GE Sensing & Inspection Technologies MEMS. Global Solutions for Microsystems

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1 GE Sensing & Inspection Technologies MEMS Global Solutions for Microsystems g

2 Global research, development and manufacturing excellence Groby, United Kingdom MEMS Design and Manufacturing Center Advanced Packaging and Instrumentation Group Fremont, CA USA MEMS Advanced Design and Manufacturing Center Munich, Germany Global Research Center Pyeongtaek, Korea MEMS Advanced Volume Manufacturing Center Niskayuna, NY USA Global Research and Prototyping Center MEMS, Microfluidics and Nanotechnology Shanghai, China Global Research Center Advanced Design and Development Center Bangalore, India Global Research Center Advanced Modeling and Analysis Center Centers of Excellence Equipped with the most advanced design tools and cutting edge laboratories, teams of GE researchers at four global Centers of Excellence focus on designing MEMS-based sensors and actuators. Design of these devices involves a multifaceted approach, integrating various concepts of physics, mechanics, semiconductors, electronics, optics and materials. These researchers apply frontier research knowledge and engineering techniques to synthesize, manipulate and modify materials to create novel electronic devices, photonic devices, integrated structures and machines. Molecular modeling research provides fundamental molecular level understanding of various material properties and how they translate into device applications, as well as creating new materials for desired applications. Electronics miniaturization Semiconductor technology Micro systems and microfluidics Thin films Sensors technology Electronic devices and molecular modeling Micro and nano process development Device integration Process operations Fab production

3 MEMS Microfluidics Microstructures Nanotechnology GE capitalizes on NovaSensor s heritage as a pioneer in micromachining process design for pressure sensing and MEMS technology for OEM customers in the medical, automotive, and industrial process industries. This expertise spans three decades and shipment of more than 500 million MEMS-based sensors. This track record, combined with a library of intellectual property, range of technology, production capability and expertise, make GE a logical choice to help bring your microsystem design to market. GE has foundry capabilities beyond those of virtually any other MEMS partner. Advanced prototyping centers help develop your ideas and make them process ready. Dedicated production facilities located in the US, Europe and Asia offer redundant capacity to enhance productivity and meet global delivery requirements giving you room to grow your business. Our foundries produce more than a million dice weekly. Our facilities include thousands of square feet of Class 100 and Class 1000 clean room areas, along with controlled environment assembly and lab areas. We hold ISO 9001, QS 9000, TS 16949/ISO and ISO quality certifications. Centers of Excellence Center of Excellence Lab GE Foundry 2

4 From concept to commercialization research and development advanced prototyping package development Advanced Research and Development At GE, technical diversity drives innovation. Our world-class talent includes a variety of disciplines including engineers, technologists, scientists, mathematicians, chemists and physicists. This talent is now at your call to help you at any point in your microsystem development. Areas of research include MEMS-based humidity and gas sensing, pressure measurement, and magnetic field sensing; MEMS microswitches and microvalves for gas flow control; microfluidics for protein analysis and nucleic acid detection; and wireless remote embedded microsystems (REMS). We have more than 75 MEMS-related patents and patents pending. 3 Intellectual Property Analysis and Strategy Whether you are a university or research facility with no production capability, a company that doesn't have foundry facilities of your own or a venture capital firm looking to fund a nanotechnology business, GE offers access to our innovation and to our foundry expertise to help develop your intellectual property. We can take your ideas, help develop them to a process-ready stage or take them from your process flow to production release. No other company offers the knowledge base that enables you to reach your end goals as quickly, or with as much confidence that your MEMS device will be ready for today's advanced technology applications, as GE. Device Design, Modeling and Fabrication Process Development We develop and deliver innovative microsystems and microfluidics for miniaturization, increased performance, portability and low cost. Our in-house design and modeling capabilities expedite production and optimize first-time success rates for your products. Sophisticated CAD/CAM technologies and imaging enable faster product development. Finite element modeling allows us to predict stresses to each microsensor under real time conditions such as temperature, pressure, vibration and acceleration. We use Design for Six Sigma techniques to improve our processes so that your product gets to market quicker, better and with the highest quality.

5 intellectual property device design and modeling precision manufacturing Advanced Prototyping Our prototype facilities consist of 25,000 square feet of semiconductor-quality clean rooms and also Class 100 general workspace areas and localized Class 10 areas. Capabilities include: Metallization Deposition Laser lithography and drilling Mask-based lithography Dry and wet etch Thermal processing Analysis Others, such as wafer bonding, milling, wafer sawing, lamination, and coating Package Development and Device Integration GE's advanced packaging solutions solve your challenging requirements of media and environmental compatibility, stress and thermal isolation, size and integrated performance. More than 25 years of packaging design and modeling experience have enabled GE to set standards for MEMS sensing packaging. Our products include flip chip style and silicon fusion bonding techniques for media compatibility, hydrid ceramic, industry standard footprints for SOIC, LLCC, SMDI and media isolated packaging for harsh environments. Our packaging options include product on tape and reel and ready-for-automated manufacturing using traditional pick and place equipment. Precision Manufacturing Technology and capacity make us one of the highest volume precision manufacturers of microsensors in the world. We use the most advanced, proven integrated circuit processes, materials and equipment to deliver enhanced product performance for greater accuracy, repeatability and quality. Our fully automated assembly and batch manufacturing techniques reduce your unit costs. Silicon micromachining High-volume ceramic substrate-based sensor assembly Automated die-attach Automated wire bonding High-volume thick film laser trim Batch mode testing 4

6 Use our assets and save yours We ve invested in people, technology and facilities so that you don t have to. Whether you need foundry service only or a full design-to-manufacture capability, we offer you the right fabrication competencies to keep your focus on bringing your idea to market. Pressure sensors High temperature sensors Flow sensors Magnetic field and current sensors Velocity sensors Gas detection sensors Multi-sensor microsystems Accelerometers Microvalves Microfluidics Microactuators Micro-spectrometers Micro and nano photonics Capacitive micromachined ultrasonic transducers (cmut) Micro optical electrical mechanical structures (MOEMS) MEMS switches MEMS resonators MEMS arrays Foundry Capabilities Lithography - Steppers, contact aligners, argon ion lasers, ESI lasers - Double-sided lithography - Thick resist Deposition - HTO and LTO oxide, nitride, poly silicon, AI, AU, SiCR, Ta, Ni, Cr, Pt - Metal composites RuO 2, CrN, TiO 2 - Thermal oxidation - Thin film anneal - Metal alloying - Impurity diffusion - PECVD - Spin coating Etch - IC wet etch - Dry - Electrochemical - Plasma, RIE and DRIE - Ion etch Bonding - Aligned silicon fusion and anodic - Selective and controlled medium Metallization - Sputtering - Electroplating Bulk or surface micromachining MEMS Development Tool Set ConventorWare TM Fluent ANSYS ESI-CFD Intellisuite SABER DW-2000 MEDICI Opti-FDTD and Opti-BPM Matlab Molecular modeling tools Quantum modeling tools Design for Six Sigma QA system experience Process control Microsystem Production, Packaging and Test Silicon, gallium nitride and silicon carbide wafer processing Glass, quartz, and sapphire polymers Au, Pt and SiC metallizations Rapid prototyping Triple layer bonding Wafer level probing Laser cutting Metal open and isolated packaging Plastic open and overmoulded packaging Ceramic packaging Flex packaging Hybrid integration PCB mount 5

7 About us GE has united the technological innovation and experience of industry leaders in the design and manufacture of advanced sensing and measurement solutions into one world-class business GE Sensing & Inspection Technologies. GE s sensing products measure temperature, pressure, liquid level, moisture and humidity, gas concentration, and flow rate for applications ranging from environmental, medical, and pharmaceutical to automotive, aerospace, chemical, and petrochemical. From high-quality hand-held and portable field calibrators to stand-alone measurement instruments and systems, GE provides end-to-end solutions that can help you monitor, protect, and control your critical processes and applications. Chemical analysis Pressure Flow Temperature Gas Moisture Humidity Level

8 g imagination at work 2008 GE. All rights reserved. BR-152A