TWIN Vertical SMD PTC Thermistors For Telecom Overload Protection

Transcription

1 PC Series WIN Vertical SMD PC hermistors For elecom Overload Protection QUICK REFERENCE DAA PARAMEER VALUE UNI Resistance value at 25 C 1 to 5 Switching temperature 15 to 13 C Maximum voltage (RMS) 24 V RMS Maximum overload current 2.5 to 8. A Operating temperature range at V max. -4 to 85 C Maximum trip time at 1 A 1.2 to 4. s Weight ~ 1.3 g DESCRIPION he component consists of two high performance PC ceramics mounted together on an alumina spacer cover and with 4 lead (Pb)-free tin plated contacts. he terminations are joined to the Ag plated ceramics by a high melting solder. MARKING All WIN Vertical SMD PC s are marked with the last 3-digits of the type number (BCxxx) and a date code (YYWW) FEAURES Very small footprint, allowing to increase the number of lines per PCB Matched pairs in one component, significantly reducing the assembly time Narrow tracking between the 2 PC s over a wide temperature range (matching at 85 C: 2 x matching at 25 C) Limited height and weight, used on high speed pick-andplace circuit assembly Flat pick-up ceramic area for easy placement Small ceramics for faster response time hermal coupled PC s for enhanced protection Small and large pitch available Compliant with the enhanced level requirements of IU - K edition 23 Suitable for lead (Pb)-bearing and lead (Pb)-free reflow soldering Material categorization: For definitions of compliance please see APPLICAIONS Over-temperature/over-load protection: elecom - elecommunications infrastructure - PABX - Set-top Box (S.B.) MOUNING A flat pick-up area of 3 mm2 and low weight allows for fast placement. No excessive solder paste should be used as no solder or flux can reach the ceramic body during reflow soldering. Not suitable for bismuth containing solder. ypical soldering 235 C, duration: 5 s (Lead (Pb)-bearing) 245 C, duration: 5 s (Lead (Pb)-free) Resistance to soldering heat 26 C, duration: 1 s max. ELECRICAL DAA R 25 ± 2 % () MACHING ( V max. (V RMS ) 25 C I nt at 7 C Note All data is measured at 25 C unless otherwise specified 85 C I t MAX. RIP-IME at 1 A (s) I max. at V max. (A) I res (2 PIECES POWERED) at V max Revision:3-Mar-14 1 Document Number: 2988 ARE SUBJEC O SPECIFIC DISCLAIMERS, SE FORH A

2 PC Series ORDERING INFORMAION R 25 ± 2 % SAP CODING () SMALL PICH LARGE PICH 1 PC95R1GE PC95R1GELAR 2 PC95R2GE PC95R2GELAR 25 PC95RGE PC95RGELAR 35 PC95R35GE PC95R35GELAR 5 PC95R5GE PC95R5GELAR ELECRICAL CHARACERISICS 3.5 rip current vs amb ypical PC will trip (1 PC powered) Current deviation factor I RIP.5 PC will not trip (2 PC's powered) I HOLD amb( C) PC OULINES.3 FOOPRIN H S t X (4x) L P BCXXX YYWW A B C K 2 d b P 1 P 2.1 K 1 D E b 1 DIMENSIONS in millimeters SMALL PICH LARGE PICH L 9. ±.1 9. ± ± ±.25 H 6.9 ± ±.25 b 1.5 ± ±.1 b 1.9 ±.15.9 ±.15 S 1.25 ± ±.15 d.22 ± ±.25 t 2.3 ± ±.1 P 6.5 ± ±.5 P ± ±.15 P ± ±.15 X.5 ±.2.5 ±.2 K 1 6. ± ±.5 K 2 5. ±.5 5. ±.5 RECOMMENDED FOOPRIN in millimeters SMALL PICH LARGE PICH A B C D E Revision:3-Mar-14 2 Document Number: 2988 ARE SUBJEC O SPECIFIC DISCLAIMERS, SE FORH A

3 PC Series PACKAGING ape specifications All tape and reel specifications are in accordance with IEC Carrier tape material is non-conductive polystyrene or polycarbonate. Blister tape K D P 2 P E F cover tape BCXXX YYWW B W 1 2 P 1 Cumulative pitch error:.2 mm over 1 pitches Cumulative tolerance over 1 holes: ±.2 mm A D 1 direction of unreeling DIMENSIONS OF BLISER APE in millimeters SMALL PICH LARGE PICH SMALL PICH LARGE PICH A 7.2 ± ±.1 D B 9.3 ± ±.1 P 4. ±.1 4. ±.1 K 7.2 ± ±.1 P ± ±.1 W 16. ± ±.3 P 2 2. ±.1 2. ±.1 E 1.75 ± ±.1.5 ±.5.5 ±.5 F 7.5 ± ± D max. 7.8 max. REEL SPECIFICAIONS in millimeters Reel W N A REEL DIMENSIONS in millimeters UNIS PER REEL APE WIDH A N W 1 W 2 MAX Note Reels are packed in sealed plastic bags for protection against high humidity and corrosive atmospheres W 1 Revision:3-Mar-14 3 Document Number: 2988 ARE SUBJEC O SPECIFIC DISCLAIMERS, SE FORH A

4 PC Series SOLDERING CONDIIONS his SMD thermistor is only suitable for reflow soldering, in accordance with JEDEC J-SD-2. Soldering processes which can be used are reflow (infrared and convection heating) and vapour phase. he maximum temperature of 26 C during 1 s should not be exceeded and no liquid flux should be allowed to reach the ceramic body. ypical examples of soldering processes that will provide reliable joints without damage, are shown below. Reflow soldering 3 ( C) 2 26 C 245 C 215 C 18 C 1 s 1 s 4 s C K/s ypical values (solid line) Process limits (dotted lines) t (s) Vapour phase soldering 3 ( C) C 18 C 2 to 4 s C external preheating 1 C internal preheating, e.g. by infrared, max. 2 K/s forced cooling ypical values (solid line) Process limits (dotted line) t (s) HANDLING PRECAUIONS Because of the nature of PC ceramic material the component should not be touched with bare hands, as the residue of perspiration can influence component behaviour at high temperatures. Handling forces applied to the component should be limited to 5 N in any condition. Revision:3-Mar-14 4 Document Number: 2988 ARE SUBJEC O SPECIFIC DISCLAIMERS, SE FORH A

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