Materials for Wearable Electronics. At A Glance

Transcription

1 Materials for Wearable Electronics At A Glance

2 INTRODUCTION From watches to fitness bands to textiles and jewelry, wearable electronics are what many believe could be the next big or small thing in electronics. Challenging dimensions, product flexibility and demanding functionality requirements have wearables pushing the limits of design and mobile performance integration. Enabling robust functionality, reliability and user-friendly interfaces of wearable devices is highly dependent upon the performance of the electronic materials used to produce today s wearables and this is where Henkel delivers. With a full portfolio of materials designed to facilitate the demands of wearable electronics, Henkel is helping its customers bring some of the most exciting new products to market. CONTENTS Introduction... 2 Product Portfolio... 3 Adhesives in Action... 4 Functional Materials... 6 Conductive Adhesives...6 Inks... 7 Solder Pastes... 7 Reliability-Enhancing Materials... 8 Conformal Coating...8 Encapsulants...9 Low Pressure Molding...9 Underfills Materials for User Interfaces Display Sealants ITO Overcoat Material ODF Adhesives Materials for Wearable Electronics

3 PRODUCT PORTFOLIO ABLESTIK 2030SC CONDUCTIVE ADHESIVES ABLESTIK CE 3103WLV Materials for Wearable Electronics FUNCTIONAL RELIABILITY- ENHANCING FOR USER INTERFACES INKS SOLDER PASTES CONFORMAL COATING ENCAPSULANTS LOW PRESSURE MOLDING UNDERFILLS DISPLAY SEALANTS ITO OVERCOAT MATERIAL ODF ABLESTIK CE 3104WXL ECI 1001 E&C ECI 1005 E&C ECI 1006 E&C EDAG 6037E SS E&C EDAG 6038E SS E&C EDAG 7019 E&C EDAG PE 007 E&C GC 10 HF 212 PC 40 UMF ECCOBOND EN 3838T ECCOBOND EO1072 UV 9060F TECHNOMELT 6208S TECHNOMELT AS 4226 E 1216M FP4531 UF 3811 ECCOBOND DS 7301 ECCOBOND DS 8027LV ECCOBOND DS 3318BK ECCOBOND DS 3318LV ODF 1020 ODF 1030 Materials for Wearable Electronics 3

4 ADHESIVES IN ACTION CONFORMAL COATING SENSOR ENCAPSULANT FLEX ATTACH ENCAPSULANT COMPONENT UNDERFILL CONDUCTIVE ADHESIVE CONDUCTIVE INKS SOLDER PASTE LOW PRESSURE MOLDING 4 Materials for Wearable Electronics

5 BARRIER SEALANT ITO OVERCOAT ONE DROP FILL Materials for Wearable Electronics 5

6 FUNCTIONAL Critical to the function of any electrical device are the conductive materials that allow component interconnectivity. Henkel s line of high-performance solder pastes, electrically conductive adhesives and inks offers the processability, flexibility, product compatibility and low cost of ownership needed for wearable functionality and cost-effective production. ABLESTIK 2030SC CONDUCTIVE ADHESIVES ABLESTIK CE 3103WLV FUNCTIONAL INKS SOLDER PASTES ABLESTIK CE 3104WXL ECI 1001 E&C ECI 1005 E&C ECI 1006 E&C EDAG 6037E SS E&C EDAG 6038E SS E&C EDAG 7019 E&C EDAG PE 007 E&C GC 10 HF 212 Conductive Adhesives ABLESTIK 2030SC Fast, low-temperature cure. Good adhesion to inks and metals. ABLESTIK CE 3103WLV Dispensible material. Good adhesion to inks and metals. ABLESTIK CE 3104WXL Printable material. Good adhesion to inks and metals. Cure C C C Volume Resistivity, Ohms-cm Modulus, N/mm 2 3,300 4,500 4,500 6 Materials for Wearable Electronics

7 Inks Applications Volume Resistivity, Ohm/sq./mil. ECI 1001 E&C Screen printable, lowcost silver ink. Consumer: Membrane switches, printed heaters ECI 1005 E&C High-speed, silver-based ink for flexographic and rotogravure processes. Adheres to a wide variety of substrates. Consumer: Printed electronic circuitry; Medical: Biosensors ECI 1006 E&C Halogen-free, silver-filled, printable ink with fine line printing capabilities and adhesion to ITO. Displays: Touch screens EDAG 6037E SS E&C Screen-printable, silver / silver chloride conductive ink for electrode material in biomedical-sensing devices. Blend with EDAG 6038E SS E&C for custom performance. Medical: Tens pads, iontophoretic, screen-printable inks EDAG 6038E SS E&C Screen-printable, silver / silver chloride conductive ink electrode material in biomedical-sensing devices. Blend with EDAG 6037E SS E&C for custom performance. Medical: Tens pads, iontophoretic, screenprintable inks EDAG 7019 E&C Screen-printable, silver / silver chloride conductive ink for use in the manufacture of electrically conductive medical devices. Medical: Tens pads, iontophoretic, screen-printable inks EDAG PE 007 E&C Silver / silver chloride ink for flexographic / rotogravure printing on plastic film. Medical: EKG pads, tens pads, biosensors, high-speed printing < < < < < < < Chemistry Solvent Water-based Solvent Solvent Solvent Solvent Solvent Conductive Medium Silver Silver Silver Silver / Silver Chloride Silver / Silver Chloride Silver / Silver Chloride Silver / Silver Chloride Solder Pastes GC 10 HF 212 Room temperature-stable, no-clean, halogen-free, lead-free solder paste. No-clean, halogen-free, lead-free solder paste. Available with high-temperature reliability enhanced alloy (90iSC). Alloy SAC iSC SAC 305 Metal Loading (% Weight) Particle Size Distribution AGS (type 3) DAP (type 4) AGS (type 3) DAP (type 4) IPC/J-STD-004B Classification ROL0 ROL0 Materials for Wearable Electronics 7

8 RELIABILITY-ENHANCING Wearable electronics demand a high degree of reliability and consistent repeatability. They need to survive challenging and varied environments, and maintain performance after being dropped, bent or exposed to water or other fluids. Exceptional moisture, shock, drop and vibration protection is why today s top wearables manufacturers rely on Henkel. With award-winning underfills, encapsulants, conformal coatings and TECHNOMELT low pressure molding materials, Henkel provides the reliability wearable devices require for consistent performance and long life cycles. CONFORMAL COATING PC 40 UMF ECCOBOND EN 3838T RELIABILITY- ENHANCING ENCAPSULANTS LOW PRESSURE MOLDING UNDERFILLS ECCOBOND EO1072 UV 9060F TECHNOMELT 6208S TECHNOMELT AS 4226 E 1216M FP4531 UF 3811 Conformal Coating PC 40 UMF Benefits Low-viscosity liquid polymer applied by spray or dip allowing for a uniform thin coating. Cured coating protects PCBs from impact of harsh environments such as high humidity, chemical exposure and thermal shock. Easily sprayed Fast UV cure Moisture cure for shadowed areas Improved fluorescence for inspection Halogen free Viscosity, cp Cure Methods UV and moisture Storage 25 C, mpa 1,929 WVTR, mg/m 2 /day (50 C/100% RH) < 30 8 Materials for Wearable Electronics

9 Encapsulants ECCOBOND EN 3838T ECCOBOND EO1072 UV 9060F Low T g thermal cure encapsulant provides physical protection for electronic components. Thermal cure encapsulant provides physical protection for connectors and sensitive components in handheld devices. Moisture protection for electronic parts used in connectors, handheld and medical device applications. Benefits Reworkable Flexible / low modulus One component Fast cure High T g Low extractable ionics High performance Good shelf life Fast curing Halogen free Fast cure One component Cures in shadowed areas Easy dispensability without stringing (jet capable) Fluorescent under UV light Cure > C C mw/cm 2 (365 nm) Depth of Cure N/A N/A > 0.25 in. 25 C, mpa s 6,700 80,000 11,000 Glass Transition Temperature (T g ), C C, N/mm ,700 2,200 Low Pressure Molding TECHNOMELT 6208S TECHNOMELT AS 4226 Thermo-plastic resin technology that provides full encapsulation of electronics and protection from harsh environments such as high humidity, chemical exposure and thermal shock. Its fast and easy process requires no mixing and improved throughput. Benefits Good adhesion to PCB surfaces and metal traces Excellent flexibility Provides electrical insulation 95 C UL RTI rating Water tight encapsulation UV stabile Low moisture uptake Appearance Black Optically Transparent Service Temperature Range, C -40 C to 130 C -40 C to 85 C Softening Point, C C, cp 3,600 16,750 Hardness 78, Shore A 45, Shore D Elongation, % Materials for Wearable Electronics 9

10 RELIABILITY-ENHANCING Underfills E 1216M FP4531 UF 3811 Non-reworkable, high-reliability underfill. Underfill for CSP and flip-chip on flex circuits. Flexible, high T g, reworkable underfill. Benefits RoHS compliant Under 900 ppm total halogens Excellent thermal cycle performance Excellent drop impact performance High T g Very low CTE Fast cure Room-temperature flow capability Halogen-free Good thermal cycling reliability Excellent drop impact performance 25 C, mpa.s 4,000 10, Pot 25 C, days Glass Transition Temperature (T g ), C Coefficient of Thermal Expansion, ppm/ C Cure C C C 10 Materials for Wearable Electronics

11 FOR USER INTERFACES From LCD to LED and the emerging OLED, there are numerous types of displays, or user interfaces, and each has its own unique manufacturing requirements. Not only has Henkel formulated some of the industry s most promising OLED sealants, ODF adhesive materials and ITO overcoat materials, it has also invested in and partnered with leading developers of next-generation display technologies to help accelerate display advances. FOR USER INTERFACES DISPLAY SEALANTS ITO OVERCOAT MATERIAL ODF ECCOBOND DS 7301 ECCOBOND DS 8027LV ECCOBOND DS 3318BK ECCOBOND DS 3318LV ODF 1020 ODF 1030 Display Sealants ITO Overcoat Material ODF Materials ECCOBOND DS 7301 ECCOBOND DS 8027LV ECCOBOND DS 3318BK ECCOBOND DS 3318LV ODF 1020 ODF 1030 Appearance Beige Translucent Black Transparent Light Yellow Light Yellow Applications OLED Sealant OLED Sealant Flex / ITO Enhancement Cure C 7.5 mj/cm mj/cm 2 (LED Cure) Flex / ITO Enhancement 800 mj/cm 2 (LED Cure) ODF Seal 100 mw/cm 2 (365 nm) C ODF Seal 100 mw/cm 2 (365 nm) C 25 C, mpa S ,000 1, , ,000 Glass Transition Temperature (T g ), C WVTR, g.mil/100 in. 2 /day Peel Strength PI Film-ITO Glass, N/mm 15 (Glass to ITO) 17 (Glass to ITO) Materials for Wearable Electronics 11

12 AMERICAS HEADQUARTERS: UNITED STATES Henkel Electronic Materials LLC Jamboree Road Irvine, CA USA Tel: Tel: Customer Support: Fax: Henkel Electronic Materials LLC Susana Road Rancho Dominguez, CA USA Tel: Fax: BRAZIL Henkel Brazil Av. Prof. Vernon Krieble, Itapevi, Sao Paulo, Brazil Tel: ASIA-PACIFIC CHINA No. 332 Meigui South Road WaiGaoQiao Free Trade Zone Shanghai , P.R. China Tel: Fax: Henkel Huawei Electronics CO. LTD Songtiao Industrial Park Lianyungang Jiangsu Province China Tel: Fax: JAPAN Henkel Japan Ltd. 27-7, Shin Isogo-cho Isogo-ku Yokohama, Japan Tel: KOREA Henkel Technologies (Korea) Ltd. 8th Floor Dae Ryung Techno Town II Gasan-dong, Geumcheon-gu, Seoul Korea Tel: EUROPE BELGIUM Henkel Electronics Materials (Belgium) N.V. Nijverheidsstraat 7 B-2260 Westerlo Belgium Tel: Fax: UNITED KINGDOM Henkel Ltd. Adhesives Limited Technologies House Wood Lane End Hemel Hempstead Hertfordshire HP2 4RQ Tel: Fax: Across the Board, Around the Globe. All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the U.S., Germany and elsewhere Henkel Corporation. All rights reserved /LT-8117 (6/15)