ALPHA SACX Plus Product Guide

Size: px
Start display at page:

Download "ALPHA SACX Plus Product Guide"

Transcription

1 the product: Delivering the confidence you need to move to a lower silver alloy without sacrificing soldering performance or reliability ALPHA SACX Plus 0807 Product Guide the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 1

2 ALPHA SACX Plus 0807 Contents PAGE PAGE Introduction 3-5 Features and Benefits 3 Overview of SACX Alloys 4-5 Basic Alloy Properties 6 Processing Parameters 7-9 Manufacturability 7 Copper Erosion Data 8 Dross Rates 9 Soldering Performance Wetting Balance Spread 12 Skips 13 Bridging 14 Solderballing 15 Hole-Fill Reliability Basic Properties 18 Joint Strength 19 Thermal Cycling Joint Appearance 23 Availability 24 When to Consider SACX Plus Summary of Properties 26 Technical Data Sheet & MSDS 27 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 2

3 ALPHA SACX Plus 0807 Introduction ALPHA SACX Plus 0807 is a newly designed and tested Pb-free electronics soldering alloy that uses the latest innovations to deliver best in class soldering performance and reliability. It s also easy to use and can be dropped in to most current SAC 305 wave soldering processes. ALPHA SACX Plus 0807 contains just the right amount of additives to be the perfect choice for the most challenging assemblies while also helping Assemblers lower their material costs. the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 3

4 Overview of the SACX Plus Family of Pb-free Alloys Alloys are engineered for optimal performance in specific processes or on certain types of assemblies Alloys are fully cross compatible For example, a component can be readily soldered to a SACX Plus 0307 HASL finished pad using the SACX Plus 0807 wave solder alloy the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 4

5 High Performance Alloys for Every Assembly the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 5

6 Alloy Properties - Basic Material Property Solidus Liquidus (peak) Density Resistivity SACX ºC 225ºC 7.4 g / cm³ µωm SAC ºC 220ºC 7.37 g / cm³ µωm Test Method / Condition Differential Scanning Colorimeter (DSC) Differential Scanning Colorimeter (DSC) Calculated value Measured resistance of solid wire at 22 C Coefficient of Thermal Expansion 19.5 x 10-6 / C 20.2 x 10-6 / C 21.9 x 10-6 / C N/A C at 1 C / minute C at 1 C / minute Specific Heat 0.23 J/g/ C C, Differential Scanning Colorimeter (DSC) the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 6

7 Processing Parameters- Manufacturability Material Property Operating Temperature Conveyor speed Contact time (single and dual wave) SACX ( ) 2-5 Units º C m/min (ft/min) Seconds Assembly Types From simple single side paper phenolic boards to thick (2.4mm+), complex 2-sided FR4 with OSP pad finishes that have hardened from prior reflow excursions With SACX Plus 0807, there is no need to change settings as it can be used in virtually any higher silver Pb-free alloy wave soldering process Unlike Ag free alloys, SACX Plus 0807 requires no costly increase in pot temperature in order to provide acceptable wetting performance the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 7

8 Processing Parameters Copper Erosion Because of proprietary additives, SACX Plus 0807 exhibits much lower rates of copper erosion than Test 1 SACX 0807 No erosion Cu erosion at barrel knee after 50 secs. exposure over wave Actual Cu trace erosion Cu plated through hole Test 2 seconds Wire Break Times at 260C SACX 0807 Time taken for a.05mm copper wire to fail under a 1.5g load when immersed in 260ºC static solder bath the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 8

9 Processing Parameters Dross Rate Proprietary additives substantially decrease the amount of dross produced by SACX Plus 0807 versus traditional Weight (g) Time (Hours) SACX % less dross can save >$5K / per line / per year! the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 9

10 Soldering Performance Wetting Speed Wetting Balance Test - Pot temp. 260C Wetting Time (seconds) Alloy SACX0807 SACX Plus 0807 is engineered to have lower surface tension Lower surface tension results in faster wetting Faster wetting means better hole fill the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 10

11 Soldering Performance Wetting Force 3 2 Wetting Force / mn SACX 0807 Time / sec Wetting Balance tests show the wetting force (Fmax) of SACX Plus 0807 is nearly identical to under the same test conditions the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 11

12 Soldering Performance Spread SACX Plus 0807 Spread value Similar wetting angles as Spread Coefficient (JIS) 260C SACX0807 SAC 305 Similar spread characteristics as the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 12

13 Soldering Performance Skips Solder Skip resistance of SACX Plus 0807 equivalent to in our testing. No skips were seen with either alloy during testing. Chip Capacitors - various sizes # of Skips SACX0807 # of Skips Transistors - Skips per Board SACX0807 Process set-up Flux Pad finish Pot temp. Wave.Configuration Conveyor Speed ALPHA EF-8000 Entek HT 260ºC Dual Chip / Lambda 1.3 m / min the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 13

14 Soldering Performance Bridging Bridges per Connector Bridges per 0.8mm QFP # of Bridges A llo y SACX 0807 Designed to deliver excellent solder drainage Good drainage = low bridging # of Bridges Alloy SACX 0807 Process set-up Flux Pad finish Pot temp. Wave.Configuration Conveyor Speed ALPHA EF-8000 Entek HT 260ºC Dual Chip / Lambda 1.3 m / min the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 14

15 Soldering Performance Solder Balls Avg. # per board Solder Ball Performance SAC 405 SACX0807 Average # of micro solder balls recorded from sampling of 24 processed assemblies Equivalent solder balling resistance compared to higher silver SAC alloys Process set-up Flux Pad finish Pot temp. Wave.Configuration Conveyor Speed ALPHA EF-8000 Entek HT 260ºC Dual Chip / Lambda 1.3 m / min the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 15

16 Soldering Performance Hole-Fill A V e r a g e H o le F ill ( % ) Ave 10mil Hole-Fill Ave 20mil Hole-Fill Ave 40mil Hole fill SACX Plus 0807 SACX 0807 High wetting force leads to improved hole-fill at standard operating temperatures Process set-up Flux Pad finish Pot temp. Wave.Configuration Conveyor Speed ALPHA EF-8000 Entek HT 260ºC Dual Chip / Lambda 1.3 m / min the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 16

17 Soldering Performance Hole-Fill SACX Plus 0807 SAC405 In field trials, SACX Plus 0807 achieved comparable hole-fill performance to higher silver SAC alloys the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 17

18 Reliability Basic Properties Material Property Hardness Tensile Strength Elongation Solder Creep (time to failure) SACX Plus Hv (after aging) 30.7 MPa 21.5% >1000 hrs SAC Hv (after aging) 32 MPa 33.5% >1000 hrs Test Method Vickers Hardness cast samples aged for 125ºC Strain rate 10-3 per second Strain rate 10-3 per second 1.5 kg weight at 100ºC the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 18

19 Reliability Joint Strength (shear and pull tests) Shear and Pull Testing Results Additives contribute to joint strength that is similar to Shear Force Pulling Force 250 Shear 0 SACX Pull Mean data collected from over 20 separate tests the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 19

20 Thermal Cycling Test Vehicles used Bottom Side Large Equipment Board 1.6mm FR4 multilayer PCB Entek OSP HT 1 prior glue cure 4% solids ROL0 flux Current alloy SAC 405 Joint inspections and cross sectional analysis performed on large power management devices in high heat capacity areas the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 20

21 Reliability Thermal Cycling test conditions and results Test Conditions Shock profile - Twin chamber environmental cabinet used to cycle between -20 C to +100 C with 1 hour dwell (total cycle time = 2.5 hrs.) Cross sections of radial film capacitor SAC405 SACX 0807 External view of the bottom side joint of a large pot capacitor After cycles: Equivalent results for SACX Plus 0807 and SAC405 alloys SAC405 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 21

22 Reliability Thermal Cycling Class A No deformation Class B Slight deformation Class C Moderate deformation Class D Surface striations Class E Surface cracks Class D Amt. of Defects Joint Degradation from Thermal Shock Testing Results from inspection of large heat capacity components only SACX 0807 outperforms current standard! Class E Class D Class C Class B Class A High performing, low cost alternative Class E Current customer process with acceptable reliability SAC405 SAC 405 Alloy SACX0807 SACX Plus 0807 Test Profile -20 C to +100 C 1 hour dwell (total cycle time = 2.5 hrs.) cycles the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 22

23 Joint Appearance SACX Plus 0807 SAC405 SACX Plus 0807 Pb-free finish is different from SnPb finish helps avoid contamination during rework Unique additives help create uniform grain structures resulting in shiny joints SAC405 the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 23

24 Availability SACX Plus 0807 is made in each of our 3 global regions Item Number Description BAR SACX0807 Vaculoy Kilo BAR SACX0807 Vaculoy Tri-Kilo BAR SACX0807 Vaculoy 3.5KG BAR SACX0807 Vaculoy Chunk BAR SACX0800 Vaculoy Kilo BAR SACX0800 Vaculoy Tri-Kilo BAR SACX0800 Vaculoy 3.5KG BAR SACX0807 Vaculoy Ultra Low Lead Kilo BAR SACX0807 Vaculoy Ultra Low Lead Tri-Kilo BAR SACX0807 Vaculoy Ultra Low Lead 3.5KG BAR SACX0807 Vaculoy Ultra Low Lead Chunk BAR SACX0800 Vaculoy Ultra Low Lead Kilo BAR SACX0800 Vaculoy Ultra Low Lead Tri-Kilo BAR SACX0800 Vaculoy Ultra Low Lead 3.5KG Product Type Product Group Product Name BAR BRC VAC Consult your local / regional manufacturing plant for special shape or size requests the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 24

25 When to consider SACX Plus 0807 Current /387/405 or SnPb users that are evaluating low-ag alternatives and have difficult to solder assemblies Assembler should always consider their most difficult assembly when selecting a single alloy Users of lower Ag or Ag free alloys that: Are not getting the soldering performance they need Are seeing an increase in mechanical reliability related field failures Use the SACX Plus Family map for guidance on which alloy to offer (based on the assembly type) the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 25

26 Summary of Properties Low silver content lowers alloy cost Wide processing temperature range saves energy and allows drop in replacement of higher silver bearing Pb-free alloys Vaculoying process and unique additives minimize dross Fast wetting speeds and high wetting force results in excellent soldering across a wide variety of assemblies Silver and other additives result is strong, ductile solder joints for reliability similar or better than the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 26

27 Technical Bulletin and MSDS Documents available from or contact your local Alpha sales office the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 27