High-reliability Low-Ag Alloy

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1 #47002E Koki no-clean LEAD FREE solder paste High-reliability Low-Ag Alloy PAT. pend Product information Sn0.3Ag0.7Cu S01X7C- alloy After ºC 1500cycle This Product Information contains product performance assessed strictly according to our own test procedures and may not be compatible with results at end-users.

2 2 Product Solder alloy composition is Sn0.1Ag0.7Cu0.03Co HIGHER RELIABILITY than conventional low or non-ag alloys. PERFECT MELTING and wetting at super fine pitch (<0.4mm pitch) and micro components (<0.3mm dia CSP, 0603 chip). Specially formulated flux chemistry ensures extremely LOW VOIDING with CSPs and broad contact area components. Halogen FREE (Cl+Br<1500ppm) No clean ROL0 Powder Type 3 or 4 Fine pattern 0.4mm pitch CSP<0.3mm Idle time > 60 min. CSP 0.3mm >48hrs. High heat slump resist Powerful wetting Low beading Low voiding High reliability

3 3 Alloy Flux Product Application Printing - Stencil Product Alloy Composition (%) Sn0.1Ag0.7Cu0.03Co Melting Point(ºC) Shape Spherical Particle size (um) Halide Content (%) 0 Flux Type ROL0* 3 Flux Content (%) 11.3 ± 0.5 Viscosity* 1 (Pa.s) 220 ± 30 Cupper plate corrosion* 2 Passed Tack Time > 48 hours Shelf Life(below 10ºC) 6 months Optional powder (um) 20 38; Product code S01X7C58-M Viscosity : Malcom spiral type viscometer,pcu-205 at 25ºC 10rpm 2. Copper plate corrosion : In accordance with IPC J-STD-004A 3. Flux type : According to IPC J-STD-004A

4 4 Alloy selections S01X7C 48 - M 500 Flux number Particle size Alloy composition Flux type Alloy composition (%) Particle size (μm) S01X7C : SnAg0.1Cu0.7Co : 20 ~ 45 μm Flux type M : Low halide, halide free Flux number Solids and solvent used

5 5 Alloy Specification (bulk specification) Item Melting point (ºC) Specific gravity Tensile strength (N/mm2) *1 Elongation (%) *1 Hardness (Hv) *2 Shear strength (N/mm2) *3 Impact strength (J/cm2) *4 Creep time (h) *5 S01X7C- alloy Sn-0.3Ag-0.7Cu Sn-3Ag-0.5Cu *1: JIS test piece No.4, 30mm/min. *2: Vickers hardness meter, pressure 25g. *3: Tensile Shear Strength of Laser Lap Joints, 20mm/min. *4: Charpy impact test (weight 5kg), JIS test piece No.3 *5: 150ºC,weight 3kg

6 6 Material : Surface treatment : Stencil thickness : Pad size : Stencil aperture : Component : Heat source : Atmosphere : Reflow profile : Glass epoxy FR-4 OSP 0.12mm (laser cut) 0.5mm diameter 100% aperture opening to pad 2012 Resistor (Sn100) Shere strength Hot air convection Air Same as 2012R (kgf) After 1500 cycles Sn3Ag0.5Cu Cracks S3X 0.3Ag S01X7C S3X 0.3Ag S01X7C S3X 0.3Ag 0 cycle 1000 cycles 1500 cycles S01X7C Sn0.3Ag0.7 Cracks S01X7C of S01XC1(Sn0.1Ag0.7Cu0.03Co) indicates at least or even more than S03X(Sn0.3Ag0.7Cu).

7 7 Print parameters Test patterns Stencil : 0.12mm thickness, laser cut stencil 1. QFP pad pattern : Width 0.20 mm Printer : Model YVP-Xg YAMAHA Motor Length 1.5 mm Distance 0.2 mm Squeegee : Metal blade, Angle MBGA pad pattern : 1) Di ameter 0.35 mm Print speed : 40 mm/sec 2) Diameter mm Stencil separation speed : mm/sec Atmosphere : 24.5~ 25.5 C (50~60%RH) Parallel to squeegee 1st print 10th print 10th print after 200 strokes 0.30mm diameter Newly developed additives provide a lubricating effect that greatly improve the paste release properties and assures excellent print quality even with micro BGA, 0603 and super fine pitch components.

8 8 in continual printing Print (knead) solder paste on the sealed-up stencil continually up for 8 hours to observe viscosity variation. Squeegee : Metal blades Squeegee angle : 60 Squeegee speed : 30mm/sec. Print stroke : 300mm Printing environment : 26+/-1 C, 60+/-10%RH Viscosity (Pa.S) *120 strokes/hour No. of print strokes (times) A newly developed flux formula has succeeded to realize consistent long term printability by preventing excess viscosity drop due to shear thinning and excess increase due to chemical reaction between solder powder and flux during print rolling

9 9 (Stencil idle time) Print solder paste continuously and stop to idle the paste for 45, 60 min. intervals, and resume the printing and observe the 1st print result to verify intermittent printability. Squeegee : Metal blades Squeegee angle : 60 Squeegee speed : 40mm/sec. Print stroke : 300mm Printing environment : 25+/-1 C, 60+/-10%RH Test pattern : QFP pad pattern - Width 0.20 mm Length 1.5 mm Distance 0.2 mm MBGA pad pattern - Diameter 0.30 mm 0.30mm diameter 0.4mm pitch QFP pattern (Parallel) 1st print 1st print after 60 min. Unique formulation solvent system assures extremely long stencil idle time, eliminating printing faults and improving process window and production yields.

10 10 Tackiness (gf) Stencil : 0.2mm thick, 0.6mm dia. aperture Measurement instrument : Malcom tackimeter TK-1 Probe pressure : 50gs Pressurizing time : 0.2sec. Pull speed : 10mm/sec. Test method : In accordance with JIS Z 3284 Test environment : 25+/-1 C, 60+/-10%RH Tensile strength = Tack force Load 50gf 0.2 sec. Pull up at 10mm/sec Time(hr) Unique solvent system has succeeded to extend tack time dramatically (>48 hours) helps widen process window significantly.

11 11 Stencil thickness : 0.2mm Stencil aperture : Pattern (1) 3.0mm 0.7mmm Pattern (2) 3.0mm 1.5mm Spacing between apertures: 0.2mm to 1.2mm Heat profile : 180~190ºC 300 sec. Test method : In accordance with JIS Z 3284 Pattern (1) mm 0.7 mm 3.0 mm Pattern (2) mm 1.5 mm 3.0 mm Improved heat slump property assures reduced soldering defects, such as solder beading and bridging.

12 12 (Residue cosmetics) Stencil : 0.2mm thick Stencil aperture : 6.5mm diameter Solder pot temperature : 260ºC Test method : In accordance with JIS Z 3284 Category hour after printing 24 hours after printing Category 3 Category 3 Almost no solder balling and resistant to ambient temperature and humidity.

13 13 Material : Surface treatment : Stencil thickness : Pad size : Stencil aperture : Heat source : Zone structure : Atmosphere : Glass epoxy FR-4 OSP 0.12mm (laser cut) 0.35, 0.30mm diameter, 0603 chip pattern 100% aperture opening to pad Hot air convection 5 pre-heat zones +2 peak zones Air 0.30mm φ 0603 chip 0.30mm Φ 0603 R Initial After 4-hour printing on sealed-up stencil Temp. (ºC) Reflow Profile Time(s) Larger relative surface areas of solder paste exposed due to miniaturization of components (CSP, 0603 chips), often cause incomplete melting due to excess oxidation during the reflow. An improved flux formula ensures complete coalescence by minimum deterioration of barrier performances.

14 14 Anti-pillow defect test Material : Glass epoxy FR-4 Surface treatment : OSP Stencil thickness : 0.12mm (laser cut) Pad size : 0.8x0.8mm pattern Mount solder ball size : 0.76mm SAC305 Stencil aperture : 100% aperture opening to pad Heat source : Solder bath at 285ºC Mount time : 20sec Pillow defect S01X7C48- M500 Conventional paste (ROL0) 20sec 40secsec Good NG Drop solder ball every 20 sec. after the solder paste has melted to see heat durability of flux. 60sec 80sec S01X7c48-M500 indicated much longer heat durability nearly up to 80sec., while the conventional solder paste lost activation less than 40 sec. since the solder paste started melting.

15 15 Material : Surface treatment : Stencil thickness : Stencil aperture : Components : Heat source : Zone structure : Atmosphere : Reflow profile : Glass epoxy FR-4 OSP 0.12mm (laser cut) 100% aperture opening to pad 30 pcs./board(2012 Resistor) Hot air convection 5 pre-heat zones +2 peak zones Air Same as *Fault finding design 1608 R 2012R 60 Number of solder beading R 1608R Initial After 2h printing After 4h printing

16 16 Material : Glass epoxy FR-4 Surface treatment : OSP Stencil thickness : 0.12mm (laser cut) Stencil aperture : 100% aperture opening to pad Components Power transistor : 100% Sn plated 6432 resistor : 100% Sn plated 2012 resistor : 100% Sn plated Power transistor : 100% Sn plated BGA : SnAgCu bumps 1.0mm pitch Heat source : Hot air convection Zone structure : 5 pre-heat zones +2 peak zones Atmosphere : Air Reflow profile : Same as 6432R 1.0mm pitch BGA Power Tr 2012R Power-Tr 6432R 2012R BGA Initial After 4-hour printing on sealed-up stencil

17 17 Material pieces : Stencil thickness : Stencil aperture : Heat source & temp.: Copper, Nickel,Brass (*Pre-conditioning acetone cleaning + soft etched by 15% sulfuric acid solution) 0.15mm (laser cut) 6.5mm diameter Reflow simulator *Same profile as. Copper plate Nickel Brass Category 2 Category 3 Category 2 * Definition Category 1 : Solder has spread more than the area where solder paste was printed. Category 2 : Solder has spread whole area where solder pasted was printed. Category 3 : Solder has partially spread. Category 4 : Solder spread is less than the area where solder paste was printed.

18 18 Voltage applied surface insulation resistance Test conditions : 85±2ºC 85%RH for 504 hours Stencil thickness : 100 micron Comb type electrode : JIS type-ii Measurement voltage : DC100V Voltage applied : DC50V Test method : JIS Z 3197 Insulation resistance (Ω) 1.00E E E E E E E E+09 SIR GRAPH 1.00E E Time (hour) No evidence of electromigration can be observed.

19 19 Test method : A: IPC-TM B: BS EN14582 Measurement instrument: ICS-1500 (DIONEX) AQF-100 (Mitsubishi Chemical Analytec) (wt%) Method A B F ND ND Cl ND ND Br

20 20 1. Printing 1) Recommended printing parameters (1) Squeegee 1. Kind : Flat 2. Material : Rubber or metal blade 3. Angle : 60~70º (rubber) or metal blade 4. Pressure : 40-60N(Recomend) 5. Squeegee speed : 20~80mm/sec. (2) Stencil 1. Thickness : 200~100μm for 0.65~0.4mm pitch pattern 2. Type : : Laser or electroform 3. Separation speed : 0.5~10.0mm/sec. 4. Snap-off distance : 0mm (3) Ambiance 1. Temperature : 23~27ºC 2. Humidity : 30~70%RH 3. Air draft : Air draft in the printer badly affects stencil life and tack performance of solder pastes. 2. Shelf life 1) 0~10ºC : 6 months from manufacturing date 2) At 20~30ºC : 1 month from manufacturing date * Manufacturing date can be obtained from the lot number ex. Lot No No. of lot : 2nd Date : 18th Month : August Year : 2009

21 S01X7C48-M50 M Recommended reflow profile (ºC) For reduction of voids, it is recommended to have >50sec. as time above liquidus and >240ºC of peak temperatures. Peak temp. 240~260ºC Pre-heat temp. 110~190ºC 60~120sec. 150 Over 240ºC > 20 sec Ramp-up temp. 1.0~3.0ºC/sec (sec.) 300 Excess pre-heating (time & temperature) may cause too much oxidation. Relatively short and low pre-heat may be recommendable, especially for fine pitch/micro pattern components.