Annular Ring and Feature Clearances. Track to Feature Clearances

Transcription

1 Hi-Tech Corporation Technical Capabilities Annular Ring and Feature Clearances Outer Value layer min (mm) A 75 B 125 C 150 Inner Value layer min (mm) A 100 B 150 C 150 Track to Feature Clearances Outer Layer (mm) 18µm Cu foil: µm Cu foil: µm Cu foil: µm Cu foil: µm Cu foil: µm Cu foil: 210µm Cu foil: Inner Layer (mm) 18µm Cu foil: µm Cu foil: µm Cu foil: µm Cu foil: µm Cu foil: µm Cu foil: 210µm Cu foil: Solder Resist and Legend Solder Resist Standard colour: GREEN Other colours: RED, BLUE, WHITE, BLACK, YELLOW

2 Legend print Solder resist features to ensure no encroachment Nominal 12 µm Min 10 µm According to IPC- SM-840 class H yes Yes/No Minimum line width 100 µm of legend Standard colour: WHITE Other colours: YELOW, BLACK Feature type Value min (mm) SMT to covered copper A mm SMT to SMT with kept bridge B mm Soldermask oversize C mm Soldermask bridge D mm Peelable Mask & Kapton tape Peelable Mask Nominal mm Minimum mm Max covered hole 4.0 mm diameter: Min distance to not covered feature: 1.0 mm Kapton tape (to cover larger holes) Can Use: Y Y/N Nominal / mm Drilling/ Routing / V-cut Drilling Min. hole mechanically drilled 0.1 mm Max. hole mechanically drilled 6.2 mm Hole tolerances (finished hole) Standard Best PTH holes < 5mm 0.1 +/-mm /-mm PTH holes > 5mm /-mm 0.1 +/-mm

3 NPTH holes < 5mm 0.1 +/-mm 0.1 +/-mm NPTH holes > 5mm /-mm 0.1 +/-mm PTH Slots /-mm 0.1 +/-mm NPTH Slots /-mm 0.1 +/-mm Drill registration PTH / NPTH against pattern (first drill) /-mm NPTH against pattern (secondary drill) /-mm Aspect Ratio 1:25 Profiling Rout Diameters (mm) Standard: / Others: / Standard Best Rout edge to copper 0.2 +/-mm 0.1 +/-mm Rout Tolerance 0.1 +/-mm 0.1 +/-mm Control depth routing tolerance /-mm /-mm Scoring / V-cut Feature type Nom. (mm) Min (mm) Distance to copper A Thickness of remaining core B 30%core th. 30%core th. Position accuracy C Depth D 35%core th. 30%core th. Scoring / V-cut Min board thickness: 0.8 mm Max board thickness: 2.4 mm Build-up / Multilayer Core Min thickness used mm Type of prepreg used 1080 R-1650V Board thickness Tolerance board > 1mm 10 +/- % Tolerance board< 1mm 10 +/-mm Capability Max thickness ML board: 6.0 mm Min thickness 4 Layer: 0.35 mm Min thickness 6 Layer 0.55 mm Min thickness 8 Layer 0.75 mm Min thickness 10 Layer 0.95 mm Min thickness 12 Layer 1.05 mm

4 Standard build-up used for 1.6mm thick board with 35µm copper finished on all layers 4 Layer 6 Lager 8 Layer 10 Layer 12 Layer Copper 55µm Copper 55µm Copper 55µm Copper 55µm Copper 55µm Prepreg 450µm Prepreg 250µm Prepreg 180µm Prepreg 0.14µm Prepreg 0.11µm Copper 35µm Copper 35µm Copper 35µm Copper 35µm Copper 35µm Core 550µm Core 180µm Core 180µm Core 0.11µm Core 0.11µm Copper 35µm Copper 35µm Copper 35µm Copper 35µm Copper 35µm Prepreg 450µm Prepreg 450µm Prepreg 180µm Prepreg 0.14µm Prepreg 0.11µm Copper 55µm Copper 35µm Copper 35µm Copper 35µm Copper 35µm Core 180µm Core 180µm Core 0.11µm Core 0.11µm Copper 35µm Copper 35µm Copper 35µm Copper 35µm Prepreg 250µm Prepreg 180µm Prepreg 0.14µm Prepreg 0.11µm Copper 55µm Copper 35µm Copper 35µm Copper 35µm Core 180µm Core 0.11µm Core 0.11µm Copper 35µm Copper 35µm Copper 35µm Prepreg 180µm Prepreg 0.14µm Prepreg 0.11µm Copper 55µm Copper 35µm Copper 35µm Core 0.11µm Core 0.11µm Copper 35µm Copper 35µm Prepreg 0.14µm Prepreg 0.11µm Copper 55µm Copper 35µm Core 0.11µm Copper 35µm Prepreg 0.11µm Copper 55µm Via hole plugging techniques Plugging techniques Soldermask Y Y/N Resin non conductive Y Y/N Resin electrical conductive N Y/N Resin thermal conductive N Y/N Overplated plugs (IPC 4761 Y Y/N type VII) Max hole size Soldermask plug 0.6 mm Resin non conductive 0.6 mm Resin electrical conductive / mm Resin thermal conductive / mm HDI capability (Fill in only if applicable) Laser drilled hole Min. hole size mm Max. hole size 0.15 mm Aspect Ratio Normal 1:1 X:X Best 1:1.15 X:X Build-up material used RCC N Y/N RCC High Tg N Y/N LD Prepreg Y Y/N LD Prepreg High Tg Y Y/N Aramid N Y/N Polyimide N Y/N No-Flow prepreg Y Y/N Speedboard C N Y/N Others / Y/N Technique 1+N+1 Y Y/N

5 2+N+2 (staggered µvia) Y Y/N 3+N+3 (staggered µvia) N Y/N 4+N+4 (staggered µvia) N Y/N 2+N+2 (stacked µvia) N Y/N 3+N+3 (stacked µvia) N Y/N 4+N+4 (stacked µvia) N Y/N (step down µvia N Y/N Filling technique µvia Copper filled Y Y/N Resin filled (overplated) Y Y/N Copper pillar N Y/N Design features HDI Preferred Min. Entry pad (A) 0.30µm 0.25µm Target pad L1 (A) 0.30µm 0.25µm Hole L1-L2 (B) 0.1µm 0.075µm Preferre d Min. Entry pad (A) 0.30µm 0.25µm Target pad L2 (A) 0.30µm 0.25µm Target pad L3 (A) 0.30µm 0.25µm Hole L1-L2 (B) 0.1µm 0.075µm Hole L2-L3 (B) 0.1µm 0.075µm

6 Preferred Min. Entry pad (A) /µm /µm Target pad L2 (A) /µm /µm Target pad L3 (D) /µm /µm Hole L1-L2 (B) /µm /µm Hole L2-L3 (C) /µm /µm Preferre d Min. Entry pad (A) 0.30µm 0.25µm Target pad L1 (C) 0.45µm 0.35µm µvia hole L1-L2 (B) 0.1µm 0.075µm Buried hole (D) 0.25µm 0.20µm