RF Transformer (Stabilized Matching Device) SMST21NMHB series
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- Everett Hicks
- 6 years ago
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1 1 Features RF Transormer Stabilized Matching Device is RF impedance matching components. You can adjust impedance matching easily between antenna and eeding point, when you use RF Transormer. RF Transormer has very ew requency characteristics. So it s extremely useul or RF impedance matching. Small size : 2.0 x 1.25 x 0.6 mm 3 2 Part Number Coniguration SMST 21 NMHB Product ID (SMST = Antenna Matching device) 2 Dimension Code (Unit : mm) Code Dimension x Control Code 4 Serial Number RoHS Compliant Halogen ree T/R only. 1 October.2013
2 3 Construction Dimensions 3.1 Dimensions L TOP VIEW W 1 pin mark SIDE VIEW T a b a d (2) BOTTOM VIEW c (1) (3) (4) e e Unit:mm Mark Size Mark Size L / c / W / d / T / e / a / / b / Pin Coniguration Pin No. Pin Name Description (1) GND Ground (2) RF port (Radiator) (3) NC No connect (4) RF port (RFIC) 2 October.2013
3 3.3 Circuit Diagram SMST21NMHB-*** L1 Radiator RF-IC ~ L2 NC GND 4 Characteristics 4.1 Absolute maximum ratings Rating Symbol Value Unit Operating Temperature T OP -40 to +85 Storage Temperature T STO -40 to +85 Input power P IN 35 dbm o C o C 4.2 Electrical Characteristics (T=25 o C) Parameter Low Band (892MHz) High Band (1940MHz) Impedance Insertion Loss *1 Impedance Insertion Loss *1 Symbol R L IL L R H IL H Unit Ω db Ω db Test condition = =, =R L = =, =R H SMST21NMHB-001 * SMST21NMHB-002 * SMST21NMHB SMST21NMHB *1: When is terminated by the complex conjugate o the component *2: Preliminary 3 October.2013
4 4.3 Typical Characteristics [SMST21NMHB-001] Smith chart Equivalent circuit [Low Band] X= (Equivalent o 2.1nH) 8Ω [High Band] X=7.887 (Equivalent o 0.6nH) 19Ω [SMST21NMBH-002] Smith chart Equivalent circuit [Low Band] X= (Equivalent o 2.3nH) 8Ω [High Band] X= (Equivalent o 0.9nH) 22Ω 4 October.2013
5 [SMST21NMHB-003] Smith chart Equivalent circuit [Low Band] X= (Equivalent o 2.2nH) 12Ω [High Band] X=9.227 (Equivalent o 0.8nH) 19Ω [SMST21NMBH-004] Smith chart Equivalent circuit [Low Band] X= (Equivalent o 2.6nH) 12Ω [High Band] X= (Equivalent o 0.9nH) 22Ω 5 October.2013
6 5 Reliability Test Mechanical Test No. Items Speciications Test Methods 1 Vibration Appearance No severe damages Solder specimens on the testing jig (glass Resistance Electrical Speciications Satisy speciications listed in paragraph 4-2 over operational temperature range luorine boards) shown in appended Fig.1 by a Pb ree solder. The soldering shall be done either by iron or relow and be conducted with care so that the soldering is uniorm and ree o deect such as by heat shock. Frequency : 10~2000 Hz Acceleration : 196 m/s 2 Direction : X,Y,Z 3 axis Period : 2 h on each direction Total 6 h. 2 Shock Appearance No severe damages Solder specimens on the testing jig (glass luorine boards) shown in appended Fig.1 by a Electrical Satisy speciications listed in Pb ree solder. The soldering shall be done Speciications paragraph 4-2 over operational either by iron or relow and be conducted with temperature range care so that the soldering is uniorm and ree o deect such as by heat shock Acceleration : 14,700 m/s 2 Period : 0.3 ms. Cycle : 3 times 3 Delection No damage with 1.6mm delection Solder specimens on the testing jig (glass epoxy boards) by a Pb ree solder. The soldering shall be done either by iron or relow and be conducted with care so that the soldering is uniorm and ree o deect such as by heat shock. 4 Soldering strength (Push Strength) 3N Minimum Solder specimens onto test jig shown below. Apply pushing orce at 0.5mm/s until electrode pads are pealed o or ceramics are broken. Pushing orce is applied to longitudinal direction. Pushing Direction Specimen Jig 5 Solderability o Termination 75% o the terminations is to be soldered evenly and continuously. 6 Resistance to Soldering Heat (Relow) Immerse specimens irst an ethanol solution o rosin, then in a Pb ree solder solution or 2±0.5 sec. at 245±5 C. Preheat : 100~120 C, 60 sec. Solder Paste : Sn-Ag-Cu Flux : Solution o ethanol and rosin (25 % rosin in weight proportion) Appearance No severe damages Preheat Temperature : C Preheat Period : 90+/-30 s Electrical Satisy speciications listed in speciications High Temperature : 220 paragraph 4-2 over operational temperature range High Temp. Period : 30+/-10 s Peak Temperature : 260+5/-0 C Specimens are soldered twice with the above condition, and then kept in room condition or 24 h beore measurements. 6 October.2013
7 Environmental Test No. Items Speciications Test Methods 7 High Temp. Appearance No severe damages Temperature : 85+2/-0 C Exposure Period : /-0 h Electrical Satisy speciications listed in speciications Room Condition : 2 ~ 24 h paragraph 4-2 over operational temperature range 8 Temperature Appearance No severe damages Set the specimens to the supporting jig in the Cycle Electrical speciications Satisy speciications listed in paragraph 4-2 over operational temperature range same manner and under the same conditions as Fig.1 and conduct the 100 cycles according to the temperatures and time shown in the ollowing table. Set it or 2 to 24 h at room temperature, then measure. Step Temp( C) Time(min) 1 Min. Operating Temp.+0/-3 30±3 2 Max. Operating Temp.+0/-3 30±3 9 Humidity (Steady State) 10 Low Temp. Exposure Appearance No severe damages Temperature:85±2 Humidity:80~90 %RH Electrical speciications Satisy speciications listed in paragraph 4-2 over operational temperature range Period: /-0 h Room Condition:2 ~ 24 h Appearance No severe damages Temperature:-40±2 Period: /-0 h Room Condition:2 ~ 24 h Electrical speciications Satisy speciications listed in paragraph 4-2 over operational temperature range Fig.1 Land Pattern TOP VIEW c d a b a (2) (3) (1) (4) e e Unit: mm Mark Size Mark Size a 0.35 d 0.35 b 0.40 e 0.30 c Note: This ootprint is or reerence purpose only. 7 October.2013
8 6 Tape and Reel Packing 1) Dimensions o Tape (Plastic tape) (Unit: mm) Φ1.50± ± ± ± ± ± ± ± ± ± ±0.1 Feeding direction 2) Dimensions o Reel (Unit: mm) 2±0.5 Φ60 Φ180 φ13± ±1.0 8 October.2013
9 A RF Transormer (Stabilized Matching Device) 3) Taping Diagrams [1] Feeding hole: As speciied in (1) [2] Hole or chip: As speciied in (1) [3] Cover tape: 0.05mm in thickness [4] Base tape: As speciied in (1) [3] [1] [2] [3] [4] Feeding hole Feeding Direction Chip 9 October.2013
10 4) Leader and Tail tape Tail tape (No components) Components No components Leader tape (Cover tape alone) Over160m m Over100mm Over400mm Feeding direction 5) The tape or chips are wound clockwise, the eeding holes to the right side as the tape is pulled toward the user. 6) Packaging unit: 4000 pcs 7) Material Base tape: Plastic Reel: Plastic 8) Peeling o orce : 0.1~1.0 N in the direction o peeling as shown below. 0.1~1.0N 0.7 N max. 165 ~ 180 Cover tape Base tape 10 October.2013
11 NOTICE 1. Storage Conditions: To avoid damaging the solderability o the external electrodes, be sure to observe the ollowing points. - Store products where the ambient temperature is 15 to 35 C and humidity 45 to 75% RH. (Packing materials, In particular, may be deormed at the temperature over 40 C.). - Store products in non corrosive gas (Cl 2, NH 3,SO 2, No x, etc.). - Stored products should be used within 6 months o receipt. Solderability should be veriied i this period is exceeded. This product is applicable to MSL1 (Based on IPC/JEDEC J-STD-020) 2. Handling Conditions: Be careul in handling or transporting products because excessive stress or mechanical shock may break products due to the nature o ceramics structure. Handle with care i products may have cracks or damages on their terminals, the characteristics o products may change. Do not touch products with bear hands that may result in poor solderability. 3. Standard PCB Design (Land Pattern and Dimensions): All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please reer to the speciications or the standard land dimensions. The recommended land pattern and dimensions is as Murata's standard. The characteristics o products may vary depending on the pattern drawing method, grounding method, land dimensions, land orming method o the NC terminals and the PCB material and thickness. Thereore, be sure to veriy the characteristics in the actual set. When using non-standard lands, contact Murata beorehand. 4. Notice or Chip Placer: When placing products on the PCB, products may be stressed and broken by uneven orces rom a worn-out chucking locating claw or a suction nozzle. To prevent products rom damages, be sure to ollow the speciications or the maintenance o the chip placer being used. For the positioning o products on the PCB, be aware that mechanical chucking may damage products. 11 October.2013
12 5. Soldering Conditions: Careully perorm preheating so that the temperature dierence ( T) between the solder and products surace should be in the ollowing range. When products are immersed in solvent ater mounting, pay special attention to maintain the temperature dierence within 100 C. Soldering must be carried out by the above mentioned conditions to prevent products rom damage. Contact Murata beore use i concerning other soldering conditions. Soldering method Soldering iron method Relow method Temperature <=130 C - Soldering iron method conditions are indicated below. Kind o iron Item Ceramics heater Soldering iron wattage <=18 W Temperature o iron-tip <=350 C Iron contact time within 3 sec - Diameter o iron-tip : 3.0 mm max. - Do not allow the iron-tip to directly touch the ceramic element. Temperature ( C) Relow soldering standard conditions (Example) Peak Temperature within 10 sec. MAX260 C 220 C 180 C Cooling down slowly 120 C Pre-heating sec sec. Time (s.) Use rosin type lux or weakly active lux with a chlorine content o 0.2 wt % or less. 12 October.2013
13 6. Cleaning Conditions: Any cleaning is not permitted.. 7. Operational Environment Conditions: Products are designed to work or electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Thereore, products have no problems to be used under the similar conditions to the above-mentioned. However, i products are used under the ollowing circumstances, it may damage products and leakage o electricity and abnormal temperature may occur. - In an atmosphere containing corrosive gas ( Cl 2, NH 3, SO x, NO x etc.). - In an atmosphere containing combustible and volatile gases. - Dusty place. - Direct sunlight place. - Water splashing place. - Humid place where water condenses. - Freezing place. I there are possibilities or products to be used under the preceding clause, consult with Murata beore actual use. 8. Limitation o Applications: The product is designed and manuactured or consumer application only and is not available or any application listed below which requires especially high reliability or the prevention o such deect as may directly cause damage to the third party's lie, body or property. - Aircrat equipment. - Aerospace equipment - Undersea equipment. - Power plant control equipment. - Medical equipment. - Transportation equipment (vehicles, trains, ships, etc.). - Traic signal equipment. - Disaster prevention / crime prevention equipment. - Data-procession equipment. - Application o similar complexity and/ or reliability requirements to the applications listed in the above. 13 October.2013
14 ! Note: Please make sure that your product has been evaluated and conirmed against your speciications when our product is mounted to your product. All the items and parameters in this product speciication have been prescribed on the premise that our product is used or the purpose, under the condition and in the environment agreed upon between you and us. You are requested not to use our product deviating rom such agreement. We consider it not appropriate to include other terms and conditions or transaction warranty in product speciications, drawings or other technical documents. Thereore, even i your original part o this product speciication includes such terms and conditions as warranty clause, product liability clause, or intellectual property inringement liability clause, we are not able to accept such terms and conditions in this product speciication unless they are based on the governmental regulation or what we have agreed otherwise in a separate contact. We would like to suggest that you propose to discuss them under negotiation o contract. Note: This catalog is or reerence only and not an oicial product speciication document, thereore, please review and approve our oicial product speciication beore ordering this product. 14 October.2013
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