Mated with IPBT-110-H1-T-S

Transcription

1 Project Number: Requested by: Brandon Harpenau Date: 2/17/2006 Product Rev: 1 Lot #: 0 Tech: Troy Cook/ Tony Wagoner Eng: Dave Scopelliti Qty to test: 50 Test Start: 03/17/2006 Test Completed: 4/20/2006 PMSS-1XX-XX-SP-XX.-X-XX DVT Report Mated with IPBT-110-H1-T-S

2 CERTIFICATION All instruments and measuring equipment were calibrated to National Institute for Standards and Technology (NIST) traceable standards according to IS l and ANSI/NCSL , as applicable. All contents contained herein are the property of Samtec. No portion of this report, in part or in full shall be reproduced without prior written approval of Samtec. SCOPE To perform the following tests: Modified DVT. PCB TST-XX. I will what I want you to test, please send me a flow chart and we will go from there, I just wanted the prepping to start. Mating connector IPBT T-S. APPLICABLE DOCUMENTS Standards: EIA Publication 364 TEST SAMPLES AND PREPARATION 1) All materials were manufactured in accordance with the applicable product specification. 2) All test samples were identified and encoded to maintain traceability throughout the test sequences. 3) After soldering, the parts to be used for LLCR and DWV/IR testing were cleaned according to TLWI ) Either an automated cleaning procedure or an ultrasonic cleaning procedure may be used. 5) The automated procedure is used with aqueous compatible soldering materials. 6) The ultrasonic procedure can be used with either aqueous or non-aqueous soldering components and follows:. Sample test boards are to be ultrasonically cleaned after test lead attachment, preparation and/or soldering.. Sample test boards are immersed into Branson 3510 cleaner containing Kyzen Ionox HC1 (or equivalent) with the following conditions:. Temperature: C+/- 5 C. Frequency: KHz. Immersion Time: ---5 to 10 Minutes. Sample test boards are removed and placed into the Branson 3510 cleaner containing deionized water with the following conditions:. Temperature: C +/- 5 C. Frequency: KHz. Immersion Time: ---5 to 10 Minutes. Sample test boards are removed and placed in a beaker positioned on a hot plate with a magnetic stirrer containing deionized water warmed to 55 C +/- 5 C for 1/2 to 1 minute.. Upon removal, the sample boards are rinsed for ½ to 1 minute at room temperature with free flowing deionized water.. After the final rinse, the sample test boards are dried in an air-circulating oven for 10 to 15 minutes at 50 C +/- 5 C.. Sample test boards are then allowed to set and recover to room ambient condition prior to testing. 7) Parts not intended for testing LLCR and DWV/IR are visually inspected and cleaned if necessary. 8) Any additional preparation will be noted in the individual test sequences. 9) Solder Information: 10) Re-Flow Time/Temp: See accompanying profile. 11) Internal Test PCBs used: PCB TST-XX

3 OVEN PROFILE (Soldering Parts to Test Boards)

4 Current Carrying Capacity FLOWCHARTS TEST STEP GROUP A 1 connector min 6 contacts powered 01 CCC Tabulate calculated current at RT, 65 C, 75 C and 95 C after derating 20% and based on 105 C CCC, Temp rise = EIA Mating/Unmating/Normal TEST GROUP A GROUP B1 GROUP B2 STEP 10 Connectors 5 Connectors 5 Connectors 50 Cycles 01 Contact Gaps Setup Approve Setup Approve 02 Mating / Unmating Normal Thermal Aging (Mated) 03 Data Review Data Review Normal Cycles 05 Mating / Unmating 06 Contact Gaps 07 Data Review 08 Thermal Aging (Mated) 09 Mating / Unmating 10 Contact Gaps 11 Data Review 12 Humidity (Mated) 13 Mating / Unmating 14 Contact Gaps Thermal Aging = EIA , Test Condition 4, 105 deg C; Time Condition 'B' (250 hours) Humidity =EIA , Test Condition 'B' (240 Hours) and Method III (+25 C to %RH to 98% RH) ambient pre-condition and delete steps 7a and 7b Mating/Un-Mating s = EIA Normal = EIA Contact Gaps/Height - No standard method. Usually measured optically

5 ` FLOWCHARTS Continued IR / DWV TEST GROUP A GROUP B1 GROUP B2 GROUP B3 STEP 3 Connectors 3 Connectors 3 Connectors 3 Connectors Ambient Ambient Thermal Humidity 01 IR DWV/ Thermal Aging Humidity 02 Data Review 03 Thermal Aging 04 IR 05 Data Review 06 Humidity 07 IR DWV/ DWV/ Thermal Aging = EIA , Test Condition 4, 105 deg C; Time Condition 'B' (250 hours) Humidity =EIA , Test Condition 'B' (240 Hours) and Method III (+25 C to %RH to 98% RH) ambient pre-condition and delete steps 7a and 7b IR = EIA DWV = EIA

6 ATTRIBUTE DEFINITIONS The following is a brief, simplified description of attributes. THERMAL: 1) EIA , Temperature Life with or without Electrical Load Test Procedure for Electrical Connectors. 2) Test Condition 4 at 105 C. 3) Test Time Condition B for 250 hours. 4) Connectors are sometimes mated and all samples are pre-conditioned at ambient. HUMIDITY: 1) Reference document: EIA , Humidity Test Procedure for Electrical Connectors. 2) Test Condition B, 240 Hours. 3) Method III, +25 C to + 65 C, 90% to 98% Relative Humidity excluding sub-cycles 7a and 7b. 4) Connectors are sometimes mated and all samples are pre-conditioned at ambient. TEMPERATURE RISE (Current Carrying Capacity, CCC): 1) EIA , Temperature Rise versus Current Test Procedure for Electrical Connectors and Sockets. 2) When current passes through a contact, the temperature of the contact increases as a result of I 2 R (resistive) heating. 3) The number of contacts being investigated plays a significant part in power dissipation and therefore temperature rise. 4) The size of the temperature probe can affect the measured temperature. 5) Copper traces on PC boards will contribute to temperature rise:. Self heating (resistive). Reduction in heat sink capacity affecting the heated contacts 6) A de-rating curve, usually 20%, is calculated. 7) Calculated de-rated currents at three temperature points are reported:. Ambient. 65 о C. 75 о C. 95 о C 8) Typically, neighboring contacts (in close proximity to maximize heat build up) are energized. 9) The thermocouple (or temperature measuring probe) will be positioned at a location to sense the maximum temperature in the vicinity of the heat generation area. 10) A computer program, TR 803.exe, ensures accurate stability for data acquisition. 11) Hook-up wire cross section is larger than the cross section of any connector leads/pc board traces, jumpers, etc. 12) Hook-up wire length is longer than the minimum specified in the referencing standard. CONTACT GAP 1) Contact gaps were measured before and after stressing the contacts (e.g. thermal aging, mechanical cycling, etc.). 2) Typically, all contacts on the connector are measured.

7 MATING/UNMATING: 1) Reference document: EIA , Mating and Unmating s Test Procedure for Electrical Connectors. 2) The full insertion position was to within to of the plug bottoming out in the receptacle to prevent damage to the system under test. 3) One of the mating parts is secured to a floating X-Y table to prevent damage during cycling. NORMAL FORCE (FOR CONTACTS TESTED OUTSIDE THE HOUSING): 1) Reference document: EIA , Normal Test Procedure for Electrical Connectors. 2) The contacts shall be tested in the loose state, not inserted in connector housing. 3) The contacts shall be prepared to allow access to the spring member at the same attitude and deflection level as would occur in actual use. 4) In the event that portions of the contact prevent insertion of the test probe and/or deflection of the spring member under evaluation, said material shall be removed leaving the appropriate contact surfaces exposed. 5) In the case of multi-tine contacts, each tine shall be tested independently on separate samples as required. 6) The connector housing shall be simulated, if required, in order to provide an accurate representation of the actual contact system performance. 7) A holding fixture shall be fashioned to allow the contact to be properly deflected. 8) Said holding fixture shall be mounted on a floating, adjustable, X-Y table on the base of the Dillon TC 2, computer controlled test stand with a deflection measurement system accuracy of 5 µm ( ). 9) The probe shall be attached to a Dillon P/N , 5 N (1.1 Lb) load cell providing an accuracy of ± 0.2%. 10) The nominal deflection rate shall be 5 mm (0.2 )/minute. 11) Unless otherwise noted a minimum of five contacts shall be tested. 12) The force/deflection characteristic to load and unload each contact shall be repeated five times. 13) The system shall utilize the TC 2 software in order to acquire and record the test data. 14) The permanent set of each contact shall be measured within the TC 2 software. 15) The acquired data shall be graphed with the deflection data on the X-axis and the force data on the Y-axis and a print out will be stored with the Tracking Code paperwork. INSULATION RESISTANCE (IR): To determine the resistance of insulation materials to leakage of current through or on the surface of these materials when a DC potential is applied. 1) PROCEDURE:. Reference document: EIA , Test Procedure for Electrical Connectors.. Test Conditions:. Between Adjacent Contacts. Electrification Time 2.0 minutes. Test (500 VDC) corresponds to calibration settings for measuring resistances. 2) MEASUREMENTS: 3) When the specified test voltage is applied (VDC), the insulation resistance shall not be less than 5000 megohms. DIELECTRIC WITHSTANDING VOLTAGE (DWV): To determine if the sockets can operate at its rated voltage and withstand momentary over potentials due to switching, surges, and other similar phenomenon. Separate samples are used to evaluate the effect of environmental stresses so not to influence the readings from arcing that occurs during the measurement process. 1) PROCEDURE:. Reference document: EIA , Withstanding Test Procedure for Electrical Connectors.. Test Conditions:

8 . Between Adjacent Contacts. Rate of Application 500 V/Sec. Test (VAC) until breakdown occurs 2) MEASUREMENTS/CALCULATIONS. The breakdown voltage shall be measured and recorded.. The dielectric withstanding voltage shall be recorded as 75% of the minimum breakdown voltage.. The working voltage shall be recorded as one-third (1/3) of the dielectric withstanding voltage (onefourth of the breakdown voltage).

9 RESULTS Temperature Rise, CCC at a 20% de-rating CCC for a 30 C Temperature Rise A per contact with 6 adjacent contacts powered Contact Gap Initial o Min o Max After 50 Cycles o Min o Max Thermal o Min o Max Humidity o Min o Max Mating Unmating s Initial o Mating Min Lbs. Max Lbs. o Unmating Min Lbs. Max Lbs. After 50 Cycles o o Mating Min Lbs. Max Lbs. Unmating Min Lbs. Max Lbs. Thermal o Mating Min Lbs. Max Lbs. o Unmating Min Lbs. Max Lbs. Humidity o Mating Min Lbs. Max Lbs. o Unmating Min Lbs. Max Lbs. Normal at.013 deflection Initial o Min grams Set o Max grams Set

10 Thermal o Min grams o Max grams minimums, IR Initial o Mated ,000 Meg Ω Pass o Unmated ,000 Meg Ω Thermal o Mated ,000 Meg Ω o Unmated ,000 Meg Ω Humidity o Mated ,000 Meg Ω o Unmated ,000 Meg Ω Dielectric Withstanding minimums, DWV Initial o Mated ,000 VAC Unmated ,000 VAC o DWV Mated ,000 VAC Unmated ,000 VAC o voltage Mated ,000 VAC Unmated ,000 VAC Thermal o Mated ,900 VAC Unmated ,200 VAC o o DWV Mated ,175 VAC Unmated ,400 VAC voltage Mated VAC Unmated VAC Humidity o Mated ,700 VAC Unmated ,900 VAC o o DWV Mated ,025 VAC Unmated ,175 VAC voltage Mated VAC Unmated VAC

11 DATA SUMMARIES TEMPERATURE RISE (Current Carrying Capacity, CCC): 1) High quality thermocouples whose temperature slopes track one another were used for temperature monitoring. 2) The thermocouples were placed at a location to sense the maximum temperature generated during testing. 3) Temperature readings recorded are those for which three successive readings, 15 minutes apart, differ less than 1 C (computer controlled data acquisition). 4) Adjacent contacts were powered:. Linear configuration with SIX adjacent conductors/contacts powered Maximum Current, Amp per Contact TC Contacts powered PMSS/IPBT Tested at 8.0 amps C Limit Base Curve Derated 20 % RT Peak Amp RT Derated Amp Measured Current 65 C 65 C Peak Amp 65 C Derated Amp 75 C 75 C Peak Amp 75 C Derated Amp Limit 95 C Peak Amp 95 C Derated Amp 95 C Room Temp 2.0 Useful Range Ambient Temperature, C

12 CONTACT GAPS: DATA SUMMARIES Continued Initial Measurements in inches After 50 Cycles Measurements in inches Minimum Minimum Maximum Maximum Average Average St. Dev St. Dev Count 100 Count 100 After Thermals Measurements in inches After Humidity Measurements in inches Minimum Minimum Maximum Maximum Average Average St. Dev St. Dev Count 100 Count 100 MATING/UNMATING: (Oz) Initial After 50 Cycles Mating Unmating Mating Unmating (Lbs) (Oz) (Lbs) (Oz) (Lbs) (Oz) (Lbs) Minimum Maximum Average After Thermal After Humidity (Oz) Mating Unmating Mating Unmating (Lbs) (Oz) (Lbs) (Oz) (Lbs) (Oz) Minimum Maximum Average (Lbs)

13 DATA SUMMARIES Continued NORMAL FORCE (FOR CONTACTS TESTED OUTSIDE THE HOUSING): 1) Calibrated force gauges are used along with computer controlled positioning equipment. 2) Typically, 8-10 readings are taken and the averages reported. Normal Compare Initial Thermal 150 Grams Deflection, Inches Initial Deflections in inches s in Grams SET Averages Min Max St. Dev Count Thermals Deflections in inches s in Grams SET Averages Min Max St. Dev Count

14 INSULATION RESISTANCE (IR): DATA SUMMARIES Continued Initial, Meg Ohms Thermal, Meg Ohms Humidity, Meg Ohms Mated Unmated Mated Unmated Mated Unmated Average Min Max DIELECTRIC WITHSTANDING VOLTAGE (DWV): Humidity, VAC Mated Humidity, VAC Unmated DWV DWV Average Min Max Test Until Occurs Thermal, VAC Mated Thermal, VAC Unmated DWV DWV Average Min Max Test Until Occurs Humidity, VAC Mated Humidity, VAC Unmated DWV DWV Average Min Max

15 CONTACT GAP: DATA Initial Measurements in inches Sample# B1 B2 B3 B4 B5 B6 B7 B8 B9 B After 50 Cycles Measurements in inches Sample# B1 B2 B3 B4 B5 B6 B7 B8 B9 B After Thermals Measurements in inches Sample# B1 B2 B3 B4 B5 B6 B7 B8 B9 B After Humidity Measurements in inches Sample# B1 B2 B3 B4 B5 B6 B7 B8 B9 B

16 MATING/UNMATING: Initial DATA Continued After 50 Cycles Mating Unmating Mating Unmating Sample# (Oz) (Lbs) (Oz) (Lbs) (Oz) (Lbs) (Oz) (Lbs) After Thermal After Humidity Mating Unmating Mating Unmating Sample# (Oz) (Lbs) (Oz) (Lbs) (Oz) (Lbs) (Oz) (Lbs)

17 DATA Continued NORMAL FORCE (FOR CONTACTS TESTED OUTSIDE THE HOUSING): Initial Deflections in inches s in Grams Sample # SET Thermals Deflections in inches s in Grams Sample # SET INSULATION RESISTANCE (IR): Initial, Meg Ohms Thermal, Meg Ohms Humidity, Meg Ohms Mated Unmated Mated Unmated Mated Unmated Sample #

18 DATA Continued DIELECTRIC WITHSTANDING VOLTAGE (DWV): Humidity, VAC Mated Humidity, VAC Unmated Sample # DWV DWV Thermal, VAC Mated Thermal, VAC Unmated Sample # DWV DWV Humidity, VAC Mated Humidity, VAC Unmated Sample # DWV DWV

19 EQUIPMENT AND CALIBRATION SCHEDULES Equipment #: MO-02 Description: Multimeter /Data Acquisition System Manufacturer: Keithley Model: 2700 Serial #: Accuracy: See Manual Last Cal: 05/12/06, Next Cal: 05/12/07 Equipment #: MO-04 Description: Multimeter /Data Acquisition System Manufacturer: Keithley Model: 2700 Serial #: Accuracy: See Manual Last Cal: 01/31/06, Next Cal: 01/31/07 Equipment #: PS-01 Description: System Power Supply Manufacturer: Hewlett Packard Model: HP 6033A Serial #: (HP) 3329A Accuracy: See Manual Last Cal: 05/12/06, Next Cal: 05/12/07 Equipment #: TC /105 Description: IC Thermocouple-103/105 Manufacturer: Samtec Model: Serial #: TC /105 Accuracy: +/- 1 degree C Last Cal:, Next Cal: Equipment #: OGP-01 Description: 6''X 6'' Video Measuring Machine Manufacturer: Optical Gauging Products Model: Smartscope 200 CFOV Serial #: SF Accuracy: See Manual Last Cal: 04/12/06, Next Cal: 04/12/07 Equipment #: TCT-03 Description: Dillon Quantrol TC2 Test Stand Manufacturer: Dillon Quantrol Model: TC2 Serial #: Accuracy: Speed Accuracy: +/- 5% of indicated speed; Displacement: +/- 5 micrometers. Last Cal: 5/12/06, Next Cal: 5/12/07

20 Equipment #: LC-250N (icell) Description: 250 Newton load cell for Dillon Quantrol test stand Manufacturer: Dillon Quantrol Model: icell Serial #: Accuracy:.10 % of Capacity.10 % of Capacity Last Cal: 5/10/2006, Next Cal: 5/10/2007 Equipment #: OV-03 Description: Cascade Tek d Air Oven Manufacturer: Cascade Tek Model: TFO-5 Serial #: Accuracy: Temp. Stability: +/-.1C/C change in ambient Last Cal: 05/12/06, Next Cal: 05/12/07 Equipment #: THC-01 Description: Temperature/Humidity Chamber Manufacturer: Thermotron Model: SM Serial #: Accuracy: See Manual Last Cal: 7/15/2005, Next Cal: 8/15/2006 Equipment #: TCT-04 Description: Dillon Quantrol TC mm/min series test stand Manufacturer: Dillon Quantrol Model: TC2 I series test stand Serial #: Accuracy: Speed Accuracy: +/- 5% of indicated speed; Speed Accuracy: +/- 5% of indicated speed; Last Cal: 05/16/2006, Next Cal: 05/16/2007 Equipment #: LC-5N (icell)-2 Description: 5 Newton load cell for Dillon Quantrol test stand Manufacturer: Dillon Quantrol Model: icell Serial #: Accuracy:.10 % of capacity Last Cal: 5/10/2006, Next Cal: 5/10/2007 Equipment #: HPM-01 Description: Hipot Megommeter Manufacturer: Hipotronics Model: H306B-A Serial #: M Accuracy: 2 % Full Scale Accuracy Last Cal: 5/12/06, Next Cal: 05/12/07