HALOGEN-FREE Pb FREE SOLDER PASTE TLF SERIES LFSOLDER TLF-204-NH(20-36) (2)Halogen content of the flux (Analysis data of the company inside)

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1 29. 7 Technical data TAMURA 1. Introduction LFSOLDER TLF-24-NH(2-36) is the Pb-free and Halogen-free solder paste which it used spherical Pb-free solder powder and the halogen-free flux. Also, after reflow, the flux residue of this paste becomes with halogen free, because it does not include halogen. As the paste contains no Pb, it will largely contribute to the protection of global environment. Furthermore, excellent reliability can be obtained with the flux without washing. PRODUCT INFORMATION HALOGEN-FREE Pb FREE SOLDER PASTE TLF SERIES LFSOLDER TLF-24-NH(2-36) (2)Halogen content of the flux (Analysis data of the company inside) Test Results Sample name : TLF-24-NH(2-36) State of flux at solder paste measurement : Residue after reflow Test Method : JEITA ET-734 Type of halogen Unit Result MDL Chlorine(Cl) mg/kg N.D. 1 Bromine(Br) mg/kg N.D. 1 Fluorine(F) mg/kg N.D Outstanding features Pb-free (Sn/Ag/Cu series) solder alloy is used. Halogen-free flux is used. Stable printability with little change in viscosity during continuous printing. Having a good solderability even in air reflow. Excellent solderability can be attained for a high peak temperature. Superior reliability is provided by no washing. 3. Outline of product (1) Product characteristics The characteristics of LFSOLDER TLF-24-NH(2-36) is shown in Table 1: Table 1 Characteristics Items Characteristics Test methods Alloy composition Sn96.5/Ag3./Cu.5 JIS Z 3282(1999) Melting point 216~22 According to DSC Particle size of solder powder 2-36μm measurement According to laser diffraction method Flux content 11.8% JIS Z 3284 (1994) Chlorine content.% JIS Z 3197 (1999) Viscosity 2Pa s Annex 6 to JIS Z 3284 (1994) Viscometer, type PCU, manufactured by Malcom., at 25 Result of examination in flux. Note : 1. mg/kg = ppm 2. N.D. = Not Detected (<MDL) 3. MDL = Method Detection Limit (3) Product packing unit The standard of the packing unit of this product is 5g. (4) Quality guarantee period 18 days after manufactured if stored, hermetically sealed under Physical properties (1) Appearance of solder powder Fig.1 shows the appearance of the solder powder taken by SEM photography. 35μm Fig.1 SEM photograph of solder powder 1

2 (2) Particle size distribution of solder powder Shown in Fig.2 is the result of particle size distribution of solder powder as measured in accordance with JIS Z 3284(1994): Viscosity (Pa s) Volume (%) Fig.2 Particle size distribution of solder powder by laser diffraction method Measuring apparatus:ls-23 manufactured by Coulter (3) Characteristics Table1 shows the thixotropic index and the non-recovery rate of viscosity as measured in accordance with JIS Z 3284(1994). Table 2 Thixotropy index and non-recovery ratio of viscosity Items Measured values Thixotropy index.53 non-recovery ratio of viscosity(%) 7.3 (4) Temperature dependency The relationship between temperature and viscosity is shown in Fig.3 The viscosity changes with the temperature and as s result the printability. Therefore it is important to control the temperature of the working environment Particle diameter (μm) (5) Slumping during preheating Solder balls and bridges tend to occur if solder paste has a large slumping during printing and heating. Fig.4 shows the conditions after printing of LFSOLDER TLF-24-NH(2-36) and the state of slumping when heated after printing: After printing After heating Fig.4 Slumping after printing and after heating Metal mask :.2mmt Slit interval : mm (from the left side) Heating temperature : 15 1min (6) Tackiness The change in the tackiness of solder paste as measured in accordance with JIS Z 3284 (1994) is shown in Fig.5 Tackiness (N) Time (h) Fig.5 Change in tackiness Measuring device : Tackiness tester, TK-1, manufactured by Malcom. Press speed :2.mm/s Press force :.49N Peeling speed : 1.mm/s Press time :.2 s Temp.( ) Fig.3 Relationship between temperature and viscosity Viscometer: PCU manufactured by Malcom 2

3 Insulation resistance(ω) 5. Reliability (1) Insulation resistance test Shown in Fig.6 is the change in the values of insulation resistance measured in accordance with JIS Z 3284 (1994). Having practically no decline in the values of insulation resistance, the film shows a good insulation. 1.E+15 1.E+14 1.E+13 1.E+12 1.E+11 1.E+1 1.E+9 1.E+8 1.E %RH Blank 85 85%RH Specimen Holding time(h) Fig.6 Change in the values of insulation resistance Measured in accordance with JIS Z 3284(1994). Boards : JIS comb type electrode boards, type 2. printed with solder paste and re-flowed by reflow soldering system are used as test boards. Measurement: Inside tank, measuring voltagedc1v 6. Printability (1) Appropriate printing conditions Squeegee hardness : 8-9 (Polyurethane) Printing speed : 2-4 mm/s Squeegee material : Urethane, Metal(SUS) Printing pressure :1~2kPa (2) Continuous Printability Fig.8 shows the conditions of continuous printing on sections.3 mm φ First sheet 1th sheet Insulation resistance( Ω ) (2) Migration test The results of migration test measured in accordance with JIS Z 3284 (1994) are shown in Fig.7. No decline is seen in the value of insulation resistance, and no occurrence of migration or corrosion is observed. 1.E+15 1.E+14 1.E+13 1.E+12 1.E+11 1.E+1 1.E+9 1.E+8 1.E Holding time(h) 85 85%RH Blank 85 85%RH Specimen Fig.7 Migration test in accordance with JIS Z 3284 (1994) Boards : JIS comb type electrode boards, type 2. printed with solder paste and re-flowed by reflow soldering system are used as test boards. Voltage: DC 5V Measurement: Inside tank, measuring voltage DC 1V on.3mmφ dots. An excellent printability is shown, with no bleeding from the beginning to the 1th sheet: Fig.8 Continuous printability at.3mmφ dots, with no wiping of the back of plate Squeegee : SUS, Printing speed : 3mm/s Metal mask:.12mmt Environments : (4-6%RH) 7. Shelf life The change in viscosity during storage at temperature of 1 is shown in Fig.1. It can be seen that the product is excellent in stability with no change in viscosity from the 4 time of manufacture. 3 Viscosity(Pa s) Stroage period(day) Fig.1 Change in viscosity during storage, temperature at 1 Viscometer : PCU type manufactured by Malcom

4 8. Recommended reflow profile Shown in Fig.11 is a recommended temperature profile for air reflow. Beware of sudden rise in preheat temperature as it will cause slumping of solder paste which tends to result in solder balls. Temperature( ) Time(s) Fig.11 Recommended temperature profile for air reflow a) Preheat Set the temperature rising speed A at a rate of 1-3 per second. Rapid temperature raising in pre-heat zone tends to cause solder balls. It will be appropriate if pre-heat time B were set in the range from 6 to 1 seconds. If pre-heat is insufficient, rather large solder balls tend to be caused. Conversely, if it is excessive, fine balls and large balls are caused in clusters. Pre-heat ending temperature C would be appropriate if it were set in the range from 15 to 19. If the temperature is too low, non-melting tends to be caused often after reflow. b) Heating If the temperature rise is too fast it may cause excessive slump of the solder paste. Set the peak temperature D in the range from 235 to 245. Adjust the melting time, the time at over 22, E to be from 2 to 6 seconds. 9. Cautions for safety and health a) Store in refrigerator to maintain characteristics of LFSOLDER TLF-24-NH(2-36). b) Break the seal after returning to room temperature without fail, before use. In case of 5 kg container, it will take approximately one to two hours at 25. c) Physiological interaction varies by individuals. As a prudent policy, therefore, care, should beexercised not to inhale gas of fume of solvent emitted during operations and not to have your skin exposed (especially mucous membrane and other parts vulnerable to stimuli) for a long time. d) This paste is contains the organic solvent, but it is no flammable. e) If the paste sticks to the skin, wipe it off with ethanol and the like, and wash thoroughly with soapy water. Please refer to MSDS before you use this solder paste. The physical chemistry-character among written contents etc. is not a guarantee value. The evaluation of danger and noxiousness is based and makes material, information, and the data, etc. which can be acquired now. However, it is not because all material was covered and note handling enough, please. As for notes, it is the one intended for usual handling. Special handling is not assumed. Please observe the restriction of related various regulations, and use after executing suitable safety measures for the usage. Before using it in your company, it is related with process conditions or reliability. Please conduct sufficient examination surely performed. c) Cooling Careful about slow cooling as it may cause the positional shift of parts and decline in joining strength at times. Perform adequate test in advance as the reflow temperature profile will vary according to the conditions of parts and boards and the specifications of the reflow furnace. 4

5 TAMURA KAKEN CORPORATION Head Office / Factory: 16-2, Sayamagahara, Iruma-shi, Saitama-Prefecture, , Japan Kodama Factory: Phone: Fax: , Toyohara, Motohara, Kamikawa-cho, Kodama-gun, Saitama-Prefecture, , Japan Phone: Fax: TAMURA KAKEN TECH CO., LTD. 5F-3, No.181, Fusing N. Rd., Songshan District, Taipei City Phone: Fax : SHANGHAI XIANGLE TAMURA ELECTRO CHEMICAL INDUSTRY CO., LTD. 555, Xiangjiang Road, Nanxiang, Jiading, Shanghai 2182, China Phone: Fax : TAMURA KAKEN (DONGGUAN) LTD. The scientific & Technologic Industry Zone, Shijie Town, Dongguan City, Guangdong Province, China Phone: Fax : DONG-HWA TAMURA KAKEN CO., LTD. 58-3,Shin-kungi-Dong, Ansung-shi, Kyungki-Do, Korea Phone: Fax : TAMURA KAKEN SINGAPORE PTE. LTD. Blk 67, Ayer Rajah Crescent #1-1/2, Ayer Rajah Industrial Estate, Singapore TAMURA KAKEN (M) SDN. BHD. Phone: Fax : No.3A-2, IOI Business Park 1, Persiaran Puchong Jaya Selatan, Bander Puchong Jaya, 471 Puchong, Selangor Darul Ehsan, Malaysia Phone: FAX : TAMURA KAKEN (U.K.) LTD. Caswell Road, Brackmills, Northampton NN4 7PW, U.K. Phone: Fax : Head Office: , Higashiohizumi, Nerima-ku, Tokyo, , Japan Electronic Equipment Sales Division Dealer: 5