at 50 (Td 5%). RESULTS The samples were tested by the methods given above, the test results meet the requirement of IPC-4101D/130 standards. See attached test data sheet and test pictures for actually test result. MCQD530-02(2014) (37 of 54 )

38 Table 23 Decomposition Temperature Test Designation: CCL Identification TU-862HF Test Date: ~ Ambient: 22, 55%RH Number Decomposition temperature ( ) mass loss at 2% mass loss at 5% Requirement / 340 Picture TU-862HF MCQD530-02(2014) (38 of 54 )

39 Glass Transition Temperature and Z-CTE (TMA) TEST SPECIMEN Two specimens shall be approximately 6.35 mm 6.35 mm by the thickness of the sample. REFERENCE IPC-TM-650 Method Glass Transition Temperature and Z-Axis Thermal Expansion by TMA IPC-4101D Specification for Base Materials for Rigid and Multilayer Printed Boards Customer Technical Requirement METHOD/ REQUIREMENT Dry the specimens in oven for 4h at 135. Remove the specimens from the oven and immediately place in the desiccator to cool.two specimens were prepared by cutting out approximately 6.35mm 6.35mm and sanding any rough edges. The specimens were preconditioned by baking for 2h±0.25h, at 105 ±2, then cooled to room temperature in a desiccators. Measure and record the thickness of the specimens. Mount the specimen on the stage of the TMA and apply a load 5g.Start the scan at a temperature no higher than 35 to 260, at a rate of 10 /min. The CTE shall be calculated over the specified regions. RESULTS The samples were tested as given by the methods above, the test results meet the requirement of IPC-4101D/130 standards. See attached test data sheet and test picture for actually test result. Table 24 Glass Transition Temperature and Z-CTE(TMA) Designation CCL Identification TU-862HF Test Date ~ Ambient 19, 50%RH Number Z-CTE(μm/m ) PTE(%) (50~100) (220~260) (50~260) (50~260) Tg( ) Requirement / MCQD530-02(2014) (39 of 54 )

40 Picture TU-862HF Picture TU-862HF MCQD530-02(2014) (40 of 54 )

41 Time to Delamination TEST SPECIMEN Two specimens shall be approximately 6.35mm 6.35mm by the thickness of the sample. REFERENCE IPC-TM-650 Method Time to Delamination (TMA Method) IPC-4101D Specification for Base Materials for Rigid and Multilayer Printed Boards Customer Technical Requirement METHOD/ REQUIREMENT Dry the specimens in oven for 4h at 135. Remove the specimens from the oven and immediately place in the desiccator to cool.two specimens were prepared by cutting out approximately 6.35mm 6.35mm and sanding any rough edges. The specimens were preconditioned by baking for 2h±0.25h, at 105 ±2, then cooled to room temperature in a desiccators.measure and record the thickness of the specimens. Mount the specimen on the stage of the TMA and apply a load 5g.Start the scan at a temperature no higher than 35 to 260, 288 and 300 at a rate of 10 per minute, hold at that temperature until failure.the time to delamination is determined as the time from the onset of the isotherm to failure. RESULTS The samples were tested as given by the methods above, the test results meet the requirement of IPC-4101D/130 standards. See attached test data sheet and test picture for actually test result. MCQD530-02(2014) (41 of 54 )

42 Table 25 Time to Delamination Designation CCL Identification TU-862HF Test Date ~ Ambient (20~22),(49~54)%RH. Test Item Time of Reversible Event (min) Time of Delaminate (min) Requirement / >60 T / > T288 / / >15 > T300 / / >2 >2 2 MCQD530-02(2014) (42 of 54 )

43 Picture TU-862HF Picture TU-862HF Picture TU-862HF Picture TU-862HF Picture TU-862HF Picture TU-862HF MCQD530-02(2014) (Page 43 of 54 )

44 Dimensional Stability TEST SPECIMENS Three specimens shall be 300mm 280mm in size with the warp direction in the 300mm dimension. REFERENCES IPC-TM-650 Method Dimensional Stability, Glass Reinforced Thin Laminates IPC-4101D Specification for Base Materials for Rigid and Multilayer Printed Boards Customer Technical Requirement METHOD/ REQUIREMENT Before testing the specimens need to be baked at 135 for 4h. Mark the specimen for traceability in the identification area. Prepare the four location points by drilling or scribing. Measure distances F l, F 2, W 1, and W 2. Bake Process: Etching the sample, bake specimens at 105 ± 5 for 4h ± 5min. After baking, immediately place the test specimens in a stabilization chamber. Remove from stabilization chamber after h and within 5min, measure F l1, F 21, W 11, and W 21. Thermal Stress Process: Bake specimens at 150 ± 5 for 2h ± 5min. After baking, immediately place the test specimens in a stabilization chamber. Remove from stabilization chamber after h and within 5min, measure F l2, F 22, W 12, and W 22. Use the below formula to calculate result: After Bake Process: MD=(Wx 1 -Wx) 10 3 /Wx(mm/m)(x=1,2) TD=(Fx 1 -Fx) 10 3 /Fx(mm/m)(x=1,2) After Thermal Stress Process: MD=(Wx 2 -Wx) 10 3 /Wx(mm/m)(x=1,2) TD=(Fx 2 -Fx) 10 3 /Fx(mm/m) (x=1,2) W 1, W 2, F l, F 2 = initial dimensions W 11, W 21, F l1, F 21 = after bake dimensions W 12, W 22, F l2, F 22 = after thermal stress dimensions RESULTS The samples were tested by the methods given above, the test results meet the requirement of IPC-4101D. See attached test data sheet for actually test result. MCQD530-02(2014) (Page 44 of 54 )

45 Table 26 Dimensional Stability Designation CCL Identification TU-862HF(Thin) Test Date ~ Ambient (22~23), (49~50)%RH. After Bake Process (mm/m) After Thermal Stress Process (mm/m) MD TD MD TD Average Requirement -0.3~0.3 Table 27 Dimensional Stability Designation CCL Identification TU-862HF(Thick) Test Date ~ Ambient (22~23), (49~50)%RH. After Bake Process (mm/m) After Thermal Stress Process (mm/m) MD TD MD TD Average Requirement -0.3~0.3 MCQD530-02(2014) (Page 45 of 54 )

46 Solderability(Edge Dip Test) TEST SPECIMENS The test specimen shall be a portion of the printed board not greater than 75 mm x 75 mm, the suggested coupon, or the complete board if it is smaller than this size. REFERENCE IPC-4101D Specification for Base Materials for Rigid and Multilayer Printed Boards IPC J-STD-003C; Edge Dip Test Customer Technical Requirement METHOD/ REQUIREMENT Before testing the specimens need to be baked at 135 for 4h. Edge Dip Test (Tin/lead solder): The samples are to be dipped in the flux to the full depth to be soldered for (5-10) seconds. After withdrawal from the flux, the test specimen shall be allowed to drain vertically for a maximum of 60 seconds. Excess flux shall be removed by blotting the surface to be tested with a piece of clean, absorbent material. The solderability test shall then be performed not less than one minute, and not more than five minutes, after blotting. Wiped with isopropyl alcohol and immersed in a 20% by volume solution of hydrochloric acid, Baume that is maintained at 21 ±5 for 15s. The specimens shall be rinsed with a cold water spray rinse for 5s and blown dry with filtered, oil free, compressed air. The sample should be dip on tin/lead solder bath be maintained at (235±5) edgewise to a depth of (25±2) mm. The dwell time in the molten solder is 10s. Immersion time may have to be adjusted depending on the construction of the board. A dwell time of up to 30 seconds maybe required for heavy or high copper content boards. After withdrawal, the solder shall be allowed to solidify by air cooling while the board is maintained in a vertical position. Specimens shall have the flux removed after the test, than examination the tested area. A minimum of 95% of each of surfaces being tested shall be exhibit good wetting. The balance of the surface may contain only small pin holes, dewetted areas, and rough spots provided such defects are not concentrated in one area. There shall be no nonwetting or exposed base metal within the evaluated area. RESULTS The samples were tested by the methods given above. The test results meet the requirement of IPC J-STD-003C. See attached test data sheet and test pictures for actually test result. MCQD530-02(2014) (Page 46 of 54 )

47 Table 28 Solderability Designation CCL Test Date Quantity 2 pcs Ambient 23, 50%RH. Identification Test result TU-862 HF (Thin) surface exhibit good wetting TU-862 HF (Thick) surface exhibit good wetting Picture 40 After the test Top After the test Bottom Defects: ne found Picture 41 After the test Top After the test Bottom Defects: ne found MCQD530-02(2014) (Page 47 of 54 )

48 Chemical Resistance TEST SPECIMEN The specimens shall be (50.8±0.5) mm (50.8±0.5) mm by the thickness of the material. Edges shall be smooth. REFERENCE IPC-TM-650 Method Chemical Resistance of Laminates, Prepreg, and Coated Foil Products, by Solvent Exposure IPC-4101D/ 130 Customer Technical Requirement METHOD/ REQUIREMENT Dry the specimens in oven for 4h at 135. Remove the specimens from the oven and immediately place in the desiccator to cool. Measure and record the nominal thickness of the test specimen. Then put the specimens in oven for (60±5)min at 105. Remove the specimens from the oven and immediately place in the desiccator to cool for (60±30)min. Remove the specimens individually from the desiccator and weigh on the analytical balance. Record these weights as W1. Fill the battery jar with 750 ml of solvent and maintain the solvent temperature at (23±0.5) using the water bath. After ( ) min, measure the weight of the specimens and record it as W2. Subtract the dry weight of each specimen, W1, from the final weight, W2 of each specimen after immersion. Record the weight gain in mg. Calculate the average weight gain in mg. Examine the specimens using 20/20 vision for any changes to the appearance of the material, such as hazing, whitening or swelling. RESULTS The sample was tested by the methods given above. See attached test data sheet and test picture for actually test result. MCQD530-02(2014) (Page 48 of 54 )

49 Table 29 Chemical Resistance Designation CCL Identification TU-862 HF Test Date ~ Ambient 23,50%RH. Thickness (mm) Weight (mg) Increase Weight (mg) W 1 W 2 W 2 -W 1 After Bake Appearance Inspection After Immerse in the Solvent no any change no any change no any change no any change no any change no any change Average 3.6 / no any change no any change no any change no any change no any change no any change Average 2.7 / MCQD530-02(2014) (Page 49 of 54 )

50 Picture ~ TU-862 HF After Bake Top Picture ~ TU-862 HF After Bake Bottom Picture ~ TU-862 HF After Immerse in the Solvent Top Picture ~ TU-862 HF After Immerse in the Solvent Bottom MCQD530-02(2014) (Page 50 of 54 )

51 Metal Surface Cleanablility TEST SPECIMEN The specimens shall be (50.8±0.5) mm (50.8±0.5) mm by the thickness of the material. Edges shall be smooth. REFERENCE IPC-TM-650 Method Chemical Cleaning of Metal-Clad Laminate IPC-4101D/ 130 Customer Technical Requirement METHOD/ REQUIREMENT Dry the specimens in oven for 4h at 135. Remove the specimens from the oven and immediately place in the desiccator to cool. Place the specimen in a cleaner/degreaser solution and gently agitate for (30±5) seconds. Remove the specimen and flush with tap water. Next place the specimen in a 180 g/l sodium persulfate micro etch solution with (38 ±3) for (30±5) seconds and vigorously agitate. Remove the specimen and flush with deionized water for (1~2) minutes. RESULTS The sample was tested by the methods given above. See attached test data sheet for actually test result. Table 30 Metal Surface Cleanablility Designation CCL Identification TU-862 HF Test Date ~ Ambient 21,50%RH Sanple Nunber Requirements Test Result The metal cladding on the test specimen shall be cleaned to a uniform matte finish. Deionized or distilled water poured on the metal surface does not bead or form puddles. The metal cladding on the test specimen shall be cleaned to a uniform matte finish. Deionized or distilled water poured on the metal surface does not bead or form puddles. The metal cladding on the test specimen shall be cleaned to a uniform matte finish. Deionized or distilled water poured on the metal surface does not bead or form puddles. The metal cladding on the test specimen shall be cleaned to a uniform matte finish. Deionized or distilled water poured on the metal surface does not bead or form puddles. MCQD530-02(2014) (Page 51 of 54 )

52 Pressure Cooker Test TEST SPECIMEN 5 pcs specimens, the dimensions is 100mm 100mm. REFERENCE IPC-4101D Specification for Base Materials for Rigid and Multilayer Printed Boards IPC-TM Pressure Vessel Method for Glass Epoxy Laminate Integrity Customer Technical Requirement METHOD/ REQUIREMENT Place the samples at 135 for 4h. Maintain the samples at 15 psi for minutes in pressure cooker. Carefully remove the hot specimens from the pressure vessel and blot dry with paper towel. The specimens shall be maintained at ambient temperature, and within 10 minutes it shall be immersed vertically into the solder bath which is maintained at either F ( )for 20s Visual inspection samples after the test. Check if there is any measles, blisters, delamination, convolution,or surface erosion. RESULTS Value Condition 5 The samples have no measles, blisters, or surface erosion. 4 Occasional minute (1/32 inch or less) measles. 3 Minute measles scattered across the specimen. 2 Occasional minor blisters (two to four adjacent weave intersections). 1 Large blisters, delamination, or convolution. The samples were tested by the methods given above. See attached test data sheet and test picture for actually test result. Table 31 Pressure Cooker Test Designation CCL Test Date 2017/3/2 Identification TU-862 HF Ambient 23,50%RH. Test result Grade5:The sample have no measles, blisters, or surface erosion. Grade5:The sample have no measles, blisters, or surface erosion. Grade5:The sample have no measles, blisters, or surface erosion. Grade5:The sample have no measles, blisters, or surface erosion. Grade5:The sample have no measles, blisters, or surface erosion. MCQD530-02(2014) (Page 52 of 54 )

53 Picture 46 After the test ~ TU-862 HF The samples have no measles, blisters, or surface erosion. MCQD530-02(2014) (Page 53 of 54 )

54 CERTIFICATE OF CONFORMANCE Microtek (Changzhou) Laboratories certifies that the test equipment used complies with the calibration requirements of correlation criterion and that the data contained in this report is accurate within the tolerance limitation of this equipment. The report is invalid without signature of approver and Special seal for test report, and the test results of this report are only responsible for tested samples. The report shall not be reproduced, except in full, without the written approval of Microtek (Changzhou) Laboratories. Thank you for selecting Microtek (Changzhou) Laboratories for your testing requirements. Edited by: Reviewed by: Approved by: Ji Juan Ronson Sun Gestar Project Engineer Project Manager Assistant Lab Manager Date: Date: Date: MCQD530-02(2014) (Page 54 of 54 )