Leadership pays. Proven path to new security-driven applications.

Transcription

1 Leadership pays Proven path to new security-driven applications

2 Opportunities Chance to tap into higher value cards Faster route to multi-application business models New form factors Challenges Master the shift towards contactless cards Avoid proprietary lock-in Roll out EMV rapidly and in high volumes Success factors Partner with experience in contactless and multi-application space, e.g. egovernment, etransport Open standards Speed New form factors compliant with strict certification requirements 2

3 Changing needs of a changing market Payment cards are facing new challenges. They are evolving to include additional applications such as transport ticketing and this calls for more robust technologies. The mobile trend also demands more convenient contactless solutions. Traditional, contact-based cards must transition quickly and efficiently to contactless schemes offering strong contactless performance to support speed-critical applications such as ticketing. These new payment cards with additional applications involving multiple stakeholders are far more complex to implement. Know-how and experience across different applications are essential to master this complexity. Proven expertise can also help accelerate time to market and enable a speedy transition to new payment standards supporting global interoperability such as EMV and CIPURSE. Mastering rising requirements for payment cards The road to success lies in chip technologies designed to meet evolving security, flexibility and performance needs, delivered by an experienced partner who can offer proven implementation support and enable rapid roll-out. Storing payment credentials, security chips must be built on robust, fraud-resistant architectures designed to international security standards ideally open standards such as EMV, PBOC or RuPay. In addition, they must support various online and offline authentication methods, interfaces and application schemes for multi-application functionality. In short, service providers need tailored solutions that are secure, flexible, powerful, easy to use and above all capable of building user trust. Rising payment and banking card ICs Units Shipped (Million) CAGR : +13% 2,644 2,861 3,023 3,151 3,279 2,226 1,853 1, Source: IHS Smart Cards Semiconductors Report, Edition - July

4 Applications Contact-based, dual interface and contactless payment cards Online and offline (DDA/CDA) data authentication Mobile Payment 4

5 Shaping tomorrow s payment market As a leading provider of security chips for payment applications, like credit and debit cards we offer a broad range of solutions that empower our customers with the benefits of speed, flexibility and responsiveness. Our entire portfolio is designed to reduce complexity and conserve resources while giving our customers a head-start on current market trends such as the migration to EMV. 5

6 Fastest time to market Our SOLID FLASH technology offers a future-proof memory concept to meet rising demand for increasingly differentiated smart card functionality. It combines the advantages of a flexible flash memory with a sophisticated security concept. This smart design accelerates time to market by more than 50% compared with ROM-based solutions; it also significantly reduces planning and logistics complexity. SOLID FLASH SOLID FLASH combines the advantages of a flexible flash memory with a dedicated security concept. Faster time to market Reduced complexity SOLID FLASH Development Prototyping & Learning cycles Lead times Savings > 50% Logistics Reduced by > 50% ROM Development Prototyping & Learning cycles Lead times Complexity & Risks Planning Process ROM Logistics Complexity & Risks Planning Process SOLID FLASH 6

7 Benefits Improved long-term robustness of dual interface (DIF) payment cards Simplified card design and manufacturing up to five times faster than conventional technologies Increased manufacturing yield by elimination of direct antenna-to-module connection Significant reduction in electrostatic discharge (ESD) impact of dual interface cards Easy transition from contact-based to contactless Our Coil on Module technology gives card manufacturers rapid access to the growing market for contactless solutions without having to invest in new manufacturing equipment. CoM uses radio frequency instead of a physical link between the module and the antenna. It improves the performance, robustness and reliability of the final product. Coil on Module Chip module with antenna at the rear side of the module Chip card antenna Using our chip modules, dual-interface cards can be manufactured faster and more efficient than ever before. Radio communication between chip card antenna and chip module antenna 7

8 Broadest portfolio in the industry We have the broadest portfolio in the industry. This portfolio reflects our commitment to enabling, innovating and simplifying the global migration to the EMV standard. SLC 32P answers the rising performance demands of today s contactless applications and supports all contactless transmission protocols. It is the solution of choice for multi-application cards. All of our contactless SLC 32P products support the open CIPURSE standard for secure, cost-effective handling of payment, access and ticketing applications. The CIPURSE standard is non-proprietary, interoperable and capable of supporting multi-functional cards and infrastructure convergence. 8

9 Benefits Optimized for payment applications such as VSDC, M/Chip, PBOC Ready for multi-application and public transport cards Fast personalization capabilities Support for Type A, B and C (Felica ) Card Authentication methods online Card Authentication Dual- Interface Contactbased Multiapplication Current solutions require an own OS development with hardware qualification for each function Operating System 1 Operating System 1 Operating System 2 Operating System 3 Operating System 4 Hardware Platform 1 Hardware Platform 2 Hardware Platform 3 Hardware Platform 4 Hardware Platform 5 The Infineon platform SLC 32P allows integration of all functions with only one OS solution All card authentication methods Multiapplication e.g. payment and transport Operating System All Interfaces Contactbased, contactless, Dual-Interface SLC 32P Platform The latest generation of our SLC 32P security controller family was designed specifically to conserve resources and save time by offering one platform for all applications. 9

10 Proven partner with leading, future-proof payment portfolio Understanding our customers needs By building long-standing relationships with our customers, we have developed a profound understanding of global and regional requirements for payment solutions. These close ties have fostered the trust that enabled us to secure major market shares around the world. Our local technical and marketing experts work closely with our customers to find the right solution for each market segment and application challenge. Our customers value our in-depth experience, technical support capabilities and strong commitment to innovation not to mention the choice that comes with the world s largest, most diversified one-stop offering. They also appreciate our speed and agility demonstrated through fast delivery times and benchmark time-to-market. Exceptional network of partnerships We have formed an exceptional and established network of partnerships and alliances with players in the banking and credit card industry as well as with industry and certification bodies such as EMVCo, Master- Card, Visa, Global Platform, BCTC, NFC Forum, Smart Card Alliance, Multos Consortium and OSPT Alliance. Impressive track record Our broad and expanding footprint of successful reference projects illustrates our customers trust in our leading and established platforms and tools. To date, we have already sold more than five billion chips for payment applications. Our customers know they can rely on an unbroken supply track record and the experience we have gained leading the payment market for more than ten years. Infineon s CoM was recognized with the 2013 Global Frost & Sullivan New Product Innovation Leadership Award: (Infineon) has developed a complete solution for Dual Interface cards that bridge the gap from today s contact-based applications to tomorrow s contactless world. Jean-Noel Georges, Frost & Sullivan Global Program Director, Digital Identification, ICT about Infineon s CoM 10

11 4 out of 10 payment cards in 2014 contain an Infineon SOLID FLASH security chip 1/3 of India s chip based (EMV) payment cards feature an Infineon SOLID FLASH chip 75% of payment cards in Australia are dual-interface cards Infineon is the leading supplier of the chips for these cards 8 out of 10 dual interface cards in Visa & MasterCard projects in 2014 have an Infineon chip inside Every 2nd French citizen holds a payment card with an Infineon chip inside Today more than 50% of US payment cards have an Infineon chip inside 11

12 Where to Buy Infineon Distribution Partners and Sales Offices: Service Hotline Infineon offers its toll-free 0800/4001 service hotline as one central number, available 24/7 in English, Mandarin and German. Germany (German/English) China, mainland (Mandarin/English) India (English) USA (English/German) Other countries... 00* (English/German) Direct access (interconnection fee, German/English) * Please note: Some countries may require you to dial a code other than 00 to access this international number, please visit for your country! Mobile Product Catalog Mobile app for ios and Android. More information: Contact us: dsscustomerservice@infineon.com Published by Infineon Technologies AG Neubiberg, Germany 2015 Infineon Technologies AG. All Rights Reserved. Order Number: B180-I0183-V EU-EC-P Date: 09 / 2015 Please note! THIS DOCUMENT IS FOR INFORMATION PURPOSES ONLY AND ANY INFORMATION GIVEN HEREIN SHALL IN NO EVENT BE REGARDED AS A WARRANTY, GUARANTEE OR DESCRIPTION OF ANY FUNCTIONALITY, CONDITIONS AND/OR QUALITY OF OUR PRODUCTS OR ANY SUITABILITY FOR A PARTICULAR PURPOSE. WITH REGARD TO THE TECHNICAL SPECIFICATIONS OF OUR PRODUCTS, WE KINDLY ASK YOU TO REFER TO THE RELEVANT PRODUCT DATA SHEETS PROVIDED BY US. OUR CUSTOMERS AND THEIR TECHNICAL DEPARTMENTS ARE REQUIRED TO EVALUATE THE SUITABILITY OF OUR PRODUCTS FOR THE INTENDED APPLICATION. WE RESERVE THE RIGHT TO CHANGE THIS DOCUMENT AND/OR THE INFORMATION GIVEN HEREIN AT ANY TIME. Additional information For further information on technologies, our products, the application of our products, delivery terms and conditions and/or prices please contact your nearest Infineon Technologies office ( Warnings Due to technical requirements, our products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by us in a written document signed by authorized representatives of Infineon Technologies, our products may not be used in any life endangering applications, including but not limited to medical, nuclear, military, life critical or any other applications where a failure of the product or any consequences of the use thereof can result in personal injury.