Thermal Materials for High Power Electronics. May 27, 2015

Transcription

1 Thermal

2 Contents 1. Market - High Power Electronics 2. Material Focus 3. Thermal Management Materials 1. Roadmap 2. TIM Portfolio Progression 3. Value Proposition 4. Key Attributes 5. Printing 6. Successes 7. Product Ordering Information 2

3 High Power Electronics SiC IGBT and High Power Modules SiC Schottky Diode SiC High voltage Components (e.g. TO >1200V) High Power SiC Devices Low power loss, high reliability High operating temperature 3

4 Market Trends Pre-applied Phase Change Thermal Interface Material Drivers High operating temperature High reliability, power cycling Low stress materials Ease of processing 4

5 Power Electronics Thermal Interface Material High Reliability, Ease of Use Improved Cooling Performance Product Features May be Applied in Various Patterns Dry to the Touch at Room Temp Silicone Free Technology Development Roadmap TIM2 (Printable Paste) CTM TCP 7800NC 175C Open Bake Stable Launched Development Research 5

6 TIM2 for Power Modules Portfolio Progression Started as Film in 2006 Powerstrate Xtreme 2007: Dispensable (needle print) PSX-D Fast Dry Formulation 2009: Printable PSX-Pm Medium Dry Formulation PSX-Pe Extended Dry Formulation Now: Next Generation Printable PCTIM CTM TCP 7800NC (Pure Dielectric Version) Medium Dry, 125 o C stable open bake 6

7 TIM2 for Power Modules Value Proposition Power Module CPU Source: Infineon AG Grease TIM2 materials can pump-out over time from thermo-mechanical stress, causing failure. 7

8 TIM2 for Power Modules Value Proposition Wind farm in the North Sea High Speed Train A failed high power package can lead to expensive replacement costs 8

9 TIM2 for Power Modules Value Proposition Pre-Applied TIM Source: Infineon Current TIM materials from Henkel offer: Flexibility with thickness and geometries Optimum thermal contact, bondline low pressure Increase of semiconductor efficiencies Pre-application without preheating Cost savings by hot-spot marking patterns Eliminates part number complexity, toolings, liners Non-silicone Reliable cycling behavior Damage-free re-workability 9

10 Henkel Printable Thermal Interface Materials Key Attributes Product attribute High thermal conductivity 3.0 to 3.4 W/m K Benefits Improved cooling performance allows for use of smaller, lighter and more cost effective heat sinks Dispensable/Printable Can be applied in various patterns and thicknesses manually, with dispense equipment or with a printer Dries to a solid phase change compound Dry to the touch at room temperature after solvents have time to flash off Excellent Long Term Reliability Offers long term reliability associated with Loctite materials 10

11 Vertical Stability 20 mm x 20 mm Thixotropic properties: After C Material remains stable, no changes in dimension 25 mm x 25 mm 11

12 Long-term 125 C (Open Bake) 1.5 CTM R th [ C/W] T [h] No degradation seen after 1000 hours Slide 12

13 Thermal cycling -40 to 150C CTM Rth measurements taken at 20 and 102C No degradation observed after 1500 cycles 13

14 Thermal cycling -40 to 150C TCP 7800NC 0.25 Thermal Resistivity cm2 C/W Thermal Cycles Rth measurements taken at 20 and 102C No degradation observed after 1500 cycles 14

15 TCP 7800NC Rth vs Pressure (ASTM-D5470) Thermal Resistance versus Pressure TCP 7800NC Thermal Resistance ( C/W) C 85C 100C Pressure (psi) Higher pressure decreases bond line thickness and subsequently reduces thermal resistance. 15

16 TCP 7800NC 125C Aging (ASTIM-D5470) Thermal Resistant versus Pressure 125 C Open Baking - Measuring at 70 C Thermal impedance ( C cm^2/w) Fresh 1000 hours Pressure (psi) High thermal stability. Thermal impedance remained same after open baking for 1000 hours at 125 C. 16

17 TCP 7800NC 150C Aging (ASTIM-D5470) Thermal Resistant versus Pressure 150 C Open Baking - Meauring at 70 C Thermal impedance ( C*cm^2/W) Fresh 500 hours Pressure (psi) Even at 150 C open baking, thermal impedance remained stable for 500 hours. 17

18 Product Comparison Product Dry Type (see next slide for times) Thermal Conductivity Filler Type Typical minimum bondline thickness Solvent Content by volume (before drying) Melt Point (After drying) Open Bake Stability (1000hrs) TCP 4000D Fast Dry Electrically Conductive 25µm 18.7% TCP 4000DLV Fast Dry 25µm 22.4% TCP 4000PM Medium Dry 3.4 W/mk 25µm 18.3% 100C TCP 4000PE Extended Dry 25µm 20.5% 45C TCP 7800NC Medium Dry 3.0 W/mk Electrically Non-conductive 50µm 24.8% 125C CTM Medium Dry 3.0 W/mk Electrically Conductive 25µm 20.2% 18

19 Dry Times Product Fast Dry Formulation (TCP 4000D, TCP 4000DLV) Medium Dry Formulation (TCP 4000PM, CTM *, TCP 7800NC**) Extended Dry Formulation (TCP 4000PE) Thickness Dry Time at 22 C Dry Time at 60 C Dry Time at 125 C 2 mil 30 minutes 3½ minutes 3 minutes 6 mil 2½ hours 8 minutes 3 minutes 10 mil 5 hours 21 minutes 4 minutes 2 mil 30 hours 22 minutes 3 minutes 6 mil 50 hours 50 minutes 4½ minutes 10 mil 65 hours 65 minutes 8 minutes 2 mil Not 4 hours 7 minutes 6 mil Recommended 11½ hours 12 minutes 10 mil > 500 hours 18½ hours 18 minutes * CTM : 125C open bake stable. Electrically conductive filler. **TCP 7800NC: 125C open bake stable. Electrically non-conductive filler. 19

20 Printing Material is compatible with any screen or stencil printing equipment DEK, MPM, Ekra, New Long Several customers use DEK printers The following printing study was completed with PSX-Pm. Other variants behave similarly 20

21 Printing Printing Process Stencil Design Squeegee speed Slow max 30mm/sec Stencil type Stainless steel Squeegee pressure Medium to high Stencil thickness µm Squeegee type Metal Blade 60 Stencil pattern Honeycomb Separation Speed Slow 0.5mm/sec D1 dimension 3.5mm D2 spacing 0.5mm Apertures for stencil design Should we leave the stencil design to the customer? Bin 21

22 Stencil Printing Roll: The circular motion of the paste as it moves across the stencil Squeegee Paste Compound Drop-off: The tendency for the paste to fall off the squeegee blade after printing Paste Bead Paste Curtain 22

23 The Squeegee Blades PU Rubber Stainless Steel 23

24 Stencil Printing Key machine settings: Print speed: 15 mm/s Print 100 N (across a 30 cm long squeegee) Release speed: Slowest possible on machine Test 1: Printing Patterns (7 mm ) of twenty printings without pause or cleaning of the underside of the stencil to establish print stability Test 2: Printing of 1 PCB, leave for a determined period of time (0.5h, 1hr, 2hrs) and print a second PCB to establish material abandon time. 7 mm 24

25 Stencil Printing Putting the compound on the stencil 25

26 Stencil Printing Stencil Fogging- A thin film across the stencil 26

27 Stencil Printing Print Speed - Adjust speed and pressure Squeegee sweeps clean 27

28 Stencil Printing 28

29 Stencil Printing 29

30 Print Patterns Print only where Compound is needed As thin as possible As thick as required Each application should have it s own custom print pattern 30

31 Lateral Heat flow at Power-up 31

32 Lateral Heat flow at Power-up 65 C Uniform layer - No trapped air 32

33 Stencil Printing Results Adequate printing was achieved with standard stencil printers used for solder paste (MPM) More than 20 consistent prints without a requirement for stencil cleaning is adequate for most printing applications An abandon time of two hours is acceptable for mass production Negligible reduction in printed material is seen during the 20 printings The relatively high viscosity requires adequate print pressure, slow print speeds, slow withdrawal of the substrate from the stencil The change of specific gravity is compensated by the layout of the printing stencil or screen Dried and after mounting the compound shows a good lateral flow and distribution at heat up above phase change temperature Process can easily be automated for mass production with consistent results 33

34 Removeability 34

35 TIM2 for Power Modules Successes PSX-P Pre-applied at Vincotech: Loctite Pre-applied at Infineon (video on right side of web page): 35

36 TIM2 for Power Modules Product Sampling Information Product IDH Package Size Contact TCP 4000D Kg Jar CSR TCP 4000DLV Kg Jar CSR TCP 4000PM oz Semco (0.5kg) CSR TCP 4000PE oz Semco (0.5kg) CSR TCP 7800NC oz Semco (0.5kg) CSR CTM TBD 12oz Semco (0.5kg) Jason.brandi@henkel.com 36

37 Summary High Power Electronics Material Ambition Deliver key differentiated technology to growing market Engage and collaborate with key customers Leverage expertise from outside partnerships 37

38 Thank you! 38

39 Method 1: Cut Bar ASTM D5470 Heater ASTM D5470 T 1 T A T B T 2 T 3 Sample T 4 R Cold Plate TH T A T B P Assumptions uniformed thermal gradient All power applied goes through column 1D heat flow Junction to ambient thermal resistance Slide May 27, 2015 TMS 2012