Overview of ESA's approach to Photonics reliability and space qualifications

Transcription

1 Overview of ESA's approach to Photonics reliability and space qualifications Mustapha Zahir Rhodes Island Oct/2010

2 Layout 1. Introduction. 2. Space environment and challenges. 3. Radiation effect and test requirements. 4. Vacuum. 5. Thermal and mechanical loads. 6. ESCC system. 7. ESCC qualification. 8. Components Evalation and Qualification. 9. Photonics components standards. ESA Presentation Mustapha Zahir Rhodes Island Oct/2010 TEC/QTC Slide 2

3 Introduction Over the past 20 years there have been tremendous developments and advances in all domains of Photonics to such extent that today photonic technologies are used, or considered to be used, in all Space segments: from the Payload, to the Satellite (onboard bus, links, structure,..), to Launchers. -Advantages are: essentially unlimited BW, low loss, very small volume, mechanically flexible, galvanic isolation ) Photonics components, i.e Lasers, CCD, CMOS Image sensors, Fibre Optic Cables, etc are constantly evolving in terms of technology, materials and processes within the lifetime of a project cycle. Qualification standards need to keep pace, which is the main challlenge. ESA Presentation Mustapha Zahir Rhodes Island Oct/2010 TEC/QTC Slide 3

4 Space application challenges The application of optoelectronics in space systems faces a number of challenges Space environment Reliability and Lifetime Lack of accessibility Consideration must be given to the impact of: Lot non-uniformity & traceability Temperature range of component Availability of test data It is critical that all aspects of reliability and relevant known failure modes and mechanisms be addressed prior to the insertion of the component in the application ESA Presentation Mustapha Zahir Rhodes Island Oct/2010 TEC/QTC Slide 4

5 Space environmental Launch Environment Operation at Extreme Temperatures. Extreme temperature cycling and shock. Space Radiation Effects Spacecraft Charging. Vacuum. Non-repairable and costly. ESA Presentation Mustapha Zahir Rhodes Island Oct/2010 TEC/QTC Slide 5

6 Radiation effects on EEE components (1) Total Ionizing Dose (TID) Degradation of μelectronics and optoelectronics Cumulative long term effects Parameter drifts, threshold shifts, timing changes, functional failures Non Ionizing Effects Displacements Damage Degradation of optoelectronics (GaAs ), CCDs, bipolar technologies in very harsh environments Cumulative long term effects ( disruptions of crystal lattice) CMOS technologies less affected ( majority carriers) ESA Presentation Mustapha Zahir Rhodes Island Oct/2010 TEC/QTC Slide 6

7 Radiation: effects on EEE components (2) Single Event Effects (SEE) Single charged particles (heavy Ions and protons) passing through a semiconductor material Soft errors: data corruption (SEU), system shutdown (SEFI), transients (SET) Hard errors ( sometimes destructive): Latch-up ( SEL), Stuck bits (SHE), Gate ruptures ( Power MOSFETs and thin capacitors in analog devices) New effect types or unknown manifestations of known effects always possible especially for new technologies ESA Presentation Mustapha Zahir Rhodes Island Oct/2010 TEC/QTC Slide 7

8 Radiation: Tests and requirements for TID Usual particle type: γ rays (1.17 & 1.33 MeV) from Co 60 sources Effects similar to/ representative of space radiation High penetration (parts irradiated as is on test boards) European Specification: ESCC Experimental Set-up Sample size: (10 + 1) parts in g al, from a single lot Static bias ( considered as a worst case) ON and OFF Total dose ~100 krad(si) max. in several steps (0/5/10/20/50/100) Dose rate < 360 rad(si)/h Actual space dose rate very low ( a few rad(si)/h) High dose rate not relevant for bipolar/ BiCMOS technologies due to ELDRS Facilities: one source at ESTEC, several in Europe (e.g., ONERA Toulouse) ESA Presentation Mustapha Zahir Rhodes Island Oct/2010 TEC/QTC Slide 8

9 Radiation: Tests and requirements for SEE (1) General: Characterization: experimental curve σ vs. LET (HI) or energy (p + ) σ = ratio number of events / number of incident particles Key parameters: σ sat, LETth and Weibull fit For LETth < 12 MeV.cm2/mg proton sensitivity possible Based on these parameters event rate calculations For SET, pulse energies are also important pulse amplitudes and durations have to be determined For some events (e.g., SEGR), destruction of the test samples can t be prevented Results may be strongly dependent from test patterns or application conditions European Specification: ESCC ESA Presentation Mustapha Zahir Rhodes Island Oct/2010 TEC/QTC Slide 9

10 Radiation: Tests and requirements for SEE (2) Experimental method: Fluences > 10 6 HI/cm 2 or > p + /cm 2 Sample size: ( 3+1) min. Particle range > 30 μm Bias: dynamic or static The range of LETs (HI)/Energies (p + ) must be sufficient to determine threshold and saturation Experimental Set-up A min. of 5 LET/Energy steps is required De-lidded parts for HI Back side irrad. possible ESA supported facilities: HIF(B), PSI (CH), RADEF (F) Other facilities in Europe (IPN- Orsay) or in the USA (BNL ) ESA Presentation Mustapha Zahir Rhodes Island Oct/2010 TEC/QTC Slide 10

11 Radiation: Tests for Displacement Damage 1. Experimental method: a. Unit of interest: NIEL ( Non Ionizing Energy Loss) b. Affected types: CCDs / Optocouplers / GaAs (and similar material) based components c. Ground test: protons ( pref. < 60 MeV), fluences > p + /cm 2 neutrons ( ~ 1MeV), fluences > n/cm 2 d. Some parts are also TID sensitive ( if a silicon chip is included) e. Sensitivity to bias conditions ESA Presentation Mustapha Zahir Rhodes Island Oct/2010 TEC/QTC Slide 11

12 Vacuum 1. Outgassing Organic materials outgases in vacuum. High values may occur from adhesives, boots, fibre coatings Condensed outgassed material may disturb optical properties. Work around solution in the form of baking may be possible. Both ESA and NASA data bases are available on internet. 2. Thermal Paths Both performance and reliability may be affected by operation in vacuum due to the temperature increase. 3. PIF; Packaged Induced Failure Laser diodes may exhibit sensitivity to vacuum operation, probably explained by outgassed organic material dissociated by laser light with the carbon acting as heat centres in the active emitting area. The obvious solution is hermetic packaging, which also is preferred and sometimes mandatory. It may however be difficult both to achieve and to test hermeticity for fibre coupled components. Impact on alignment from rapid lowering of pressure during launch? ESA Presentation Mustapha Zahir Rhodes Island Oct/2010 TEC/QTC Slide 12

13 Thermal &Mechanical loads 1. Vibration and shock levels during launch and separation can be severe and it has to be checked that components will withstand them. In most space fibre applications it is enough that components survive, but the more stringent requirement to operate properly during mechanical stress could also apply. 2. Temperature environment varies from benign to severe. Temperature cycling is a very standard part of test program. Power Spectral Density PSD / g 2 Hz Frequency / Hz Example of random vibration test level from ESCC ESA Presentation Mustapha Zahir Rhodes Island Oct/2010 TEC/QTC Slide 13

14 ESCC Eval. / Qualif. Approach: The ESCC system in brief An international system for the specification / qualification / procurement of EEE components for use in Space programmes For users, 3 levels of specifications: 1. Basic: test methods, qualification methodology and general requirements applicable to all ESCC components 2. Generic: requirements for screening, periodic or lot acceptance testing and qualification testing for individual families of components 3. Detail: performance requirements for individual or ranges of particular components ESA Presentation Mustapha Zahir Rhodes Island Oct/2010 TEC/QTC Slide 14

15 ESCC QUALIFICATION 1. ESCC qualification approval is a status given to electronic components which are manufactured under controlled conditions and which have been shown to meet all the requirements of the relevant ESCC specifications. 2. Unlike the US MIL System, ESCC is based on a 2 step qualification approach: Evaluation + Qualification 3. During the Evaluation phase, components/technologies can be more extensively characterised and margins determined 4. 3 main phases: a. Manufacturer Evaluation ( ESCC 20200) -> AUDIT b. Component Evaluation ( ESCC and ancillaries) Preparation and realization of an agreed Evaluation Test Program ( ETP) including: Constructional analysis and technology evaluation Step-Stress testing Preparation of a Process Identification Document (PID) & Detail Specification c. Component Qualification testing On components produced strictly as defined in the final PID and from a given lot According to ESCC Generic Spec. requirements ESA Presentation Mustapha Zahir Rhodes Island Oct/2010 TEC/QTC Slide 15

16 COMPONENT EVALUATION (1) 1. Constructional Analysis a. On random samples taken from the current production b. Performed by the Evaluation Authority (ESCC Executive) 2. Evaluation Test Programme a. Established in conjunction with Manufacturer / ESCC Executive b. On a sample ( ~ 100 parts) representative of the component family c. In order to determine failure modes and margins, it includes: Endurance tests ( HTRB, Extended Burn-in, Life Test ) Destructive tests ( Step-stress, radiation, Environmental/Mechanical/Assembly ) d. Includes a CA on representative components e. Ancillary specifications 226xxxx* describe the procedure and requirements to create and perform an ETP ESA Presentation Mustapha Zahir Rhodes Island Oct/2010 TEC/QTC Slide 16

17 COMPONENT EVALUATION (2) 1. Process Identification Document ( PID) a. Shall be prepared by the Manufacturer b. Establishes a precise reference for an electronic component qualified in accordance with the ESCC System Component s design configuration Materials used in manufacture Manufacturing processes and controls Inspections and tests to be carried-out during and after manufacture c. PID shall be in accordance with the requirements of ESCC Detail Specification a. Necessary if not already described by an existing Detail Specification b. Or if the existing specification requires updating c. Described in ESCC ESA Presentation Mustapha Zahir Rhodes Island Oct/2010 TEC/QTC Slide 17

18 QUALIFICATION TESTING PHASE 1. Prerequisites: a. Successful completion of the Evaluation Phase (EPPL listing) b. The PID reviewed and approved by ESCC Executive c. A production and test schedule for major processing operations d. A Production Flow Chart, Process Schedules and Inspection Procedures. 2. Components required for qualification testing must be produced strictly in accordance with the PID 3. Qualification testing of the component must be in accordance with the requirements of the relevant ESCC Generic Specification 4. On successful completion of the testing phase => ESCC QPL 5. A Qualification, once established, is valid for 2 years ESA Presentation Mustapha Zahir Rhodes Island Oct/2010 TEC/QTC Slide 18

19 Photonics Components specification 1. European space level component specifications are contained within the ESCC (European Space Component Coordination) system and available at 2. For opto-electronic components up to 2010 only CCDs, Laser, optocouplers and LEDs were included but work is in progress to enlarge the range. 3. An evaluation test plan for single optic fibre connectors has been issued during 2006, to be followed by a generic and a detailed specification. 4. Work is also ongoing to create evaluation test plan and generic specification for laser diodes. These should cover also fibre pigtailed components. 5. There have also been discussions about creating a specification set for complete optic fibre cable assembly. Draft versions exist. ESA Presentation Mustapha Zahir Rhodes Island Oct/2010 TEC/QTC Slide 19

20 THANK YOU ESA Presentation Mustapha Zahir Rhodes Island Oct/2010 TEC/QTC Slide 20