Advanced packaging technologies for MEMS Gregor Woldt, Head of R&D Dr. Gregor Zwinge, Managing Director

Transcription

1 Advanced packaging technologies for MEMS Gregor Woldt, Head of R&D Dr. Gregor Zwinge, Managing Director Microelectronic Packaging Dresden GmbH

2 A First Sensor Company MPD is an integral part of First Sensor AG, Berlin Total sales 2012: 120 Mio ; 13 companies, >750 employees, Shares: Prime Standard WKN MPD focusses on customized solutions for packaging of semiconductor sensors Sales: 2010: 18,1 Mio., 2011: 23,8 Mio., 2012: 25,0 Mio. 175 employees, thereof: 20% engineering, 65 % manufacturing Backend materials and interconnection expertise since 1961 Quality system: ISO/TS certified; DIN in preparation Founding member of Silicon Saxony e.v., the biggest microelectronic association / cluster in Europe Microelectronic Packaging Dresden GmbH 2 Sep-12 Wdt / GZ

3 Technologies for semiconductor packaging Process flow of 5 20 assembly steps 4 core technologies: dicing die-bonding wire bonding encapsulation Combination of materials, substrates, form factors and application is determining the packaging solution for each sensor Customization is mandatory whenever a standard leadframe/mold package is not feasable for the functionality of a MEMS or optoelectronic sensor Microelectronic Packaging Dresden GmbH 3 Sep-12 Wdt / GZ

4 Special requirements for MEMS product Coupling of MEMS sensing functions via housing necessary Functionality of sensors within defined temperature range Calibration procedures possible Avoidance of hysteresis (temp., magnetic field, pressure, ) mandatory Tradeoff betwenn soft coupling (stress avoidance, function of sensor) and hard coupling (assembly, exactness, rigidity) necessary Short signal paths to signal processing ADC / CDC / ASIC / µcontroller Robustness, long lifetime Extreme environmental conditions, especially for security devices Microelectronic Packaging Dresden GmbH 4 Sep-12 Wdt / GZ

5 Gyro Sensors Packaging tasks for gyroscope sensors Sensor Module: Sensor coupling: Application: gyro sensor and ASIC package/housing automotive, industrial (security) Temperature range: -40 C +125 C Device: Production scale: Positioning accuracy: 25 µm Special requirements: DIL or LCC package medium series ( p.a) low thermomechanical strain soft adhesion chip/substrate Microelectronic Packaging Dresden GmbH 5 Sep-12 Wdt / GZ

6 Gyro Sensors Construction example: plastic DIL package low strain-level die bonding chip-to-chip thermosonic wire bonding silicone encapsulation Microelectronic Packaging Dresden GmbH 6 Sep-12 Wdt / GZ

7 Gyro Sensors Realisation 1: thermosonic chip-to-chip wire bonding Microelectronic Packaging Dresden GmbH 7 Sep-12 Wdt / GZ

8 Gyro Sensors Realisation 1: die-bonding, wire bonding, encapsulation Microelectronic Packaging Dresden GmbH 8 Sep-12 Wdt / GZ

9 Gyro Sensors Realisation 2: die-stacking chip-to chip wire bonding LCC housing bistage epoxy sealing of ceramic lid lower chip: ASIC upper chip: MEMS LCC package Microelectronic Packaging Dresden GmbH 9 Sep-12 Wdt / GZ

10 Packaging tasks for inclination sensors High Precision Inclination Sensors Sensor Module: sensor and ASIC (CDC) Sensor coupling: package/housing Application: industrial, aerospace Device: CLDCC package Production scale: small series ( p.a) Positioning accuracy: 25 µm Special requirements: lowest thermomechanical strain Microelectronic Packaging Dresden GmbH 10 Sep-12 Wdt / GZ

11 High Precision Inclination Sensors Construction solutions for single and double sensors Microelectronic Packaging Dresden GmbH 11 Sep-12 Wdt / GZ

12 High Precision Inclination Sensors Applikation solutions: topside and backside coupling to system electronics pcb w/ connector housing housing lid sensor sample leads on backside frontside Microelectronic Packaging Dresden GmbH 12 Sep-12 Wdt / GZ

13 High Precision Inclination Sensors Realisation 1: 2-channel inclination sensors rotation of ASIC to avoid bond wire crossings Microelectronic Packaging Dresden GmbH 13 Sep-12 Wdt / GZ

14 High Precision Inclination Sensors Realisation 2: 2-channel inclination sensor stacked dies soft glueing of dies ASIC assembly on sensor chip chip-to-chip ultrasonic bonding Microelectronic Packaging Dresden GmbH 14 Sep-12 Wdt / GZ

15 Pressure Sensor / PCB Packaging Tasks Sensor module: Pressure range: Exposure to media: Application: Device: Production scale: Specialties: Pressure Sensor, ASIC and SMD 0 1 bar direct to membrane w/o filling automotive (braking booster, gasoline pipe, etc.) Multi-chip-module pcb laminate, pressure sensor on glass/metal carrier pieces p.a. molding of assembled housing (in booster, piping, etc.) Microelectronic Packaging Dresden GmbH 15 Sep-12 Wdt / GZ

16 Pressure Sensor / PCB Construction solution Microelectronic Packaging Dresden GmbH 16 Sep-12 Wdt / GZ

17 Pressure Sensor / PCB Realisation Microelectronic Packaging Dresden GmbH 17 Sep-12 Wdt / GZ

18 MOEMS: Optoelectronic MEMS Sensors Packaging Tasks Sensor type: Sensor module: Sensor coupling: Application: Device: Production scale: Specialties: Thermopile type, line arrays Sensor & ASIC on substate; redistribution ceramic optional IR glass window in metal lid industrial PGA Small series low strain chip mounting open membrane on chip Microelectronic Packaging Dresden GmbH 18 Sep-12 Wdt / GZ

19 MOEMS: Optoelectronic MEMS Sensors Construction T/r 19mm 0.6 pitch L i n e A r r a y ASIC 2.50mm 2.0mm 3.17mm 3.0mm 0.7mm Nonconductive epoxy IR Filter window Laser weld or resistance seam seal 0.1 pitch 19mm 1mm 1mm 2.5mm 4.5mm Ceramic substrate 5mm conductive epoxy 19mm 3.600mm 3.000m m mm mm 0.250mm 0.380mm Microelectronic Packaging Dresden GmbH 19 Sep-12 Wdt / GZ

20 MOEMS: Optoelectronic MEMS Sensors Realisation 1: Metal-glass package w/ ceramic subtrate Microelectronic Packaging Dresden GmbH 20 Sep-12 Wdt / GZ

21 Realization 2: TO package MOEMS: Optoelectronic MEMS Sensors Microelectronic Packaging Dresden GmbH 21 Sep-12 Wdt / GZ

22 3D-Packaging Projected 3D- (2,5D...)Integration Actual reserch collaboration project VERIMIS Use of a structured pcb insted of ceramic advanced mechanical structuring for pcb: high precision countersink cost advantages for niche products High-level integration of MEMS, ASICS, µcontroller, Periperals Intended: integration of via last TroughSiliconVias Microelectronic Packaging Dresden GmbH 22 April_2013 GZ

23 3D-Packaging Construction outline of VERIMIS Microelectronic Packaging Dresden GmbH 23 April_2013 GZ

24 3D-Packaging VERIMIS First Samples Microelectronic Packaging Dresden GmbH 24 April_2013 GZ

25 Большóe спасибо. Thank you for your attention. До скόрой встрéчи в Дрэздэнe! Contact R&D Sales Managing Director ++49/351/ Gregor Woldt Eckhard Schulze Thomas Ruf Gregor Zwinge