ACX Advanced Ceramic X

Transcription

1 BF 2012 Series Multilayer Chip Band-Pass Filters Features Ultra small SMD type with low loss at passband and high attenuation at stop-band. Applications 0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth modules, Hyper-LAN, etc. Specifications Part Number Freq. Range (MHz) Insertion BW (db) BW Frequency Attenuation (db) 4000MHz 35 min. BF ~ 3.5 max. 2.5 max. 4500MHz 35 min. L5R5DAC_ MHz 40 min. Q ty/reel (pcs) : 4,000 Operating Temperature Range : -40 ~ +85 o C Storage Temperature Range : -40 ~ +85 o C Storage Period : 12 months max.* *12 months in vacuum sealed bag and 1 week after opened. Please keep unused parts in vacuum sealed bags. Solder Paste : SAC 305 type is recommended. Power Capacity : 500mW max. Part Number BF L 5R5 DAC /LF Type BF : Band-Pass Filter Dimensions ( L W ) mm Material Code L Frequency Range 5R5=5500MHz Specification Code DAC Packaging Soldering =lead-containing /LF=lead-free T: Tape & Reel B: Bulk Terminal Configuration No. Terminal Name No. Terminal Name GND GND OUT IN BF2012-L5R5DACT/LF REV:2 PAGE:1/7

2 Dimensions and Recommended PC Board Pattern c d a Unit : mm W b c L T Mark L W T a b c d Dimensions Solder Resist Land Through-hole ( 0.35) * Line width should be designed to match 50 characteristic impedance, depending on PCB material and thickness. BF2012-L5R5DACT/LF REV:2 PAGE:2/7

3 Measuring Diagram Port 1 Network Port 2 Analyzer (50 ) (50 ) GND I/O I/O GND Electrical Characteristics (T=25 o C) 0-10 db(s(2,2)) db(s(1,1)) db(s(2,1)) freq, GHz Notes The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order. BF2012-L5R5DACT/LF REV:2 PAGE:3/7

4 Taping Specifications Tape Dimensions (Unit: mm) & Quantity A D 1.75 ± C E F T EMBOSS B A TAPE Type A A B C D E F T Quantity/reel Tape material ± 4.0± 1.35± 2.15± 2.0± 3.5± 8.0± 1.08± 4,000pcs Plastic (Embossed) Reel Dimensions (Unit: mm) Label 1.4 ± ± 1 60±1 Label: Customer s Name, P/N, Q ty, Date, A 13.5±0.5 B Corp. Type A B ± ±0.3 Leader and Trailer Tape Trailer End Trailer (160 mm min.) Empty Compartments with Cover Tape (500 mm min.) BF2012-L5R5DACT/LF REV:2 PAGE:4/7

5 Peel-off Force Peeling Direction <10 0 Top Cover Tape Carrier Tape Peel-off force should be in the range of 0.6 N at a peel-off speed of 300±10 mm/min. Storage Conditions (1) Temperature: +5 ~35, relative humidity (RH): 45~75%. (2) Non-corrosive environment. Notes The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order. BF2012-L5R5DACT/LF REV:2 PAGE:5/7

6 Mechanical & Environmental Characteristics Item Requirements Procedure 2. More than 75% of the terminal 1. Preheat: o C electrode shall be covered with 2. Solder: o C for 5 1 sec new solder Solderability Soldering strength (Termination Adhesion) 1. 1kg minimum 1. Solder specimen onto test jig. 2. Apply push force at 0.5mm/s until electrode pads are peeled off or ceramic are broken. Pushing force is applied to longitude direction 1. Solder specimen onto test jig (FR4, 0.8mm) using the recommend soldering profile. 2. Apply a bending force of 2mm deflection Pressure Rod Deflection (Substrate Bending) R230 90mm Heat/Humidity Resistance Thermal shock (Temperature Cycle) after test after test 1. Temperature: 85 2 o C 2. Humidity: 90% ~ 95% RH 3. Duration: 1000±48hrs 4. Recovery: 1-2hrs 1. One cycle/step 1:125 ± 5 C for 30 min step 2:- 40 ± 5 C for 30 min 2. No of cycles: Recovery:1-2 hrs Low Temperature Resistance after test 1. Temperature: -40 o 5 o C 2. Duration: 500 ±24hrs 3. Recovery: 1-2hrs BF2012-L5R5DACT/LF REV:2 PAGE:6/7

7 Soldering Conditions Typical Soldering Profile for Lead-free Process Reflow Soldering : Temperature ( o C) 250 o C 217 o C o C 10s max. Pre-heating 60-90s. Time (s.) s Notes The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order. Corp. 16 Tzu Chiang Road, Hsinchu Industrial District Hsinchu Hsien 303, Taiwan TEL: FAX: acx@acxc.com.tw BF2012-L5R5DACT/LF REV:2 PAGE:7/7