V2X AUTOMOTIVE ON-BOARD UNIT COST COMPARISON SUMMARY

Transcription

1 VX AUTMTIVE N-BARD UNIT CST CMPARISN SUMMARY Cornelius Bittersohl Senior Consultant - Technology February 018 P North America, Inc.

2 This Vx BU Cost Analysis Has Been Conducted To Serve Following Four Main bjectives 1 DEFINITIN F SCPE Development of given scenarios into viable Vx product configurations for an automotive grade installation (components, software and packaging) IDENTIFY CST REALITIES Identify cost factors for bill of material items (HW components), software fees and overhead related activities (sales, general & administrative expenses, research & development, testing & validation and manufacturing surcharges) TRANSPARENT CMPARISN Provide an comparative overview of given scenarios to identify cost drivers and opportunities to reduce implementation costs 4 IDENTIFY INCREMENTAL CSTS FR VX FUNCTINALITY n the cost basis of a Telematics Control Unit (TCU) determine the incremental Vx functionality cost value for each product scenario

3 n the Basis of the P Cost Model Expertise Following Premises and Scope Boundaries Have Been Set in Regard to This Cost Analysis P Cost Model Inputs Approach Functionality description of TCU and Vx system to be covered (broadband connection for vehicle gateway or infotainment system respect. BSM broadcast and receiving) Existing automotive grade BoM component costs Packaging options and requirements for vehicle integration TCU/Vx configuration scenarios to be analyzed (1,, & 4) Industry comparable for software and overhead costs Creation of viable product configurations based on desired features Population of bill of material line items and corresponding component costs (similar to NPRM study) Capturing components costs price ranges to address EM product design variabilities (minimum data processing/ comm. environment vs. high performance & feature rich) Integration of subject matter expert and industry feedback Model Coverage of Value Chain Costs Bill of Material Processing: SoC, Low Energy, Connectivity:, Radio Frontend Memory: RAM, RM/Flash Power Management:, Standby Battery Sensors:, Packaging:, s, Casing, Passive Elements Interfaces: CAN, Ethernet : s, Wiring, Software Real-Time perating System & AUTSAR Stack Application SW & Stacks: Broadband Connectivity Processing and Vx communication verhead Sales, General & Administrative Expenses Research & Development Testing & Validation Manufacturing Costs Results Transparent overview of nature and source of cost drivers within and between TCU/Vx deployment scenarios Reliable information of expected cost levels for future realworld deployment within the automotive space Not included: Profit margins of Tier 1 or EM Backend/infrastructure or provisioning costs Assembly costs on plant level Reoccurring license fees

4 Concept B Concept A Following Scenarios for TCU/Vx Control Units Configurations Have Been Investigated Within the Same Framework and Premises 1 Distinct Products Within Vehicle TCU WWAN VX Radio / RFFE BU (DSRC or C-VX) detached from optional TCU Physical and logical separation of processing and communication functions Highly Integrated System Vx BU (DSRC or C-VX) integrated within TCU Two distinct modems controlled by shared main application processor and other system modules/ functions e. g. Logical processing separation realized through hypervisor functions of main appl. processor ne Product/ Two Systems TCU w/ Card Vx Card Vx Board ne control unit casing with two integrated systems for TCU and Vx communication ( or DSRC) Vx card connected onto TCU main board Vx card is self sufficient regarding processing and purpose related communication 4 Fully Integrated System BU (C-VX only) integrated with existing TCU (most vehicles circa 05 will have VV capable TCUs) ne modem with integrated and (+) functionality packaging, single interface to main application processor Logical processing separation realized through hypervisor functions of application processor 4

5 All Four Product Scenarios Share the Same Cost Model Boundary Conditions. Furthermore Certain Cost Influence Parameters Have Been Set to Support the Comparison Efforts System Boundaries Example based on Scenario Assumed Packaging Locations TCU (Diversity) (Diversity) Casing, s Illustrative Data Power Vehicle Infotainment Central Gateway Wiring costs estimates included up to next harness junction in trunk area costs do not include aesthetical integration products (e. g. shark fin module) + Comments HW bill-of-material and SW reflects a viable product configuration for Secure establishment of broadband connectivity between EM backend and infotainment system or central vehicle gateway Transmitting and receiving BSM messages Communication path for SCMS is realized over broadband modem Sourced components comply with standard automotive qualifications Increase of HW requirements and costs (e. g. performance, hypervisor) reflected in scenarios and 4 to meet also cybersecurity and privacy related requirements Products (HW, SW, packaging) fulfill QMbased functional safety level HMI related messages/warnings to driver announced through infotainment system or instrument cluster 5

6 Concept B Concept A FINDINGS/ CNCLUSINS Comparison verview of Scenario Specific Incremental Costs for Vx Functionality Based on an Existing TCU Within Vehicle 1 Distinct Products Within Vehicle TCU WWAN VX Radio / RFFE BU (DSRC or C-VX) detached from optional TCU Highest incremental cost: $19 (Range: $104-$165) Highest execution complexity Moderate market alignment Highly Integrated System Vx BU (DSRC or C-VX) integrated within TCU Moderate incremental cost: $61 (Range: $50-$74) Moderate execution complexity Poor market alignment ne Product/ Two Systems TCU w/ Card Vx Card Vx Board ne control unit casing with two integrated systems for TCU and Vx communication ( or DSRC) Incremental cost: $10 (Range: $98-$15) Complex to execute Extremely poor market alignment 4 Fully Integrated System ptimal End-State BU (C-VX only) integrated with existing TCU (most vehicles circa 05 will have VV capable TCUs) Incremental cost: $ (B) /$40 (A) (Range: $1-8 / $-48). Base modem cost $17 (Range: $ ) is not mandate driven Total cost $160/$177 is similar to cost of Vx ption 1 6

7 Max. cost level for scenario: High product requirements/ integration of overall features into product Expected cost level for scenario: Balance of costs versus amount of overall product features Min. cost level for scenario: Large economies of scale/ lower integration of overall features into product Market Alginment 1 & Packaging Complexity : Unfavorable Beneficial Scenario Specific Cost Comparison For Costs Generated by BM Items and Software Left Axis: Absolute Product Scenario Costs, Right Axis: Incremental Vx Costs for Product Scenario Product Costs Incremental Vx Costs $50 + $165 + $15 + $00 + $150 $50 $150 TCU only $174 $17 $104 + $19 + $10 + $104 + $98 + $74 + $61 + $50 + $48 + $40 + $ + $8 + $ + $1 + $100 + $50 + $0=$17 $50 Scenario 1 Distinct Products Scenario ne Product/ Two Systems ~ - $68/ 6% ~ - $89/ % ~ - $105/ 9% Scenario Highly Integrated Scenario 4.A* Fully Integrated Concept A Scenario 4.B* Fully Integrated Concept B Market Alignment 1 Engineering & Packaging Complexity February 018 Cost band of TCU ( only) products based on same cost model premises *Cost levels validated by industry feedback 7

8 Summary 1 INCREASING DEGREE F LGICAL & PHYSICAL INTEGRATIN YIELDS IN HIGHER CST SAVINGS AND LWERED IMPLEMENTATIN CMPLEXITY FR AUTMTIVE INDUSTRY Direct costs savings can be realized through a decrease of redundant HW components respectively the activation of indirect cost reductions through over the down stream product realization process HW/ Bill of Material Consolidation of shared elements (,, /, connectors, ) for /Vx functions Realization of economies of scale by virtualization of processing environments Reusing of MIM antenna configuration for use cases Software/ Development Reduction of efforts for SW development of base functions (RTS, AUTSAR, etc. ) Decrease of development and testing & validation efforts for highly/ fully integrated systems Packaging / Realization Complexity and failure potential decrease for overall product realization processes on EM and Tier 1 levels Indirect cost savings within manuf. & assembly activities + DSRC INTEGRATIN SIMILAR T SCENARI 4 IS CHALLENGING DUE T CMMERCIAL AND TECHNICAL ASPECTS F AUTMTIVE PRDUCT REALIZATIN Integration of dissimilar modem solutions ( & DSRC) potentially causing higher costs as / due to missing supplier products and aggravated economies of scale compared to GPP- release roadmaps and annual production volumes CST INCREASE F INTEGRATED /C-VX MDULE TWARDS SINGLE TCU MDULES IS RELATIVELY LW IN CMPARISN T DSRC SCENARIS, RESULTING IN DECREASED MNETARY IMPACT N CNSUMERS 8

9 Your Contact at P North America P North America Inc W. 11 Mile Road Suite 00 Southfield, MI 4804 USA Cornelius Bittersohl Senior Consultant - Technology cornelius.bittersohl@p-group.com Web Disclaimer + Conception and enhancement of business strategies + Development and implementation of cutting-edge technology + Efficiency programs, quality systems and new business + Design and improvement of internal processes MANAGEMENT SUPPRT + Management of company risks & opportunities + Structure of business divisions and company reorganization + Control and successful completion of complex projects This document and all information contained herein is the sole property of P. No intellectual property rights are granted by the delivery of this document or the disclosure of its content. This document shall not be reproduced or disclosed to a third party without the express written consent of P. This document and its content shall not be used for any purpose other than that for which it is supplied. CNSULTING SERVICES ENGINEERING SLUTINS + Design, conception, modelling, construction, certification + Simulation, measurement, testing, performance, documentation + ME, Quality + utsourcing and offshoring 9